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FEATURES:
IDT WinChip Processor technology with internal/bus frequencies of 180/60 or 200/66 512K Secondary level cache of pipeline burst SRAM Burst read/write at 3-1-1-1-1; back-to-back burst reads at 3-1-1-1-1-1-1-1 Supports up to 64MB of cacheable system memory (non-PCI memory) Supports ZZ snooze mode power management Thermal transfer "TopHat" system for processor heat dissipation Active thermal feedback (ATF) sensing Internal A/D - digital signaling (SMBUS) across the module interface
Intel 430TX system controller DRAM controller supports EDO and SDRAM at 3.3V Provides PCI CLKRUN# signal to control memory clock on the PCI bus SDRAM clock enable support and self refresh of EDO or SDRAM during Suspend mode Compatible SMRAM (C_SMRAM_ and Extended SMRAM (E_SMRA) mode supports write-back cacheable SMRAM up to 1MB 3.3V PCI bus control, Rev 2.1 complaint 280 position MMC-1 connector interface
BLOCK DIAGRAM
ATF Sense
Processor Core Voltage Host Bus Processor Voltage Regulator PIPELINED BURST SRAM
IDT Winchip
HCLK_1
System Controller
Memory Bus
4268 drw 01 The IDT logo is a registered trademark of Integrated Device Technology, Inc. All others are property of their respective companies.
May 1998
ADVANCE INFORMATION
FUNCTIONAL DESCRIPTION
The IDT Mobile WinChip Processor Module is an integrated building block for system integrators and manufacturers of notebook computers. The module consists of the IDT WinChip processor with MMX technology, a system controller, second level cache, a voltage regulator and a thermal sensor. The IDT Mobile WinChip Processor Module interfaces to the notebook motherboard PCI and memory buses through the system controller. The Block Diagram illustrates interconnect of the components within the module and system interfaces. Heat is transferred from the processor through IDT's TopHat thermal transfer system. The TopHat is configured to provide a standard thermal attach point which can be used to connect additional heat dissapation devices.
SIGNAL DESCRIPTIONS
Table 1 provides a list of signals for the IDT Mobile WinChip Processor Module by category and the corresponding number of signals in each category.
INFORMATION
ADVANCE INFORMATION
Pin# 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51
Row A V_3S MD14 MD15 SRASA# SRASB# Gnd MWEA# MWEB# RAS0#/CS0# RAS1#/CS1# V_3S MD36 MD39 MD37 Gnd MD35 MD34 MD38 MD33 V_3S MD32 MA06 MA07 MA08 Gnd MA09
Row B V_3S MD22 MD23 SCASA# SCASB# Gnd MPD0 MPD4 MPD1 MPD5 V_3S MPD2 MPD6 MPD3 Gnd MPD7 MD48 MD50 MD49 V_3S MD51 MD52 MD53 MD54 Gnd MD55
Row C V_3S AD12 AD13 AD14 AD15 Gnd AD16 AD17 AD18 AD19 V_3S AD20 AD21 AD22 Gnd RAS2#/CS2# RAS3#/CS3# RAS4#/CS4# RAS5#/CS5# V_3 AD23 AD24 AD25 AD26 Gnd AD27
Row D REQ1# REQ2# REQ3# GNT0# GNT1# Gnd GNT2# GNT3# L2_ZZ Reserved V_3S Reserved PPP_PP# CLKRUN# Gnd SM_CLK SM_DATA ATF_INT# SUSCLK V_3 SUS_STAT# V_3 OEM_PU VR_ON Gnd VR_PWRGD
INFORMATION
Pin# 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70
Row A CAS2#/DQM4 CAS3#/DQM3 MA10 V_3S MA11 MD25 MD24 MD26 Gnd MD27 MD28 MD31 MD30 MD29 V_3S OEM_PD FQS0 HCLK1 Gnd
Row B CAS6#/DQM6 CAS7#DQM7 MA12 V_3S /MA13 MD56 MD60 MD58 Gnd MD57 MD61 MD59 MD62 MD63 V_3S PCLK FQS1 HCLK0 Gnd
Row C AD28 AD29 AD30 V_3S AD31 C/BE0# C/CBE1# C/BE2# Gnd C/BE3# IGNNE# FERR# A20M# V_CPUIO TDO ITP0 ITP1 CPU3.3_2.5# Gnd
Row D V_3 V_3 Reserved Reserved INIT# V_CPUIO INTR CPURST Gnd STPCLK# SMI# NMI V_5S V_CPUIO TRST# TDI# TMS TCLK Gnd
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NOTE: Pins B54 and C43 are connected together on the IDT WinChip Mobile Processor Module, and Pins C56 and C44 are connected together on the IDT WinChip Mobile Processor Module.
ADVANCE INFORMATION
CONNECTOR FOOTPRINT
Figure 2 shows the connector pad assignment for the system manufacture I/O module. This footprint is viewed from the primary side of the I/O Module (side of the printed circuit board on which the 280-pin connector is soldered).
A1 B1 C1 D1
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Figure 2. 280-Pin Connector Footprint Pad Numbers, I/O Module Primary Side
CONNECTOR SPECIFICATIONS
The IDT Mobile WinChip Processor Module connector is a surface mount, 0.6 mm pitch, 280-pin connector. Table 3 describes the connector specifications in detail.
Mechanical
INFORMATION
ORDERING INSTRUCTIONS
IDT XXXXX Device Type X Power X Speed X Package X Process/ Temperature Range Blank Commercial (0C to +55C)
180 200
Standard Power
7M9602
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