Constituent

or condition

Copper sulfate bath

Copper fluoborate bath

General

Printed circuit
through-hole

Low copper

High copper

Copper sulfate, CuSO4 5H2O

200-240 (27-32)

60-110 (8-15)

...

...

Sulfuric acid, H2SO4

45-75 (6-10)

180-260 (24-35)

...

...

Copper fluoborate, Cu(BF4)2

...

...

225 (30)

450 (60)

Fluoboric acid, HBF4

...

...

To pH

40 (5)

Copper

50-60 (7-8)

15-28 (2-4)

8 (1)

16 (2)

Sulfuric acid

45-75 (6-10)

180-260 (24-35)

...

...

Specific gravity at 25 C (77 F)

...

...

1.17-1.18

1.35-1.37

Temperature, C (F)

20-50 (68-120)

20-40 (68-105)

20-70 (68-160)

20-70 (68-160)

Current density, A/dm2 (A/ft2)

2.0-10.0 (20-100)

0.1-6.0 (1-6)

7.0-13.0 (70-130)

12-35 (120-350)

Cathode efficiency, %

95-100

95-100

95-100

95-100

Voltage, V

6-12

pH

...

...

0.8-1.7

<0.6

Anodes

Copper(a)

Copper(a)

Copper(b)

Copper(b)

Bath composition, g/L (oz/gal)

Bath analysis, g/L (oz/gal)

Operating conditions

(a) Phosphorized copper (0.02-0.08% P) is recommended.

(b) High-purity, oxygen-free, nonphosphorized copper is recommended.