Professional Documents
Culture Documents
11/17/2000
IMAGING
2003
2004 2005
2008 2011
2014
60
60
60
60
60
60
60
60
60
42.5
51
75
59
125
125
50
100
35
50
33
36
74
59
125
100
35
75
32
50
33
36
50
59
125
75
35
75
32
25
27
36
50
37
100
50
35
75
32
25
27
36
50
37
100
50
35
75
32
25
25
36
49
20
75
40
35
50
32
25
17 11.5
36
36
49
24
20
20
75
75
40
20
35
35
50
26
32
32
25
25
8
36
24
20
75
15
35
26
32
25
2003
2004 2005
2008 2011
2014
Gap Width
Date
My Company All
SIA,ITRS
SIA,ITRS
IPC
IPC
NEMI
NEMI
JISSO
JISSO
Delphi
Delphi
Intel
Motorola
Chip Carriers
Product Board Escape
Chip Carriers
Product Board - Low
Hand Held
Cost Perf.
Chip Carriers - High
Product Board - High
Product Board - High
Product Board
Few Chip Module
Product Board
60
60
60
60
60
60
42.5
60
50
75
61
125
65
125
100
75
35
50
33
48
35
51
61
125
50
100
100
75
32
50
33
48
35
51
61
125
50
100
76
75
32
25
27
48
35
51
36
100
50
100
76
75
32
25
27
48
35
51
36
100
50
100
76
75
32
25
2003
60
60
60
25
48
35
51
20
74
30
100
76
75
32
25
17 11.5
36
36
35
35
50
50
20
20
74
74
30
30
100 100
76
76
75
75
32
32
25
25
8
30
35
50
20
74
30
100
76
75
32
25
2004 2005
2008 2011
2014
Trace Thickness
Date
My Company All
60
60
60
60
60
60
60
60
60
JISSO
JISSO
JISSO
12
30
20
5
30
20
5
30
20
5
30
20
5
30
20
5
20
10
5
20
10
3
10
5
3
10
5
2003
2008 2011
2014
PWB Thickness
Date
2004 2005
My Company All
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
JISSO
0.4
0.2
0.2
0.2
0.2
0.1
0.1
0.1
0.1
2003
2008 2011
2014
PWB Length/Width/Area
Chip Carriers
cm2
Date
My Company All
NEMI
NEMI
NEMI
60
Hand Held
Cost Perf.
High Perf
60
60
60
30
30
30
600 600 600
3000 3000 3000
28
400
3000
2003
2004 2005
60
60
60
60
60
28
26
400 300
3000 3000
26
20
300 200
3000 3000
20
200
3000
2004 2005
2008 2011
2014
Panel Size
Date
My Company All
JISSO
JISSO
Chip Carriers
Product Board
60
60
60
60
230 mm x 200 mm
600 mm x 710 mm
60
60
60
60
600 mm x 710 mm
60
Internal Capacitors
Date
My Company All
NIST ATP
Product Boards
60
2003
60
60
2003
2004 2005
60
60
2008 2011
60
2014
60
60
2008 2011
2014
30 pf - 100 nf, 5%
Internal Resistors
Date
My Company All
NIST ATP
60
60
60
60
2003
2004 2005
60
60
60
60
60
2008 2011
2014
Product Boards
TEST ELECTRICAL
Pad Size - micrometers
Date
My Company All
SIA,ITRS
SIA,ITRS
SIA,ITRS
Pad Pitch - micrometers
Chip Carriers
BGA/CSP
F/C
Date
My Company All
SIA,ITRS
SIA,ITRS
SIA,ITRS
SIA,ITRS
SIA,ITRS
SIA,ITRS
SIA,ITRS
Chip Carriers
F/C
Product Board
BGA
Hand Held
Cost Perf.
High Perf
2004 2005
60
60
60
60
60
60
60
60
60
200
100
200
100
160
100
160
100
160
100
160
75
160
75
120
75
120
75
2003
2008 2011
2014
2004 2005
60
60
60
60
60
60
60
60
60
200
200
165
150
120
110
100
50
35
1.27
1.27
1
1
1
0.8
1
1
0.8
1
1
0.8
1
1
0.8
1
1
0.8
0.8 0.65
0.8 0.65
0.65 0.5
0.65
0.65
0.5
2003
2004 2005
2008 2011
2014
Test Voltage
Date
My Company All
IPC
Product Board
60
60
60
60
60
60
60
60
60
100
100
250
250
250
250
250
250
250
2003
2008 2011
2014
Test Current
No Inputs
Continuity Resistance - ohms
Date
My Company All
IPC
Chip Carriers
IPC
Product Board
Isolation Resistance - megohms
Date
My Company All
IPC
Chip Carriers
IPC
Product Board
Resistance Measurement- mohms
Date
2004 2005
60
60
60
60
60
60
60
60
60
20
20
10
10
2003
2008 2011
2014
2004 2005
10
10
10
10
10
10
10
2003
2008 2011
2014
2004 2005
My Company All
IPC
IPC
Chip Carriers
Product Board
100-1 Mohm
Capacitance Measurement
Date
NIST ATP, AEPT Project
30 pf - 100 nf, 5%
TEST, OPTICAL
Minimum Defect
VIA MAKING
Through Hole Dia
No Input
Date
My Company All
2003
2004 2005
2008 2011
2014
60
60
60
60
60
60
60
60
60
300
200
300
200
300
200
275
175
275
175
275
175
275
175
250
150
250
150
2003
2004 2005
2008 2011
2014
My Company All
6:00
6:00 6:00
6:00 6:00
6:00
IPC
6:01
IPC
Aspect Ratio
Date
Product Board
Via Pitch
Date
My Company All
IPC
Microvia Dia - microns
Product Board
Date
My Company All
IPC
Delphi
Intel
Motorola
Product Board
Product Board
Few Chip Module
Product Board
IPC
Product Board
2003
2008 2011
2014
60
60
60
60
60
60
60
60
60
100
100
100
75
75
75
75
50
50
2003
2008 2011
2014
2004 2005
60
60
60
60
60
60
60
60
60
125
200
133
50
125
150
120
50
125
150
100
50
60
150
100
50
60
150
100
50
60
75
100
50
60
75
100
50
60
50
100
50
60
50
100
50
Via Pitch
2004 2005
300 microns
100
120
My Company All
100
IPC Product Board S.O.A.
Microns
80
Delphi Product Board
60
40
20
0
2000
2001
2002
2003
2004
Year
2005
2008
2011
2014
120
My Company All
100
SIA,ITRS Chip
Carriers
SIA,ITRS Product
Board Escape
Microns
80
60
JISSO Product
Board - High
40
20
0
2000
2001
2002
2003
2004
Year
2005
2008
2011
2014
120
100
My Company All
IPC Product Board - Low
NEMI Cost Perf.
Microns
80
JISSO Chip Carriers - High
Delphi Product Board - High
60
40
20
0
2000
2001
2002
2003
2004
Year
2005
2008
2011
2014
120
My Company All
100
SIA,ITRS Chip Carriers
IPC Chip Carriers
Microns
80
NEMI Hand Held
JISSO Product Board
60
Supplier Interchange
40
20
2000
2001
2002
2003
2004
Year
2005
2008
2011
2014
My Company All
IPC Product Board S.O.A.
NEMI Cost Perf.
Delphi Product Board
Intel Few Chip Module
120
100
80
Supplier Interchange
60
40
20
S.O.A.
2014
Year
2002
2000
Microns
140
My Company All
IPC Product Board S.O.A.
NEMI Cost Perf.
Delphi Product Board
Intel Few Chip Module
Motorola Product Board
SIA,ITRS Product Board Escape
JISSO Product Board - Low
140
120
80
JISSO Product Board - High
60
40
2008
Year
2002
0
2000
Microns
100
My Company All
Where
SIA,ITRS
What
Chip Carriers
IPC
USA
Chip Carriers
IPC
USA
NEMI
USA
Hand Held
NEMI
USA
Cost Perf.
JISSO
Japan
Product Board
Supplier Interchange
Delphi
Product Board
Intel
OEM
Motorola
OEM
Product Board
NIST ATP
Product Boards
Why