Electron beam physical vapor deposition (EBPVD)

technology and its equipment

Since the 1980s, EBPVD has been investigated for preparation of TBCs.
A signifi cant development in the 1990s was the invention by Paton Electric
Institute of Welding in Ukraine of a new EBPVD technology which
decreased the preparation cost of EBPVD TBCs. This technology has been
widely applied in the production of TBCs.
The electron beam has a very important role as the thermal source of
EBPVD technology. EBPVD is capable of depositing any type of material.
The deposition mechanism consists of an electron beam formed at
2000 C in an electron gun (either a Pierce gun or an electromagnetism
defl exion gun), followed by acceleration of thermal electrons under high
voltage. When the high-speed electrons hit materials in the ingot, energy is
generated suffi cient to melt and convert material into vapor and then
deposit it onto the substrate. Compared to other preparation methods, this
method has a higher deposition rate. Moreover, deposition parameters can
be easily controlled and the surface is very smooth with a Ra surface value
of about 12 m. There is a strong adhesion between the substrate and
coatings after deposition by EBPVD. Process parameters are easily modifi
ed and the deposition rate can be accurately controlled