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  • Radysis Catalog 120411 r1 120415 p50-p51

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    Plating Chemicals plating chemistry Lead free (Full process chemistry from pre-treatment to post-treatment) Advantages : Methane sulfuric acid based chemistry Cpk > 2. On deposition thickness Good visual quality high speed deposition rate Superior throwing power No dumping of plating bath even after 5 years Suitable for different types of equipment Good deposition on different types of base materials (Cu, Alloy42, Ni..)

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    radysis catalog 120411 r1 120415 p50-p51

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    Plating Chemicals plating chemistry Lead free (Full process chemistry from pre-treatment to post-treatment) Advantages : Methane sulfuric acid based chemistry Cpk > 2. On deposition thickness Good visual quality high speed deposition rate Superior throwing power No dumping of plating bath even after 5 years Suitable for different types of equipment Good deposition on different types of base materials (Cu, Alloy42, Ni..)

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    63 views2 pages

    Radysis Catalog 120411 r1 120415 p50-p51

    Uploaded by

    api-200462502
    Plating Chemicals plating chemistry Lead free (Full process chemistry from pre-treatment to post-treatment) Advantages : Methane sulfuric acid based chemistry Cpk > 2. On deposition thickness Good visual quality high speed deposition rate Superior throwing power No dumping of plating bath even after 5 years Suitable for different types of equipment Good deposition on different types of base materials (Cu, Alloy42, Ni..)

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    of 2

    t : +604 3999 396 f : +604 3988 396 e : info@radysis-asia.com w : radysisgroup.

    com
    1 source, multiple technology
    SPECIALTY CHEMICAL PRODUCTS

    Plating Chemicals



    Plating Chemistry

    Lead Free (Full process chemistry from pre-treatment to post-treatment )

    Advantages :
    Methane sulfuric acid based chemistry
    Cpk > 2.0 on deposition thickness
    Good visual quality
    High speed deposition rate
    Superior throwing power
    No sludge formation
    No dumping of plating bath even after 5 years
    Suitable for different types of equipment
    Good deposition on different types of base materials (Cu,
    Alloy42, Ni ... .) Tin/Lead

    Tin/Lead
    Electroless Ni and Electrolytic Ni (high speed)
    100% Bright Tin
    Immersion/Electrolytic Deflasing Chemicals
    Immersion/Electrolytic Stripping solutions
    Rework stripping solution
    Solvent cleaners







    t : +604 3999 396 f : +604 3988 396 e : info@radysis-asia.com w : radysisgroup.com
    1 source, multiple technology


    Dipping Materials

    Solder oil/Dross reducers
    Solder/Lead-free
    Ball, Bar, Buttons
    Highly pure (100%)
    Tin/Lead
    Cu ball/anode
    Flux






    Immersion
    high temp => 80C to 110C
    low temp => 60C to 75C

    EIectroIytic
    Neutral
    Alkaline

    Advantages
    Water based formulation
    Non-hazardous
    Halide free
    Able to remove flashes/resins bleed for
    different packages without damaging base metal

    Deflashing Chemicals


    Products base

    Immersion
    high temp => 80C to 110C
    low temp => 60C to 75C

    EIectroIytic
    Neutral
    Alkaline

    Advantages

    Water based formulation
    Non-hazardous
    Halide free
    Able to remove flashes/resins bleed for
    different packages without damaging base metal

    SPECIALTY CHEMICAL PRODUCTS

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