PCB

. PCB
1.1 PCB
PCB
PCB
PCB1.1
1.2 PCB
1.1903Mr. Albert Hanson""(Circuit)
PCB
2. 1936Dr Paul EisnerPCB
print-etch(photoimage transfer)
1.3 PCB

PCB
1.3.1 PCB
A.
a.
/PolyimideBT/Epoxy
b.
Copper-invar-copperceramic
B.
a. Rigid PCB
b. Flexible PCB 1.3
c. Rigid-Flex PCB 1.4
C.
a. 1.5
b. 1.6
c. 1.7
D. /////,1.8 BGA.
PCB
1.3.2
A. 1.9
B. 1.10 1.11
C. IC

PCB

.
2.1.
PCBBare Board

PCB Shop(Assembly)Turn-Key
Drawing, Artwork, Specification
PCB:123
4 ( 5 ) 6
Micro-Modifier
CAM(Computer Aided Manufacturing)
DFM(Design For Manufacturing)
output
2.2.
A Gerber file
PCB CAD1960Gerber Scientific
Gerber System
CADOutput DataDrawingFilm
Gerber Format
B. RS-274D
Gerber Format EIA STANDARD RS-274D(Electronic Industries Association)
1.Function CodeG codes, D codes, M codes 2.Coordinate dataimaging
C. RS-274X
RS-274DRS-274DCode RS-274X Parametersextended
Gerber format
D. IPC-350
IPC-350IPCneutral format,PCB CAD/CAM,,PCB
SHOP NC Drill Program,Netlist,Laser Plotter.
E. Laser Plotter
Gerber format IPC 350 format Artwork
F. Aperture List and D-Codes
2.3.
2.3.1
PCB SHOPBare Board
-.
,

2.3.2 .

A. .
B.BOM-Bill of Material
BOM
LaminatePrepregCopper foilSolder Mask
LegendFinish,,
OSP

C. , .,CheckECO(Engineering

Change Order) ,.
D.

30~60%

Layout PCB
Layout PANEL

a.
b.PANEL
c.piece__________
d..
e.

,

2.3.3

A. (Flow Chart)
:.
B. CAD/CAM
a. Gerber Data CAMaperturesshapes
PCB CAMIPC-350CAMNC Routing
PCB Layout NC Router,
.
Shapes ,thermal padAperture
codeshapes
b. Check list
check list
c. Working Panel
PCB Layout

30~60%

Layout PCB

Layout PANEL

1.
2.PANEL
3.piece
4..
5

working Panel
d.
Artwork CAMD-CodeLaser
Plotter
PCB

1.
2.
3.
4.

,RoutingNC Routing
e. DFMDesign for manufacturing .Pcb lay-out PCB
Lay-out PCB
PAD
PAD
PCB

PCBLay-out .
C. Tooling
AOINetlist ..AOICAD referenceAOINet list
Fixture
2.4
,,
,PCB,,
,, ,, Lay-out , PCB
,.,,,
.

 Copper-clad Laminate CCL

,:,
,, ,.3.1
.
Resin Glass fiber
( Copper foil ) Composite material
.
3.1
3.1.1 Resin
3.1.1.1
, Phenolic Epoxy
Polyimide PolytetrafluorethylenePTFE TEFLONB
Bismaleimide Triazine BT Thermosetted Plastic Resin
3.1.1.2 Phenolic Resin
phenol
Formaldehyde Formalin
Crosslinkage 3.1
1910 Bakelite
Bakelite
(NEMA-Nationl Electrical Manufacturers Association)
, NEMA

"X" "X"
"X" "P" Punchable
"C" cold punchable "FR"
(Flame Retardent) (Flame resistance)
XXXPC FR-225 ,.062in

:
A
a. XPC Grade
UL94XPC Grade HB__________

b. FR-1 GradeXPC GradeXPC Grade

VTRUL94FR-1
V-0V-1V-2
V-0
c. FR-2 GradeFR-1
FR-1FR-1FR-2,FR-2
FR-1
B.
a.

FR-4PCB .
b.
FR-4
(Silver Paste)
FR-4
b-1
1)
XY()Z()

2)
FR-4FR-1XPC
FR-1XPC .
b.-2
1)

2)
__________

3)

(Silver Migration)
c. (Carbon Through Hole).

PCB .
Carbon Paste Key Pad
XPC
0.81.01.2mm
d. 40Pitch1.78mmIC

e. (Anti-Track)



2.1.2 Epoxy Resin
Varnish)
A-stage
B-stage prepreg ,__________ C-stage
2.1.2.1
Bisphenol A Epichlorohydrin dicy
(Flammability test),

Tetrabromo-Bisphenol A FR-4 :
--Bisphenol A, Epichlorohydrin
() - DicyandiamideDicy
(Accelerator)--Benzyl-Dimethylamine ( BDMA ) 2- Methylimidazole ( 2-MI )
--Ethylene glycol monomethyl ether( EGMME ) Dimethyl formamide (DMF)
Acetone ,MEK
(Additive) -- Tg.
A.
( Difunctional Epoxy Resin),3.2.

3.3. NEMA FR-4( NEMA

G-10)

B. ()
Dicy, (latent) , 160
B-stage Dicy
(Hygroscopicity)
dicy
,
,.
C.
epoxy dicy BDMA 2-MI
D. Tg

,
FR4 Tg 115-120,
,
,, Tg , Tg
Tg , a. X Y
b. Z
c. Tg
.
,
Tg
E. FR4

3.1.2.2(Multifunctional Epoxy)

 FR4
__________
A. Novolac
Novolac , Novolac
Epoxy Novolacs3.4. FR4
, Tg
, (Smear) PTH
B. Tetrafunctional Epoxy
FR4 " " (Tetrafunctional Epoxy Resin ).
" " ,3.5Tg
Novolac
Polyclad Novolac
160
2-4 ,
,, .
,FR4.
3.1.2.3 Polyimide(PI)
A.
Bismaleimide Methylene Dianiline ,3.6.
B.

FR4 Tg 120 FR4 180-190 260

.PI,
FR4 FR4
X Y
Z
C. :
a. UL94 V-0
b.

c. (Hygroscopic),
d.(Varnish,,)
,
e. FR4 2-3 Rigid- Flex
MIL-P-13949H, GI.
3.1.2.4 (PTFE)
Polyterafluoroethylene ,3.7. PTFE Teflon
, (Impedance) (microwave)
"GT""GX" "GY" ,type3M
:
A. PTFE

MILP-55110E 4.8.4.4
(Wicking)
B.
.
C. Tg 19 c,
.
3.1.2.5 BT/EPOXY
BT(Mitsubishi Gas Chemical Co.)1980
Bismaleimide Trigzine Resin monomer3.8
BT
A.
a. Tg180BT(peel Strength)
(Smear)
b. UL94V-0
c.
d.
e.
B.
a. COB wire bonding
BT/EPOXY
b. BGA ,PGA, MCM-Ls
CAF(Conductive Anodic Filament),( )
BT/EPOXY
3.1.2.6 Cyanate Ester Resin
1970PCBCiba Geigy3.9
A.
a. Tg250
b. (2.5~3.1)
B.
a. .
b. .
3.1.2
3.1.2.1
(Fiberglass)PCB
Kelvar(Polyamide)(Quartz)

(Glass)

17Owen-IllinoisCorning Glass Works

Owens-Corning Fiberglas Corporation1939
3.1.2.2
(Continuous)(discontinuous)

(Fabric)(Mat)FR4
CEM3
A.

()A
CESE

a./

b.
c.
d.
e.

f.
PCBE

3.2 (copper foil)

,,3,4mil,(
1 mil),.,Profile.
.
3.2.1
3.2.1.1 (Rolled-or Wrought Method)

(3 *4) ,,
(Heat treatment or Annealing),
A. .
a. Ductility,FPC,.
b. Low-profile Surface,Microwave.
B. .
a. .
b. .
c. ,.
3.2.1.2 (Electrodeposited Method)
ED.
, 600 ASF
(Columnar) (passivated)
(Drum)
,

(Drum side ), (Matte side) .:

A.
a. .
b. .
B. .
a. ,
b. .
3.2.1.3
, 1.0
Ounce (oz)1 oz (28.35g). 35
(micron)1.35 mil. 1 oz 1/2 oz 1/4 oz,.
3.2.2
3.2.2.1
0.5 oz (17.5 micron )
3/8 oz (Carrier) (
copper foil), ED ,2.1 mil.
,3 mil..
" " " "(Porosity),
.,. ,5 mil,
.
3.2.2.2

XY
(Stress)ED
.
,Grade 2,E-Type high-ductilityGrade 2,E-Type HTE
. ED.
3.2.2.3
A
EDDrum
a. Bonding Stage(Matte Side)
"""Nodulization" 2000~4000A
b. Thermal barrier treatments-(BrassGould
JTC)(Zinc YatesTW)
Dicy
500~1000A
c. Stabilization""(Chromation)
""(passivation)" "(antioxidant)
B
a. (Double treatment) 20
COST

 / Polyclad
DST

b. (Low profile) Tooth Profile () ()
( just etch,over-etch) Polyclad
DST ""Organic Silane
Treatment
3.3.3
IPC-CF-150 TYPE E TYPE W ,
class 1 class 4 class 5 class 8 .

3.4 PP( Prepreg)

"Prepreg""preimpregnated"
B-stagePrepreg"Bonding sheet"
3.4.1
3.4.2
Gel time, Resin flow, Resin Content Volatile Dicy

3.4.3
EPOXY53~6
3.3.2prepregData sheet

3.4.4Cruing
3.4
(Driving Force)(Miniaturization)(
)
3.4.1
PDAPC
Chip Package -(a)(b)

3.4.2
CPU
PCB, DkDf
PCB

.
4.1
,
(FCC)
198410
"",pcb lay-out """"
,

..
4.2

A. Print and Etch

B. Post-etch Punch

C. Drill and Panel-plate

,(buried hole),20.
( Post-etch Punch).
4.2.0
BOM

A. -
B. -
C. -
D. -
4.2.1
step

A.
a.
b.
c.
d.
e.
f.
g. (__________)
h.
a. c. f. g. (
)
B.
a. (Brush)
b. (Pumice)
c. (Microetch)

C.
,4.1.
4.1

a. ,

b.

a.
b.

a.
b.
c. D/F
d.
D.
(pumice)

a.
b.
c.

a. Pumice
b.
E. ()
.
F.

4.2.2
4.2.2.1
A.
,(Silk Screen Printing)
""
(Thick Film)(Hybrid Circuit)(Chip Resist )(Surface
Mounting)
,,,,
.cover:
a. , ( ,)
b. c.,
d.
e.
f.
g.(Peelable ink)
,,__________..
B. (Screen Printing)
:,,,,,,,,
.

a.
(1) (silk),(nylon),(Polyester,),,.
.
(2) : Plain Weave.
(3) (mesh),(thickness),(diameter),(opening)

:4.2
:inchcm
:
:,Slight(S),Medium(M),Thick(T),Half heavy duty(H),Heavy
duty(HD),Super heavy duty(SHD)
4.2.
b.(Stencil)
(1).(Direct Stencil)

,
.,, .,
.
(2).(Indirect Stencil)

,,
,.
c.

(1)..
(2).(UV)
(3).,,,,,. ,
, .
d.
:. ,
,. .
loading/unloading,, .3/4,
loading, Rack. loading/unloading,
. , pinningccd. :
(1) :
,,
.,.
(2) Squeege

(Polyure-thanePU)
Shore A6080.
7080; ,6070


3/41


(3).
pin,(Off
Contact Distance)( 2m/m5m/m ),
..
, pinningccd.,
.
(4).
, ,follow data sheet,
modify. ,UV,IR
.
(5).

.
,.

check list .
4.2.2.2
..
A. (Laminator)0.1mm,
B.
C.
D. Break point 50~70% ,30+_2, auto dosing.
4.2.3
(CaCl2)

&
Resist
D/FD/F

B
C.
Etchant PVC (Poly Vinyl
chloride)PP (Poly Propylene) (Ti)
,( etching factor4.3)

Cu+


, .
a. CuCl2
Cu, Cu++
Cu+__________1
Cu+Cu++2 Cu+ ------------- (1)
Cu+Cu++,

b.
Cu++ Cu+CuCl2 CuCl
HCl
Cu + H2CuCl4 + 2HCl 2H2CuCl3 ------------- (2)

H2CuCl4 CuCl2 + 2HCl
2H2CuCl3 CuCl + 2HCl
(2)HCl(2)

Cu+ H2CuCl4 2H2CuCl3 + CuCl () ---------- (3)

CuCl + 2HCl 2H2CuCl3 () ---------- (4)
CuClHCl CuCl
HCl
HCl
1. (undercut ) etching factor
2.
3. (H2O2)H2O2
c.. CuCl2,Auto dosing,
,:
1.
2. HCl
3. H2O2
4.
5.
4.2.4
pcbstepD/F
D/F()D/F
NaOHKOH 1~3%
A.
.
B. ,
BCS

C. K()

4.2.5
4.2.5.1
A. 2.3,(),
, 4.4
B. (6)(),
M/L
4.2.5.2(post Etch Punch)
A. Pin Lam
4Slot 4.5 prepreq
4SLOT SLOT
PIN

B. Mass Lam System
Multiline""PPS
1.CAM""(Optical Target) pads
4.6
2.
3.Optiline PECCD
4Slot 4.7
4.

4.2.5.2
A.
a. check
b. Shift
B.
a.4.8
b.4mil,

c.Resin Curepattern
4.3
AOI() () ,
(integrity),,,,
,, ,
,,.,
(AOI), ,,
AOI,(Leakage),
AOI,.
, .__

.
5.1. :
(Copper Foil),(Prepreg)(Oxidation),.
,,.
5.2. ,5.1:
5.3.
5.3.1 (Black/Brown Oxide Treatment)
5.3.1.1
A. ,(Adhesion).
B. ,
C. (Passivation)(Amine)

5.3.1.2.

( pink ring )
5.3.1.3. :

,,
,2Cu+[O] Cu2O,
CuO,,"",
""
5.3.1.4. ( ),
5.3.1.5
A. Cu2O,
,,
,
,,,
B. ,PTH(Pink ring), PTH
.
,,5.2.
C. ,
,

(Peel Strength). (Self-Limiting) (Sealer),

5.4,,,
5.3.1.6
,,,
,,,,:
A. - .,,scum
B. -PH,,.

C. - (grain structure),
50-70 ,
D. - , ,
- ,
E. -,,
,
,,
,,

F. .
G. ,,.
H. -,
,,
5.3.1.7
,
,,CPVCPP
,,RACK.
(Spray)(Flood),,,
,,(Accelerator).
.
5.3.1.8
A.
a.(o/w)0.30.07mg/cm2
(1) 9cm10cm 1oz
(2) 13010min.
w1(g)
(3) 20%H2SO410minw2(g)
(4) O/W = W1-W291021000
weight gain,In-processQC
b.( Peel Strength ) 4~8 lb/in
(1) 1oz-( lay up )
(2) 1cm( ).
c.(Etch Amount) 7030u in
(1) 9cm10cm 1oz13010min
w1(g)
(2) 2'18"()
w2(g)
(3)
d.
5.3.2
,,(Lay-up).,
(Prepreg),(Copper foil),:

5.3.2.1 P/P(Prepreg)
P/P:

P/P(Resin Flow)(Gel time)(Resin Content)

:
A. (Resin Flow)
1,Flow test-4
,1702.820025PSI10, ,
3.192,, :
,16m2,(3.196
2)2 3.142=16.045m2, ""
2,Scaled flow test-,
7in5.5in7in,(104,106,108)
18-20,(12.113.116)10,11615020
,31PSI840 5%8101, ,
,:
ho=[Wo/n(5.5410-2)-Wg]21.210-2
ho-,Wo-,Wg-(g/in2),n-
B. (Gel time or Tack Time)
B-Stage ,,
, C-Stage
,,
,

(air bubble)
C. (Resin Content)

c-1 (Burn Out)

c-2 (Treated Weight)

D. (Polarizing Filter) dicy ,

,
dicy
E. , 54015
, 20X
F. (Volatile), 4 4 4 , 1mg,
163 2.815 1, ,

5.3.2.2. P/P ,5.3

,Prepreg
5.3.2.3
''
5.3.2.4
:Cap-lamination,Foil-lamination__________Foil-lamination.
A.
,,,,
:
(a) ,
3.5 mil(),
,
(b) ,Z,
,5 mil

(c) ,,,
,C-Stage
,,

(d) (Impedance),(Low Profile),(Matte side)

6,12
,(Wrinkle)
,,

(e) ,6shift.
(,),().
C.
202,50% 5%, ,
(),, 30,
,
24 1 ,
,Tg
D.
(a) -,
, :
,,,
,,

,,,

2,
, ,
,
, X

.
(b) -,
__________
(c)-,,
, ,,
,,,
,
150-200PSI,
5.3.3
5.3.3.1
:
A.(Autoclave):

5.4
:
:
B.Hydraulic

5.5 :a.
b. :
C. ADARA SYSTEM Cedal
Cedal
,,Prepreg

5.6
:
a. __________
b.
c.
d. Cycle time4Omin.
e. .
f.
:
C-1. Cedal AdaraStack5.7
5.3.3.2. :
A.:

:
: a.
b.
B.
:
: a.,
b.
C.
:
:
D.:
Prepreg

: a.(35/min.)
b.
: a.
b.
5.3.3.3. (Opening):
A.:

5.8.
A-1
a. ,(Press plate): ,
,.
b. (Separator plate): , .

c.: ,
,

d.:

e. (Release sheet) (Press pad) Conformal press,

coverlayer.
B. CEDAL ADARA :5.9
CEDAL5.9,Stack65Panel,,
5.10
5.3.3.4.
Profile 5.11
A.:
a.:
b.:

c.:(Internal stress)(WarpTwist)
B.:
a.( Kiss pressure):(Book),
b.:
c.:C-stage
d.:
B-1
,,
, ,
:
= 40PSIA(__________)()
= 560PSIA
:1/2 =14.22PSI(pound/in2)
1PSI = 0.07/2 ,1/2 = 1ATM
5.3.3.5. :
a.
b.
c. ,pits & dents
d.
e.
f.
5.3.4
5.3.4.1.
A.
B. IPQC (In Process Quality Control)
5.3.4.2.:
A.(post cure, post lamination)-150,4. curing
,,( Tg ).Tg,curing .
:
a..
b.,.
c..
B. ,-(Relief),
a.:
,,
,
b.X-Ray: ,,.
C. (CNC)-,
,1, ,
,
CNC
,.__


6.1
,
,:,,
(Via),(Blind hole),(Buried hole)(via hole).'....
.',,,,,
.,20.
6.2
PIN
6.3PIN
,,,,
stack.1.2.3.4..
. ,pin,pin(pinning maching)
. ,,pin.,
PIN.
6.4.
6.4.1
List
A.
B.
C.
D. (Spindle)
E.
F.
G. XYZXY
H.
I. Step Drill
J.
K. RUN OUT
6.4.1.1
A.
B.
C.
D.
E.
6.4.2
(Drill Bit),(Back-up board),(Entry board).
:6.1.
6.4.2.1 (Drill Bit), ,
,
A. ___________ :

a. (Tungsten Carbide ,WC)

b. (Cobalt)
c..
, (Sinter) .
94% , 6%
.1 micron.
B.
,6.2, (drill point) ( Flute )
(handle,shank) :
a. (Drill Point)- 6.3
(1) (Point Angle)
(2) (Primary Face)
(3) (Secondary face)
(4) (Chisel edge)
(5) (Margin)
,
, (Chisel edge), ,
stack,
(Margin), ,.
(Corner) ,,
, (Point
angle), , 90 ~ 110 , FR4

115 ~ 135 , 130

15 (Primary Face Angle), 30 ,

(cheisel Edge Angle)

b. (Flute)
,
(Flute)
(Helix or Flute Angle), '_'(_'(_'_, ,,

, , (smear)
,
c. (Shank)
Spindle ,
4:
(1) Straight Shank,
(2) Common Shank
(3)
(4)

C.
a. 20~40,6.4
b. (Re-Sharpping) ,
(High) , 5000-6000 (Hit), ()
6.4.2.2. Entry Board()
A. :
a.
b.
c.
d.
e.
B. :
a. - ,
.
b. .
c. 5~30mil,,
,.. :,
,,,.
6.4.2.3 Backup board
A.
a.
b.(Exit Burr
c.
d.
B.
. -
.
b. phenolic .
c.
VBUVented Back Up
.:
,,,,.
6.4.3
6.4.3.1 CNC
CAD/CAM
..
Loading/Unloading.
6.4.3.2
"Feeds and Speeds"
A. (Feeds): (IPM)""(Chip Load)

(in/R)

B. (Speeds) (Revolution Per Minute RPM)

RPM
120in/minRPM

:
1.
2.
3.
4.
6.4.4
A.
B. ,Run out .
C. over100%
D. Spindle
E. Run out 0.0005"
F.
6.5
6.5.1 :
0.6 mm,0.3 mm(micro hole)
6.5.2 ,

0.3mm
(Surface Mount Techology) PC

1.
2. (Aspect)
3. PC()
4.
5. ()
6.
A

1. 10~15m

2. ()
3. PC10m

4.

 :
STACK
PCB
PC

1. PC
2. PC
3. 0.15~0.2mm0.3~0.4mm
4.
6.6
6.6.1
1.
2.
3. (check)
4.
5. ()
6. (burr)
6.6.2coupon(6.5)
coupon:
1.
2.
3. 1000,2000,3000 hit .
,.

7.1
(Plated Through Hole , PTH)
( metalization ), ,

1986Hunt PTH,
"Black hole"base,
. PTH, (direct plating).
7.2
PTHa
7.2.1. (deburr)
,,1.2.,burr.
,,,,de-burr.de-burr
Desmear.de-burr,.
4.1.
7.2.2. (Desmear)
A.:
a. Desmear

b. Create Micro-roughadhesion
B. Smear:
ResinTg
P.I.(Poor lnterconnection)
C. Desmear:
(Sulferic Acid) (Plasma)(Cromic Acid) (Permanganate).
a.

b.

c.

d.

7.2.2.1 (KMnO4 Process):

A.(Sweller):
a. :Epoxy Polymer KMnO4 Micro-rough
Concentration
b. : 7.1
c. :KMnO4
d. :
(1) 7.2

KMnO4PTH

(2) Surface Tension:

Wetting
Surface Tension Drag out

Wetting
Smear
B. (KMnO4 ):
a. KMnO4:KMnO4NaMnO4KMnO4,

b. :
4MnO4- + C + 4OH- MnO4= + CO2 + 2H2O ()
2MnO4- + 2OH- 2MnO4= + 1/2 O2 + H2O (PH)
MnO4- + H2O MnO2 + 2OH- + 1/2 O2 (Mn+4)
c. :

d. Mn+7, Mn+6,Mn+4


e. : 7.3
f. :
(1).
(2).By-product7.4:
g. KMnO4Micro-rough: Sweller
Micro-rough
h.
i.

C. (Neutralizer):
a. NaHSO3NeutralizerMn+7 or Mm+6 or
Mn+4(Neutralizer)->Mn+2 (Soluable)
b. Pink RingAcid base HCl H2SO4 Cl
Oxide LayerH2SO4Base
c .H2SO4NeutralizerAuto-dosing
7.2.2.2 .:
A.Cycle timeRack(Basket)()
B.:
(Working hours / Cycle time)*( FIight Bar / Hoist)*(Racks/Flight Bar)*(SF/Rack)= SF/Mon
C.Pre-baking:7.5
a.2.Cure1,3 CureBaking

b.ResinBonding2~31,2,3
c.StressVoid.
7.2.2.3. :
A:
a .
4MnO4- + 4OH- + Epoxy 4MnO4= + CO2 + 2H2O
b.
2MnO4- + 2OH- 2MnO4= + 1/2O2 + H2O (Side reaction)
MnO4= + H2O (CI-/SO4= /Catalize Rx.) MnO2 + 2OH- + 1/2 O2
(Precipitation formation)
2MnO4= + NaOCI + H2O 2MnO4- + 2OH- + NaCI
4MnO4= + NaS2O8 + H2SO4 4MnO4- + 2OH- + 2Na2SO4
4MnO4= + K2S2O8 + H2SO4 4MnO4- + 2OH- + 2K2SO4
(For Chemical regeneration type process reaction)
2MnO4= + 1/2 O2 + H2O 2MnO4- + 2 OH(Electrolytic reaction: Need replenish air for Oxgen consumption)
B.
MnO4- Permanganate NaS2O8 Sodium Persulfate
MnO4= Manganate S2O4- Sulfate

OH- Hydroxide(Caustic) CO2 Carbon Dioxide

NaOCI Sodium Hydrochloride MnO2 Manganese Dioxide
7.2.2.4.Desmear Process:
7.2.2.5. Pocket Void:
A.:SwellerGlass fiberThermal cycle
B.: 7.6
aStress
bResin StressZCuring Stress
aB Resin recession
cPocket void
CPull away
7.2.3 (PTH)
PTH
7.2.3.1
A.
Conditioner Microetch Catalpretreatment Cataldeposit Accelerator Electroless
Deposit
B.
a. Conditioner
1. DesmearBipolarCuGlass fiberEpoxy

2. Conditioner
(1)Cleaner
(2)Conditioner Pd/Sn Colloid
3.
Colloid
4. ConditionerDrag In ActivatorPd+
b. Microetch
1. MicroetchingConditionerFilm
2.
c. Catalpretreatment
1. MicroetchPd/Sn
2. Surface Tension
d. Cataldeposit
1. Pd 7.7
2. Pd2+Sn2+Cl- = 1612
3. 7.8 Cl
Roughness
4.
e. Accelerator
1. PdSnPd2+

2.
Pd+2/Sn+2 (HF)Pd+2(ad) + Sn+2 (aq)
Pd+2(ad) (HCHO)Pd(s)
3. SnPdPdSn
Sn+2a Sn+4 + 6F- SnF6-2 or Sn+2 + 4F- SnF4-2
Pd
PH>=4 Pd+2 + 2(OH)- Pd(OH)2
PH<4 Pd+2 + 6F- PdF6-4
4. Pd
P.I.Back_light

5. Sn+2 a Sn(OH)2 Sn(OH)4.

Sn+4Sn(OH)4PdPTH
6. PTH
f. Electroless Deposit
1. PdHCHO,
2. Pd
(1) Catalyst H- HCHO
(2) Conductore-Cu+2Cu
3. Mechanism7.9a ; 7.9b
4. H2
Dummy boards
5. Bath loadingBath loading
H2MaxMin

6. [NaOH], [HCHO]Pd+2P.I.PTH

g. 7.10
7.2.3.2
A.
Conditioner Etch Cleaner Catalpretreatment Activator Reducer Electroless
Copper
B.
a. ConditionerWetting agent + 10 g/l NaOH (A)
1. Wetting agent Film300A

2. DipolWetting agent
ConditionerCleaner
3. wetting,
FormulaWetting agent + 10 ml/l H2SO4
4. M+2(Ca+2Mg+2Fe+2)Amine Wetting agent

5. CuOH-Dipol
Over condition
b. Etch cleaner(SPS H2SO4/H2O2 )
(SPS10g/l)
c. Catalpretreatmen)ActivatorComplex
d. ActivatorActivator + Pd(Amine) complex
1. PdAmineComplex
2.
(1) Pd(Amine)+2ConditionerP.I.

(2) SnColloidSn(OH)2Sn(OH)4
Sn+2 + Fe+2 a Sn+4 +Cu
(3) Cl-Cl-PolyimideCl-

(4) Pd(Amine)+2 asPd+2+Amine

(5) ImpurityPd+2P.I.
(6) Cl-, Black-OxideattackPink Ring
(7) Coverage
e. 7.11
7.2.4(Panel plating)
PTH, 200~500
20~40(Void)__________

.
7.3.
20~30
100


,
.
:
A."Semi-Additive".
B."Fully Additive"
24 .,
CC-41,
7.3.1
a.

b. , (inner Stress)

(pull away)
c.
,
d.

e. PTH
(Active sites)
,
(Hole Void),

7.4 (Direct plating)

()(
Chelate)10PTHDirect Plating(
)
()()Approve

7.4.1

A. Carbon-(Graphite)
B. Conductive Polymer-
C. Palladium-
7.4.2:
A. ,
B.
7.4.3
, .:
A.
B.
C.
D.
E.
PCB,
.

8.1
, , , .
8.2

8.2.1
4..

8.2.2
8.2.2.1
(dry film)8.1, 1968PCB
, 1984HITACHI
.
Type:

,.
A.

8.1 Dynachem ,
.
B.
,,

8.2.2.2 (Lamination)
A. ,
, , 8.2

12010
5010
1.5~2.5
15-40 psi
a.

b. HAKUTOCEDALSCHMID

c. .
d. ___________

,
e.
10K 233 50RH5

8.2.3 Exposure
8.2.3.1

LDI
A. PIN

B. Loading/unloading
CCDCheck

C. :
:(collimate)
8.3.
: (Collimate Half
Angle)(Declination Angle)

:
(Collimation Camera)
8.4(a,b):
D. Under-Cut 8.5
(4mil)
E. LDI(Laser Direct Imaging)
coating__________ 2milbeam

18in24in30
8.2.3.2
A.

B.
(

mili - Joule = mili Watt Sec.

"Photometer" "Radiometer"
C. Stouffer 21 Step Tablet
Stouffer 21 step tablet IN-process8.6
21
8~10Follow
Data Sheet
D.

under-cutMylar (Newton Ring)
""

E.

<1> PIN
<2>
<3>
<4>
<5>

F.
10~15UVresist Film
G.UV (Inhibitor)
UV

5mW/cm2

H. :(I)(2) (3)
.(1) (3)
.
8.2.4. Developing
8.2.4.1

30 +_2
1520 PSI
272940 PSI
pH 10.5 10.7
Break point 50~70% Auto dosing
8.2.4.2
A.

B. Break point ( )
50~70%,scun,, undercut .
(auto-dosing). .8.1()
C. (Scum)
Scum
(Cupric Chloride CuCl 2)
Scum
D. ,Rack.
8.3.


A. (Clean Room) Fed.
STD 209 0.5(PPCF)

class 100 (IC)

10,000
B.

Air Shower
(Laminar Flow) ,
C. 500 n
m(naro-meter10 m5000A) 500nm

8.4

MCM-LTenting & Etching

1OOmAdditive process

A. Additive Process
Semi Additive Fully Additive Semi Additive
Fully Additive
Subtractive/Semi
Additive/Fully Additive8.7
B. Additive
2~2.5m/Hr
2~4
C. 70


D.
-600mV-355mV
Zn/Sn/Ni
40Hr
0.50.1mg/cm2
E.



40

76m,30
m

F. Semi additive
()
1m

G. Cr-Cu22 m
Semi additive 4Hr Ion milling

H. Fully additiveUV(Adhesive)
UV()
UV

, Rack ()

.
9.1
(Pattern Plating),(Panel Plating)
9.2
,,.
.build up,
buried hole, throwing power,,.
:
()
9.2.0 Time table():
,,2,304,50, 2~3,
,,RACK ,
, Time Table.PLC
,,.
9.2.1
In line process,.:

--,,
scun,.
9.2.2
9.2.2.1
A.
,(deposit)

B.

""__________(NHE

Standard
Potential , Normal Hydrogen Electrode)NHE"
"(Electrochemieal Series)(Electromotive Force Series)
-0.762
0.762V
Zn + 2 e Zn, - 0.762 V

Cu + 2 e Cu, + 0.34 V

C. (Overpotential)
(E0)

""
V(applied)-E
C-1

ct+mt+IR----------------(1)
ctCharge transfer overpotential
mtMass transfer overpotential
IR
s(surface)= h(Hole)
s=h=sct+smt+IRs=hct+hmt+IRh---------------(2)
mt DiffusionDiffusion layer
9.19.1()
(C)()
Diffusion Layer Diffusion layer thickness(Concentration gradient)
Mass transfer overpotential
mtRT/nF(I/iL)=0.082(J/JL)---------------------(3)
JJLJL
JL=(nFDCb/)=K(Cb/)--------------------------------(4)
(Cb)()JL|=*^()

()JLSmts
Cbh, JLh mtL
(mth>mtsL)IR IR=0

EIR=(J.L2/2Kd)-----------------------------------(5)
J L d
EIR>>0mth>mtsL
(2)cth>ctsCharge transfer potential
Charge transfer potential(Aspect ratio )

C-2
ctcharge transfer overpotential
9.2
9.2ct ()
a.
J(Limit)
b. Range
J/J(Limit)=0.35~0.45 c. J/J (Limit)

d. 1*

e. (ct>2*)
cts=cth9.2Jcts>Jcth(Throwing
Power T.P.<=1)9.2ctscthCurve(II)
(J2=Jcts=Jcth) Curve(I)(J2=J1)(/)
Throwing power
T.P.=(Jcth/Jcts)----------------------------------(6)
(Plating curve)T.P.
D. Throwing power
a. Throwing power
(1) ctscth(ct)

__________IR
(IR)
Charge transfer
(2) J
b.
(1)

J-
9.3
CuSO4Throwing power
Distribution
CuSO4

E. Additive()9.4
a. Additive
IR

b. Additive :
AdditiveFilm,Shift,
JJ1J2T.P.(T.P.=1-(J/ Js))

AdditiveDiffusion
AdditveJ J
J2J3T.P.Additive "
"

F.
a..
a-1.

J limit=a+bCb
Cb a,bCuSO4
J limit = 1.8+1.34 Cb ----------------------- (7)
__________
J/J limit = 0.35~0.40 ----------------------- (8)
J limit J

T.P.
a-2. Cu+2
Running100%Cu+2

Operation range J
.
T.P.
Additive

b.
T.P.
1mil T.P.

T.P.JT.P.
Aspect ratio
Aspect ratio T.P.T.P.

T.P.
c. Additive
AdditiveGap
T.P.distributionAdditive
Additive

OcclusionCrack

Migration

Additive(Functional
group)
Dump
T.P.Additive
Aspect ratio
d.
T.P.Aspect ratio
9.2.2.2
A.
PTH
,:
(electrical conductivity)
(strength)
(ductility)

,,(),
.(Wave Soldering)(Solder Paste)

(Aspect Ratio)Build-up, ,
.
B.
a.
,( Throwing Power),
(Columnar) ,
b. (High Throwing Power)
,
,

(leveling agent),(Elongation)
""
(Thermal Stress)
.
c.
, ,
,
,
mil25ASF25, 60
(DIP)
(SMT)

d.
(High speed additive)

(Pulse plating)
(Impinge)
C.
a.

b.

(Carbon treatment)(Dummy
plate)

10:1__________

0.02-0.06
(Brightner)(Leveller)(Carrier)(Wetter) ,
'-'.
c.

,
1. :Fly-bar
2. ,.
3. 9.5(a.b)
,
1..
2.9.6(a.b),
,,,.
3.PP
4.
.
5.,,
.

1.:,
3diffusion layer 5

2.45,9.7diffusion layer

diffusion layer,..

25
15

d.
:
carbon treatment .
:
,, .
:
1.
2. (hull cell)
3. CVS
9.2.3
9.2.3.1

a. ,
b. , IR,.
,.
9.2.3.2
A. (Standard Bath)
60401/2

B. (High Throwing Power Bath)

C.

a. 0%100% ,
.
b.

4HF + H3BO3 a HBF4 + 3H2O

HFH3 BO3 PP

c. Peptone.Peptone

(Treeing) ,
5-6g/l.
d.

e. 40%60%.
(IMC)Cu3SnphaseCu5Sn6 phase
.
f. , .
.
9.2.3.3
A. High throwing power

B.
C.100%
+2+4 32~54
D.(Peptone)(Gelatin)-Naphthol
(Hydroquinone)
E.
25ASF.
9.2.3.3

20PPM

A.267 ml
10

B.
(dewet)
(pimpling)
1-3 ASF
C.


D.

9.3

Aspect Ratio mil


A.

B.
C.15ASF(Ripple)
5ASF
D.

E.10/1
F.CVS

G.(Pulse Plating)

9.4
,,
,panel plating,pattern plating,.
PIOTEC(),.9.5
,.
,,
.,.
,().

10.1
,:
A. :
B. :
C. ():() .
10.2

10.2.1
pcbstepD/F
D/F()D/F
NaOHKOH 1~3%
A.
.
B. ,
BCS

C. K()

10.2.2
, 10.2.2.1
A.


)

B.
a. Acceletator
b. (Banking agent) .
c. Suppressor
10.2.2.2
A. 48

B (pudding),(,
)over etch, :
a. ,.
b. ,,.
c. , .
d. ,, .
.
10.2.2.3
A.
B. ,, (
),,,.
,delay ()
10.2.2.4
A. sludge_ D___(), PH,

.
B. .()
C. .
10.2.2.5 Undercut Overhang
10.1
10.2.3 ()
,,,,
(),.,,
.
A.(),,,
,/H2O2,HNO3/H2O2.

B.,:
a..
b..
c. .
(),(),
.
, 100%.

11.1
pcb :(),
.
11.2
11.2.1 16
11.2.2
, ,
10 ,, .
, AOI .
11.2.3 AOIAutomated optical Inspection

, AOI
11.2.3.1
A.
()
(, ,)
B. AOI ,
(surface finish) . BGA,,,,
..
11.2.3.2
" CCD Laser

Laser AOI ()(Fluorescences)

Laser AOI """"
6mil
"""Laser
, AOI .
AOI
, 11.1 , 11.2
11.2.3.3
capability data sheet . List
A.
B.
C. , 11.5 D. SMT

AOI ,,,,
. PCB .

12.1
A. pad ,

B.

C. ,, ,
.
12.2
,"",(Solder mask or Solder Resist)
.
IR ,UV , (LPISM-Liquid Photo Imagable
Solder Mask), (Dry Film, Solder Mask),.
.
:

, coating Curtain coating ,Spray coating ,

.
12.2.0
A. :
(Liquid Photoimagable Resist Ink)
(Liquid Photo Resist Ink)
(Wet Film Dry Film)
7-8mil 10l5mil
Five & Five

B.
a.:
(Liquid Photoimagable Etching & Plating Resist Ink)
(Liquid Photoimagable Solder Resist Ink)
b.:
(Dip Coating)
(Roller Coating)
(Curtain Coating)
(Electrostatic Spraying)
(Electrodeposition)
(Screen Printing)
C.
a.
-Photosensitivity & Resolution-

-Adhesion & Leveling

-Acid & Alkalin Resistance
-Stability
-Wide Operating Condition
-Ink Removing
b.

c.
()
UV
()
UV
()

()

()

()

(lnter-penetrating Net-Work)

Na2CO3
.
12.2.1.
12.2.2.
A (Screen Printing)
a.
,,
b.

c.
d. 80~120 60~70

B. (Curtain Coating)
1978 Ciba-Geigy Probimer52, Mass of Germany Curtain
Coating
a.
1 Viscosity
2.Solid Content
3.Coating Conveyor
4. coating
b.
1.
2.
3.
4. VOC
5. Coating
6.
C. Spray coating
a. spray
b. air spray
c. air spray
, cover . roller
coating coating.
12.2.3.
A. ,,.
B. , data shee.t .(
,)
C. .
D. ,,, overcuring . E. Conveyor
,,.
12.2.4.
A. : IR ,7~10KW , 25~30C.
B. : Step tablet .
C.
D. pin , CCD ,,
.
12.2.5.
A. 1~2% Na2CO3 302C 2.5~3Kg/cm2
B. , 50~60sec,Break-point 50~70%.
12.2.6.
A. , UV ,.
B. , 150C,30min.
12.3

,,:
A. Pad
B. S/M Compatible.
C. .
12.4.
IPC 840C S/M :
Class 1

Class 2 0.5mil

Class 3
mil
,
,.
,( Gold Finger & HAL )
13.1
A.(Gold Finger, Edge Connector), connector
,. .
,, bonding pad . 13.1
.
B. ,.
13.2

13.2.1
A. :

B.
a. ,,,.
,.,,..
b. migration.

(Nickel Sulfamate Ni(NH2SO3)2 )
c. (Potassium Gold Cyanide PGC )

PGC
.
d. (PH 3.5~5.0) (Tantalam)

e.
()
drag in/out,

f. 30-40%
15%
g. PH
PH
PH
PH
h. : (pore).()
10ppm . : 100ppm
:
50ppm
C.
a.
b.
c. (porosity)
d. Adhesion
e.:,,,
13.2.2 HASL(Hot Air Solder Leveling)
A
1970 HASL ,""(Roll tinning)

Pad (Solder Sag)

1980
15mil IMC

.
or :
C. ,,,,.
D.

()

0.75~1.0m(30~40 in)
()

S/M

etch rate

E.

IMC
1.6.mm IR in-line
1.6mm 144~174
(Aspect Ratio), Coating
flux flux

flux glycol. HCl HBr

flux

F
Sn/Pb glycol

IMC Cu6Sn5 IMC

PANEL

G.
PAD
.
210~260
12~30psi 1. 2. 3.
4

1.
2.
3.

4.
5.
6.

PAD
H.

1. Holder
2.
3.
4.
5.

1.
2. 6.5g/cm2
3.(SIR)310 9 35 85%RH24

13.3

in-line
AA

A.
Soldering IMC
Solder
migrates Solder Cu3Sn Cu5Sn6
0.36% 243

IMC nigrate
PAD
Wave Solder IR Reflow
B.
183 63:37
61.5~63.5%

C.
Solder
IMC AuSn4 Solder
solder


D. Antimony
wetting 0.5%
E. (Sulfur)

F. 13.1
. 1/2

SMOBC(Solder Mask Of Bare Copper)()

(OSP,,)
14.1
,, ,,
,:
A. Pitch (bridging)
B.
C. COB(chip on board)
D. OSP
14.2 OSP
OSP Organic Solderability Preservatives ,,,
Preflux,.
14.2.1

A. BTA()BENZOTRIAZOLE
BTA
ENTHON (TARNISH AND
OXIDE RESIST) CU-55 CU-56 CU-56

B. AI() ALKYLIMIDAZOLE PREFLUX ALKYLIMIDAZOLE

1985 (ETCHING
RESIST) GLICOAT
GLICOAT-SMD(E3)

C. ABI () ALKYLBENZIMIDZOLE
CUCOAT A
(COMPLEX COMPOUND)

D.


GLICOAT-SMD (E3) OR (F1)
WPF-106A (TAMURA)
ENTEK 106A (ENTHON)
MEC CL-5708 (MEC)
MEC CL-5800(MEC)

SCHERCOAT CUCOAT A
KESTER
PH PH
MIDAZOLE PH (ACETIC ACID) (FORMIC ACID)

14.2.2
0.4m

A. OSP
B. , Cu6Sn5 IMC
C.
D. OSP

E. OSP Rework
14.3
14.3.1

.
14.3.2
A. """"
B.(Nickel Chloride)
C.(Hypophosphite)/(Formaldehyde)/ (Hydrazine)/
(Borohydride)/(Amine Borane)
D.(Citrate) E.(Amonia)
(Triethanol Amine) PH

F.
G.
:
a.PH PH 8 PH 10

b. 70C 95C
.90C
c.
15.5%

d. 0.37M
O.1M

e.
0.15M
f.
H.:
(NaH2PO2H2O, Sodium Hypophosphate)(NaBH4Sodium
Borohydride) :
[H2PO2]- + H2Oa H+ +[HPO3]2- + 2H(Cat) -----------(1)
Ni2+ + 2H(Cat)a Ni + 2H+---------------------------(2)
[H2PO2]- + H(Cat)a H2O + OH- + P------------------(3)
[H2PO2]- + H2Oa H+ + [HPO3]2- + H2-----------------(4)
""
4-12%

14.3.3
A.""""""(lmmersion Gold plating)

B.: : Au+ + e- + Au0 : Reda Ox + e- :

Au+ + Red aAu0 + Ox.
C.

D.
E.

: Au(CN)-2 + e-a Au0 + 2CN-:

: BH4- + H2O a BH3OH- + H2
BH3OH- + 30H- a BO2- + 3/2H2 + 2H20 +3e: BH3OH"+3AU(CN)z"+30H` -, BOz + /2Hz+2H,0 +3Auo 6CNF.
G. 9O
H. I. Galvanic Cell
Corrosion K.
14.3.4
A.


B.: 0.5-1.0m
SPS 150g/l
2OOppm

C. 3ppm, 40,
Cu+ Cu
Cu++
0./~O.15M3/M2*min
D.: ,


E.: 855 ,PH4.5~4.8 4.9~5.1 g/l
5.5 4.5g/l 15m/Hr,Bath loading
0.5~1.5)dM2/l 5 g/l 5 Turn
316 50%
0.2~0.4 A/M2(0.018~0.037 ASF)
PH=5~4.7 NaOH
H2S04 PH 4.8 PH

F.: ""
4~6% 6~8% 12%
500~600HV 9%
10% 130
G.:
5g/l PP PH=5.1~5.3
PH=4.5~4.8 PH 85
2.5"

2OOppm 40Oppm
2Oppm
10%

14.4
A. OSP ,,,.
.
B. , COB,IC Substrate ,.
C. Pd/Ni,Sn, Organic Silver ,
.
(Outline Contour)
15.1
Panel
V-cut Assembly
Panel Pieces PCB connector
Beveling

15.2
(Punching or Routing)V-cutaBeveling ( )
15.2.1
PCB
15.2.1.1 Template

(Template) Template (Die)

15.2.1.2
CARE

routing :
First Article
a.
(1) PCB ( FR4CEMFRI)
(2)
(3) Guide hole (Aligned hole)
(4) Aligned Pin
(5)
(6)
(7)
b.

15.2.1.3
,
CNC Routing
A.
a. (Blank)
b. slots
c.
B.
CNC Routing (First Article)
a.
b.
CAD/CAM Support CNC Routing
DRAWING
(1) SLOT
() STACK 1/8 in Routing Bits
(2) offset .
(3).
(4). PTH Slot

(5) Routing Bit (deflect)

b.
6,000~36,000 /

1
. Relief Angle .
Rake Angle(): chip()Tooth
Angle(Wedge Angle) routing bit
2. ( deflect )

, .

FR4 24,000 /

B.
NC ROUTING

1 (Machine Plate) PIN 1/4 in

2.(Tooling Plate) bushings SPINDLE
(Slot)
3.Sub-plates Benelax
(chips) PIN
1/8 in holding-pins pin (ping
)( piece 2 3 pin ) STACK1~3
PIN
D.
P/N P/N
piece()
0.15 in ( 1/8in Router)
1. Pin Pin 15.6 a. piece
b.
piece TAPE
Piece

0.005in
piece )
STACK STACK panel
2. Pin 15.7
0.005in

STACK STACK
3. pins 15.8

200in/min
0.002in
pin pin
STACK
15.2 V-cutScoring ,V-Grooving
V-cut routing punching
piece
15.2.1
A. V-Groove 15.10 30~90
B. V-cut 0.003in,0.006in
,

C. FR4 0.060in web 0.014in

CEM-3 0.060in web 0.024inCEM-1

web 0.040in
D.

0.030in V-cut
PCB
PANEL V-cut piece
E. V-cut , . IPQC
.
15.2.2
A. X
B. CNC CNC V-cut
(Jumpscoring)
15.3 (Beveling)
PCB (Edge connectors ) Card

DRAWING
A. 304560
B. Web 0.060in web 0.020in
C. HD Drawing
15.4
, V-cut,slot ,.
:

loadingunloading
15.4.1
A. .
B. V-cut .
C. .
15.5
First Article ,
.

16.1
PCB
1.
2.
3.

rework

16.2

. PCB ,
ISSURE
A.
16.1 PCB
"The Rule of 10'S"
IR

B. PCB
.
1.
2.
3.
4.
5.
C. PCB 2~3 100%,

,

1. (
)


2.

3.

D. , ,
, .
16.3
A.

B.

C. (Leakage)

16.4
1.(dedicated) 2.(universal) 3. (moving probe),
1. 2. 3.
4. 5. 16.4 16.5
, .
A. (dedicated) (Fixture)
. ( )
a.
1. 10,240 8,192
2 0.020" pitch ,, 0.020" pitch ,
,,.
b. 40 200

c. CAD Gerber netlist
( SMT )
1 : () FR4
2 2,1,0,00,. 6 0 ,pitch 0 . 16.6
.
d.

e.

1 Mylar


f. ,

:
1Running cost
2.
:
1
2.set up
3.
B. (Universal on Grid)
a. Universal Grid 1970 , PCB Lay-out Grid()
, Grid 0.100", 16.7 , 100points/in2,,
, Grid . G10 Mask, on grid ,
,.,
b. On-grid test lay-out, pad on-grid, 0.100", 0.050"
on-grid ,.
c. Off-grid test , on-grid , Off-grid , 16.9
fixture .
d. CAM Workstation . key- board mouse
x,y , ,.
e. ,
:
1.
2.set-up ,,.
3.
:
1
2.
C. (Moving probe)
a. , x,y,z

b. ccd ,.
c. 10~40 /.
d.,
:1 MCM
2.,.
:1
2.
D.
a. E-Bean
b.,
c.
d.(ATG-SCAN MAN)

17.1
PCB
A.
B.
C.
D.
A LIST
PCB
17.2.1 (Dimension)
1. Outline Dimension
2. Hole to Edge
3. Board Thickness
4. Holes Diameter
5. Line width/space
6. Annular Ring
7. Bow and Twist
8. Plating Thickness
17.1.2 (Surface Inspection)
(Base Material)
1. Measling
2. Crazing
3. Blistering
4. Delamination
5. Weave Exposure
6. Fiber Exposure
7. Haloing

1. Pin hole
2. Void
3. Hole Plug
4. Copper Exposure
5. Foreign particle
6.S/M PAD S/M on Pad
7./ Extra/Missing Hole
8. Gold Finger Defect
9. Roughness
10.S/M S/M Scratch
11.S/M S/M Peeling
12. Legend(Markings)
17.2.3 (Reliability)
1. Solderability
2. Peel strength

3. Micro Section
4.S/M S/M Adhesion
5.Gold Gold Adhesion
6. Thermal Shock
7. Ionic Contamination
8. Moisture and Insulation Resistance
9. Impedance

17.3
A. IPC

IPC-A-600 PCB
IPC-6012
IPC-4101
IPC-D-275
IPC-MF-150
I-STD-003A PCB
IPC/JPCA-6202 FPCB
IPC-TM-650
IPC-SM-840 S/M
IPC-2315 HDI Microvias
B. Military

MIL-P-55110
MIL-P-50884
MIL-P-13949
MIL-STD-105
C.
UL 796 PCB

PCB

(Packaging)
18.1
"" PCB STEP

PCB Flexible PCB

18.1

18.2

PCB
PCB

PCB

1.
2.
3. PE
4.PE (Air Bubble Sheet)
5.
6.
7.
8.
(Vacuum Skin Packaging)

18.2 (Vacuum Skin Packaging)

18.2.1
A. PE PE

B.

a. PE ()( 0.2m/m)

b. 18.3
c. PANEL
PE

C. A. PE B. pump
C. D. PE

D.

E.
a. ""(P/N)
Made in Taiwan()
b.
,,.

19(Trend)
19.1 .

PCB

19.2
19.1 19.2
SMD
19.3

19.3 I.C PACKAGING 19.4(a.b.c.d.e)

19.4

"
"

Rigid PCB Flexible-PCB

BONDING ( 19.5)
MCM (Multichip Module)

1.(Power distribution)
2.(Signal connection)
3.(Heat dissipation)
4.(Protection)

19.5
PCB
19.5.1
, IPC Build-UP
19.7 Build-UP
19.4.2
QFP 208 Motorola "
-Ball Grid Array" BGA

19.8(a.b) IC ILBOLB Substrate PCB

 BGA Prolinx V-BGATessera BGA

A. BGA

(Peripheral) to ( Array) .
208 :TAB BGA
PGALGA BGA(Ball Grid Array) Motorola
19.9:
BGA
MCM BGA BGA CPU
.
B. CSP(Chip Scale Package):

CSP
"" [ < *1.2 ] CSP CSP
BGA CSP

CSP
C. (Build up process):
Build up "
"

D. (Flip Chip Substrate):

"(ILB-Inner Lead Bond)
(OLB-Outer Lead Bond)" OLB BGA PGA PinLead-fram Lead
ILB (Wire Bonding Type)
(Tape Automation Bonding)(Flip Chip Bonding) 19.11:

IC PACKAGE

PCB
DIP 1 mm SMD 0.6 mm
0.4mm
A. Buried Via
20.1
B. Blind Via

20.1
20.2

 20.3 . 20.4 PAD

20.2

Via-in-pad,
RF(Radio frequency), 1GHz .
20.5

spindle

Sequential lamination
20.6
PTH +

Build up Process

Sequential lamination

a.Photo Defind

Blind Via

b.Laser Ablation 2 Excimer

Nd:YAG
c.Plasma Etching Dyconex
DYCOSTRATE
20.1 20.7
Chemical Etching
20.9

, ,
, , , (Niche)
..