MN-PAC5500

Course schedule
Autumn 2014
Lectures Mondays & Thursdays
Date
Week (Mon)
1

35 25 Aug

36 1. Sep

Topics
The role of packaging in -electronics and systems
Single- chip packaging
Topics from materials science:
Binary systems
Polymers
Single- chip packaging

37 8.Sep
Encapsulation and Sealing (?)

38 15. Sep

Multichip packaging

5
6

39 22. Sep
40

Flip-chip
No assigned lectures
Flip-chip

41 6. Oct

42 13. Oct

Flip-chip
3D chip stacking
Wafer-level packaging and heterogenous
integration. Packaging of MEMS.

43 20. Oct

10

44 27. Oct

11

45 3. Nov

12

46 10. Nov

13

47 17. Nov
48 24. Nov
49

Reliability
Heterogenous integration?
Thermal management

Litterature

Lecturer

Tummala
Chs. 1-3
Tummala 7

KAa
HVN
HVN

Callister
Callister
Tummala
Ch. 7
Ch. 9.1-9.6
Tummala
Ch. 15
(15.6-15.7)
Ch. 8
Tummala
Ch. 9.7-9.8

KAa
KAa

Tummala
Ch. 9.7-9.8
+additional

Lecturers:
KAa: Knut Aasmundtveit
HVN: Hoang-Vu Nguyen
EA: Erik Andreassen
SH: Stein Hollung, Norspace
TS:
Thomas Spatscheck, PoLight
EJ:
Erik Johannessen

Wire bonding
lab

EA (?)
EA (?)
KAa/
HVN?
KAa

KAa

Wire bonding
lab
KAa away 18
Sep
Simulation lab
Simulation lab

KAa
Harper
Tumm ch10
+ additional
papers
Tummala
Ch. 5 & 22
Ch. 6

Packaging of biomedical components

Packaging of RF components
Thermal management.
Packaging of optoelectronics
Summary
Exam period starts

Comments

KAa

Company visit
FC lab 1
FC lab 2?

EA
KAa
EJ
SH

Tummala
Ch. 6

KAa
TS
KAa

Only Monday