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CU 9223 MICROWAVE INTEGRATED CIRCUITS (Regulation 2009) Time : Three hours Answer ALL questions PART A (10 2 = 20 marks) 1. 2. 3. 4. List out four substrates along with their dielectric values. What are the advantages of MMIC technology?
Why lumped components are not realizable at microwave frequencies? Write down the various approximation techniques to perform a filter design.
5. 6.
Why matching is essential? List out the gain formulas to calculate the gain of amplifier circuit.
30 3
7.
8.
9.
10.
30
30
Maximum : 100 marks
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PART B (5 16 = 80 marks) 11. (a) Compare and contrast various conventional technologies. Or (b) (i) (ii) 12. (a) Explain multichip module technology. MMIC technology with the (16) (10)
A microstrip line is composed of zero thickness copper conductors on a substrate having r = 8 .4 , tan 8 = 0 .0005 and thickness 2.4 mm. If the line width is 1 mm and operated at 10 GHz, calculate (i) (ii) The characteristic impedance Or The attenuation due to conductor loss.
(b)
13.
(a)
(b)
The S parameters for the HP HFET 102 GaAS FET at 2 GHz with a bias voltage V gs = 0 are given as follows ( Z 0 = 50 )
30
Or
Explain using flow chart how an amplifier can be designed at microwave frequencies.
3
123 . 6 o
Or Or 2
Design a stepped impedance low pass filter having a cutoff frequency of 4 GHz and a fifth order, 0.5 dB equal ripple response. Assume = R 0 = 100 , Z l = 15 and Z h = 200 .
S 11 = 0 . 894
60 . 6 o , S 21 = 3 . 122
Explain the working of a single ended mixers. Using one port negative resistance concept, explain the working of an oscillator. What are micromachined Antenna? How reconfigurability can be achieved using micro machining technique? How probe station can be used to measure a RF amplifier? Write down the initial setup to perform the measurement.
30 3
15.
(a)
(b)
30
;
Write down the various design methodologies to design active devices. (6)
S 12 = 0 . 020
3
62 . 4 o ;
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