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Service Manual

Internal Use Only

Service Manual
U990/KU990

Model : U990/KU990

Date: November, 2007 / Issue 1.0


Table Of Contents
1. INTRODUCTION.................................. 5 4.11 Micro SD trouble ....................................122
1.1 Purpose ...................................................... 5 4.12 Audio trouble..........................................123
1.2 Regulatory Information ............................... 5 4.13 Camera trouble ......................................136
4.14 Main LCD trouble...................................142
2. PERFORMANCE ..................................7 4.15 Bluetooth trouble....................................145
4.16 Bluetooth RF Test..................................146
2.1 System Overview.........................................7
4.17 Touch Screen trouble ............................147
2.2 Usable environment.....................................8
2.3 Radio Performance......................................8
5. DOWNLOAD.....................................148
2.4 Current Consumption.................................16
2.5 RSSI BAR ..................................................17 5.1 Introduction ..............................................148
2.6 Battery BAR ...............................................17 5.2 Downloading Procedure ..........................148
2.7 Sound Pressure Level ...............................18 5.3 Troubleshooting Download Errors ..........161
2.8 Charging ....................................................18 5.4 Caution ....................................................166

3. TECHNICAL BRIEF............................19 6. BLOCK DIAGRAM ...........................167


3.1 General Description ...................................19 6.1 GSM & UMTS RF Block ..........................167
3.2 GSM Mode.................................................21 6.2 Interface Diagram ....................................169
3.3 UMTS Mode...............................................25
3.4 LO generation and distribution circuits ......27
7. CIRCUIT DIAGRAM..........................171
3.5 Off-chip RF Components ...........................27
3.6 Digital Baseband (DBB/MSM6280) ...........37 8. BGA IC PIN MAP..............................183
3.7 Subsystem(MSM6280) ..............................40
3.8 Power Block...............................................48 9. PCB LAYOUT ...................................191
3.9 External memory interface.........................53
3.10 H/W Sub System .....................................55 10. Calibration......................................199
3.11 Feature List..............................................72 10.1 Usage of Hot-Kimchi..............................199
3.12 Multimedia Chip Interface ........................78
3.13 Touch Screen Interface ...........................85 11. EXPLODED VIEW & REPLACEMENT
3.14 Main Features..........................................86 PART LIST ..................................... 203
11.1 EXPLODED VIEW ................................ 203
4. TROUBLE SHOOTING.......................93 11.2 Replacement Parts
4.1 RF Component ..........................................93 <Mechanic component> ....................... 205
<Main component> ............................... 208
4.2 SIGNAL PATH ...........................................94
11.3 Accessory ............................................. 226
4.3 Checking VCTCXO Block ..........................96
4.4 Checking Front-End Module Block ............98
4.5 Checking UMTS Block.............................101
4.6 Checking GSM Block...............................106
4.7 Power on trouble......................................112
4.8 SIM detect trouble....................................117
4.9 Key sense trouble ( KEYPAD ) ................118
4.10 Keypad backlight trouble .......................120

Copyright © 2007 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only -4- Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.

1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of commoncarrier telecommunication service of facilities accessed through or
connected to it. The manufacturer will not be responsible for any charges that result from such
unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.

Copyright © 2007 LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
1. INTRODUCTION

E. Notice of Radiated Emissions


This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation


A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

LGE Internal Use Only -6- Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE

2. PERFORMANCE

2.1 System Overview

Item Specification

Shape GSM900/1800/1900 and WCDMA2100 - Bar type Handset

Size 103.5 X 54.4 X 14.8 mm

Weight Under 112 g (with 1000mAh Battery)

Power 3.7 V normal, 1000 mAh Li-Ion

Talk Time Over 170 min (WCDMA, Tx=10 dBm, Voice)

with 1000mAh) Over 200 min (GSM, Max Tx-29dBm, Voice)

Standby Time Over 250 Hrs (WCDMA, DRX=1.28)

(with 1000mAh) Over 250 Hrs (GSM, Paging period=5)

Antenna Internal type

LCD Main 3” TFT, WQVGA, 262K

LCD Backlight White LED Back Light

Camera 5.0 Mega pixel + VGA Video Call Camera

Vibrator Yes (Coin Type)

LED Indicator No

MIC Yes

Receiver Yes

Earphone Jack Yes (18 pin)

Connectivity Bluetooth, USB

External Memory Yes(Micro SD)

I/O Connect 18 Pin

Copyright © 2007 LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
2. PERFORMANCE

2.2 Usable environment

1) Environment

Item Specification

Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]

Operation Temp -20 ~ +60°C

Storage Temp -30 ~ +80°C

Humidity 85 % (Max)

2) Environment (Accessory)
Reference Spec. Min Typ. Max Unit

TA Power Available power 100 220 240 Vac


* CLA : 12 ~ 24 V(DC)

2.3 Radio Performance

1) Transmitter - GSM Mode


No Item GSM DCS & PCS

9k ~ 1GHz -39dBm
100k~1GHz -39dBm
MS allocated 1G~[A]MHz -33dBm

Channel [A]M~[B]MHz -39dBm


1G~12.75GHz -33dBm
Conducted [B]M~12.75GHz -33dBm

1 Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm

Emission 880M~915MHz -62dBm 880M~915MHz -62dBm

915M~1GHz -60dBm 915M~1GHz -60dBm


Idle Mode
1G~[A]MHz -50dBm 1G~[A]MHz -50dBm

[A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm

[B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm


* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910

LGE Internal Use Only -8- Copyright © 2007 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE

No Item GSM DCS & PCS

30M~1GHz -36dBm
30M ~ 1GHz -36dBm
MS allocated 1G~[A]MHz -30dBm

Channel [A]M~[B]MHz -36dBm


1G ~ 4GHz -30dBm
Radiated [B]M~4GHz -30dBm

2 Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm

Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm

915M~1GHz -57dBm 915M~1GHz -57dBm


Idle Mode
1G~[A]MHz -47dBm 1G~[A]MHz -47dBm
[A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm

[B]M~4GHz -47dBm [B]M~4GHz -47dBm

3 Frequency Error ±0.1ppm ±0.1ppm

±5(RMS) ±5(RMS)
4 Phase Error
±20(PEAK) ±20(PEAK)

3dB below reference sensitivity 3dB below reference sensitivity

Frequency Error RA250 : ±200Hz RA250: ±250Hz

5 Under Multipath and HT100 : ±100Hz HT100: ±250Hz

Interference Condition TU50 : ±100Hz TU50: ±150Hz

TU3 : ±150Hz TU1.5: ±200Hz

0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB

200kHz -30dB 200kHz -30dB


250kHz -33dB 250kHz -33dB

Due to 400kHz -60dB 400kHz -60dB

modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB


Output RF
6 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB
Spectrum
3000 ~ 6000kHz -71dB ≥6000kHz -73dB

≥6000kHz -77dB

400kHz -19dB 400kHz -22dB


Due to
600kHz -21dB 600kHz -24dB
Switching
1200kHz -21dB 1200kHz -24dB
transient
1800kHz -24dB 1800kHz -27dB
** In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910

Copyright © 2007 LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
2. PERFORMANCE

No Item GSM DCS & PCS

Frequency offset 800kHz

Intermodulation product should


7 Intermodulation attenuation –
be Less than 55dB below the

level of Wanted signal

Power control Power Tolerance Power control Power Tolerance

Level (dBm) (dB) Level (dBm) (dB)

5 33 ±3 0 30 ±3

6 31 ±3 1 28 ±3
7 29 ±3 2 26 ±3

8 27 ±3 3 24 ±3

9 25 ±3 4 22 ±3

10 23 ±3 5 20 ±3

8 Transmitter Output Power 11 21 ±3 6 18 ±3

12 19 ±3 7 16 ±3

13 17 ±3 8 14 ±3

14 15 ±3 9 12 ±4

15 13 ±3 10 10 ±4

16 11 ±5 11 8 ±4

17 9 ±5 12 6 ±4

18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5

15 0 ±5

9 Burst timing Mask IN Mask IN

LGE Internal Use Only - 10 - Copyright © 2007 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE

2) Transmitter - WCDMA Mode

No Item Specification

1 Maximum Output Power Class 3 : +24dBm(+1/-3dB)

2 Frequency Error ±0.1ppm

3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +16/+24

5 Minimum Output Power -50dBm(3.84MHz)

Qin/Qout : PCCH quality levels

6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB

Ton@DPCCH/Ior : -24 -> -18dB

7 Transmit OFF Power -56dBm(3.84MHz)

±25us
8 Transmit ON/OFF Time Mask
PRACH,CPCH,uplinlk compressed mode

±25us

Power varies according to the data rate


9 Change of TFC
DTX : DPCH off
(minimize interference between UE)

10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)

11 Occupied Bandwidth(OBW) 5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M
12 Spectrum emission Mask
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M

Copyright © 2007 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
2. PERFORMANCE

No Item Specification

33dB@5MHz, ACP>-50dBm
13 Adjacent Channel Leakage Ratio(ACLR)
43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1K BW

-36dBm@f=50KHz~30MHz, 10K BW

-36dBm@f=30MHz~1000MHz, 100K BW

Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW


14
(*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K

(*)-67dBm@f=925~935MHz, 100K BW

(*)-79dBm@f=935~960MHz, 100K BW
(*)-71dBm@f=1805~1880MHz, 100K BW

-31dBc@5MHz,Interferer -40dBc
15 Transmit Intermodulation
-41dBc@10MHz, Interferer -40dBc

17.5%(>-20dBm)
16 Error Vector Magnitude (EVM)
(@12.2K, 1DPDCH+1DPCCH)

-15dB@SF=4.768Kbps, Multi-code
17 Transmit OFF Power
transmission

3)Receiver - GSM Mode

LGE Internal Use Only - 12 - Copyright © 2007 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE

3) Transmitter - HSDPA Mode

No Item Specification
Sub-Test
1 Maximum Output Power
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
Sub-test Power Start of Ack/Nack Power Transmitter
in table step boundary step power step
C.10.1.4 size, P tolerance
[dB] [dB]
2 HS-DPCCH
1 Start of Ack/Nack 6 +/- 2.3
2 Start of CQI 1 +/- 0.6
5
3 Middle of CQI 0 +/- 0.6
4 End of CQI 5 +/- 2.3
3 Spectrum Emission Mask Sub-Test : 1=1/15, 2=12/15, 3=13/15,
4=15/8, 5=15/7, 6=15/0
Frequency offset Minimum Measurement
from carrier ∆f requirement Bandwidth
2.5 ~ 3.5 MHz -35-15(∆f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1(∆f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10(∆f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
4 Adjacent Channel Leakage Sub-Test : 1=1/15, 2=12/15, 3=13/15,
Power Ratio (ACLR) 4=15/8, 5=15/7, 6=15/0

> 33 dB @ ±5 MHz
> 43 dB @ ±10 MHz
5 Error Vector Magnitude 3GPP Not Complete

Copyright © 2007 LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
2. PERFORMANCE

4)Receiver - GSM Mode

No Item GSM DCS & PCS

1 Sensitivity (TCH/FS Class II) -105dBm -105dBm


Co-Channel Rejection
2 C/Ic=7dB Storage -30 ~ +85
(TCH/FS Class II, RBER, TU high/FH)

3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB

Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB

Wanted Signal :-98dBm 1st Wanted Signal :-96dBm 1st

4 Intermodulation Rejection interferer:-44dBm 2nd interferer:-44dBm 2nd

interferer:-45dBm interferer:-44dBm

Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm


5
(TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency

LGE Internal Use Only - 14 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE

5) Receiver - WCDMA Mode

No Item Specification

1 Reference Sensitivity Level -106.7 dBm(3.84 MHz)

-25dBm(3.84MHz)

2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(Class3)

33dB
3 Adjacent Channel Selectivity (ACS)
UE@+20dBm output power(Class3)

-56dBm/3.84MHz@10MHz

4 In-band Blocking UE@+20dBm output power(Class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@f=2050~2095 and

2185~2230MHz

UE@+20dBm output power(Class3)

-30dBm/3.84MHz@f=2025~2050 and

5 Out-band Blocking 2230~2255MHz

UE@+20dBm output power(Class3)

-15dBm/3.84MHz@f=1~2025 and

2255~12500MHz

UE@+20dBm output power(Class3)

-44dBm CW
6 Spurious Response
UE@+20dBm output power(Class3)

-46dBm CW@10MHz

7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz

UE@+20dBm output power(Class3)

-57dBm@f=9KHz~1GHz, 100K BW

8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW

-60dBm@f=1920MHz~1980MHz, 3.84M BW

-60dBm@f=2110MHz~2170MHz, 3.84M BW

Copyright © 2007 LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
2. PERFORMANCE

6) Receiver - HSDPA Mode

No Item Specification
1 Maximum Input Level Sub-Test : 1=1/15, 2=12/15, 3=13/15,
(BLER or R), 16QAM Only 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps

2.4 Current Consumption

1) KU990/U990 Current Consumption

Stand by Voice Call VT


Under 4.00 mA Under 350 mA Under 550mA
WCDMA
(DRX=1.28) (Tx=10dBm) (Tx=10dBm)
Under 4.00 mA Under 300 mA
GSM Paging=5 period (Tx=29dBm)

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test
Condition : Speaker off, LCD backlight On)

LGE Internal Use Only - 16 - Copyright © 2007 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE

2.5 RSSI BAR


Level Change WCDMA GSM

BAR 4 → 3 -88 ± 2 dBm -90 ± 2 dBm

BAR 3 → 2 -98 ± 2 dBm -95 ± 2 dBm

BAR 2 → 1 -108 ± 2 dBm -100 ± 2 dBm

BAR 1 → 0 -112 ± 2 dBm -106 ± 2 dBm

2.6 Battery BAR


Indication Standby

Bar 4 Over 3.81 ± 0.03V

Bar 4 → 3 3.80 ± 0.03V

Bar 3 → 2 3.70 ± 0.03V

Bar 2 → 1 3.61 ± 0.03V

Bar 1 → Empty 3.49 ± 0.03V

Low Voltage, 3.49 ± 0.03V (Stand-by) / 3.49 ± 0.03V (Talk)

Warning message+ Blinking [Interval : 3min(Stand-by) / 1min(Talk)]

3.20 ± 0.03V (Stand-by)


Power Off
3.10 ± 0.03V (Talk)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 17 - LGE Internal Use Only
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2. PERFORMANCE

2.7 Sound Pressure Level


No Test Item Specification
1 Sending Loudness Rating (SLR) 8 ±3 dB
Nor -4 ± 3 dB
2 Receiving Loudness Rating (RLR)
Max -15 ± 3 dB
3 Side Tone Masking Rating (STMR) Min 17 dB
MS
4 Echo Loss (EL) Min 40 dB
5 Idle Noise-Sending (INS) Max -64 dBm0p
Nor Under -47 dBPA
6 Idle Noise-Receiving (INR)
Max Under -36 dBPA
7 Sending Loudness Rating (SLR) 8±3dB
Nor -1 ±3 dB
8 Receiving Loudness Rating (RLR)
Max -12 ±3 dB
9 Side Tone Masking Rating (STMR) Min 25 dB
Headset
10 Echo Loss (EL) Min 40 dB
11 Idle Noise-Sending (INS) Max -55 dBm0p
Nor Under -45 dBPA
12 Idle Noise-Receiving (INR)
Max Under -40 dBPA

TDMA Noise
-. GSM : Power Level : 5
DCS/PCS : Power Level : 0
(Cell Power : -90 ~ -105 dBm)
MS and
13 Max Under -62 dBm
Headset
-. Acoustic (Max Vol.)
MS/Headset SLR : 8 ± 3dB
MS/Headset RLR : -15 ± 3dB/-12dB
(SLR/RLR : Mid-value setting)

2.8 Charging
• Charging Method : CC & CV (Constant Current and Constant Voltage)
• Maximum Charging Voltage : 4.2 V
• Maximum Charging Current : 600 mA
• Normal Battery Capacity : 1000 mAh
• Charging Time : Max 3 hours (except for trickle charging time)
• Full charging indication current (charging icon stop current) : 80 mA
• Cut-off voltage : 3.20 V (Stand-By), 3.10V (Talk)

LGE Internal Use Only - 18 - Copyright © 2007 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 General Description


The U990 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based
GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF
architecture to eliminate intermediate frequencies, directly converting signals between RF and
baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset
phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.

[Fig 1.1] Block diagram of RF part

1
QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

Copyright © 2007 LG Electronics. Inc. All right reserved. - 19 - LGE Internal Use Only
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3. TECHNICAL BRIEF

A generic, high-level functional block diagram of U990 is shown in Figure 1-1. One antenna collects
base station forward link signals and radiates handset reverse link signals. The antenna connects with
receive and transmit paths through a FEM(Front End Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that
translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx
analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx
baseband outputs share the same inputs to the MSM IC.
For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM
device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The
RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then
amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge
from the RTR6275 transceiver.
In the GSM receive path, the received RF signals are applied through their band-pass filters and
down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are
shared with the UMTS receiver and routed to the MSM IC for further signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency,
is divided into phase and amplitude components to produce an open-loop Polar topology:
1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated
signal, to a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power
amplifier from a DAC within the MSM
U990 power supply voltages are managed and regulated by the PM6650 Power Management IC. This
versatile device integrates all wireless handset power management, general housekeeping, and user
interface support functions into a single mixed signal IC. It monitors and controls the external power
source and coordinates battery recharging while maintaining the handset supply voltages using low
dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for
monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip
variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter
circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout
and crystal oscillator signal presence are monitored to protect against detrimental conditions.

LGE Internal Use Only - 20 - Copyright © 2007 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF

3.2 GSM Mode

3.2.1 GSM Receiver


The Dual-mode U990’s receiver functions are split between the three RFICs as follows:
• GSM-900, DCS-1800, PCS-1900 and UMTS-2100 modes both use the RTR6275 IC only. Each
mode has independent front-end circuits and down-converters, but they share common baseband
circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-
controlled parameters.
RF Front end consists of antenna, antenna switch module (LSHS-M090UH) which includes three RX
saw filters (GSM-900, DCS-1800 and PCS-1900). The antenna switch module allows multiple
operating bands and modes to share the same antenna. In U990, a common antenna connects to one
of six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-
1800, PCS-1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires
simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that
separates receive and transmit signals. GSM900, DCS1800, and PCS1900 operation is time division
duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not
required.

Control Logic (L : 0 ~ 0.1V, H : 2.6 ~ 2.8V)

Vc3 Vc2 Vc1 Vdd


GSM900 Tx L H H H
DCS1800/PCS1900 Tx L L H H
UMTS Tx/Rx H L H H
GSM 900 Rx L L/H L H
DCS 1800 Rx H L/H L H
PCS 1900 Rx L L/H L H

L/H : L and H are acceptable

[Table 1.1] Antenna Switch Module Control logic

2
The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application
Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS
Software documentation for details.

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The GSM900, DCS1800, and PCS1900 receiver inputs of RTR6275 are connected directly to the
transceiver front-end circuits(filters and antenna switch module). GSM900, DCS1800, and PCS1900
receiver inputs use differential configurations to improve common-mode rejection and second-order
non-linearity performance. The balance between the complementary signals is critical and must be
maintained from the RF filter outputs all the way into the IC pins
Since GSM900, DCS1800, and PCS1900 signals are time-division duplex (the handset can only
receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency
duplexers - this is accomplished in the switch module.
The GSM900, DCS1800, and PCS1900 receive signals are routed to the RTR6275 through band
selection filters and matching networks that transform single-ended 50-Ωsources to differential
impedances optimized for gain and noise figure. The RTR input uses a differential configuration to
improve second-order inter-modulation and common mode rejection performance. The RTR6275 input
stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The
downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q)
having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter
circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6280 IC
for further processing (an interface shared with the RFR6275 UMTS receiver outputs)

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[Fig 1.2] RTR6275 RX feature

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3.2.2 GSM Transmitter


The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT) include on-chip output matching
inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The
capacitor value may be optimized for specific applications and PCB characteristics based on pass-band
symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.

6pF 68Ω

91Ω 91Ω

5pF 51Ω

120Ω 120Ω

[Fig 1.3] GSM Transmitter matching

The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design
guideline shows a tri-band GSM application.

Both high-band and low band outputs are followed by resistive pads to ensure that the load Presented
to the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filter
to remove noise-spurious components and noise that would be amplified by the PA and appear in the
GSM Rx band

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3.3 UMTS Mode

3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx
input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides
differential downconverter. This second stage input is configured differentially to optimize second-order
intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and
the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic
range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-
tobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass
filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter
circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with
GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is
downconverting GSM signals and on when the UMTS is operating.

3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These
analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-
converter output is amplified by multiple variable gain stages that provide transmit AGC control. The
AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated
matching inductor that simplifies the external matching network to a single series capacitor to achieve
the desired 50-Ω interface.

The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly
high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer
to the antenna through the switch module.
The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip
loop filter components and the VC-TCXO. This provides a simplified design for multimode applications.
The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital
logic generator.

UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals
for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to
translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC
design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS
2100/1900 and UMTS 850 mode transmitting.
This design guideline shows only UMTS 2100 applications.

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[Figure 1.4] RTR6275 IC functional block diagram

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3.4 LO generation and distribution circuits


The integrated LO generation and distribution circuits are driven by internal VCOs to support various
modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE and UMTS band
upconverters and downconverters; with the help of these LO generation and distribution circuits, true
zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the
signal directly from RF to baseband and from baseband to RF.

Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the
RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS
2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM850,
GSM900, DCS1800, and PCS1900. The second synthesizer (PLL2) provides the LO for the UMTS
2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer
frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates
most of PLL loop filter components onchip except two off-chip loop filter series capacitors, and
significantly reduces off-chip component requirement. With the integrated fractional-N PLL
synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time,
and low-integrated phase error.

3.5 Off-chip RF Components

3.5.1 UMTS PAM (U105: AWT6277R)


The UMTS PA output power is monitored by power detector circuits (U101 : RTR6275) . This detector
voltage can be used for transmitter calibration and monitor to meet RF system specification.

FL104
EFCH1950TDF1
2

1
4
8

C159
+VPWR
ANT

GND1
GND2
GND3

FL103 8.2p
4 5 C161
SAYZY1G95EB0B00 C160 C162 C163 C164 O1 G3 1
22u 0.01u 100p 1u IN WCDMA_2100_TX_OUT
GND6
GND5
GND4

G2 G1
L123
56p
RX

L124
TX

3 2
15nH C165
3.3nH NA L122
7

3
6
9

U105 NA

11
GND5
U104 10
9
VCC2 VCC1
1
2
C170 GND4 RFIN
C169 5.6p SCDY0003403 8 3
RFOUT GND1
7 4
1

1.8p GND3 VMODE PA_R1


4.7nH 6 5
OUT

IN

L128 L126
GND2 VREF
Q100
20dB 8.2nH
VREG_TCXO_2.85V
50OHM

AWT6277R
COUP

C173 PA_ON
4

100p
R124 R123
5

51 PWR_DET
68 KRX102E
R125 R126
100 100
8 dB

[Figure 1.5] UMTS PAM, Duplexer, Coupler

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3.5.2 VCTCXO (X100 : TG-5010LH(19.2M))


The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the
reference frequency for all RFIC synthesizers as well as clock generation functions within the
MSM6280 IC. The oscillator frequency is controlled by the MSM6280 IC.s TRK_LO_ADJ pulse density
modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC
lowpass filter is recommended on this control line.

The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up
interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller
functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output
voltage is used to power the VCTCXO and is enabled before most other regulated outputs.
Any GSM mode power control circuits within the MSM6280 IC require a reference voltage for proper
operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6275 IC
GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 µF low
frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both
sides, plus ground above and below if routed on internal layers.

3.5.3 Front-End Module (FL100 : LSHS-M090UH)


This equipment uses a single antenna to support all handset operating modes, with an antenna switch
module select the operating frequency and band. UMTS operation requires simultaneous reception
and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and
transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10],
and GPIO[11]). These GPIOs are programmed to be ANT_SEL0, ANT_SEL1, and ANT_SEL2
respectively.

Vc3 Vc2 Vc1 Vdd


GSM900 Tx L H H H
DCS1800/PCS1900 Tx L L H H
UMTS Tx/Rx H L H H
GSM 900 Rx L L L H
DCS 1800 Rx H L L H
PCS 1900 Rx L L L H

[Table 1.2] Front End Module control logic

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3.5.4 PMIC Functional Block Diagram (U501 : PM6650-2M)


• Input power management
- Valid external supply attachment and removal detection
- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources
- Supports lithium-ion main batteries
- Trickle, constant current, constant voltage, and pulsed charging of the main battery
- Supports coin cell backup battery (including charging)
- Battery voltage detectors with programmable thresholds
- VDD collapse protection
- Charger current regulation and real-time monitoring for over-current protection
- Charger transistor protection by power limit control
- Control drivers for two external pass transistors and one external battery MOSFET MOSFET is optional
- Voltage, current, and power control loops
- Automated recovery from sudden momentary power loss
• Output voltage regulation
- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG
- Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA
(or second MSMC) supply voltages
- Supports dynamic voltage scaling (DVS) for MSMC and PA
- Eleven low dropout regulator circuits with programmable output voltages, implemented using three
different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power
MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits.
- All regulators can be individually enabled/disabled for power savings
- Low power mode available on MSMA and MSMP regulators
- All regulated outputs are derived from a common bandgap referenceclose tracking
• Integrated handset-level housekeeping functions reduces external parts count, size, cost
- Analog multiplexer selects from 8 internal and up to 18 external inputs
- Multiplexer outputs offset and gain are adjusted, increasing the effective ADC resolution
- Adjusted multiplexer output is buffered and routed to an MSM device ADC
- Dual oscillators -32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock
- Crystal oscillator detector and automated switch-over upon lost oscillation
- Real time clock for tracking time and generating associated alarms
- On-chip adjustments minimize crystal oscillator frequency errors
- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal
- TCXO buffer control for optimal QPH/catnap timing
- Three-stage over-temperature protection (smart thermal control)
• Integrated handset-level user interfaces
- Four programmable current sinks recommended as keypad backlight, LCD backlight,
camera flash, and general-purpose drivers
- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments
- Speaker driver with programmable gain, turn-on time, and muting; differential operation
(drives external 8 Ω speakers with volume controlled 500 mW)

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• IC-level interfaces
- MSM device-compatible 3-line SBI for efficient initialization, status, and control
- Supports the MSM devices interrupt processing with an internal interrupt manager
- Many functions monitored and reported through real-time and interrupt status signals
- Dedicated circuits for controlled power-on sequencing, including the MSM devices reset signal
- Several events continuously monitored for triggering power-on/power-off sequences
- Supports and orchestrates soft resets
- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to
computers as a USB peripheral, or connecting the MSM device to other peripherals
- RUIM level translators enable MSM device interfacing with external modules
• Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or current
sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an
LED driver, and a reference voltage buffer.
• Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical
ground, mechanical stability, and thermal relief

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[Figure 1.7] PM6650 Block Diagram

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3.5.5 GSM PAM (U101:TQM7M5003)


The TQM7M5003 is an extremely small (7 x 7 mm), GSM/EDGE PAM for handset applications. This
module has been optimized for excellent EDGE efficiency and Pout in a Polar Loop environment at
EDGE class E2+ operation while maintaining high GSM/GPRS efficiency.
The small size and high performance is achieved with high-reliability 3 rd generation InGaP HBT
technology. With 50ߟ and output, no external matching or bias components are required.
The module incorporates two highly-integrated InGaP power amplifier die with a CMOS controller.
Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q
passives technology for optimal performance. The CMOS controller implements a fully integrated
power control within the module for GSM operations, and serves as the AM/AM path in EDGE
operations. This eliminates the need for any external couplers, power detectors, current sensing etc.,
to assure the output power level. The module has Tx enable and band select inputs. Module
construction is a low-profile overmolded landgrid array on laminate.

14 1 R111
GND6 DCS_PCS_IN DCS_PCS_TX
68
13 2
GND5 BS GSM_PA_BAND R112 R113
91 10 dB 91
12 3
VCC TX_EN GSM_PA_EN
U101
11 TQM7M5003 4
C136 8p GND4 VBATT +VPWR
C137 C135
DCS_PCS_OUT

10 5 33u
C138 GND3 GND1 1u

L112
NA
9
GSM_OUT VRAMP
6 FL101
GND8

GND7

3 2
15nH 8 7
EFCH897MTDB1
G2 G1 R114
GND2 GSM_IN IN GSM_TX
O1 G3 1
51
17

16

15

4 5 8 dB
R117 2.2K R118 R119
GSM_PA_RAMP 120 120

C146 10p C143


68p

C142
L113
4.7nH
0.75p
GSM_PA_BAND MODE
LOW GSM
HIGH DCS/PCS
PQ

[Figure 1. 8] GSM PAM Schematic

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3.5.6 UMTS Duplexer(FL103:SAYZY1G95EB0B00)


A UMTS duplexer splits a single operating band into receive and transmit paths. Important
performance requirements include;
• Insertion loss, this component is also in the receive and transmit paths ;
In the U990 typical losses : UMTS2100_ Tx = 1.5 dB, UMTS2100_ Rx = 1.8 dB
• Out-of-band rejection or attenuation, the duplexer provides input selectivity for the receiver, output
filtering for the transmitter, and isolation between the two. Rejection levels for both paths are
specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver
performance:
• Rx-band isolation, the transmitter is specified for out-of-band noise falling into the Rx band. This
noise leaks from the transmit path into the receive path, and must be limited to avoid degrading
receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and
Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 46.7
dB.
• Tx-band isolation, the transmit channel power also leaks into the receiver. In this case, the leakage is
outside the receiver passband but at a relatively high level. It combines with Rx band jammers to
create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band
isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum
duplexer Tx-band isolation value is about 51.7dB.
• Passband ripple, the loss of this fairly narrowband device is not flat across its passband. Passband
ripple increases the receive or transmit insertion loss at specific frequencies, creating performance
variations across the band.s channels, and should be controlled.
• Return loss, minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).
• Power handling, high power levels in the transmit path must be accommodated without degraded
performance. The specified level depends on the operating band class and mobile station class (per
the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics
depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be
used between the UMTS PA and duplexer to assure proper performance.

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3.5.7 UMTS Rx RF filter (FL102 : EFCH2140TDE1)


An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical
as losses before the LNA. The most important parameters of this component include:
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
- Far out-of-band signals - ranging from DC up to the first band of particular concern and from the
last band of particular concern to beyond three times the highest passband frequency.
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still
presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must
provide rejection of this Tx-band leakage.
- Other frequencies of particular concern . bands known to include other wireless transmitters that
may deliver significant power levels to the receiver input.

[Table 1.3] UMTS Rx SAW Filter Specification

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3.5.8 Bluetooth (M800 : LBRQ-2B43A)


The MSM6280 includes BT baseband embedded BT 1.1 compliant baseband core, so the other
bluetooth components are bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system
architecture in the U990.

[Figure 1.9] Bluetooth system architecture

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3.5.9 FM Radio (U103 : TEA5766UK)


This FM Module is a single chip, electronically tuned, FM stereo radio with RDS/RBDS demodulator
and decoder for low voltage applications, with fully integrated IF selectivity and demodulation. This
equipment tunes the European, US, and Japanese FM bands.
Figure1.10 shows the FM Radio system architecture in the U990.

[Figure 1.10] FM Radio system architecture in the U990

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3. BB Technical Description

3.6 Digital Baseband (DBB/MSM6280)

3.6.1 General Description

A. Features (MSM6280)
• Support for multimode operation - HSDPA, tri-band WCDMA (UMTS), quad GSM/GPRS/EDGE
• Support for HSDPA downlink up to 7.2Mbps (initial commercial release will support 3.6Mbps
• HSDPA. Later releases will have support for 7.2 Mbps HSDPA)
• Support for WCDMA (UMTS) uplink data rate up to 384 kbps
• High-performance ARM926EJ-S running at up to 225 MHz (later at 270 MHz for 7.2 Mbps HSDPA)
• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets
• QDSP4000 high-performance DSP cores
• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals
• QcameraTM with 15 fps QVGA viewfinder resolution, and support for 4 MP camera sensors
• Direct interface to digital camera module with video front end (VFE) image processing
• True 3D graphics for advanced wireless gaming
• SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI
integrity. Support for Q-fuse.
• Audio on par with portable music players
• Vocoder support (AMR, FR, EFR, HR)
• Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology
• SD/SDIO hardware support

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Figure. Simplified Block Diagram of Baseband

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Figure. Simplified Block Diagram of RF

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3.7 Subsystem(MSM6280)

3.7.1. ARM Microprocessor Subsystem


The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM, including control of the
external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a
QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the
functionality of the RTR6275, RFR6275 and PM6650 devices.

3.7.2 WCDMA R99 features


The MSM6280 device supports release 99 June 2004 of the W-CDMA FDD standard, including the
following features:
■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following
restrictions:
❏ The downlink supports the following specifications:
- Up to four physical channels, including the broadcast channel (BCH), if present
- Up to three dedicated physical channels (DPCHs)
- Spreading factor (SF) range support from 4 to 256
- The following transmit diversity modes are supported:
Space time transmit diversity (STTD)
Time-switched transmit diversity (TSTD)
Closed-loop feedback transmit diversity (CLTD)
■ The uplink supports the following specifications:
❏ The uplink provides the following UE support:
- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary
- A maximum data rate of 384 kbps
❏ Full SF range support from 4 to 256
■ SMS (CS and PS)
■ PS data rate - 384 kbps DL / 384 kbps UL
■ CS data rate - 64 kbps DL / 64 kbps UL
■ AMR (all rates)

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3.7.3 HSDPA features


The MSM6280 device supports the HSDPA release 5 standard:
■ Supports HS-DSCH (HS-SCCH, HS-PDSCH and HS-DPCCH) in addition to the R99 transport
channels as defined in 3GPP specifications.
■ Supports a maximum of four simultaneous HS-SCCH channels as defined in 3GPP specifications.
■ Supports a maximum of 10 HS-PDSCH channels and supports both QPSK and 16 QAM modulation.
It supports UE category 6 in SW release 2.0 and category 8 in SW release 4.0.
■ Supports CQI, and ACK/NACK on HS-DPCCH channel as defined in 3GPP specifications.
■ Supports all incremental redundancy versions for HARQ, as defined in 3GPP specifications.
■ Can switch between HS-PDSCH and DPCH channel resources, as directed by the network.
■ Can be configured to support any of the two power classes 3 or 4 as defined in 3GPP R5
specifications (25.101).
■ Supports network activation of compressed mode by SF/2 or HLS on the DPCH for conducting inter-
frequency or inter-RAT measurements when the HS-DSCH is active.
■ Supports STTD on both associated DPCH and HS-DSCH simultaneously.
■ Supports CLTD mode 1 on the DPCH when the HS-PDSCH is active.
■ Supports STTD on HS-SCCH when either STTD or CLTD Mode 1 are configured on the associated
DPCH.
■ Supports TFC selection limitation on the UL factoring in the transmissions on the HS-DPCCH as
required in TS 25.133.

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3.7.4 GSM features


The following GSM modes and data rates are supported by the MSM6280 device hardware. Support
modes conform to release '99 specifications of the sub-feature.
■ Voice features
❏ FR
❏ EFR
❏ AMR
❏ HR
❏ A5/1, A5/2, and A5/3 ciphering
■ Circuit-switched data features
❏ 9.6k
❏ 14.4k
❏ Fax
❏ Transparent and non-transparent modes for CS data and fax
❏ No sub-rates are supported.

3.7.5 GPRS features


■ Packet switched data (GPRS)
❏ DTM (Simple Class A) operation
❏ Multi-slot class 12 data services
❏ CS schemes: CS1, CS2, CS3, and CS4
❏ GEA1, GEA2, and GEA3 ciphering
■ Maximum of four Rx timeslots per frame

3.7.6 EDGE features


■ EDGE E2 power class for 8 PSK
■ DTM (simple Class A), multi-slot class 12
■ Downlink coding schemes - CS 1-4, MCS 1-9
■ Uplink coding schemes - CS 1-4, MCS 1-9
■ BEP reporting
■ SRB loopback and test mode B
■ 8-bit, 11-bit RACH
■ PBCCH support
■ 1 phase/2 phase access procedures
■ Link adaptation and IR
■ NACC, extended UL TBF.

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3.7.7 MSM6280 device audio processing features


■ Integrated wideband stereo CODEC
❏ 16-bit DAC with typical 88 dB dynamic range
❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path
■ VR- Voice mail + voice memo
■ Acoustic echo cancellation
■ Audio AGC
■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8
(G2)
■ Internal vocoder supporting AMR, FR, EFR, and HR

3.7.8 MSM6280 microprocessor subsystem


■ Industry standard ARM926EJ-S embedded microprocessor subsystem
❏ 16 kB instruction and 16 kB data cache
❏ Instruction set compatible with ARM7TDMI®
❏ ARM version 5TEJ instructions
❏ Higher performance 5 stage pipeline, Harvard cached architecture
❏ Higher internal CPU clock rate with on-chip cache
■ Java hardware acceleration
■ Enhanced memory support
Please note that NOR/PSRAM will not be supported on MSM6280.
❏ 75 MHz and 90 MHz bus clock for SDRAM
❏ 32-bit SDRAM
❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed
peripherals (EBI2) such as LCD panels
❏ 1.8 V or 2.6 V memory interface support (excluding EBI1)
❏ NAND FLASH memory interface
- 8/16-bit data I/O width NAND flash support
- 1- or 4-bit ECC
- 512-byte/2KB page-size support
- 2 chip selects supported for NAND Flash
❏ Boot from NAND
❏ Low-power SDRAM (LP-SDRAM) interface
■ Internal watchdog and sleep timers

Copyright © 2007 LG Electronics. Inc. All right reserved. - 43 - LGE Internal Use Only
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3. TECHNICAL BRIEF

3.7.9 Supported interface features


■ USB On-the-Go core supports both slave and host functionality
■ Three universal asynchronous receiver transmitter (UART) serial ports
■ USIM controller (via UART)
■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards
■ Parallel LCD interface
■ General-purpose I/O pins
■ External keypad interface

3.7.10 Supported multimedia features


■ Provide additional general purpose MIPS by using:
❏ Two QDSP4000s
❏ Dedicated hardware accelerators and compression engines
■ Improve Java, BREW, and game performance
❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine
■ Enable various accessories via USB host connectivity.
❏ Integrated USB host controller functionality
■ Enable compelling visual and audio applications.

QcameraTM
■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 4-megapixel
with 15 fps capture rate
■ 15 fps QVGA viewfinder

QtvTM
■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.
■ Audio Codecs supported: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows® Audio v9,
RealAudio® v8
■ Integrated stereo wideband Codec for music/digital clips
■ CMX
■ Video Codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10

Video telephony services: QvideophoneTM


■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF
■ Video Codecs supported: MPEG-4 and H.263
■ Audio Codecs supported: AMR-NB.

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3. TECHNICAL BRIEF

QcamcorderTM
■ Real time mobile video encoder
■ Video Codecs supported: MPEG-4, H.263.H.264
■ Audio Codecs supported: AMR-NB, AAC
■ Recording performance: 15 fps @ QVGA, 384 kbps

gpsOneTM
■ Integrated gpsOne processing
■ Standalone gpsOne mode in which the handset acts as a GPS receiver

CMXTM (MIDI and still image, animation, text, LED/vibrate support)


■ 72 simultaneous polyphonic tones
■ 44 kHz sampling rate
■ 512 kB wave table
■ Support of universal file formats
❏ Standard MIDI Format (SMF)
❏ SP-MIDI
❏ SMAF Audio playback (MA-2, MA-3, MA-5)
❏ XMF/OLS
❏ MFil (requires Docomo license)
■ PNG decoder
■ Pitch bend range support
■ LED/vibrate support
■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)
■ MLZ decoder
■ Integrated PNG/SAF A.T.

Copyright © 2007 LG Electronics. Inc. All right reserved. - 45 - LGE Internal Use Only
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3. TECHNICAL BRIEF

3.7.11 Serial Bus Interface(SBI)


The MSM6280 device’s SSBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMM’s RTR6275, RFR6275 and PM6650 ASICs. Using the SSBI, the RTR6275, RFR6275,
and PM6650 devices can be configured for different operating modes and for minimum power
consumption, extending battery life in Standby mode. The SSBI also controls DC baseband offset
errors.

3.7.12 Wideband CODEC


The MSM6280 device integrates a wideband voice/audio CODEC into the mobile station modem
(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one
single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the
microphone and earphone amplifiers into the MSM6280 device, reducing the external component
count to just a few passive components. The microphone (Tx) audio path consists of a two-stage
amplifier with the gain of the second stage set interally. The Rx/Tx paths are designed to meet the
ITU-G.712 requirements for digital transmission systems.

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3. TECHNICAL BRIEF

3.7.13 Vocoder Subsystem


The MSM6280 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has
modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx
volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal
Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable,
13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6280 device’s integrated ARM9TDMI
processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the
desired functionality.

3.7.14 ARM Microprocessor subsystem


The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM device, including control of
the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices.
Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the
functionality of the RFR6275, RTR6275, and PM6650 devices.

3.7.15 Mode Select and JTAG Interfaces


The mode pins to the MSM6280 device determine the overall operating mode of the ASIC. The options
under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,
ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6280
device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used
to test digital interconnects between devices within the mobile station during manufacture.

3.7.16 General-Purpose Input/Output Interface


The MSM6280 device has general-purpose bidirectional input/output pins. Some of the GPIO pins
have alternate functions supported on them. The alternate functions include USB interface, additional
RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function
of these pins is documented in the various software releases.

3.7.17 UART
The MSM6280 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3
share multiplexed pins.
■ UART1 for data
■ UART2 (can be used for USIM interface)
■ UART3 for data

3.7.18 USB
The MSM6280 device integrates a universal serial bus (USB) controller that supports both
unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral
communicating with the USB host.

Copyright © 2007 LG Electronics. Inc. All right reserved. - 47 - LGE Internal Use Only
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3. TECHNICAL BRIEF

3.8 Power Block

3.8.1 General
MSM6280, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of
MSM6280, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :

PM6650 : Phone power supply


AAT3169 : LCD Backlight/Flash charge pump

3.8.2 PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power
management portion accepts power from all the most common sources - battery, external charger,
adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate
handset electronics. It monitors and controls the power sources, detecting which sources are applied,
verifying that they are within acceptable operational limits, and coordinates battery and coin cell
recharging while maintaining the handset electronics supply voltages. Eight programmable output
voltages are generated using low dropout voltage regulators, all derived from a common trimmed
voltage reference.
A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-
voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental
conditions.
MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI)
supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface
circuit monitors multiple trigger events and controls the power-on sequence.

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3. TECHNICAL BRIEF

Figure 1-1. PM6650 Functional Block Diagram

Copyright © 2007 LG Electronics. Inc. All right reserved. - 49 - LGE Internal Use Only
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3. TECHNICAL BRIEF

3.8.3 Charging control


A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for
the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this
pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or
not. For additional accuracy or to capture variations over time, this voltage is routed internally to the
housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and
ICHARGE pins to determine which supply should be used and when to switch between the two
supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the
pass transistor respectively.

4.2V~3.81V 3.80V~3.71V 3.70V~3.62V 3.61V~3.50V 3.49V~3.28V


100~70 (%) 69~45 (%) 44~20 (%) 19~3 (%) 2~0 (%)

KU990 Battery Bar Display(Stand By Condition)

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Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided
by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current
from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with
its performance specified below (3.2V). The charging current is set to 80mA.

Parameter Min Typ Max Unit

Trickle Current 60 80 100 mA

Copyright © 2007 LG Electronics. Inc. All right reserved. - 51 - LGE Internal Use Only
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3. TECHNICAL BRIEF

Constant Current Charging


The PM6650 IC supports constant current charging of the main battery by controlling the charger pass
transistor and the battery transistor. The constant current charging continues until the battery reaches
its target voltage, 4.2V.

Constant Voltage Charging


Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of
constant voltage charging is commonly detected 10% of the full charging current.
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 600mA
• Nominal Battery Capacity : 1000mAh
• Charger Voltage : 5.1V
• Charging time : Max 3h (Except time trickle charging)
• Full charge indication current (icon stop current) : 100mA
• Low battery POP UP : Idle - 3.49V, Dedicated(GSM/WCDMA) - 3.49V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1min
• Cut-off voltage : 3.20V(idle), 3.1V(call)

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3. TECHNICAL BRIEF

3.9 External memory interface


The MSM6280 device was designed to provide two distinct memory interfaces. EBI1 was targeted for
supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower
asynchronous devices such as LCD, NAND flash, SRAM, etc. In addition, MSM6280 provide SD bus
interface. KU990 supports 512MByte free user memory using SD interface.
• EBI1 Features
- 16 bit static and dynamic memory interface
- 32 bit dynamic memory interface
- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select
- Synchronous burst memories supported (burst NOR, burst PSRAM)
- Synchronous DRAM memories supported
- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses
- Pseudo SRAM (PSRAM) memory support
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices (UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit).
• 2Gb NAND(16bit, Large Block ) flash memory + 1Gb SDRAM (32bit)

• 1-CS(Chip Select) are used.

• The SD bus allows the dynamic configuration of the number of data line from 1 to 4 Bidirectional data
signal. After power up by default, the Device will use only DAT0. After initialization, host can change
the bus width.

Interface Spec
Device Part Name Maker Read Access Time Write Access Time
NAND TYA000BC00DOGG Toshiba 50 ns 30 ns
SDRAM TYA000BC00DOGG Toshiba 15 ns 15 ns

Table#1. External memory interface

Copyright © 2007 LG Electronics. Inc. All right reserved. - 53 - LGE Internal Use Only
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3. TECHNICAL BRIEF

EBI1 EBI2
ADDRESS[14: 0]

NAND_CS*
DATA[31:0]
NAND_RE*
NAND_WE*
WE* NAND
SDRAM NAND_CLE
CS* MSM6280
1Gbit NAND_WP* 2Gb
CAS*
(512M x 2) RAS* NAND_ALE (256MB)
CLK_EN NAND_READY
CLK DATA[15:0]
DQM[3:0]

Figure. Simplified Block Diagram of Memory Interface

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3.10 H/W Sub System

3.10.1 RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)
MSM6280 controls RF part(RTR6275) using these signals.
• SBST : SSBI I/F signals for control Sub-chipset
• PA_ON1 : Power AMP on RF part
• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
• DAC_REF : Reference input to the MSM Tx data DACs
SBDT1_GPIO1
H11
PA_ON1_GPIO2 LIN_INVERTER
D5
GRFC9_GPIO12 LIN_MOTOR_EN
J21
CAMCLK_PO_GP_MN_GPIO13 CAM_MCLK
A6
GPIO28 LCD_IF_MODE
N19
USB_RX_DATA_GPIO29 USB_SELECT_N
W15
XMEM2_CS_N2_GPIO35 CAM_MODE3_N
AA15
XMEM2_CS_N3_GPIO36 VGA_CAM_PWDN
AE13
LCD_EN_GPIO37 LCD_LDO_EN
H9
GPIO43 MICROSD_DETECT
B6
SYNTH2_GPIO65 HOOK_SENSE_N
F8
GPIO66 RMT_INT
AA1
XMEM1_CS_N1_GPIO76
Y6
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
L25
UART3_RFR_N_GPIO87 HP_AMP_EN
H6
UART2_DP_RX_DATA_GPIO89 CAM_SELECT_N
F18
SYNTH0_GP_PDM0_GPIO92 LCD_RESET_N
H18 R215 0
SBST1_GPIO93 MMP_INT_N
H13
TX_AGC_ADJ TX_AGC_ADJ
L13 R211 2K
TRK_LO_ADJ TRK_LO_ADJ
F19
TCXO_EN_GPIO94 TCXO_EN
F17
PA_ON0 PA_ON C223
(WCMDA 2100 PAM Enable) 33nF
A12
Q_OUT_N TX_QM
B12
Q_OUT TX_QP
A13
I_OUT_N TX_IM
B13
I_OUT TX_IP
F12
DAC_REF DAC_REF
W23
Q_IM_CH1
V23
Q_IP_CH1
V25
I_IM_CH1
W25
I_IP_CH1
AA25
Q_IM_CH0 RX_QM
Y25
Q_IP_CH0 RX_QP
AB25
I_IM_CH0 RX_IM
AC25
I_IP_CH0 RX_IP

D17
GP_PDM2_PA_RAN_GE1 PA_R1
H17
GP_PDM1_PA_RAN_GE0 LIN_PWM_MAG
H15
TRST_N
D16
TCK
F15
TMS
D15
TDI
A17
TDO
H16
RTCK
K19
AUX_PCM_CLK_GRFC14_GPIO80 MMP_HPCM_CLK
N21
AUX_PCM_DIN_GRFC13_GPIO14 MMP_HPCM_DI
G4 MMP_HPCM_DO
AUX_PCM_DOUT_GRFC12_GPIO103
J8
AUX_PCM_SYNC_GRFC11_GPIO102 MMP_HPCM_FSYNC
H12
TX_ON_GRFC10 TX_ON
B4
GRFC8_GPIO11 ANT_SEL2
T23
GRFC7_GPIO10 ANT_SEL1
T19
GRFX6_GPIO9 ANT_SEL0
D11
GRFC5_AUX_SBST_GPIO8 CAM_MODE1_N
H10
GRFC4_AUX_SBCK_GPIO7 FM_INTX
F10
GRFC3_GPIO6 FM_BUSEN
D9
GRFC2_GPIO5 GSM_PA_BAND
A8
GRFC1_AUX_SBDT_GPIO4 GSM_PA_EN
B8
GRFC0_GPIO3 VGA_CAM_RESET_N
R213
G23
BT_CLK_GPIO25 BT_CLK NA
F23
BT_SBST_GPIO24 BT_SBST
E26
BT_SBCK_GPIO23 BT_SBCK
E25
BT_SBDT_GPIO22 BT_SBDT
H21
BT_TX_RX_N_GPIO21 BT_TX_RX_N
R19
BT_DATA_GPIO20 BT_DATA
A22

Figure. Schematic of RF Interface of MSM6280

Copyright © 2007 LG Electronics. Inc. All right reserved. - 55 - LGE Internal Use Only
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3. TECHNICAL BRIEF

B. the others
• TRK_LO_ADJ : TCXO(19.2M) Control
• PA_ON : WCDMA(2100) TX Power Amp Enable
• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp
• GSM_PA_RAMP : Power Amp Gain Control of APC_IC
• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC

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3. TECHNICAL BRIEF

3.10.2 MSM Sub System


3.10.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx

VREG_UIM 2.85V
USIM CLK USIM CLK
USIM Reset
PM6650 USIM Reset USIM
MSM6280 USIM Data USIM Data

Figure. SIM Interface

3.10.2.2 UART Interface


UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map Name Note

GPIO_96 UART_RXD Data_Rx

GPIO_95 UART_TXD Data_Tx

Table. UART Interface

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3. TECHNICAL BRIEF

3.10.2.3 USB
The MSM6280 device contains a Universal Serial Bus (USB) interface to provide an efficient
interconnect between the mobile phone and a personal computer (PC). The USB interface of the
MSM6280 was designed to comply with the definition of a peripheral as specified in USB Specification,
Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB
Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation,
namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the
MSM6280.

Name Note
USB_DAT Data to/from MSM
USB_SE0 Data to/from MSM
USB_OE_N Out-Put Enable of Transceiver
USB_VBUS USB_Power From Host(PC)
USB_D+ USB Data+ to Host
USB_D USB Data- to Host

Table. USB Signal Interface


MMC_DATA_SDC
MMC_CLK_SDCC
MMC_CMD_GPIO
USB_OE_TP_N
USB_DAT_VP
USB_SE0_VM
GPIO40
GPIO42
D6
D7

N26
N23
N25

H14
L14
M16

USB_CTL_N
USB_VBUS 16
USB_VBUS
4.7u

17
47K

USB_DAT USB_DAT
18
MSM_USB_D+ USB_D_P
19
USB_SE0 USB_SE0
R514
C540

20
MSM_USB_D- USB_D_M
21
GP1_DRV_N(M
PM_INT_N
PS_HOLD

USB_OE_N

ICROSD_CMD
OSD_DATA[0]
MICROSD_CLK
USB_DAT
USB_SE0

Figure. Schematic of USB block(MSM6280 Side & PM6650 Side)

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3.10.3 HKADC(House Keeping ADC)


The MSM6280 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to
digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF
power levels. The MSM6280 device has six analog input pins which are multiplexed to the input of the
internal HKADC.

Figure. MSM6280HKADC Block diagram

Channel Signal Note


HKADC0 AMUX_OUT RF PAM Temperature Check

HKADC1 VBATT_SENSE Battery voltage level

HKADC2 REF_ADC ADC Reference voltage

HKADC3 TTY_ADC_DET Ear jack Detection for TTY

HKADC4 PCB_Rev_ADC PCB Version Check

HKADC5 Battery_THERM Battery Temperature Check

Table. HKADC channel table

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3.10.4 Key Pad


There are 5 key buttons. Shows the Key Matrix & Keypad circuit.
‘END’ Key is connected to PMIC(PM6650).

COL(0) COL(1)

ROW(0) Lock Capture


ROW(1) AF
ROW(2) SEND CLR

Table. Key Matrix Mapping Table

VREG_MSMP_2.7V
R701

51K

700 701

SEND CLR
KEY_ROW[2]

KEY_COL[0]

KEY_COL[1]
EVLC14S02050

EVLC14S02050

EVLC14S02050
VA703
VA701

VA702

Figure. Main Keypad Circuit

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3. TECHNICAL BRIEF

1100
SW1100

KEY_ROW[0]
LOCK KEY CAMERA

FOCUS

KEY_ROW[1]

KEY_COL[0]
KEY_COL[1]

Figure. Side Keypad Circuit

END

PM_ON_SW_N END
EVL14K02200

VA700

ON_SW KEY
Figure. END Keypad Circuit

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3. TECHNICAL BRIEF

3.10.5 Camera Interface


U990 Installed a 5M Pixel and 0.3Mega Camera.
Below figure shows the camera board to board connector and camera I/F signal.

CAM_VDD_AF_2.7V

CAM_VDD_SA_2.7V
CAM_VDD_CORE_1.2V CAM_VDD_SD_1.8V
CAM_VDD_IO_2.7V
C601 C602 C600
0.1u 1u 10u

C605

0.1u
0.1u

1u
C606
GB042-30S-H10-E3000 0.1u C607

C608
C609
CN600
0.1u
30 1
R601 10 29 2
MMP_I2C_SCL
R602 10 28 3
MMP_I2C_SDA
R603 10 27 4
MMP_CAM_VSYNC
R604 10 26 5
MMP_CAM_HSYNC
25 6
MMP_CAM_RESET_N MMP_CAM_INT
24 7
STROBE_TRIGGER
23 8
5M_CAM_DATA[6] 5M_CAM_DATA[7]
22 9
5M_CAM_DATA[4] 5M_CAM_DATA[5]
21 10
5M_CAM_DATA[2] 5M_CAM_DATA[3]
20 11
5M_CAM_DATA[0] 5M_CAM_DATA[1]
19 12
R607 18 13 R608 10
5M_CAM_MCLK MMP_CAM_PCLK
17 14
33
VA600

VA601
16 15
VA602
ICVL0518100Y500FR

ICVL0518100Y500FR
C610 C611 C612 C613 C614
10p 10p 10p 10p 0.1u
EVLC18S02015

VGA_VDD_2.7V

VGA_VDD_1.8V

CN701
1 30
VGA_CAM_PWDN R717 2 29
VGA_CAM_MCLK
3 28
10 VGA_CAM_RESET_N
R718 10 4 27 R719 10
MMP_CAM_PCLK I2C_SCL
5 26 R720 10
VGA_CAM_DATA[0] I2C_SDA
6 25
VGA_CAM_DATA[1]
7 24 R724 10
VGA_CAM_DATA[2] MMP_CAM_HSYNC
8 23 R725 10
VGA_CAM_DATA[3] MMP_CAM_VSYNC
9 22
VGA_CAM_DATA[4] VGA_CAM_DATA[7]
10 21
VGA_CAM_DATA[5] VGA_CAM_DATA[6]
11 20
MOTOR+
12 19
MOTOR- x+
13 18
Y+
14 17
RCV+ x-
15 16
RCV- Y-
VA713

VA714

VA715
R729

C710 C711 C712 C713 C709 C714 C715


ICVL0518100Y500FR

0.1u 0.1u 10p 10p 10p 10p


EVLC18S02015

EVLC18S02015

NA 0.1u
resistor

Figure. Camera PCB Board to Board Connector

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The MEGA Camera module is connected to Main PCB with 30pin Board to Board connector Its
interface is dedicated camera interface port in Multimedia chip. The camera port supply 13MHz master
clock to camera module, vertical sync signal, horizontal sync signal, reset signal and 8bits data from
camera module. The camera module is controlled by I2C port from Multimedia chip.

[ Pin Description ]

Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)

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The VGA Camera module is connected to FPCB with 20pin Board to Board connector (AXK720147G).
Its interface is dedicated camera interface port in MSM6280. The camera port supply 13.MHz master
clock to camera module and receive 13MHz pixel clock (15fps), vertical sync signal, horizontal sync
signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port
from MSM6280.

[ Pin Description ]

No Name Port Note


1 CAM_PWDN i Camera power down
2 CAM_MCLK I Master Clock(24M)
3 GND GND GND
4 CAM_PCLK O Clock for Camera Data Out(13M)
5 CAM_DATA(0) O Data
6 CAM_DATA(1) O Data
7 CAM_DATA(2) O Data
8 CAM_DATA(3) O Data
9 CAM_DATA(4) O Data
10 CAM_DATA(5) O Data
11 CAM_DATA(6) O Data
12 CAM_DATA(7) O Data
13 CAM_VSYNC O Vertical Synch
14 CAM_HSYNC O Horizontal Sync
15 GND GND GND
16 I2C_SCD I I2C Clock
17 I2C_SCL I I2C Clock
18 CAM_RESET_N I Camera reset signal
19 VREG_MSMP_2.8V I Camera I/O Power
20 VREG_CAM_2.8V I Camera I/O Power

Table. Interface between VGA Camera Module and FPCB (in camera module)

LGE Internal Use Only - 64 - Copyright © 2007 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF

3.10.6 LCD Module (LS030B3UX01 : SHARP)


- The IM220DBN2A model is a Color TFT Main supplied by SHARP.
This LCD Module has a 3.0 inch diagonally measured active display area with 240(RGB)X400
resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in
vertical stripes.
* Features
- Display mode(Main LCD) : Normally Black, Transmissive VA mode 265K colors
- LCD Driver IC: LS030B3UX01(Magnachip)
- Driving Method : A-Si TFT Active Matrix
- 16 bit CPU interface Parallel

LCD_RESET_N

MMP_CS_N MMP_LCD_CS_N

EBI2_OE_N MMP_LCD_RD_N
MSM6280 LCD 3.0î
EBI2_WE_N MMP_LCD_WE_N
Multimedia TFT(WQVGA)
EBI2_ADDR[11] MMP_LCD_ADS
Chip
EBI2_DATA[0:15] MMP_LCD_DATA[0:15]

LCD_MAKER_ID

LCD_IF_MODE

Figure. LCD Module Block Diagram

Copyright © 2007 LG Electronics. Inc. All right reserved. - 65 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.10.7 Display
LCD module is connected to Main PCB with 40 pin B TO B connector The LCD module is controlled by
16-bit EBI2 in MSM6280 via Multimedia Chip.

LCD_VDD_2.8V

C320 C321
VA300 NA 0.1u
ICVN0505X150FR

CN300
1 40
2 39
MMP_LCD_VSYNC_IN
3 38
LCD_MAKER_ID
4 37
LCD_DATA[0] WLED_PWR
5 36
LCD_DATA[1] WLED_1
6 35
LCD_DATA[2] WLED_2
7 34
LCD_DATA[3] WLED_3
8 33
LCD_DATA[4] WLED_4
9 32
LCD_DATA[5] WLED_5
10 31
LCD_DATA[6]
11 30
LCD_DATA[7] LCD_IF_MODE
12 29
LCD_DATA[8] MMP_LCD_ADS
13 28 R314 51
LCD_DATA[9] MMP_LCD_CS_N
14 27 R315 51
LCD_DATA[10] LCD_RESET_N
15 26 R316 51
LCD_DATA[11] MMP_LCD_RD_N
16 25 R317 51
LCD_DATA[12] MMP_LCD_WE_N
17 24
LCD_DATA[13] MMP_LCD_VSYNC_OUT
18 23 R318 0
LCD_DATA[14] OTP Program Pin
19 22
22p

22p

22p

22p

LCD_DATA[15] VA301 LCD_VSYNC_OUT


20 21
C326
22p
C323
C322

C324

C325

ENBY0036001
1.0T, Socket
GB042-40S-H10-E3000

FL300 ICVE10184E150R500FR
1 9
MMP_LCD_DATA[0] INOUT_A1 INOUT_B1 LCD_DATA[0]
2 8
MMP_LCD_DATA[1] INOUT_A2 INOUT_B2 LCD_DATA[1]
3 7
MMP_LCD_DATA[2] INOUT_A3 INOUT_B3 LCD_DATA[2]
4 6
MMP_LCD_DATA[3] INOUT_A4 INOUT_B4 LCD_DATA[3]
G1
G2
5
10

FL301 ICVE10184E150R500FR
1 9
MMP_LCD_DATA[4] INOUT_A1 INOUT_B1 LCD_DATA[4]
2 8
MMP_LCD_DATA[5] INOUT_A2 INOUT_B2 LCD_DATA[5]
3 7
MMP_LCD_DATA[6] INOUT_A3 INOUT_B3 LCD_DATA[6]
4 6
MMP_LCD_DATA[7] INOUT_A4 INOUT_B4 LCD_DATA[7]
G1
G2
5
10

FL302 ICVE10184E150R500FR
1 9
MMP_LCD_DATA[8] INOUT_A1 INOUT_B1 LCD_DATA[8]
2 8
MMP_LCD_DATA[9] INOUT_A2 INOUT_B2 LCD_DATA[9]
3 7
MMP_LCD_DATA[10] INOUT_A3 INOUT_B3 LCD_DATA[10]
4 6
MMP_LCD_DATA[11] INOUT_A4 INOUT_B4 LCD_DATA[11]
G1
G2
5
10

FL303 ICVE10184E150R500FR
1 9
MMP_LCD_DATA[12] INOUT_A1 INOUT_B1 LCD_DATA[12]
2 8
MMP_LCD_DATA[13] INOUT_A2 INOUT_B2 LCD_DATA[13]
3 7
MMP_LCD_DATA[14] INOUT_A3 INOUT_B3 LCD_DATA[14]
4 6
MMP_LCD_DATA[15] INOUT_A4 INOUT_B4 LCD_DATA[15]
G1
G2
5
10

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3. TECHNICAL BRIEF

3.10.7.1 Audio Signal Processing & Interface


Audio signal processing is divided uplink path and downlink path.
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal
and then transmits it to DBB Chip (MSM6280).
This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset.
The downlink path amplifies the signal from DBB chip (MSM6280) and outputs it to receiver (or
speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary
output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are
differential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a
headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary input
and a two-stage audio amplifier.

Figure. Audio Interface Detailed Diagram(MSM6280)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 67 - LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only
AC18
LINE_ON HP_R
3. TECHNICAL BRIEF

AC17
LINE_OP HP_L
AA17
MSM6280 Audio CODEC pins

HPH_R SPK_R
W17
HPH_L SPK_L
AE18
EAR1ON RCV-
AF18
EAR1OP RCV+
T15
MICBIAS MICBIAS
AA18
AUXOUT
AA19
HPH_VREF
AC22
LINE_L_IP
AC21
LINE_L_IN

- 68 -
AC19
LINE_R_IP
AC20
LINE_R_IN

10p
C200
AF19
AUXIN
AE19
AUXIP C236 0.1u
AF21
MIC2N C235 0.1u
AF22

Figure . Audio part schematics


MIC2P MIC2P
AF20
MIC1N MIC1N
AE20
L200

MIC1P MIC1P
100nH

AA20
CCOMP

SDCC DAT2
SDCC_DAT
C203 NA

Only for training and service purposes


Copyright © 2007 LG Electronics. Inc. All right reserved.
3. TECHNICAL BRIEF

MICBIAS

C564
47p

C563
SPM0204HE5-PB-3
10u
P C567 22n MIC1N
4
G2 C569
3
G1 C568 22n NA
2
O MIC1P
1
MIC500

C575 C576

MIC 33p 10p


R904

NCS2200SQ2T2G
U902
100K

2
VIN+ 3 GND OUT
R905 HOOK_SENSE_N
VCC 1
EAR_MIC_P VIN- 4 5
1M

10K
R906

5.1K
VREG_MSMP_2.7V C905
R907 0.1u
Headset Hook Switch

Figure . Audio part schematics

Copyright © 2007 LG Electronics. Inc. All right reserved. - 69 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

VREG_5V
R533
C514 C513 VREG_WM_2.7V
0.1u 10u 0

C516 C517
4.7u 0.1u

MIDI_3.3V

C518 C519
4.7u 0.1u VREG_MSME_1.8V

C520 C521
4.7u 0.1u

U502 WM8983
13 12
DCVDD DGND
14
DBVDD
26 28
AVDD2 AGND1
31
AVDD1
24
AGND2 C525
7 C524
MMP_A_LRCLK LRC 0.1u 10u
8
MMP_A_BCLK BCLK
9
C530 MMP_ADI_ADCDAT ADCDAT C531
10 27
12n MMP_ADO_DACDAT DACDAT VMID NA
11
MMP_A_MCLK MCLK
32
C534

C532 1u R510 C533 R511 MICBIAS MIC_PWR


4
1u

SPK_R RIP
5 29 HP_EAR_R
1K 4.7n 18K RIN ROUT1
30
C535 1u LOUT1 HP_EAR_L
6
FM_AUDIO_R R2_GPIO3
C536 1u FB500
3 23
C539

FM_AUDIO_L L2_GPIO2 ROUT2 SPK_OUT+


1u

1 25
C541 1u R516 C542 R517 MID_MICP LIP LOUT2 SPK_OUT-
2
SPK_L LIN FB501
1K 4.7n 18K C543 C544
19 22
C547 AUXL OUT3 MIC2P NA NA
21
12n OUT4
20
AUXR
18
MODE
15
CSB_GPIO1
16
R519

100K

CODEC_I2C_SCL SCLK
17 33
C548 1u CODEC_I2C_SDA SDIN PGND
HP_L
C549 1u
HP_R

C550 C551
NA NA

AUDIO DAC/ADC, AMP etc. (WM8983)

L504 VREG_MSMP_2.7V
2.2uH
100K

CN500
R528

21
19
1 FB504
FM_ANT
2
EAR_MIC_P
3
TV_OUT
4
MIDI_EAR_L
5
MIDI_EAR_R
6
RMT_INT-USB_D+
7

Figure . Audio part schematics

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3. TECHNICAL BRIEF

3.10.7.2 Audio Mode


There are three audio modes (Voice call, speaker phone, MIDI/MP3).

MODE Device Description

Receiver Mode Receiver Voice Call

Voice Call Loud Mode Speaker Phone

Headset Headset Voice Call

Speaker phone Loud Mode Speaker Phone

Loud Mode Speaker MIDI Bell


MIDI
Headset Headset MIDI Bell

Loud Mode Speaker MP3


MP3
Headset Headset MP3

Table. Audio Mode

Audio & Sound Main Component


There are 8 main components in KU990.

Component Maker Part No. Note

1 MSM6280 MSM6280 Base-Band Modem

2 Audio Codec WM8983 ADC/DAC, AB class SPK AMP

3 Analog Switch NC7SB3157L6X Analog Switch for MIC BIAS

4 Speaker EMS1634APB1 8 ohm Speaker

5 Receiver EMR0906SP 32 ohm receiver

6 Main MIC SPM0204HE5-PB -42 dB microphone

7 CAM MIC SPOB-413S42- -42 dB microphone


RC3310BC
8 Ear MIC HC-MQD-LG059 Ear MIC

Table. Audio main component list

Copyright © 2007 LG Electronics. Inc. All right reserved. - 71 - LGE Internal Use Only
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3. TECHNICAL BRIEF

# Multimedia Chip

3.11 Feature List

3.11.1 IC Characteristics
• MCP with Internal SDRAM, no need for external memory.
• Package: 180-pin TFBGA (8 x 8 mm)
• 90nm process
• Core voltage - 1.0 V
• IO voltage - Eleven strips, separate voltage between 1.8 and 3.3 V

3.11.2 Multimedia Performance


• Digital Still Camera support with ISP on chip up to 5M pixel.
- Photo-album and photo-editing capabilities.
- Superior quality, (e.g. including lens shading).
- Camera controls for flash, optical zoom,focus, shutter and iris.
• Camcorder operation as a DivX recorder /player at 30 fps CIF, VGA resolution.
AVI file format with MP3 audio.
• Player for general DivX content, up to 30 fps CIF resolution. MP3 or WMA audio.
• 3GPP MMS compliant video clip recorder, supporting CIF/QCIF H.263, MPEG4 recording with AMR
voice or AAC audio.
• Player for 3GPP MMS / streaming video clips, up to 30 fps CIF H.263, MPEG4, and H.264 with AMR
voice or AAC/Enhanced AACPlus audio.
• 3GPP-compliant videophone, with H.263 or MPEG4 video at QCIF 15 fps (full-duplex).
• MIDI player (for ring tones, melodies).
Compliant with 3GPP standards, including
support for Mobile XMF for melodies with custom instruments.

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3. TECHNICAL BRIEF

• Audio stereo recorder player MP3/WMA


• ID3 tags display
• Spectral bars
• Lyrics display
• Equalizer
• 3D Surround Audio

3.11.3 DRM
• MDTV Conditional access compliant to JSR-177 (AES and TDES)
• Key exchange support
• True RNG (Random Number Generator)

3.11.4 3D Graphics
• 3D hardware + software accelerator targeting VGA 30 fps games with PlayStationTM-1 enhanced
quality.
- Setup and viewport transforms
- Bilinear and Trilinear texturing
- Multi-texturing
- Flat and Gourard shading
- 24-bit ARGB support
- Compressed textures (2 bits/texel)
- Mipmaping
- Full scene anti-aliasing (x4 / x16)
- 16-bit Z-buffer
- 4-bit stencil buffer
- Fog
- Alpha blending
- Dot3 bump mapping
• Fill rate: 120M pixels/sec
• Polygon rate 0.8M triangles/sec

Copyright © 2007 LG Electronics. Inc. All right reserved. - 73 - LGE Internal Use Only
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3. TECHNICAL BRIEF

3.11.5 Image Sensor


• 10/12/14/16-bit RGB - Bayer Grid
- CMOS up to 5MP
- CCD up to 5MP
- Pixel clock - Up to 90 MHz.
- Active pixel rate - up to 75M pixels/sec:
- 15fps @ 5MP
- 25fps @ 3MP
- 30fps @ 2MP
- Black-level evaluation and correction
- Defective pixel correction
- Auto exposure and White-balance
- Edge enhancement and auto focus.
- Lens shading correction
- Polyphase image scaling.
- Digital zoom up to X4 in 16 steps
- 8/16-bit YCbCr - 4:2:2
- Input streaming bus - as CCIR601
- Progressive (CMOS/CCD sensors) or interlaced (PAL/NTSC decoders) mode
- Pixel clock - Up to 120 MHz (8-bit), 60Mhz (16-bit)
- Input resolution - Up to 5M pixels
- Auto focus
- Polyphase image scaling
- Digital zoom up to X4 in 16 steps

3.11.6 LCD Port


• Output resolution - up to VGA
• Supports dual-panels (two LCDs)
• Bypass from Host port to LCD CPU bus
• Up to 18-bit color depth (262K colors)
• CPU bus 8/9/16/18 bit compliant to all known vendors.
• RGB bus 3/6/18 bit up to 30Mhz clock

3.11.7 TV-out Port


• Composite analog interface
- NTSC-M
- PAL-B,D,G,H,I

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3. TECHNICAL BRIEF

3.11.8 Video and Graphics Postprocessing


• Handles Video (YUV) and Graphic (RGB)
• Video de-blocking
• Blending of video and graphics - up to 256 levels of blending
• Resizing (upscale and downscale) using quality polyphase filter
• Rotation and flip - 90, 180 and 270 degrees
• Picture brightness, contrast, and saturation control
• Display gamma adjustment
• Color space reduction

3.11.9 Serial Audio Ports


• ZR3453X has two audio/voice ports: one port is used for host bypass connection, and another for
connecting to a codec or to a Bluetooth voice port.
- PCM master/slave
- I2S master/slave (5 lines including clock)
- AC’97 master (5 lines including AC-Link reset)
- Audio output master clock (I2S), up to 48 MHz
- Supports sample rates of 8, 11.025, 16, 22.05, 24, 32, 44.1 or 48 kHz

3.11.10 Serial Data Ports


• I2C Multiple device support 100 and 400 kHz
• UART with flow control up to 3Mb/sec
• SPI port with Bit clock up to 40 MHz
- (Motorola, National microwire, TI synchronous serial interface )

3.11.11 Mass Storage


• High-speed SD/MMC I/F
• NAND-flash storage
• SPI-flash
• CE-ATA HDD.
• SDIO peripherals

Copyright © 2007 LG Electronics. Inc. All right reserved. - 75 - LGE Internal Use Only
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3. TECHNICAL BRIEF

3.11.12 USB
• USB 2.0 High speed/full speed
• USB On The Go
• USB applications:
- USB mass storage
- PictBridge
- Webcam

3.11.13 Host Port


• Two flavors:
- Generic interface 8/16-bit Intel style.
Connects as memory map (4-bit address)
- LCD like 8/9/16 bit multiplexed bus.
Connects as an LCD (1-bit address)

3.11.14 Clocks
• Main clock input frequency, 10 to 31 MHz:
- Directly from system PMU main clock and bypass its control
- Embedded crystal oscillator (12Mhz)
- Optional GPS TCXO
• Four configurable clock-out pins to drive external components:
(e.g. Audio codec, Sensor, PWM)

3.11.15 Boot
• Host boot
• Standalone boot

3.11.16 Debug
• JTAG for code debug
• UART for fast system ramp up

3.11.17 Power
• Very low power consumption, smaller than150mW for all intense multimedia applications.
• Low power sleep mode 100 µW
- Host can control display audio and peripherals via bypass
• Light sleep mode 500uW
- Specifically for GPS accurate off-line tracking

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3. TECHNICAL BRIEF

Figure 1-1 presents a typical multimedia cellular phone system where ZR3453X is used as a co-
coprocessor. In this system, ZR3453X is connected to the following devices:
• Baseband chip (the host)
• CCD/CMOS Image Sensor for capturing video and still
• LCD panel(s)for displaying video
• Audio CODEC (A2D, D2A) for capturing voice and playing voice/music
• Media Flash (SmartMedia, NANDFlash, MMC or SD) to store media data (two active I/F, e.g. one
NAND and one SD)
• Connector to TV

[ Figure 1-1 ]

Copyright © 2007 LG Electronics. Inc. All right reserved. - 77 - LGE Internal Use Only
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3. TECHNICAL BRIEF

3.12 Multimedia Chip Interface

3.12.1 Host Interface


3.12.1.1 Host Interface
The HOST interface connects the ZR3453X and the host processor
(a handset baseband
chip) in two optional modes:
• On the host memory bus.
• On the host LCD bus.
R309
MMP_LCD_BYPASS_CS_N
NA
VREG_MSMP_2.7V

R310 R311 0 B8
MMP_CS_N HCS0N
R313 NA A8
10K NAND_ALE HCS1N
B7
EBI2_OE_N HRDN
B9
EBI2_WE_N HWRN
A7
MMP_INT_N HGINTN
A10
EBI2_ADDR[11] HA11
A9
EBI2_ADDR[12] HA12
C8
EBI2_ADDR[13] HA13
C7
EBI2_ADDR[14] HA14
D12
EBI2_DATA[0] HD0
C10
EBI2_DATA[1] HD1
[ Block Diagram ] C12
HD2
EBI2_DATA[2] C13
EBI2_DATA[3] HD3
C14
EBI2_DATA[4] HD4
B14
EBI2_DATA[5] HD5
C11
EBI2_DATA[6] HD6
B13
EBI2_DATA[7] HD7
A14
EBI2_DATA[8] HD8
A13
EBI2_DATA[9] HD9
B12
EBI2_DATA[10] HD10
A12
EBI2_DATA[11] HD11
B11
EBI2_DATA[12] HD12
A11
EBI2_DATA[13] HD13
C9
EBI2_DATA[14] HD14
B10
EBI2_DATA[15] HD15
L13
NCSN
M13
EBI2_DATA[0:15]

[ Schematics ]

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Only for training and service purposes
3. TECHNICAL BRIEF

3.12.2 Host - LCD - Bypass mode


The Host-LCD Bypass bypasses the host interface pins to the LCD pins.
This means that the bus transactions performed by the host are transferred to the LCD pins, enabling
the host to have full control over one or two LCD panels, even when the ZR3453X is in sleep mode.
This is the default mode.

3.12.3 Camera interface


ZR3453X connects with the CCD or CMOS Image Sensor (CIS) via its image sensor port.
ZR3453X supports several system configurations:
• CCD bayer 10,12,14,16 bit (ZR34532 only)
• CMOS bayer 10,12,14,16 bit
• YCbCr 8 bit
• YCbCr 8 bit with pixel valid
• YCbCr 16 bit

Copyright © 2007 LG Electronics. Inc. All right reserved. - 79 - LGE Internal Use Only
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3. TECHNICAL BRIEF

3.12.4 LCD Interface


The ZR3453X LCD port supports mobile LCD panels of upto VGA size and upto 60fps refresh rate.
There are various bus formats and color depth up to 18-bit (262K colors).

P11
VIDH
N12
VIDI MMP_CAM_DATA[0]
N7
VIDJ MMP_CAM_DATA[1]
L8
VIDK MMP_CAM_DATA[2]
P13
VIDL MMP_CAM_DATA[3]
L9
VIDM MMP_CAM_DATA[4]
N13
VIDN MMP_CAM_DATA[5]
M11
VIDO MMP_CAM_DATA[6]
M9
VIDP MMP_CAM_DATA[7]

B5
LD0 MMP_LCD_DATA[0]
A5
LD1 MMP_LCD_DATA[1]
B6
LD2 MMP_LCD_DATA[2]
B4
LD3 MMP_LCD_DATA[3]
A4
LD4 MMP_LCD_DATA[4]
C3
LD5 MMP_LCD_DATA[5]
A3
LD6 MMP_LCD_DATA[6]
A2
LD7 MMP_LCD_DATA[7]
A1
LD8 MMP_LCD_DATA[8]
B2
LD9 MMP_LCD_DATA[9]
B1
LD10 MMP_LCD_DATA[10]
B3
LD11 MMP_LCD_DATA[11]
C1
LD12 MMP_LCD_DATA[12]
C2
LD13 MMP_LCD_DATA[13]
[ Block Diagram ] LD14
C5
MMP_LCD_DATA[14]
C6
LD15 MMP_LCD_DATA[15]
D3
LD16
D1
LD17

A6
LCS0N MMP_LCD_CS_N
D2
LCS1N
D5
LRDN MMP_LCD_RD_N
C4
LWRN MMP_LCD_WE_N
D4
LA0 MMP_LCD_ADS
E1
LCK TP300
E4
LHS TP301
E3
LVS MMP_LCD_VSYNC_IN
E2
LACT MMP_LCD_VSYNC_OUT

[ Schematics ]

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Only for training and service purposes
3. TECHNICAL BRIEF

3.12.5 TV out Interface


The display data is converted to video with video-encoder according to CCIR-601 and sampled by 10-
bit DAC and transmitted over an analog pad as a composite video signal.
This mode is used in a system where ZR3453X is connected gluelessly to a TV screen that requires
real-time display data. ZR3453X generates TV signal according to the NTSC and PAL standards.
The TVDATA pin can drive a full video level signal directly into a 75 terminated TV cable.

C331
G14
TVDATA
F13
22p TVREF

VENBYPIN
R339
R338
L300

390
75
TV_OUT
2.2uH
392ohm 1%
C334 C335

E13
330p 330p

[ Block Diagram ] [ Schematics ]

Copyright © 2007 LG Electronics. Inc. All right reserved. - 81 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.12.6 Audio Interface


In this configuration ZR3453X is connected to an external audio codec.
There are three possible configurations:
• Audio/Voice codec with two ports: PCM and I2S
• Audio/Voice codec with one port: I2S
• Audio/voice/data codec with one port: AC97
In all configurations ZR3453X connects its external audio ports to the codec single or two
ports.
The host uses its internal voice codec for voice communication. There is no bypass of voice.
The host controls the codec configuration via I2C bus directly. The host codec analog audio output is
connected to the external audio codec and muxed with the codec audio path from the ZR3453X on the
way is to the speaker.
The microphone is connected to the external audio codec and the baseband internal codec.
ZR3453X appears in Figure 3-35 as a master on the bit clock and frame sync. This is only one of the
possible configurations. In external audio configuration ZR3453X can run all the Audio/voice
applications including conversation recording .

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3. TECHNICAL BRIEF

3.12.7 USB interface


ZR3453X is a USB 2.0 Device or On-the-Go dual-role device (OTG) with the following
characteristics:
• Complies with USB (Universal Serial Bus) 2.0 specifications
• Complies with On-the-Go Supplement 1.0a
• Integrated 45-ohm termination, 1.5Kilohm pull-up and 15-Kilohm pull-down resistors.
• Supports 480-Mbps high-speed, 12-Mbps full-speed and 1.5Mbps low-speed (Host mode only) data
transmission rates.
• Control + 4 endpoints:
- EP0 - two-way Control
- 2-input , 2-output - Bulk, INT or ISO
• Suspend, resume, reset and SOF signaling

P3
UDP MMP_USB_D+
P4
UDN MMP_USB_D-
J4 R335 0
UVBUS VREG_5V
P6
UID
M7
AGND_VDAC

AGND_USBC
AGND_USBT

URSET
R340

3.3K

+VPWR
F12

K5
L5

3.4K
1%

C336
0.01u

FSUSB30UMX U304
10 1
USB_SELECT_N SEL HSD1+ MSM_USB_D+
9 2
R345

VCC HSD2+ MMP_USB_D+

8 3
_OE D+ USB_D+
100K

7 4
MSM_USB_D- HSD1- GND
6 5
MMP_USB_D- HSD2- D- USB_D-

Copyright © 2007 LG Electronics. Inc. All right reserved. - 83 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.12.8 MMC interface


ZR3453X has a dedicated port for multimedia cards. It can support SD (Secure Digital) cards and
SecureMMC (standard multimedia cards with security functions).
The same port can be used for HDD CE_ATA connection or SDIO to peripheral devices
(e.g.; MDTV front-end).
MMC
• MMC v4
• Dual voltage (separate IO power domain, host GPIO control)
• 1 or 4 bit cards
• Multiple cards support (if dual-voltage or high-speed interface are not used)
• Up to 43 MHz bit clock

SD
• 1 or 4 bit bus support
• High-Speed SD, up to 43 MHz bit clock

F1
SDAT0 MMP_MICROSD_DATA[0]
F2
SDAT1 MMP_MICROSD_DATA[1]
E5
SDAT2 MMP_MICROSD_DATA[2]
F3
SDAT3 MMP_MICROSD_DATA[3]
H2
SCMD MMP_MICROSD_CMD
G1 R312 33
SCLK MMP_MICROSD_CLK
G3
SWP
P12
VMCLK MMP_CAM_MCLK
P10
VPCLK MMP_CAM_PCLK
M12
VHREF MMP_CAM_HSYNC
K12
VVS MMP_CAM_VSYNC

3.12.9 Power Domain

LGE Internal Use Only - 84 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.13 Touch Screen Interface


The TSC2007 device has a 12-bit analog-to-digital resistive touch screen converter including drivers
and the control logic to measure touch pressure. The TSC2007 device is controlled by I2C port from
MSM6280.
Touch Screen interface scheme is shown in Figure.
And, there control signals are followed
• TOUCH_I2C_SCL : I2C CLOCK
• TOUCH_I2C_SDA : I2C DATA
• TOUCH_PENIRQ_N : DETECT

Figure. Touch Screen Interface


UART3_DP_RX_DATA_GPIO85
UART2_DP_TX_DATA_GPIO88

UART3_DP_TX_DATA_GPIO84
UART2_RFR_N_GPIO91
UART2_CTS_N_GPIO90

UART3_CTS_N_GPIO86

LCD_VDD_2.8V
R700

0
GPIO44
GPIO39
GPIO64

GPIO40

R702

C700 C701
R703

R704
2.7K

2.7K

1u 0.1u
NA
D8
F7
F14

F4
TP200 G6
E4

L23
M21
M19
D6
D7

U700 TSC2007IYZGR

A1 C1
AUX SDA TOUCH_I2C_SDA
A2 C2
VDD_REF A1
A3 C3
X+ X-
B1 D1
TOUCH_PENIRQ_N PENIRQ- SCL TOUCH_I2C_SCL
B2 D2
A0 GND
B3 D3
Y+ Y-
TOUCH_PENIRQ_N

VGA_CAM_PWR_EN
TOUCH_I2C_SCL
UART_TXD

CAM_MODE2_N

USIM_CLK
USIM_RST_N

PM_INT_N

X+
TOUCH_I2C_SDA
USIM_DATA

Y+
X-
Y-

Copyright © 2007 LG Electronics. Inc. All right reserved. - 85 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.14 Main Features

1. Main features of KU990


- BAR Type
- WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode
- Main LCD: 240x400/3.0”/262K TFT
- 5.1M Pixel AF Camera
- VGA CMOS Camera
- φ16 module speaker
- Stereo Headset
- Video telephony in WCDMA with camera
- HSDPA up to 3.6 Mbps
- Loud Speaker phone(in GSM and WCDMA)
- 64 Poly Sound
- Audio: MP3, AAC, AAC+,AAC++, WMA, WAV
- MPEG4 encoder/decoder and play/save
- H.263 decoder
- Video Recording: VGA 30 fps
- JPEG en/decoder
- Support Bluetooth, USB
- FM Radio
- touch screen, touch feedback
- 103 x 54 x 15.6 mm
- 1000mAh soft pack

LGE Internal Use Only - 86 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

2. Main Components of KU990

MAIN Top Side MAIN Bottom Side

VGA camera 5M camera

5M Camera FPCB
VGA Camera FPCB

Sub PCB

Intenna Strobe Flash


LCD

Copyright © 2007 LG Electronics. Inc. All right reserved. - 87 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

2.1 Main Top Side

U103 U700
U504
U506 U604
U503
U507
U304 U607
U505
U601 U600
U602 U301

U400 U300
U303
U401
SideKey

701

700 END

Reference Description Reference Description


U103 FM Radio IC 700 Send Key
U504 Headphone AMP IC 701 Clear Key
U506 CAM/HP MIC SEL IC END End Key
U503 Audio AMP LDO SideKey Side Key FPCB
U507 USB/REMOCON SEL IC U303
LCD LOD IC
U304 Switch IC for USB2.0 U300
LCD Backlight Charge
U505 Over Voltage Protection IC U301
Pump IC
U601 U600 VGA CAM LDO IC
5M CAM LDO IC
U602 U607
Switch IC for 5M VT Call
U400 MicroSD Select MSM and U604
U401 MMP IC U700 Touch Screen Driver IC

LGE Internal Use Only - 88 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

2.2 Main Bottom Side

CN500
CN701
U502
SW600
U606 CN603
CN600
CN601 U501

CN300 X500

U701 U500
U200 OUT PAD
U302

X300 U402

X100
U100
U105
J400
FL103

SW100 U101
FL100
MIC500
ANT PAD

Reference Description Reference Description


CN701 VGA CAM FPCB Connector CN500 TA and USB Connector
SW600 Mode Switch U502 WM8983 Audio DAC/ADC AMP IC
U606 Linear Motor Driver IC CN603 Main-Sub B-to-B Connector
CN600 5M CAM FPCB Connector U501 PM6650 PMIC
CN601 Strobe Flash Connector X500 32.768KHz Crystal Oscillator
CN300 LCD Connector U500 Charging IC
U701 DC-DC Converter IC OUT PAD Battery Connector PAD
U200 MSM6280 Modem IC U402 Memory IC
U302 ZR3453 DSP IC X100 19.2MHz Crystal Oscillator for TCXO
X300 27Mhz Crystal Oscillator U105 PAM IC for WCDMA
U100 RTR6275 RF IC FL103 Duplexer IC for WCDMA
J400 USIM Connector U101 PAM IC for GSM
SW100 RF Switch FL100 Antenna Switching Module
MIC500 MIC ANT PAD Main Intenna Connection PAD

Copyright © 2007 LG Electronics. Inc. All right reserved. - 89 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

2.3 Sub PCB

BT PAD

MIC900

U900
M800
U902

BAT900
CN800

CN801

SPEAKER

S800

Reference Description Reference Description


BT PAD Bluetooth Antenna PAD SPEAKER Module Speaker
MIC900 CAM MIC S800 T-Flash Connector
U900 5MP Camera Power IC M800 Bluetooth Driver IC
U902 Headset Hook Switch IC BAT900 Backup Battery
Main-Sub B-to-B
CN800 Wheel Switch Connector CN801
Connector

LGE Internal Use Only - 90 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

2.4 VGA Camera FPCB

CN102
CN101

Vibrator

CN100

Receiver

Reference Description Reference Description

Vibrator Vibrator PAD Main B-to-B Connector


CN101
Receiver Receiver PAD (FPCB to Main PCB)

CN100 VGA_CAMERA Connector CN102 Touch Window Connector

Copyright © 2007 LG Electronics. Inc. All right reserved. - 91 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

2.5 5M Camera FPCB

CN601

CN602

Reference Description Reference Description

5M Camera Module Main PCB Connector


CN601 CN602
Connector (FPCB to Main PCB)

LGE Internal Use Only - 92 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.1 RF Component

X100

FL104
U100

FL103 U105

U104
FL102

FL101
FL100

SW100 U101

Reference Descri ption Reference Description


U100 GSM/UMTS Transceiver (RTR) X100 VCTCXO(19.2MHz)
FL103 UMTS Duplexer FL104 UMTS TX SAW
FL102 UMTS RX SAW U105 UMTS PAM
FL100 Front -End-Module U104 Coupler
SW100 RF Antenna Connector FL101 GSM900 TX SAW
U101 GSM/EDGE PAM

Copyright © 2007 LG Electronics. Inc. All right reserved. - 93 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.2 SIGNAL PATH

4.2.1 UMTS PATH

COMMON TX/RX PATH

UMTS TX PATH

UMTS RX PATH

LGE Internal Use Only - 94 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.2.2 GSM PATH

COMMON TX/RX PATH GSM RX PATH

DCS/PCS TX PATH PCS RX PATH

GSM TX PATH DCS RX PATH

Copyright © 2007 LG Electronics. Inc. All right reserved. - 95 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.3 Checking VCTCXO Block


The reference frequency (19.2MHz) from X100 (VCXO) is used UMTS TX part, GSM part and BB part.

TCXO
X100 TP2
TP1 OUT GND
3 2
R115 100ohm
VREG_TCXO_2.85V VCC VCONT TRK_LO_ADJ
4 1
19.2MHz
C139 C140 C141
0.1u 1000p 0.01u

TP4 VREG_BT_2.85V
C144 1000p R120 100K C145
TCXO_PM 1000p

C147 1000p C148 8200p


RTR6275_TCXO TCXO_BT
U102
TP3 TC7SH04FS

Schematic of the TCXO Block

TP4

TP1

TP2 TP3

Test Point of the TCXO Blcok

LGE Internal Use Only - 96 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

Check TP1
VCC of VCXO

No
VCC ≥ 2.8V Check PMIC

Yes
Check TP2
TRK_LO_ADJ

No
3V≥ Voltage≥ 0V Check MSM

Yes

Check TP3, TP4


With Oscilloscope

No Check soldering
19.2MHz Signal and components

Yes

VCXO is OK
Check other part

Copyright © 2007 LG Electronics. Inc. All right reserved. - 97 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.4 Checking Front-End Module Block


TP4
TP1 TP3 VREG_RF_SMPS
C109
47p
5 10
ANT_SEL0 4
VC1 ANT
ANT_SEL1 3
VC2
6
ANT_SEL2 VC3 VDD
7
NC
1
C113 GND1
C115 2 8
47p 47p GND2 UMTS_TX_RX
9 13
TP2 C114
11
12
GND3
GND4
DCS_PCS_TX
EGSM_TX
16
47p GND5
14 19
GND6 DCS_RX2
15 20
GND7 DCS_RX1
17 21
GND8 PCS_RX2
18 22
GND9 PCS_RX1
25 23
PGND1 EGSM_RX2
26 24
PGND2 EGSM_RX1
LSHS-M090UH

Schematic of the Front-End Module Block

TP3 TP2 TP1

TP4

Test Point of Front-End Module Block

LGE Internal Use Only - 98 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

Vc3 Vc2 Vc1 Vdd


GSM900 Tx L H H H
DCS1800/PCS1900 Tx L L H H
UMTS Tx/Rx H L H H
GSM 900 Rx L L/H L H
DCS 1800 Rx H L/H L H
PCS 1900 Rx L L/H L H

Logic Table of the FEM

- UMTS Tx/Rx - GSM900 Tx

TP1 (Vc1)
TP1 (Vc1)

TP2 (Vc2)
TP2 (Vc2)
TP3 (Vc3)
TP3 (Vc3)

- DCS1800/PCS1900 Tx - GSM Rx / PCS1900 Rx

TP1 (Vc1)
TP1 (Vc1)
TP2 (Vc2)
TP2 (Vc2)

TP3 (Vc3) TP3 (Vc3)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 99 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

- DCS1800 Rx

TP1 (Vc1)

TP2 (Vc2)

TP3 (Vc3)

Checking Switch Block power source

Check Soldering
ANT_SEL0, 1, 2 High Level

NO Check VDD
2.5V < Voltgae < 3.0V
TP4 VREG_RF_SMPS

YES

Check the Logic


in each mode

LGE Internal Use Only - 100 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.5 Checking UMTS Block

4.5.1 Checking TX level


KMS-518
SW100
TP1
G1

G2
A
C

C101 120p

L102
NA

FL100
5 10
VC1 ANT
4
VC2
3 6
VC3 VDD
7
NC
1
2
9
11
GND1
GND2
GND3
UMTS_TX_RX
DCS_PCS_TX
8
13
16
TP2
GND4 EGSM_TX
12
GND5
14 19
GND6 DCS_RX2
15 20 C152
GND7 DCS_RX1 3.9p
17 21
18
25
26
GND8
GND9
PGND1
PCS_RX2
PCS_RX1
EGSM_RX2
22
23
24
TP4
PGND2 EGSM_RX1
LSHS-M090UH
2.2nH
L121
C156
2.2p

FL104
EFCH1950TDF1
2

1
4
8

C159
+VPWR
ANT

GND1
GND2
GND3

FL103 8.2p
4 5 C161
SAYZY1G95EB0B00 C160 C162 C163 C164 O1 G3 1
22u 0.01u 100p 1u IN WCDMA_2100_TX_OUT
GND6
GND5
GND4

G2 G1
L123
56p
RX

L124
TX

3 2
15nH C165
3.3nH NA L122
7

3
6
9

U105 NA

11
GND5

C167
U104 10
9
VCC2 VCC1
1
2
C168 C170 GND4 RFIN
C169 5.6p SCDY0003403 8 3
RFOUT GND1
7 4
1

56p 56p 1.8p GND3 VMODE PA_R1


4.7nH 6 5
OUT

IN

L125 L128 L126


GND2 VREF
Q100
1.2nH 20dB 8.2nH
VREG_TCXO_2.85V
50OHM

AWT6277R
COUP

PQ

C173 PA_ON
4

100p
R124 R123
5

51 PWR_DET
68 KRX102E
R125 R126
100
8 dB
100
TP3

Schematic of the WCDMA Tx Block

TP4

TP3

TP2
TP1

Test Point of the WCDMA Tx Block

Copyright © 2007 LG Electronics. Inc. All right reserved. - 101 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

For testing, Max power of UMT 2100 is needed.

Run a FTM program


set RF mode to IMT
set uplink freq. To
9750 click Tx on and
WCDMA set PA range
R1 on set Tx AGC to
410

Check coupler U104

Check Tx SAW
Check Duplexer
Filter
FL103
FL104

Check PAM block Check FEM FL100


U105

LGE Internal Use Only - 102 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.5.2 Checking UMTS PAM Control Block


• PAM control signal
1. PWR_DET : UMTS Tx Power Detected value (Check R123)
2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control
3. VREG_TCXO_2.85V : UMTS PAM enable (about 2.85V)
4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)
5. PA_ON : Turns the PA on and off
6. PA_R1 : Control signals that step the active PA mode and bias

+VPWR

VREG_TCXO_2.85V R123

UMTS2100
Coupler

Copyright © 2007 LG Electronics. Inc. All right reserved. - 103 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.5.3 Checking RX level

TP3

Vbias

TP4
TP2

TP1

KMS-518
TP1 SW100
G1

G2
A
C

ANT100 ANT101 ANT102 L100 L101


C101 120p
0 4.7nH

C102 C104 L102


NA
12nH 1.2p

PQ FL100

LGE Internal Use Only - 104 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

Vbias
VDD_RX
L115
C149 EFCH2140TDE1 L116
22p
L114 FL102 1nH
WCDMA_MIX_IN_M
1.5nH 1nH

TP2 C153 C154 2 3


G1 O1
C155
WLNA_OUT 1
IN
G2 O2
0.5p
C152 56p
3.9p 56p 5 4

L117 L118
L119
1.8nH
1nH
WCDMA_MIX_IN_P
PQ 1nH
2.2nH
L121

TP4
C156
2.2p

TP3 FL104
EFCH1950TDF1
2

1
4
8

C159
+VPWR
ANT

GND1
GND2
GND3

FL103 8.2p
4 5 C161
SAYZY1G95EB0B00 C160 C162 C163 C164 O1 G3 1
22u 0.01u 100p 1u IN
GND6
GND5
GND4

G2 G1
L123
56p
RX

L124
TX

3 2
15nH C165
3.3nH NA
7

3
6
9

U105
11
GND5

C167
U104 10
9
VCC2 VCC1
1
2
C168 C170 GND4 RFIN
C169 5.6p SCDY0003403 8 3
RX_WCDMA_2100 RFOUT GND1
7 4
1

56p 56p 1.8p GND3 VMODE PA_R1


4.7nH 6 5
OUT

IN

L125 L128 L126


GND2 VREF
Q100
1.2nH 20dB 8.2nH
VREG_TCXO_2.85V
50OHM

3
AWT6277R
COUP

PQ

C173 PA_ON
4

2
100p
R124 R123

1
51 PWR_DET
68 KRX102E
R125 R126
100 100
8 dB

Check Vbias over 2V?

Check the RF S/W

Check TP2 Check FEM


Signal exist? FL100

Check TP3 Check the Duplexer


Signal exist? FL103

Check TP4 Check the RTR6275


Signal exist? U100

Copyright © 2007 LG Electronics. Inc. All right reserved. - 105 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.6 Checking GSM Block

2
1

4.6.1 Checking Front-End Module


Refer to chapter 3.4

LGE Internal Use Only - 106 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.6.2 Checking RF Tx Level

KMS-518 TP1
SW100
G1

G2
A
C

ANT100 ANT101 ANT102 L100 L101


C101 120p
0 4.7nH

C102 C104 L102


NA
12nH 1.2p

PQ FL100 TP2
5 10
ANT_SEL0 4
VC1 ANT
ANT_SEL1 3
VC2
6
ANT_SEL2 VC3 VDD
7
NC
1
C113 GND1
C115 2 8
47p 47p GND2 UMTS_TX_RX 14 1
9 13 GND6 DCS_PCS_IN
GND3 DCS_PCS_TX
11 16
C114 GND4 EGSM_TX 13 2
47p 12 GND5 BS
GND5
14 19 12 3
GND6 DCS_RX2 VCC TX_EN
15 20 U101
GND7 DCS_RX1
17 21
GND8 PCS_RX2 11 TQM7M5003 4
18 22 C136 8p GND4 VBATT
GND9 PCS_RX1

DCS_PCS_OUT
25 23
PGND1 EGSM_RX2 10 5
26 24 C138 GND3 GND1
PGND2 EGSM_RX1
L112 9 6
LSHS-M090UH NA GSM_OUT VRAMP

GND8

GND7
15nH 8 7
GND2 GSM_IN

17

16

15
C146 10p
TP3
C142
L113
4.7nH
0.75p

PQ

Schematic of the GSM Tx Block

TP1 TP2

TP3

Test Point of GSM Tx Block

Copyright © 2007 LG Electronics. Inc. All right reserved. - 107 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

START

Check TP1
If GSM over 31 dBm? Yes GSM/DCS/PCS Tx is OK
If DCS/PCS over 28dBm? Check other part

No

Check TP2, TP3 Yes Check Front-End


If TP2 over 29dBm? Module
If TP3 over 25dBm? Refer to chapter 3.4

No

Check PAM Block OK? Yes


Check the RTR6275
Refer to chapter 3.6.3

No

Check Soldering of PAM (U101)


If problem still exist,
replace the PAM

Yes
Problem resolved ? GSM/DCS/PCS Tx is OK

No

Change the Board

LGE Internal Use Only - 108 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.6.3 Checking PAM Block


TP2 TP3
14 1 R111
GND6 DCS_PCS_IN DCS_PCS_TX
68
13 2
GND5 BS GSM_PA_BAND R112 R113
91 10 dB 91
12 3
VCC TX_EN GSM_PA_EN
U101
11 TQM7M5003 4
GND4 VBATT +VPWR
C137 C135
DCS_PCS_OUT

10 5 33u
GND3 GND1 1u

9
GSM_OUT VRAMP
6 FL101
GND8

GND7

3 2
8 7
EFCH897MTDB1
G2 G1 R114
GND2 GSM_IN IN GSM_TX
O1 G3 1
51
17

16

15

4 5 8 dB
R117 2.2K R118 R119
GSM_PA_RAMP 120 120

C143
68p

TP1 GSM_PA_BAND MODE


LOW GSM
HIGH DCS/PCS

Schematic of PAM Block

TP3

TP2

TP1

Test Point of PAM Block

Test Point Net name Description


TP1 GSM_PA_RAMP Power Amp Gain Control. Typically, 0.2 ~1.6V
TP2 GSM_PA_EN Power Amp Enable (ON : >2.5V, OFF : <0.7V)
TP3 +VPWR PAM Supply Voltage (Vcc > 3V)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 109 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.6.4 Checking RF Rx Level

KMS-518
SW100
G1

G2
A
C

C101 120p

L102
NA

L103 5.6nH

VREG_RF_SMPS
FL100 C109
DCS L104
15nH TP3
47p L105 5.6nH
5 10
VC1 ANT
4
VC2
3 6
VC3 VDD
7
NC
1
GND1
2 8
GND2 UMTS_TX_RX
9 13
GND3 DCS_PCS_TX
11 16 L106 5.6nH
GND4 EGSM_TX
12
GND5
14 19 L107
15
17
GND6
GND7
DCS_RX2
DCS_RX1
20
21
PCS 15nH TP2
GND8 PCS_RX2 L108 5.6nH
18 22
GND9 PCS_RX1
25 23
PGND1 EGSM_RX2
26 24
PGND2 EGSM_RX1
LSHS-M090UH
L109 22nH

GSM L110
22nH
TP1
L111 22nH

Schematic of GSM-900, DCS-1800, PCS-1900 Rx Block

TP1 TP2 TP3

Test Point of Rx Block

LGE Internal Use Only - 110 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

Copyright © 2007 LG Electronics. Inc. All right reserved. - 111 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.7 Power on trouble


Power on sequence of KU990 is :
PWR key press → PM_ON_SW_N go to low (VA700, PM6650-2M KPDPWR_N pin#24) → PM6650-
2M Power Up → VREG_MSMC_1.2V(C560), VREG_MSME_1.8V(R520), VREG_MSMP_2.7V(R513),
VREG_MSMA_2.6V(R508), VREG_TCXO_2.85V(C510) power up → PON_RESET_N assert to MSM
→ Phone booting & PS_HOLD(D500) assert High to PMIC(PM6650-2M)

Start

NO Change or charging the


Battery voltg. higher
than 3.2V? Battery

YES

Press PWR key NO


Follow the LED trouble
Keypad LED on? shoot

YES
NO
VA700 high to low Check open Pattern
when key press? of power button
Check Dome Sheet
YES

VREG_MSMC_1.2V, NO
VREG_MSMP_2.7V, VREG_MSME_1.8V
Change the Main board
VREG_TCXO_2.85V,
VREG_MSMA_2.6V power up?

YES
NO
Is clock ok?
X100 : 19.2M Check the TXCO and SLEEP CRYSTAL
X500 : 32.768Khz

YES

Change the Main board

LGE Internal Use Only - 112 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

VREG_TCXO_2.75V(C510)

VREG_MSMA_2.6V(R508)
VREG_MSMP_2.7V(R513)

SLEEP CRYSTAL(32.768KHz)

VREG_MSMC_1.2V(C560)

VREG_MSME_1.8V(R520)

TCXO ( 19.2MHz )

Copyright © 2007 LG Electronics. Inc. All right reserved. - 113 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

RESET_IN_N(R208)

PS_HOLD(D500)

PM_ON_SW_N (D700)

LGE Internal Use Only - 114 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.7.1 USB trouble


USB Initial sequence of KU990 is :
USB connected to KU990 → USB_VBUS(C540) go to 5V
→ USB_D+(VA202) go to 3.3V → 48M Crystal on → USB_DATA is triggered → USB work

Start

NO
Cable is insert? Cable insert

YES
NO Check C540, R514,U500
USB_VBUS is about
to 5V? USB cable

YES

NO
USB_D+ is about to 3.3V? Check VA500,U507,U304

YES
NO
48MHz is run? Check X200

YES

Change the Main board

VA500(USB_D+)

X200(48MHz)

R514(USB_VBUS)

C540(USB_VBUS)

U500(USB_VBUS)

U507(USB_D+) U304(USB_D+)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 115 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.7.2 UMS(USB MASS STORAGE) trouble


UMS Initial sequence of KU990 is :
USB connected to KU990 → VREG_5V(R335, UMS) go to 5V → VREG_USB_3.3V(R301) go to 3.3V
→ USB_DATA is triggered → USB work

Start

NO
Cable is insert? Cable insert

YES

VREG_5V is about
NO Check R335, D501
to 5V?

YES

NO
VREG_USB_3.3V is
Check R301,C529, USB CABLE
about to 3.3V?

YES
NO
MICRO SD function OK? Follow the micro sd trouble

YES

Change the Main board

< TOP SIDE >

R335(VREG_5V)

R301(VREG_USB_3.3V)
D501(VREG_5V) C529 (VREG_USB_3.3V)

LGE Internal Use Only - 116 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.8 SIM detect trouble


USB Initial sequence of KU990 is :
VREG_USIM_3.0V(C552 of PM6650) go to 3.0V → USIM clock, reset and data triggered → USIM IF
work (Schematic and place are refer to SIM technical brief)

Start

Re-insert the SIM card

Yes
Work well? End

No
NO
VREG_USIM_3.0V is 3.0V?
USIM_P_CLK is run? Check J400, D400,C552

YES

Change SIM card

Yes
Work well? End

No

Change the Main board

USIM_P_RST_N USIM_P_CLK

USIM_P_DATA

J400
C552(VREG_USIM_3.0V)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 117 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.9 Key sense trouble ( KEYPAD )


Key Sense sequence of KU990 is :
Default condition ROW(0-2) is 2.7V → Press the key → Corresponding ROW(x) and COL(x) go to 0V
→ Scan pulse( Col => Row ) → MSM sense what key pressed.

START

Check the R701,R705,R706 with no key press

NO
ROW(0-2) is 2.7V?
Check R701,R705,R706
Yes
Check the R701,R705,R706 with key press

ROW(0-2), Yes
Change the Main board
COL(0-1) is 0V?

NO
Side Key
Change the DOME SHEET

Work well?
YES
NO
Change SIDE KEY
NO

Work well?
YES
NO
Check VA700~ VA707, R707~R710

Work well?
YES
NO
Change the Main board
Dome sheet

End

LGE Internal Use Only - 118 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

VREG_MSMP_2.7V
END

PM_ON_SW_N END
R701

51K

700 701

EVL14K02200
SEND CLR

VA700
KEY_ROW[2]

KEY_COL[0]

KEY_COL[1]
EVLC14S02050

EVLC14S02050

EVLC14S02050

ON_SW KEY
VA701(ROW2)
VA703
VA701

VA702

VA702(COL0) VA703(COL1)

SEND CLR END

VREG_MSMP_2.7V

LOCK
R705

R706
51K

51K

CN700
1 R707 470
KEY_ROW[0]
2 R708 470
KEY_ROW[1]
3 R709 470
KEY_COL[0]
4 R710 470
KEY_COL[1]
5
EVLC14S02050

EVLC14S02050

EVLC14S02050
EVLC14S02050

SHOT
VA707
VA704

VA705

VA706

SIDE KEY

Schematic of key sense part

Copyright © 2007 LG Electronics. Inc. All right reserved. - 119 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.10 Keypad backlight trouble


Key Pad Back Light is on as below :
Key pressing → PM6650 KYPD_LED_EN go to Low → LED On (Key Pad LED controlled by PM6650)

Start

Key press

NO Check device short :


+VPWR is OK? LD700~705 and R711~716 (Main)

Yes
Signal KYPD_LED_EN
NO
Change the main board
is Low?
Yes
Some LED Yes
is not work?
Check device open :
LD700~705 and R711~716 (Main)
NO
NO
Work well? Change the main board

Yes

End

R711~716 (Main) VA708 (KYPD_LED_EN)

LD703 (+VPWR)

LD700~705 (Main)

LGE Internal Use Only - 120 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

+VPWR LD703 (+VPWR)

SSC-TWH104-HL
SSC-TWH104-HL
LEGG-S14G

LEGG-S14G

SSC-FR104-II1

SSC-FR104-II1
LD704

LD700
LD705

LD702

LD701

LD703
200

200
47

47

47

47
R711
R713
R716

R715

R712

R714
KYPD_LED_EN
Rev. 1.1

VA708

EVL14K02200
LD700~705 and R711~716 (Main)

(GREEN) (WHITE) (RED)


VA708 (KYPD_LED_N)

Schematic of keypad backlight part

Copyright © 2007 LG Electronics. Inc. All right reserved. - 121 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.11 Micro SD trouble


Micro SD is worked as below :
Micro SD insertion → MICROSD_DETECT(R804) goes to low → go working

Start

Insert the Micro SD Card

NO
MICROSD_DETECT(R804)) Change the SUB board
is low ?

YES YES
Work well?
NO
Check VREG_MMC_3.0V
is over 2.85V? NO

YES Change the MAIN board


NO
Work well?

YES

End

R804(DETECT) C807(VREG_MMC_3.0V)
SOCKET

LGE Internal Use Only - 122 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.12 Audio trouble

4.12.1 Receiver path


Voice Receiver path as below:
MSM6280 Ear1ON/Ear1OP → CN701(VGA CAM FPCB connector) → Receiver

Start

Connect the phone to network


Equipment and setup call
Setup 1KHz tone out

Hear the tone to the receiver?

NO
YES
Change the Receiver END

Check connector pin


or change the VGA CAM FPCB

Can you hear the tone?

YES

END

Copyright © 2007 LG Electronics. Inc. All right reserved. - 123 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

VGA CAM
FPCB
connector

Receiver Receiver
pads

MSM6280

LGE Internal Use Only - 124 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.12.2 Voice path for headset


Voice path for Head_Set as below:
MSM6280 HPH_R, HPH_L → C548,C549 U502(audio codec) → C578,C562 → R529,C522 →
U504(Headset AMP) → FB502, FB503 → R525, R524 → #4, #5 pin of CN500 headset Jack

Start

Connect the phone to network


Equipment and setup call
Setup 1KHz tone out
And insert head_Set

Headset insertion detection NO Check #8 pin of CN500


in the Main LCD Display OK? or change the Main bíd

YES
NO
The sine wave appear at
Change the Main board
C548,C549 ?

YES
NO Check the U502
The sine wave appear at
C578,C562 ? or change the Main bíd

YES
NO Check the U504
The sine wave appear at
R525,R524 ? or change the Main bíd

YES
NO
Can you hear the tone? Check the CN500 or change the
Main bíd

YES

END

Copyright © 2007 LG Electronics. Inc. All right reserved. - 125 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

CN500

19
21
13
12
11
10

CN500
9
8
7
6
5
4
3
2
1 FB504
R524
R525

R528 100K
RMT_INT-USB_D+
RMT_PWR_ON_N

VBATT
EAR_SENSE_N

MIDI_EAR_R
MIDI_EAR_L

EAR_MIC_P
FM_ANT
RMT_ADC-USB_D-

TV_OUT

Schematic of voice path

LGE Internal Use Only - 126 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

U502

C548 C549

VREG_5V
R533
C514 C513 VREG_WM_2.7V
0.1u 10u 0

C516 C517
4.7u 0.1u

MIDI_3.3V

C518 C519
4.7u 0.1u VREG_MSME_1.8V

C520 C521
4.7u 0.1u

U502 WM8983
13 12
DCVDD DGND
14
DBVDD
26 28
AVDD2 AGND1
31
AVDD1
24
AGND2 C525
MMP_A_LRCLK
MMP_A_BCLK
7
8
LRC
BCLK
U502 C524
0.1u 10u
9
C530 MMP_ADI_ADCDAT ADCDAT C531
10 27
12n MMP_ADO_DACDAT DACDAT VMID NA
11
MMP_A_MCLK MCLK
32
C534

C532 1u R510 C533 R511 MICBIAS MIC_PWR


4
1u

SPK_R RIP
5 29 HP_EAR_R
1K 4.7n 18K RIN ROUT1
30
C535 1u LOUT1 HP_EAR_L
6
FM_AUDIO_R R2_GPIO3
C536 1u FB500
3 23
C539

FM_AUDIO_L L2_GPIO2 ROUT2 SPK_OUT+


1u

1 25
C541 1u R516 C542 R517 MID_MICP LIP LOUT2 SPK_OUT-
2
SPK_L LIN FB501
1K 4.7n 18K C543 C544
19 22
C547 AUXL OUT3 MIC2P NA NA
21
12n OUT4
20
AUXR
18
MODE
15
CSB_GPIO1
16
R519

100K

CODEC_I2C_SCL SCLK
17 33
C548 1u CODEC_I2C_SDA SDIN PGND
HP_L
C549 1u
HP_R

C550 C551
NA NA

Schematic of voice path

Copyright © 2007 LG Electronics. Inc. All right reserved. - 127 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

FB502
FB503

U504
C578
C562 R529
R522

HP_AMP_EN
0.22u
C562

HP_EAR_L
R522

15K

MIDI_3.3V
17

16

15

14

13

C565 C566
4.7u 1u
P_G

_SHDN

INL+

INL_

SVDD1

FB502 600
1 12 R524
PVDD OUTL MIDI_EAR_L
68
2 11
C1P U504 SVSS
MAX9722BETE FB503 600
3 10 R525
C570 PGND OUTR MIDI_EAR_R
1u
U504 PQ
68
4 9
C1N SVDD2
SGND
PVSS

INR+

INR_

PRSB6.8C

PRSB6.8C
C573

C574
5

PQ
R529

15K

0.22u
C578

C577
1u
HP_EAR_R

Schematic of voice path

LGE Internal Use Only - 128 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.12.3 Loud speaker path (voice speaker phone/VT)


Loud speaker path as below:
MSM6280 SPK_R, SPK_L → C532,C541 → R510,R516 → C533,C542 → R511,R517 →
U502(audio codec) → FB500,FB501 → CN603(B’toB connector) → OUT800, OUT801 (SPK PAD) →
Speaker

Start

Connect the phone to network


Equipment and setup call
Setup 1KHz tone out
Set phone with speaker phone mode

The sine wave appear at NO


Change the Main board
C532,C541?

YES

The sine wave appear at NO Check the U502 or


FB500, FB501? Change the Main board

YES

The sine wave appear at NO Check the CN603


pads of speaker?

YES

NO
Can you hear the tone? Change the speaker

YES

END

Copyright © 2007 LG Electronics. Inc. All right reserved. - 129 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

AC18
LINE_ON HP_R
AC17
LINE_OP HP_L
AA17
HPH_R SPK_R
W17
HPH_L SPK_L
AE18
EAR1ON RCV-
AF18
EAR1OP RCV+
T15
MICBIAS MICBIAS

24
AGND2 C525
7 C524
MMP_A_LRCLK LRC 0.1u 10u
8
MMP_A_BCLK BCLK
9
C530 MMP_ADI_ADCDAT ADCDAT C531
10 27
12n MMP_ADO_DACDAT DACDAT VMID NA
11
MMP_A_MCLK MCLK
32
C534

C532 1u R510 C533 R511 MICBIAS MIC_PWR


4
1u

SPK_R RIP
5 29 HP_EAR_R
1K 4.7n 18K RIN ROUT1
30
C535 1u LOUT1 HP_EAR_L
6
FM_AUDIO_R R2_GPIO3
C536 1u FB500
3 23
C539

FM_AUDIO_L L2_GPIO2 ROUT2 SPK_OUT+


1u

1 25
C541 1u R516 C542 R517 MID_MICP LIP LOUT2 SPK_OUT-
2
SPK_L LIN FB501
1K 4.7n 18K C543 C544
19 22
C547 AUXL OUT3 MIC2P NA NA
21
12n OUT4
20
AUXR
18
MODE
15
CSB_GPIO1
16
9

CODEC I2C SCL SCLK


VREG_MSMP_2.7V

VREG_MMC_3.0V
VREG_BT_2.85V

+VPWR

CN603
G1
1 40
EAR_MIC_P
2 39
BT_SBST
3 38
BT_TX_RX_N
4 37
TCXO_BT
5 36
MICROSD_CLK
6 35
BT_CLK MICROSD_DETECT
7 34
MICROSD_CMD
8 33
MICROSD_DATA[0]
9 32
MICROSD_DATA[1]
10 31
BT_SBCK MICROSD_DATA[2]
11 30
BT_SBDT MICROSD_DATA[3]
12 29
BT_DATA
13 28
14 27
V_BACK_UP CAM_MIC+
15 26
HOOK_SENSE_N WHEEL_SW_R
16 25
CAM_VDD_AF_2.7V WHEEL_SW_L
17 24
CAM_VDD_SD_1.8V
18 23
MMP_CAM_PWR_EN
19 22
SPK_OUT-
20 21
SPK_OUT+
G2

AXK740327G

LGE Internal Use Only - 130 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

Pads of Speaker

C532,C541

C722

MSM
U502 (audio codec)

FB500, FB501

CN603

Copyright © 2007 LG Electronics. Inc. All right reserved. - 131 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.12.4 Microphone for main MIC


Main Microphone path as below:
MIC → C567,C568 → MSM internal CODEC

MICBIAS

C564
47p

C563
SPM0204HE5-PB-3
10u
P C567 22n MIC1N
4
G2 C569
3
G1 C568 22n NA
2
O MIC1P
1

MIC1N
MIC500

MIC1P
C200

0.1u
C575 C576

MIC 33p 10p


10p

C235
C236 0.1u

NA

NA

NA
C203

C204

C237
C238 0.1u
Place near
10%
MSM pin W18
(CODEC VSS)
AC21
AC19
AC20

AA20
AE19

AE20
AF19

AF21
AF22
AF20
LINE_L_IP
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP

F25
SDCC_DAT1_GPIO99 MSM
M25
SDCC_DAT2_GPIO100 MSM
Start SDCC_DAT3_GPIO101
M26
MSM

Make a call

NO
MIC_BIAS(R221) is 1.8V? Change the Main B'd

YES
make some sound or
voice to MIC

Can you scoping some NO Change the MIC or


sound signal at C567,C568? Change the Main B'd

YES
YES
Work well? END

LGE Internal Use Only - 132 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

MSM

C567, C568

MIC500 (MIC for Handset)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 133 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.12.5 Microphone for headset


MIC for Head_Set path as below:
Insert Headset → EAR_SENSE_N(pin8) go 0V → MSM6280 sense Head_Set insertion →
MIC signal → U502(audio codec) → MSM6280.

L504 VREG_MSMP_2.7V
2.2uH
100K

CN500
R528

21
19 24
AGND2 C525
1 FB504
FM_ANT
7 C524
2 MMP_A_LRCLK LRC 0.1u 10u
EAR_MIC_P 8
3
TV_OUT
MMP_A_BCLK BCLK
4 9
MIDI_EAR_L MMP_ADI_ADCDAT ADCDAT C531
5
MIDI_EAR_R
10 27
6 MMP_ADO_DACDAT DACDAT VMID NA
RMT_INT-USB_D+ 11
7 MMP_A_MCLK MCLK
8
RMT_ADC-USB_D- 32

C534
EAR_SENSE_N MICBIAS MIC_PWR
9 4

1u
10
VBATT RIP
5 29 HP_EAR_R
11 RIN ROUT1
12
RMT_PWR_ON_N 30
LOUT1 HP_EAR_L
13 6
14
R2_GPIO3
15 FB500
USB_VBUS 3 23
C539

16 L2_GPIO2 ROUT2 SPK_OUT+


UART TXD
17
1u

1 25
MID_MICP LIP LOUT2 SPK_OUT-
2
LIN FB501
C543 C544
19 22
AUXL OUT3 MIC2P NA NA
21
OUT4
20
AUXR
18
MODE
15
CSB_GPIO1
16

K
CODEC I2C SCL SCLK

MIC2P
Start

Make a call L200

100nH
YES
Try ch ange the head set END
MIC1N
MIC1P

C200
0.1u

NO 10p
NO
C235

EAR_SENSE_N is 0V? Change the Main b'd


YES
C236 0.1u

NO
NA

NA

MIC_BIAS is 2.7V ? Change the Main b'd


C203

C204

YES
make some sound or C2

vo ice t o MIC
AC21
AC19
AC20

AA20
AE19

AE20
AF19

AF21
AF22
AF20
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP

Can y ou s coping s ome NO


sound signal at C539? Change the MIC SDCC_DAT1_GPIO99
SDCC_DAT2_GPIO100
SDCC DAT3 GPIO101

YES

Can y ou s coping s ome NO Check t he U502 or


sound signal at C235,L20 0? Change the Main Bíd

YES
YES
Work w ell? END

LGE Internal Use Only - 134 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

C535 #8 pin of ear connector


to check EAR_SENSE_N

MSM

Copyright © 2007 LG Electronics. Inc. All right reserved. - 135 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.13 Camera trouble


Camera control signals are generated by ZORAN (Multimedia Chip)
and directly connected with ZORAN.
KU990 has two cameras. The one is a 5 Mega Camera, the other is VGA camera.

5M START

Check the camera conn. and


reconnect the camera

Yes
Camera is OK? End

NO

NO
ZORAN output signal check
(MMP_CAM_RESET_N, MMP_
CAM_PWR_EN))

Yes

NO
Change the LDO (U601, U602, U701, U900, U901)

Yes

Check master clock NO


5M_CAM_MCLK Change the Analog Switch (U604, U607)
(CN600)

Yes

Check MMP_CAM_PCLK Yes No


Check the EMI/ESD filter
(CN600) (FL600, FL601)

No Yes

Change the camera


Change the Filter

Yes
Camera is OK End

NO

Change the Main board

LGE Internal Use Only - 136 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

MMP_CAM_PWR_EN

CAM_VDD_SA_2.7V CAM_VDD_SD_1.8V

CAM_VDD_IO_2.7V FL600
U604 U607

MMP_CAM_RESET_N FL601

CAM_VDD_CORE_1.2V 5M_CAM_MCLK

MMP_CAM_PCLK

CAM_VDD_AF_2.7V

Copyright © 2007 LG Electronics. Inc. All right reserved. - 137 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

C609 : CAM_VDD_SA_2.7V
CAM_VDD_AF_2.7V
C601 : CAM_VDD_AF_2.7V
C606 : CAM_VDD_IO_2.7V
CAM_VDD_SA_2.7V
C605 : CAM_VDD_CORE_1.2V CAM_VDD_CORE_1.2V CAM_VDD_SD_1.8V
CAM_VDD_IO_2.7V C607 :
C601 C602 C600
CAM_VDD_SD_1.8V
0.1u 1u 10u

C605

0.1u
0.1u

1u
C606
GB042-30S-H10-E3000 0.1u C607

C608
C609
CN600
0.1u
30 1
R601 10 29 2
MMP_I2C_SCL
R602 10 28 3
MMP_I2C_SDA
R603 10 27 4
MMP_CAM_VSYNC
R604 10 26 5
MMP_CAM_HSYNC
25 6
MMP_CAM_RESET_N MMP_CAM_INT
24 7
STROBE_TRIGGER
23 8
5M_CAM_DATA[6] 5M_CAM_DATA[7]
22 9
5M_CAM_DATA[4] 5M_CAM_DATA[5]
21 10
5M_CAM_DATA[2] 5M_CAM_DATA[3]
20 11
5M_CAM_DATA[0] 5M_CAM_DATA[1]
19 12
R607 18 13 R608 10
5M_CAM_MCLK MMP_CAM_PCLK
17 14
33
VA600

VA601
16 15
VA602
ICVL0518100Y500FR

ICVL0518100Y500FR
C610 C611 C612 C613 C614
10p 10p 10p 10p 0.1u
EVLC18S02015

R607 : 5M_CAM_MCLK R608 : 5M_CAM_PCLK

N14
MMP_I2C_SCL SCL
P14
MMP_I2C_SDA SDA
P2
10
5

MMP_CAM_RESET_N GPIO0
M3
G2
G1

MMP_STROBE_CHARGE GPIO1
P7
MMP_CAM_PWR_EN GPIO2 MMP_CAM_DATA[7] INOUT_B4 INOUT_A4 5M_CAM_DATA[7]
N1 MMP_CAM_DATA[6]
6
INOUT_B3 INOUT_A3
4
5M_CAM_DATA[6]
MMP_CAM_INT GPIO3 7 3
P1 MMP_CAM_DATA[5] INOUT_B2 INOUT_A2 5M_CAM_DATA[5]
TP302 GPIO4
100K

8 2
R331

R333 NA M5 MMP_CAM_DATA[4] INOUT_B1 INOUT_A1 5M_CAM_DATA[4]


MICROSD_DETECT GPIO5 9 1
N6
GPIO6 ICVE10184E070R100FR FL600
M6
TP303 GPIO7
P5
GPIO8
N5
GPIO9 FL600
R331 : MMP_CAM_PWR_EN U604
U604 NC7SB3157L6X
1 6
5M_CAM_MCLK B1 S CAM_SELECT_N
2 5
GND VCC +VPWR
3 4
10
5

VGA_CAM_MCLK B0 A CAM_MCLK
G2
G1

MMP_CAM_DATA[3] INOUT_B4 INOUT_A4 5M_CAM_DATA[3]


6 4
U607 NC7SB3157L6X MMP_CAM_DATA[2] INOUT_B3 INOUT_A3 5M_CAM_DATA[2]
1 6 7 3
B1 S MMP_CAM_DATA[1] INOUT_B2 INOUT_A2 5M_CAM_DATA[1]
2 5 8 2
GND VCC +VPWR MMP_CAM_DATA[0] INOUT_B1 INOUT_A1 5M_CAM_DATA[0]
9 1
3 4
5M_CAM_MCLK B0 A MMP_CAM_MCLK
ICVE10184E070R100FR FL601

U607 C621 C622 FL601


0.1u 0.1u

Schematic of 5M camera part

LGE Internal Use Only - 138 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

VGA START

Check the camera & 30-pin conn.


And reconnect these connectors
(Main & FPCB connector)

Yes
Camera is OK? End

NO

NO
MSM6280 output signal check
(VGA_CAM_RESET_N, V
VGA_CAM_PWDN)

Yes

NO
Check VGA_VDD_2.7, Change the LDO (U600)
VGA_VDD_1.8V

Yes
NO NO
Check master clock
(VGA_CAM_MCLK : R717) Change the Analog Switch (U604, U607)

Yes

NO
Check the EMI/ESD filter Change the Filter (FL700, FL701)

Yes

Yes NO No
Check the VGA_CAM_PCLK Change the slider FPCB
(R718)

Yes

Change the camera

Yes
Camera is OK End

NO

Change the Main board

Copyright © 2007 LG Electronics. Inc. All right reserved. - 139 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

VGA_CAM_PWDN VGA_CAM_PCLK

FL700, FL701 : EMI FILTER

VGA_CAM_PCLK

VGA_CAM_RESET_N

VGA_VDD_1.8V VGA_VDD_2.7V

U604 U607

LGE Internal Use Only - 140 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

R718 : VGA_CAM_PCLK
VGA_VDD_2.7V

VGA_VDD_1.8V

R717 : VGA_CAM_MCLK

CN701
1 30
VGA_CAM_PWDN R717 2 29
VGA_CAM_MCLK
3 28
10 VGA_CAM_RESET_N
R718 10 4 27 R719 10
MMP_CAM_PCLK I2C_SCL
5 26 R720 10
VGA_CAM_DATA[0] I2C_SDA
6 25
VGA_CAM_DATA[1]
7 24 R724 10
VGA_CAM_DATA[2] MMP_CAM_HSYNC
8 23 R725 10
VGA_CAM_DATA[3] MMP_CAM_VSYNC
9 22
VGA_CAM_DATA[4] VGA_CAM_DATA[7]
10 21
VGA_CAM_DATA[5] VGA_CAM_DATA[6]
11 20
MOTOR+
12 19
MOTOR- x+
13 18
Y+
14 17
RCV+ x-
15 16
RCV- Y-
VA713

VA714

VA715
R729

C710 C711 C712 C713 C709 C714 C715


ICVL0518100Y500FR

0.1u 0.1u 10p 10p 10p 10p


EVLC18S02015

EVLC18S02015
NA 0.1u
resistor

VA713 : VGA_CAM_PWDN C709 : VGA_VDD_1.8V


VA713 : VGA_VDD_2.7V
VA713 : VGA_VDD_2.7V

FL700 FL701
ICVE10184E070R100FR ICVE10184E070R100FR
1 9 1 9
MMP_CAM_DATA[0] INOUT_A1 INOUT_B1 VGA_CAM_DATA[0] MMP_CAM_DATA[4] INOUT_A1 INOUT_B1 VGA_CAM_DATA[4]
2 8 2 8
MMP_CAM_DATA[1] INOUT_A2 INOUT_B2 VGA_CAM_DATA[1] MMP_CAM_DATA[5] INOUT_A2 INOUT_B2 VGA_CAM_DATA[5]
3 7 3 7
MMP_CAM_DATA[2] INOUT_A3 INOUT_B3 VGA_CAM_DATA[2] MMP_CAM_DATA[6] INOUT_A3 INOUT_B3 VGA_CAM_DATA[6]
4 6 4 6
MMP_CAM_DATA[3] INOUT_A4 INOUT_B4 VGA_CAM_DATA[3] MMP_CAM_DATA[7] INOUT_A4 INOUT_B4 VGA_CAM_DATA[7]
G1
G2

G1
G2
5
10

5
10

FL700 FL701

U604
U604 NC7SB3157L6X
1 6
5M_CAM_MCLK B1 S CAM_SELECT_N
2 5
GND VCC +VPWR
3 4
VGA_CAM_MCLK B0 A CAM_MCLK

U607 NC7SB3157L6X
1 6
B1 S
2 5
GND VCC +VPWR
3 4
5M_CAM_MCLK B0 A MMP_CAM_MCLK

U607 C621 C622


0.1u 0.1u

Schematic of VGA camera part

Copyright © 2007 LG Electronics. Inc. All right reserved. - 141 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.14 Main LCD trouble


Main LCD control signals are generated by MSM6280. Those signal’s path are :
MSM6280 → Z ORAN (Multimedia Chip) -> 40-pin connector(CN300 in Main PCB) -> 40-pin connector
(in LCD Module)

START

Press END key


to turn the power on

No Follow the Power ON


Is the circuit powered?
trouble shooting
Yes
Disconnect and reconnect
40-pin B to B connector

Yes
LCD display OK?

No

Check LCD_VDD_2.8V, LCD_RESET_N,


LCD_DATA[0~15] in Main BD

No Yes

Change the Main BD Yes


Display OK?

No

Change the LCD module

The LCD works

End

LGE Internal Use Only - 142 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

Main BD

LCD_VDD_2.8V

LCD_NRESET

LCD_DATA[0~15]

SUB BD

Copyright © 2007 LG Electronics. Inc. All right reserved. - 143 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

LCD_VDD_2.8V

C320 C321 C321 : LCD_VDD_2.8V


VA300 NA 0.1u
ICVN0505X150FR

CN300
1 40
2 39
MMP_LCD_VSYNC_IN
3 38
LCD_MAKER_ID
4 37
LCD_DATA[0] WLED_PWR
5 36
LCD_DATA[1] WLED_1
6 35
LCD_DATA[2] WLED_2
7 34
LCD_DATA[3] WLED_3
8 33
LCD_DATA[4] WLED_4
9 32
LCD_DATA[5] WLED_5
10 31
LCD_DATA[6]
11 30
LCD_DATA[7] LCD_IF_MODE
12 29
LCD_DATA[8] MMP_LCD_ADS
13 28 R314 51
LCD_DATA[9] MMP_LCD_CS_N
14 27 R315 51
LCD_DATA[10] LCD_RESET_N
15 26 R316 51
LCD_DATA[11] MMP_LCD_RD_N
16 25 R317 51
LCD_DATA[12] MMP_LCD_WE_N
17 24
LCD_DATA[13] MMP_LCD_VSYNC_OUT
18 23 R318 0
LCD_DATA[14] OTP Program Pin
19 22
22p

22p

22p

22p

LCD_DATA[15] VA301 LCD_VSYNC_OUT


20 21
C326
22p
C323
C322

C324

C325

ENBY0036001
1.0T, Socket
GB042-40S-H10-E3000

FL300 C326 : LCD_VDD_2.8V


FL300 ICVE10184E150R500FR
1 9
MMP_LCD_DATA[0] INOUT_A1 INOUT_B1 LCD_DATA[0]
2 8
MMP_LCD_DATA[1] INOUT_A2 INOUT_B2 LCD_DATA[1]
3 7
MMP_LCD_DATA[2] INOUT_A3 INOUT_B3 LCD_DATA[2]
4 6
MMP_LCD_DATA[3] INOUT_A4 INOUT_B4 LCD_DATA[3]
G1
G2
5
10

FL301 FL301 ICVE10184E150R500FR


1 9
MMP_LCD_DATA[4] INOUT_A1 INOUT_B1 LCD_DATA[4]
2 8
MMP_LCD_DATA[5] INOUT_A2 INOUT_B2 LCD_DATA[5]
3 7
MMP_LCD_DATA[6] INOUT_A3 INOUT_B3 LCD_DATA[6]
4 6
MMP_LCD_DATA[7] INOUT_A4 INOUT_B4 LCD_DATA[7]
G1
G2
5
10

FL302 FL302 ICVE10184E150R500FR


1 9
MMP_LCD_DATA[8] INOUT_A1 INOUT_B1 LCD_DATA[8]
2 8
MMP_LCD_DATA[9] INOUT_A2 INOUT_B2 LCD_DATA[9]
3 7
MMP_LCD_DATA[10] INOUT_A3 INOUT_B3 LCD_DATA[10]
4 6
MMP_LCD_DATA[11] INOUT_A4 INOUT_B4 LCD_DATA[11]
G1
G2
5
10

FL303 FL303 ICVE10184E150R500FR


1 9
MMP_LCD_DATA[12] INOUT_A1 INOUT_B1 LCD_DATA[12]
2 8
MMP_LCD_DATA[13] INOUT_A2 INOUT_B2 LCD_DATA[13]
3 7
MMP_LCD_DATA[14] INOUT_A3 INOUT_B3 LCD_DATA[14]
4 6
MMP_LCD_DATA[15] INOUT_A4 INOUT_B4 LCD_DATA[15]
G1
G2
5
10

Schematic of LCD part

LGE Internal Use Only - 144 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.15 Bluetooth trouble


Bluetooth supplied voltages are generated by the PM6650.
Those signal’s path are : PM6650 → VREG_MSMP_2.7V and VREG_BT_2.85V is asserted →
TCXO_BT 19.2MHz is asserted → Bluetooth ON → BT_TX_RX_N is High → BT serial interface
control is operated (SBST / SBCK / SBDT)

C800 NA BT_ANT BT_GND

0
R800
L800 NA

BLUETOOTH
LG INNOTEK
16

LBRQ-2B43A M800
ANT

C801 1000p 9 4 TP800


BT_CLK CLK_REF SBST BT_SBST
11 TP801
SBCK BT_SBCK
3 12 TP802
VCC_OUT SBDT BT_SBDT

2 5
VDD_INT SYNC_DET_TX_EN BT_TX_RX_N
10 13 R807 0
VDD_MSM RX_BB_TX_BB BT_DATA
C803 C804
14 7 C802 1000p
1u 1u VDD_BAT XTAL_IN TCXO_BT
PGND4
PGND3
PGND2
PGND1

GND4
GND3
GND2
GND1

R808

R809
10K

10K
20
19
18
17

15
8
6
1

VREG_MSMP_2.7V
VREG_BT_2.85V

C811 C812 C813 C814


100p 0.1u 100p 2.2u

TCXO
X100
OUT GND
3 2
R115 100ohm
VREG_TCXO_2.85V VCC VCONT TRK_LO_ADJ
4 1
19.2MHz
C139 C140 C141
0.1u 1000p 0.01u

VREG_BT_2.85V
C144 1000p R120 100K C145
TCXO_PM 1000p

C147 1000p C148 8200p


RTR6275_TCXO TCXO_BT
U102
TC7SH04FS

Figure. Schematic of Bluetooth Interface

Copyright © 2007 LG Electronics. Inc. All right reserved. - 145 - LGE Internal Use Only
Only for training and service purposes
4. TROUBLE SHOOTING

4.16 Bluetooth RF Test

TC-3000A (Bluetooth Tester)


1. Set phone to bluetooth test-mode.
- Enter Test Mode(3845#*990#) → Module Test Set → BT DUT → BT DUT ON
2. Insert a phone in a TEMSELL (in case of radiation test)
3. Set ‘discover’ after push menu button of the tester and select the link analyzer .
4. After ‘set test mode’, confirm the connection state.
5. Measure the power of full channel after hopping mode is selected to ‘ON’
6. You can select wanted test cases after getting an optimized power

TP801 M800 TP800

Set the bluet oot h ON

VREG_BT_2.85V
No Check P MIC
and
VREG_MSMP_2.7V (U501) Pin#64
is ass erted?

Yes
Check Os ci llator TP802 BT Antenna
No (X100)
XTAL_IN
An d
is ass erted?
Check Buffer
Yes (U102)

CLK_REF No Check sol deri ng


is ass erted? of BT( M800)

Yes

SYNC_DET_TX_EN
No Check sol deri ng
is ass erted? of BT( M800)

Yes
BT_GND
SBST/SBCK/SBDT No Check
is ass erted? TP800/TP801/ P802

Yes

No Change
Bluetoot h is work well?
the main board
Yes

END R800 BT_ANT

LGE Internal Use Only - 146 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING

4.17 Touch Screen trouble


Touch Initial sequence of KU990 is:
LCD_VDD_2.8V(C701) goes to 2.8V → TOUCH_PENIRQ_N(R702),TOUCH_I2C_SCL(R703) &
TOUCH_I2C_SDA(R704) go to high Touch operation of KU990 is :
A finger is touching on the screen -> TOUCH_PENIRQ_N is low -> I2C is connected -> A finger is
took off from the Screen -> TOUCH_PENIRQ_N is high -> I2C is not connected.

Start

Touchpad Calibration

Yes
Work well? End

No
NO
Connector Is insert? Insert Connector, again

YES

Replace the Folder

Yes
Work well? End

No

Replace the Main board

C701 (LCD_VDD_2.8V) Touch Window Connector

U700

R702 (TOUCH_PENIRQ_N)

R704(TOUCH_I2C_SDA)
VGA FPCB Connector
R703 (TOUCH_I2C_SCL)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 147 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

5. DOWNLOAD

5.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a
download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple
to use and easy enough for the beginner to upload executable images to the handset. LGMDP
supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.
Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.

5.2 Downloading Procedure


• Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before
getting started, set up LGMDP preferences from the Preferences of the file menu the way you want.
Click on the File menu and select Preferences.

➢ Play a success sound


It will be played a .wav file when the download has been completed. To enable this simply check the
box.
➢ Always on Top
Check if LGMDP always appears at the top of the window so that user can monitor it all the time.
➢ Automatically run Select Port When LGMDP starts
When LGMDP starts, it will automatically select Select Port button to download new image file.

LGE Internal Use Only - 148 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

5.2.1 Connecting to PC
• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for
the port to be connected for downloading images. Then click on the Connect button.
(The port number(COM7) shall be different from that of the port number in the snapshot.)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 149 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

• The status Ready is displayed when the application is ready for downloading. While the images are
transmitted from PC to the handset, a progressive bar
(Red box) indicating the degree of transmission of data is displayed.

LGE Internal Use Only - 150 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

1) Image Folder indicates loot path where all image files are placed. To change location of the default
image path, select Browse... button. The edit box shows the file path where images are located.
Please note that all images should be located in a selected folder.
2) Click on the Browse... button to select image files to be downloaded on the handset.
3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.
Backup the NV data and restore the backed up NV data automatically.

1)

2)

3) 4) 6)
5)

7)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 151 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

4) Reset database & Contents:


User related data including the setting data on the EFS is reset in the handset. The user contents in
the handset will be erased. If you want to reset all the user data back to the way they were before
you started downloading new images, check the option.
Erase_EFS:
The calibration data, user contents, media, and module are erased. Only calibration data is kept when
NV backup/restore is checked. The user contents and file system physically are wiped out.
Keep All Contents
Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new
S/W images. User data stated above are maintained if this option is selected.
5) Additional Options:
Display Information is defaultly not selected and user cannot choose.
Override partition table is also also defaultly not selected and user cannot choose.
6) Clear: Clearing all directory paths of images in the dialog.
7) Start: Starting downloading the selected individual image.

LGE Internal Use Only - 152 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

5.2.2 Choosing image files


• Select the image folder, where all the image files are located, by clicking on the Browse....
(The folder name shall be different from that of the folder name in the snapshot. The folder name
indicates the path where the image files are located.)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 153 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically
load images accordingly. Also you can select images by manually. For instance, select the path of
AMSS Modem Image file by clicking on the Browse... button. The selected AMSS image will be
downloaded to the handset from the path directory in the PC. Make sure that you have chosen
correct file. In case of wrong AMSS Modem file is selected, the phone may not work.
(The file name shall be different from that of the file name in the snapshot.)

LGE Internal Use Only - 154 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the
desired NV file to be downloaded on the handset. To enable this simply check the box or select the
NV file from the LGMDP installation directory by clicking on the Browse... button.

Copyright © 2007 LG Electronics. Inc. All right reserved. - 155 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

Click on the START button to start downloading. A summary of the selected images and option
information window will be displayed. Click on the No button if this is not the setting you are
downloading for. Otherwise click on the Yes button to continue downloading selected image file with
options.

Yes No

LGE Internal Use Only - 156 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

5.2.3 Downloading

• This message box informs that a new file for


NV backup will be created in the displayed
file name in the LGMDP installation
directory.

• Backing up NV data and backed up NV data


will be stored in the LGMDP installation
directory.

• Erasing the existing directories and files


before the Module image is downloaded.

• Downloading the AMSS modem image

Copyright © 2007 LG Electronics. Inc. All right reserved. - 157 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

• Rebooting the handset and re-establishing


the connection

• Restoring NV data which backed up in the


Backing up process. User can also restore
NV data using NV Default image selection.

• Rebooting the handset and re-establishing


the connection

• Erasing the existing directories and files


before downloading the selected Media
image

LGE Internal Use Only - 158 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

• Downloading Media image in progress

• Downloading Module image in progress

• Downloading process has completed


successfully

Copyright © 2007 LG Electronics. Inc. All right reserved. - 159 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

5.2.4 Tools
• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is
designed to monitor USB connectivity and check where the COM has been installed . Select Device
Manager from the Tools of the file menu.

LGE Internal Use Only - 160 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

5.3 Troubleshooting Download Errors

5.3.1 When the phone does not work


• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and
then try to download all the images up to AMSS. In the emergency mode, you can not download
media or module image.
The phone supports a special mode called emergency mode. In this mode, minimum units for
downloading is running so that users can download the images again in case of emergency
situation. (AMSS modem, Media, and Module images can not be running in this mode.)
• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.
Click on the Connect button to continue.

Copyright © 2007 LG Electronics. Inc. All right reserved. - 161 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

• Choose Image file after clicking on the Browse... button. Make sure that you have chosen the right
image file. After choosing valid images, then click on the Start button to start downloading selected
images. The selected image will be downloaded to the handset from the path directory in the PC.
After downloading images successfully, it will boot to normal mode.

LGE Internal Use Only - 162 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

5.3.2 NV Restore Error


• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.

Copyright © 2007 LG Electronics. Inc. All right reserved. - 163 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

• Connect the handset and Press the Connect button in the Select Port window.
(Enable state in the window indicates that the Phone has been detected and is ready to download.)

LGE Internal Use Only - 164 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD

• Click on Browse... . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will
be shown. These nv files were saved every time NV Backup option was selected, and the name of
the nv file is determined based on the time when NV Backup was done. Choose the desired NV file
to be downloaded on the handset, and click on Start.

Copyright © 2007 LG Electronics. Inc. All right reserved. - 165 - LGE Internal Use Only
Only for training and service purposes
5. DOWNLOAD

5.4 Caution
1) Multi-downloading using the USB hub is not recommendable.
2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image
(media and module) download.
3) The NV data saved at LGMDP folder as following format.

D:\LGMDP\004400-01-429926\_COM14_

LGMDP folder name


IMEI number Port number

4) Recommended that the Module and Media Image have to be downloaded at the same time.
5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.

LGE Internal Use Only - 166 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM

6. BLOCK DIAGRAM

6.1 GSM & UMTS RF Block

[Figure 2.1] UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram

Copyright © 2007 LG Electronics. Inc. All right reserved. - 167 - LGE Internal Use Only
Only for training and service purposes
6. BLOCK DIAGRAM

Block Ref. Name Part Name Function Comment


Common FL100 LSHS-M090UH Front End Module ASM+Rx Saw
SW100 KMS518 Test Connector Calibration, etc
X100 TG-5010LH_19_2M VCTCXO 19.2MHz
U100 RTR6275 RF Transceiver IC TRX
Bluetooth M800 LBRQ-2B43A BT RF Transceiver BT TRX

UMTS FL103 SAYZ1G95EB0B00 Duplexer TRX


FL102 EFCH2140TDE1 RX SAW Filter RX
FL104 EFCH1950TDF1 TX SAW Filter TX
U105 A WT6277R TX PAM TX
U104 CP0402A1950DNTR Coupler TX
GSM U101 TQM7M5003 TX Dual PAM TX
FL101 EFCH897MTDB1 Tx SAW Filter Tx

[Table 2.1] RF Block Component

LGE Internal Use Only - 168 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM

6.2 Interface Diagram

[Figure 2.2] U990 Interface Diagram

Copyright © 2007 LG Electronics. Inc. All right reserved. - 169 - LGE Internal Use Only
Only for training and service purposes
6. BLOCK DIAGRAM

Main RF signal

Main RF signal Description Comment


GSM 900 TX GSM 900 TX RF Signal
DCS TX DCS TX RF Signal
PCS TX PCS TX RF Signal
W- TX UMTS2100 TX RF Signal
GSM 900 RX GSM 900 RX RF Signal
DCS RX DCS RX RF Signal
PCS RX PCS RX RF Signal
W- RX UMTS2100 RX RF Signal
TX_I/Q I/Q for Tx of RF
RX_I/Q I/Q for Rx of RF

Control signal

Control signal Description Comment


UMTS PA_CTL signal
PA_R1 UMTS Tx High/Low Power Control
PA_ON Power Amp. Enable
GSM PA_CTL signal
GSM_PA_BAND DCS or PCS /GSM Mode Selection
GSM_PA_EN Power Amp. Gain Control Enable
GSM_PA_RAMP Power Amp. Gain Control
RF Tranceiver_CTL signal
TX_ON RF Enable Signal
SSBDT_RTR Bidirectional SSBI Data
TX_AGC_ADJ UMTS Transmit Gain Control
FEM_CTL signal
UMTS,
GSM900Tx/Rx,
ANT_SEL 0,1,2 Ant Switch Module Mode Selection
DCS Tx/Rx,
PCS Tx/Rx

LGE Internal Use Only - 170 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12

KMS-518
SW100
C100
180p

G1

G2
A
C
TX_IP

ANT100 ANT101 ANT102 L100 L101


C101 120p C103
180p TX_IM
0 4.7nH

C102 C104 L102 55 2


ENV_OUT ENV_LNP
NA 1
A C105 56p 46
ENV_LNN A
12nH 1.2p WCDMA_2100_TX_OUT HB_RF_OUT1 C107
L103 5.6nH C106 6p 44 51
DCS_PCS_TX HB_RF_OUT2 TX_IP 180p TX_QP
50
VREG_RF_SMPS C108 5p TX_IN
PQ FL100 C109
DCS L104
15nH
GSM_TX
43
42
LB_RF_OUT1
LB_RF_OUT2
TX_QP
TX_QN
53
52
C110 TX_QM
47p L105 5.6nH 180p
5 10 24 7
ANT_SEL0 4
VC1 ANT TX_ON RF_ON TCXO
ANT_SEL1 3
VC2
6 56 5 C111 3300p
ANT_SEL2 VC3 VDD
7
TX_AGC_ADJ VCONTROL VTUNE1
18 C112 1000p
NC VTUNE2 VTUNE-Connected directly to GND RTR6275_TCXO
1 54
C113 GND1 DAC_REF DAC_REF
C115 2 8 12
47p GND2 UMTS_TX_RX RX_IP RX_IP
47p 9
11
GND3 DCS_PCS_TX
13
16 L106 5.6nH
SSBDT_RTR
R100
14
SBDT U100 RX_IN
13
RX_IM
C114 GND4 EGSM_TX 12K (1%)
47p 12
GND5 C116
3
R_BIAS1
RTR6275 RX_QP
10
RX_QP
14 19 L107 27 11
12p
15
GND6
GND7
DCS_RX2
DCS_RX1
20 PCS 15nH R101 (1%)
R_BIAS2 RX_QN RX_QM
17 21 5.6nH 680 40
GND8 PCS_RX2 L108 PWD_DET_IN R102 PWR_DET
18 22 31 21
GND9 PCS_RX1 GCELL_INP TEST
25 23 C117 22p 30 R103 NA
B 26
PGND1 EGSM_RX2
24
GCELL_INN
4 R104 5.1
0 B
PGND2 EGSM_RX1 VDDA1 VREG_RF_SMPS
32 6
EGSM_INP VDDA2
LSHS-M090UH 33 8
EGSM_INN VDDA3 22u
L109 22nH 9 R107 2.7
VDDA4 C118
38 15
DCS_INP VDDA5
L110
GSM 39 16

0.1u
DCS_INN VDDA6

0.1u
0.1u

0.1u

0.1u

0.1u
22nH 19
VDDA7
36 20
L111 22nH GPCS_INP VDDA8
37 28

C119

C120

C121

C123

C124
C122
GPCS_INN VDDA9
41
VDDA10
22 45
CAL_INP VDDA11

WLNA_OUT
23 47

WMIX_INN
WMIX_INP
CAL_INN VDDA12 VREG_SYNTH_2.6V
48
VDDA13 C126 C127 C125

VDDM
PGND
26 49 22p 100p 1u

GND
RX_WCDMA_2100 WLNA_IN VDDA14

29

34
35

25
57

17
VDD_RX
WLNA_OUT C128
22p

R109
10
C WCDMA_MIX_IN_P C
WCDMA_MIX_IN_M VREG_RF_SMPS
C131 C129
100p 0.1u 22u

ANTENNA SWITCH MODULE LOGIC VREG_MSMP_2.7V C130

C132 C133 C134


SMPS circuit for RF
ANT_SEL0 ANT_SEL1 ANT_SEL2 0.01u 22p 1000p
near to 48pin

GSM 850/GSM 900 TX HIGH HIGH LOW R111


14 1
GND6 DCS_PCS_IN DCS_PCS_TX
GSM 1800/GSM 1900 TX HIGH LOW LOW 68
13 2
GND5 BS GSM_PA_BAND R112 R113
GSM 850 RX LOW LOW LOW 91 10 dB 91
12 3
VCC TX_EN GSM_PA_EN
LOW U101
GSM 900 RX LOW HIGH

HIGH
C136 8p
11
GND4
TQM7M5003
VBATT
4
+VPWR TCXO
C137 C135

DCS_PCS_OUT
GSM 1800 RX LOW HIGH
10 5 33u
HIGH
C138 GND3 GND1 1u X100
D GSM 1900 RX LOW LOW
L112 9 6 FL101 D
NA GSM_OUT VRAMP OUT GND
GND8

GND7

3 2 3 2
WCDMA HIGH LOW HIGH 15nH EFCH897MTDB1 R114 R115 100ohm
8 7 G2 G1
GND2 GSM_IN IN GSM_TX VREG_TCXO_2.85V VCC VCONT TRK_LO_ADJ
O1 G3 1 4 1
51
17

16

15

4 5 8 dB 19.2MHz
R117 2.2K R118 R119 C139 C140 C141
GSM_PA_RAMP 120 120 0.1u 1000p 0.01u
Thermistor circuit deleted

C146 10p C143


68p
VREG_BT_2.85V
C144 1000p R120 100K C145
C142 1000p
L113 TCXO_PM

GSM
4.7nH
0.75p
GSM_PA_BAND MODE
LOW GSM C147 1000p C148 8200p
RTR6275_TCXO TCXO_BT
PQ
HIGH DCS/PCS
U102
TC7SH04FS
E E

WCDMA VDD_RX
FM RADIO
L115
C149 EFCH2140TDE1 L116
22p
L114 FL102 1nH
WCDMA_MIX_IN_M
1nH C150 C151
1.5nH
0.1u 0.01u

C153 C154 2 3 U103 TEA5766UK


C155
G1 O1 E6
WLNA_OUT 1
IN
G2 O2
0.5p VAFR FM_AUDIO_R
C152

R121
F 56p F

10K
3.9p 56p 5 4 A1 E5
CPOUT VAFL FM_AUDIO_L
L117 L118 A2 E4
L119 LOOPSW MPXOUT
1.8nH L120
1nH
WCDMA_MIX_IN_P A3 E3
PQ 1nH Rev. 1.1 LO1 VREFDIG VREG_MSMP_2.7V
47nH

100K

R122
2.2nH A4 E2 TP100
LO2 CLOCK I2C_SCL
L121
A5 E1 TP101
VREG_MMC_3.0V VCCVCO DATA I2C_SDA
C157
C156
2.2p

A6 D6
C158 VCC TMUTE
1u 0.1u
B1 D5
SWPORT ISS

FL104 FM_INTX
TP102 B2
INTX DGND2
D3
EFCH1950TDF1
B5 D2
2

1
4
8

C159 AGND DGND1


+VPWR
ANT

GND1
GND2
GND3

FL103 8.2p
4 5 C161
B6
RFIN1 VDD
D1

G SAYZY1G95EB0B00 C160 C162 C163 C164 O1 G3 G


22u 1 C1 C6
0.01u 100p 1u IN WCDMA_2100_TX_OUT FREQIN RFIN2
GND6
GND5
GND4

G2 G1
L123
56p
RX

L124 C2 C5
TX

3 2
15nH C165 FM_BUSEN BUSEN RFGND
3.3nH NA L122
7

3
6
9

U105 NA
C166
11
GND5 FM_ANT

C167
U104 10
9
VCC2 VCC1
1
2
100p
C168 C170 GND4 RFIN C171
C169 5.6p SCDY0003403 8 3
RX_WCDMA_2100 RFOUT GND1 56p
7 4
1

56p 56p 1.8p GND3 VMODE PA_R1


4.7nH 6 5
OUT

IN

L125 L128 L126


GND2 VREF
Q100 L127
1.2nH 20dB 8.2nH 100nH
VREG_TCXO_2.85V C172
50OHM

AWT6277R
COUP

TP103 27p
PQ
SLEEP_CLK
C173 PA_ON
4

100p
R124 R123
5

H 51 PWR_DET H
68 KRX102E
R125 R126
100 100
8 dB

1 2 3 4 5 6 7 8 9 10 11 12

Copyright © 2007 LG Electronics. Inc. All right reserved. - 171 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 6 7 8 9 1 10
0 11 12

PCB_Rev_ADC
MODE
USB 48M CLK MODE2 MODE1 MODE0 ( Default Pull-Down)
ADC

0 0 0 Native, ARM JTAG HKADC[0] - AMUX_OUT

MIC2P
A ( +/- 2500ppm for USB Peripheral ) VREG_MSMP_2.7V 0 1 0 Native, MSM JTAG HKADC[1] - VBATT_SENSE A
USB_XTAL_IN HKADC[2] - HDET1
BOOT_MODE2 BOOT_MODE
HKADC[3] - REMOTE_ADC
R200 X 0 NOR boot HKADC[4] - PCB_Rev_ADC
ICRT20S48M0X514CR X200 0 1 8-bit, NAND boot HKADC[5] - VBATT_TEMP
3

VREG_MSME_1.8V
VREG_MSMP_2.7V
VREG_MSMP_2.7V
1M L200 1 1 16-bit, NAND boot
2
1

48MHz PMIC_AUXIN[1]
100nH BOOT_MODE3
R201 R202 PMIC_AUXIN[2] - PA_THERM
0 Normal boot
USB_XTAL_OUT 470K1% 150K 1% 1 Trusted boot

MIC1N
MIC1P
C200

0.1u
VREG_MSMP_2.7V
10p

C235
51K
51K
SDRAM_CLK_EN

NA
USB_XTAL_OUT
SDRAM_DQM[3]
SDRAM_DQM[2]
SDRAM_DQM[1]
SDRAM_DQM[0]
SDRAM_RAS_N
SDRAM_CAS_N

SDRAM_WE_N
SDRAM_CS_N

USB_XTAL_IN

VBAT_SENSE
SDRAM_CLK

RESET_IN_N

VBAT_TEMP
BUFF_TCXO

SLEEP_CLK

AMUX_OUT
RESOUT_N

RMT_ADC

MICBIAS
R203

R205
R204

SPK_R
SPK_L

RCV+
HP_R
HP_L

RCV-

C236 0.1u

NA

NA

NA
B SDRAM_ADDR[0:14] B

100K

C203

C204

C237
NA
V1 SDRAM_ADDR[0]
L1 SDRAM_ADDR[1]
L4 SDRAM_ADDR[2]
M8 SDRAM_ADDR[3]
M4 SDRAM_ADDR[4]
N11 SDRAM_ADDR[5]
N8 SDRAM_ADDR[6]
N6 SDRAM_ADDR[7]
N2 SDRAM_ADDR[8]
N1 SDRAM_ADDR[9]
P1SDRAM_ADDR[10]
P2SDRAM_ADDR[11]
P6SDRAM_ADDR[12]
P8SDRAM_ADDR[13]
SDRAM_ADDR[14]

100K
51

R206
C238 0.1u

AE17 R209
Place near

AB1 R207

R208
10%
MSM pin W18
(CODEC VSS)

AA23

AB23

AC18
AC17
AA17

AA18
AA19
AC22
AC21
AC19
AC20

AA20
AE21
AE22

AE18

AE19

AE20
AF18

AF19

AF21
AF22
AF20
W21

W17
AA2

AA4

AD1
D18
A10
B10
A16
B16

U23
P11

Y23

V21

V19
Y21
F13
F11

T21

T15
W6
M6
G1
N4

K8

U8

U4
Y4

V8

V2
L2
SDRAM_DATA[0:31]
A1_24_GPIO79
A1_1
A1_2
A1_3
A1_4
A1_5
A1_6
A1_7
A1_8
A1_9
A1_10
A1_11
A1_12
A1_13
A1_14

ROM1_CLK_SDRAM1_CLK
XMEM1_CS_N2_SDRAM1_CS_N0
SDRAM1_CLK_EN
ROM1_ADV_N_SDRAM1_RAS_N
XMEM1_LWAIT_N_SDRAM1_CAS_N
XMEM1_HWAIT_N
WE1_N_SDRAM1_WE_N
A1_25_SDRAM1_DQM3_GPIO75
A1_23_SDRAM1_DQM2_GPIO78
UB1_N_SDRAM1_DQM1
LB1_N_SDRAM1_DQM0
OE1_N
XMEM1_CS_N0

TCXO
USB_XTAL48_IN
USB_XTAL48_OUT
SLEEP_XTAL_IN
SLEEP_XTAL_OUT

RESIN_N
RESOUT_N
RESOUT_N_EBI1
WDOG_EN

MODE2
MODE1
MODE0

BOOT_MODE
BOOT_MODE2
BOOT_MODE3
HKAIN0
HKAIN1
HKAIN2
HKAIN3
HKAIN4
HKAIN5

LINE_ON
LINE_OP
HPH_R
HPH_L
EAR1ON
EAR1OP
MICBIAS
AUXOUT
HPH_VREF
LINE_L_IP
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP
VREG_MSMC_1.2V VREG_MSME_1.8V VREG_MSMP_2.7V VREG_MSMA_2.6V

F25
SDCC_DAT1_GPIO99 MSM_MICROSD_DATA[1] (CAD : 10uF=>Input MSMA_2.6V)
SDRAM_DATA[31] T8 M25
A1_22 SDCC_DAT2_GPIO100 MSM_MICROSD_DATA[2]
SDRAM_DATA[30] T6 M26
A1_21 SDCC_DAT3_GPIO101 MSM_MICROSD_DATA[3]
SDRAM_DATA[29] T4 AE3
A1_20 MDP_VSYNC_SECONDA_GPIO104 LCD_MAKER_ID C239 C233 C234
SDRAM_DATA[28] R8 AD2 R210 0 4.7u 10u
A1_19 MDP_VSYNC_PRIMARY_GPIO105 LCD_VSYNC_OUT 1u
SDRAM_DATA[27] T2
A1_18
SDRAM_DATA[26] T1 H25
A1_17 WDOG_STB_SBCK1_GPIO0
SDRAM_DATA[25] R6 F26
C A1_16 SBDT1_GPIO1 C
SDRAM_DATA[24] R4 H11
A1_15 PA_ON1_GPIO2 LIN_INVERTER
SDRAM_DATA[23] W4 D5
GPIO_74 GRFC9_GPIO12 LIN_MOTOR_EN
SDRAM_DATA[22] V6 J21
GPIO_73 CAMCLK_PO_GP_MN_GPIO13 CAM_MCLK
SDRAM_DATA[21] Y2 A6
GPIO_72 GPIO28 LCD_IF_MODE C210 C211 C212
SDRAM_DATA[20] Y1 N19
GPIO_71 USB_RX_DATA_GPIO29 USB_SELECT_N 0.01u 0.01u 0.1u C213 C214 C215 C216
SDRAM_DATA[19] E1 W15
GPIO_70 XMEM2_CS_N2_GPIO35 CAM_MODE3_N 0.01u 0.01u 0.1u 0.1u
SDRAM_DATA[18] R11 AA15
GPIO_69 XMEM2_CS_N3_GPIO36 VGA_CAM_PWDN
SDRAM_DATA[17] V4 AE13
GPIO_68 LCD_EN_GPIO37 LCD_LDO_EN
SDRAM_DATA[16] U6 H9
GPIO_67 GPIO43 MICROSD_DETECT
SDRAM_DATA[15] L6 B6
SDRAM1_D15 SYNTH2_GPIO65 HOOK_SENSE_N
SDRAM_DATA[14] L8 F8
SDRAM1_D14 GPIO66 RMT_INT
SDRAM_DATA[13] K4 AA1
SDRAM1_D13 XMEM1_CS_N1_GPIO76
SDRAM_DATA[12] J1 Y6
SDRAM1_D12 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 C217 C218 C219 C220 C221
SDRAM_DATA[11] K6 L25
SDRAM1_D11 UART3_RFR_N_GPIO87 HP_AMP_EN 1000p 1000p 0.01u 0.01u 0.01u 2200p cap => place between
SDRAM_DATA[10] J2 H6
SDRAM1_D10 UART2_DP_RX_DATA_GPIO89 CAM_SELECT_N
SDRAM_DATA[9] J4 F18 D12(VDDA1) and F12(DAC_REF)
SDRAM1_D9 SYNTH0_GP_PDM0_GPIO92 LCD_RESET_N
SDRAM_DATA[8] P4 H18 R215 0
SDRAM1_D8 SBST1_GPIO93 MMP_INT_N
SDRAM_DATA[7] H4
SDRAM1_D7
SDRAM_DATA[6] G2 H13 C222
SDRAM1_D6 TX_AGC_ADJ TX_AGC_ADJ DAC_REF
SDRAM_DATA[5] J6 L13 R211 2K 2200p
D SDRAM1_D5 TRK_LO_ADJ TRK_LO_ADJ D
SDRAM_DATA[4] AB4 F19
SDRAM1_D4 TCXO_EN_GPIO94 TCXO_EN
SDRAM_DATA[3] D1 F17
SDRAM1_D3 PA_ON0 PA_ON C223 C224 C225 C226 C227 C228 C229
SDRAM_DATA[2] AB2
SDRAM1_D2 (WCMDA 2100 PAM Enable) 33nF 1u 1u 1000p 1000p 0.1u 0.1u
SDRAM_DATA[1] D2 A12
SDRAM1_D1 Q_OUT_N TX_QM
SDRAM_DATA[0] E2 B12
SDRAM1_D0 Q_OUT TX_QP Near to B18 (VDD_PLL)
A13
I_OUT_N TX_IM
B13
I_OUT TX_IP
AC15 F12
MMP_CS_N XMEM2_CS_N1 DAC_REF DAC_REF
AF14 VREG_MSMA_2.6V
MMP_LCD_BYPASS_CS_N LCD_CS_N_GPIO38
W23
Q_IM_CH1
AF10 V23
NAND_CLE
NAND_CS_N
W14
AF7
UB2_N
XMEM2_CS_N0
U200-1 Q_IP_CH1
I_IM_CH1
V25
W25
C230 C231
EBI2_OE_N OE2_N I_IP_CH1 0.1u 0.01u
AF4 AA25
MSM6280_A

AA26

AA16
AE16

AE11
AE15

AE23
AE24

AF17
AC2
AE8

AE6
EBI2_WE_N WE2_N Q_IM_CH0 RX_QM

G25
D25
B24
B14
B11

R25
K25
B15

B18
B21

D12

U25
U26
P23

Y26
T25
10%

W2

M2
C2
H2

B5

K2

R2
U2

B9

A3
F2
AE10 Y25
NAND_ALE LB2_N_A2_0 Q_IP_CH0 RX_QP
T14 AB25
EBI2_DATA[0:15] NAND_READY NAND2_FLASH_READY_GPIO33 I_IM_CH0 RX_IM

VDD_DIG_0
VDD_DIG_1
VDD_DIG_2
VDD_DIG_3
VDD_DIG_4
VDD_DIG_5
VDD_DIG_6
VDD_DIG_7
VDD_DIG_8
VDD_DIG_9
VDD_DIG_10
VDD_DIG_11
VDD_DIG_12

VDD_PAD1_0
VDD_PAD1_1
VDD_PAD1_2
VDD_PAD1_3
VDD_PAD1_4

VDD_PAD2_0
VDD_PAD2_1
VDD_PAD2_2

VDD_PAD3_0
VDD_PAD3_1
VDD_PAD3_2
VDD_PAD3_3

VDD_PAD4_0

VDD_PLL
VDD_MDDI

VDDA1
VDDA2
VDDA3
VDDA4
VDDA5
VDDA6
VDDA7
VDDA8
VDDA9
VDDA10
AC25
I_IP_CH0 RX_IP
EBI2_DATA[15] AA10
D2_15

(VDD_DAC_REF)
EBI2_DATA[14] AC9 D17 C26
D2_14 GP_PDM2_PA_RAN_GE1 PA_R1 RESERVED
E EBI2_DATA[13] W10 H17 F1 E
D2_13 GP_PDM1_PA_RAN_GE0 LIN_PWM_MAG VSS_PAD1_0
EBI2_DATA[12] AA9 K1
D2_12 VSS_PAD1_1 (PLLOUT_TEST)
EBI2_DATA[11] AE7 H15 M1 C1
D2_11 TRST_N VSS_PAD1_2 VSS_DIG_0
EBI2_DATA[10] AC8 D16 R1 H1
D2_10 TCK VSS_PAD1_3 VSS_DIG_1
EBI2_DATA[9] W9 F15 U1 W1
D2_9 TMS VSS_PAD1_4 VSS_DIG_2
EBI2_DATA[8] AA8 D15 AC1
D2_8 TDI VSS_DIG_3
EBI2_DATA[7] AC7 A17 AF6 AF8
D2_7 TDO VSS_PAD2_0 VSS_DIG_4
EBI2_DATA[6] AF5 H16 AF11 AF16
D2_6 RTCK VSS_PAD2_1 VSS_DIG_5
EBI2_DATA[5] AA7 AF15 T26
D2_5 VSS_PAD2_2 VSS_DIG_6
EBI2_DATA[4] AE5 K19 G26
D2_4 AUX_PCM_CLK_GRFC14_GPIO80 MMP_HPCM_CLK VSS_DIG_7
EBI2_DATA[3] AC6 N21 R26 D26
D2_3 AUX_PCM_DIN_GRFC13_GPIO14 MMP_HPCM_DI VSS_PAD3_0 VSS_DIG_8
EBI2_DATA[2] AE4 G4 MMP_HPCM_DO B17 A24
D2_2 AUX_PCM_DOUT_GRFC12_GPIO103 VSS_PAD3_1 VSS_DIG_9
EBI2_DATA[1] AF3 J8 A15 A14
D2_1 AUX_PCM_SYNC_GRFC11_GPIO102 MMP_HPCM_FSYNC VSS_PAD3_2 VSS_DIG_10
EBI2_DATA[0] AC5 H12 A9 A11
D2_0 TX_ON_GRFC10 TX_ON VSS_PAD3_3
U200-2 VSS_DIG_11
VSS_DIG_12
A5
B4 A18 AC23
GRFC8_GPIO11 ANT_SEL2 VSSA1 VSS_DIG
MMP_PWR_EN
AF13
AA14
A2_20_GPIO34
A2_19
GRFC7_GPIO10
GRFX6_GPIO9
T23
T19
ANT_SEL1
ANT_SEL0
A21
D13
VSSA2
VSSA3
MSM6280_B
T13 D11 D19
A2_18 GRFC5_AUX_SBST_GPIO8 CAM_MODE1_N VSSA4
AC14 H10 P26 AA21
F A2_17 GRFC4_AUX_SBCK_GPIO7 FM_INTX VSSA5 NC F
AE14 F10 U19
A2_16 GRFC3_GPIO6 FM_BUSEN VSSA6
W13 D9 V26 AA6
A2_15 GRFC2_GPIO5 GSM_PA_BAND VSSA7 VSS39
AC13 A8 W16 AC4
EBI2_ADDR[14] A2_14 GRFC1_AUX_SBDT_GPIO4 GSM_PA_EN VSSA8 VSS41
EBI2_ADDR[13]
AA13
A2_13 GRFC0_GPIO3
B8
VGA_CAM_RESET_N
W18
VSSA9
w18 (Analog VSS guard ring for CODEC) VSS43
AE1
AF12 R213 W26 AE2
UART1_RFR_N_PA_POWER_CTL_M_GPIO98

EBI2_ADDR[12] A2_12 VSSA10 VSS44


AE12 G23 AB26 AE25
EBI2_ADDR[11] A2_11 BT_CLK_GPIO25 BT_CLK NA VSSA11 VSS45
AC12 F23 AC16 AE26
A2_10 BT_SBST_GPIO24 BT_SBST VSSA12 VSS46
CAMIF_DATA2_AUX_TRST_N_GPIO54

AA12 E26 AC26 AF1


A2_9 BT_SBCK_GPIO23 BT_SBCK VSSA13 VSS47
CAMIF_DATA6_AUX_TDO_GPIO58

CAMIF_DATA4_AUX_TMS_GPIO56
CAMIF_DATA3_AUX_TCK_GPIO55
MMC_DATA_SDCC_DAT0_GPIO32

W12 E25 AD25 AF2


CAMIF_DATA5_AUX_TDI_GPIO57

A2_8 BT_SBDT_GPIO22 BT_SBDT VSSA14 VSS48


MMC_CLK_SDCC_CLK_GPIO31

T12 H21 AF23 AF25


UART1_DP_RX_DATA_GPIO96

UART3_DP_RX_DATA_GPIO85
UART1_DP_TX_DATA_GPIO95

UART2_DP_TX_DATA_GPIO88

UART3_DP_TX_DATA_GPIO84

A2_7 BT_TX_RX_N_GPIO21 BT_TX_RX_N VSSA15 VSS49


AC11 R19 AF24 AF26
A2_6 BT_DATA_GPIO20 BT_DATA VSSA16 VSS50

VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
AA11

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
A2_5
KEYSENSE4_N_GPIO48
KEYSENSE3_N_GPIO47
KEYSENSE2_N_GPIO46
KEYSENSE1_N_GPIO63
KEYSENSE0_N_GPIO62

UART2_RFR_N_GPIO91

CAMIF_HSYNC_GPIO15
UART1_CTS_N_GPIO97

UART2_CTS_N_GPIO90

UART3_CTS_N_GPIO86

CAMIF_VSYNC_GPIO16
CAMIF_DATA9_GPIO61
CAMIF_DATA8_GPIO60
CAMIF_DATA7_GPIO59

CAMIF_DATA0_GPIO83
CAMIF_DATA1_GPIO81

AC10 A22
CAMIF_PCLK_GPIO82

A2_4 MDDIC_DATP
W11 A23
GSM_PA_DAC_REF
MMC_CMD_GPIO30

A2_3 MDDIC_DATN

A1
A2
A25
A26
B1
B2
B25
B26
D4
D23
F6
F21
H8
H19
K10
L11
L16
M11
M12
M13
M14
M15
N12
N13
N14
N15
P12
P13
P14
P15
R12
R13
R14
R15
T11
T16
W8
W19
I2C_SDA_GPIO26

AF9 B22
I2C_SCL_GPIO27

PA_POWER_CTL
SYNTH1_GPIO41
RINGER_GPIO18

A2_2 MDDIC_STBP
USB_OE_TP_N

AE9 B23
USB_DAT_VP
USB_SE0_VM

MDDIH_DATN
MDDIH_STBN

MDDIH_DATP

VDD_EF_USE
MDDIH_STBP

A2_1 MDDIC_STBN
GPIO45
GPIO53
GPIO52
GPIO51
GPIO50
GPIO49

GPIO44
GPIO39
GPIO64

GPIO40
GPIO42

GPIO19
GPIO17
SBCK
SBDT
SBST

G G
U21
R23
D14
P19
R21

A4
L12
D10
A7
B7
F9

P21
P16
M23
L26
D8
F7
F14

F4
TP200 G6
E4

L23
M21
M19
D6
D7

N26
N23
N25

H14
L14
M16

H26
J23
L21

K21
N16

F20
F16
D20
L15
J19
D22
C25
D21
B3
E23
K23
J25
J26
G21
K26
H23
L19

P25
AD26

A19
A20
B19
B20

R16

If you are not Qfuse (security),


this pin can be grounded as in MSM6275 for VSS_THERMAL

C232 Place near


0.1u MSM pin AD26
KEY_ROW[2]
KEY_ROW[1]
KEY_ROW[0]

MMP_RESET_IN_N
KEY_COL[0]
KEY_COL[1]

WM_EN

TOUCH_PENIRQ_N

VGA_CAM_PWR_EN
TOUCH_I2C_SCL

CODEC_I2C_SCL

10%
EAR_SENSE_N
MMC_SELECT_N

LCD_BL_CTRL

LIN_PWM_FREQ

GSM_PA_PWR_CTL_REF
UART_RXD
WHEEL_SW_L
WHEEL_SW_R

UART_TXD

CAM_MODE2_N

USIM_CLK
USIM_RST_N

PM_INT_N
PS_HOLD

USB_OE_N

MSM_MICROSD_CMD
MSM_MICROSD_DATA[0]
MSM_MICROSD_CLK

MMP_CAM_DATA[7]
MMP_CAM_DATA[6]
MMP_CAM_DATA[5]
MMP_CAM_DATA[4]
MMP_CAM_DATA[3]
MMP_CAM_DATA[2]
MMP_CAM_DATA[1]
MMP_CAM_DATA[0]
MMP_CAM_VSYNC
MMP_CAM_HSYNC
MMP_CAM_PCLK

GSM_PA_RAMP
USIM_DATA

TOUCH_I2C_SDA

USB_DAT
USB_SE0

SSBDT_RTR

SSBDT_PM

CODEC_I2C_SDA

VREG_MSMP_2.7V

H R217 R218
H
2.2K 2.2K
I2C_SCL
I2C_SDA

1 2 3 4 5 6 7 8 9 10 11 12

LGE Internal Use Only - 172 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 4 5 6 7 8 9 10 11 12

A A

MMP_VDD_CORE_1.0V

MMP_VDD_USB_3.3V
VREG_MSMP_2.7V

CAM_VDD_IO_2.7V

VREG_MMC_3.0V
MMP_VDD_1.9V

VREG_USB_3.3V
LCD_VDD_2.8V
VREG_MMC_3.0V VREG_USB_3.3V CAM_VDD_IO_2.7V MMP_VDD_CORE_1.0V

C301 C302 C303 C304 C305 C306 C307 C300


0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 10p 10u

0
LCD INTERFACE

R300

R301

MMP_RESET_IN_N
MMP_VDD_1.9V LCD_VDD_2.8V VREG_MSMP_2.7V

FB301
B B

FB300
LCD_VDD_2.8V

0.1u
C310 C311 C308 C312 C313 C314 C315 C309

1u
10u 10u FL300 ICVE10184E150R500FR
0.1u 10p 0.1u 0.1u 0.1u 10p
1 9

0.1u
MMP_LCD_DATA[0] INOUT_A1 INOUT_B1 LCD_DATA[0]

1u

C316
C317

0
2 8
MMP_LCD_DATA[1] INOUT_A2 INOUT_B2 LCD_DATA[1]
3 7

R308
MMP_LCD_DATA[2] INOUT_A3 INOUT_B3 LCD_DATA[2]

C318

C319
4 6
MMP_LCD_DATA[3] INOUT_A4 INOUT_B4 LCD_DATA[3]
C320 C321

G1
G2
VA300 NA 0.1u

5
10
G11

G13
D10

K10

H11

D11
D13

D14
E10

E12
E14

F14
J11
ICVN0505X150FR

M8
G4

G2
D8

D7

D9

H4

D6

K4
F4

L7

L6

L4
AVDD_PLL

VDDCORE1
VDDCORE2
VDDCORE3
VDDCORE4

VDDQ2
VDDQ1

VDD_PMU
VDD_HOST
VDD_SERIAL
VDD_GENERAL
VDD_NAND
VDD_CIS
VDD_LCD
VDD_MMC

AVDD_VDACI
AVDD_VDACP

AVDD_USBT
AVDD_USBC

TCK
TDO
TDI
TMS
TRSTN

RESETN

TEST
FL301 ICVE10184E150R500FR CN300
1 9 1 40
R309 MMP_LCD_DATA[4] INOUT_A1 INOUT_B1 LCD_DATA[4]
2 8 2 39
MMP_LCD_BYPASS_CS_N MMP_LCD_DATA[5] INOUT_A2 INOUT_B2 LCD_DATA[5] MMP_LCD_VSYNC_IN
F1 3 7 3 38
NA SDAT0 MMP_MICROSD_DATA[0] MMP_LCD_DATA[6] INOUT_A3 INOUT_B3 LCD_DATA[6] LCD_MAKER_ID
VREG_MSMP_2.7V F2 4 6 4 37
SDAT1 MMP_MICROSD_DATA[1] MMP_LCD_DATA[7] INOUT_A4 INOUT_B4 LCD_DATA[7] LCD_DATA[0] WLED_PWR
E5 5 36
SDAT2 MMP_MICROSD_DATA[2] LCD_DATA[1] WLED_1

G1
G2
F3 6 35
C SDAT3 MMP_MICROSD_DATA[3] LCD_DATA[2] WLED_2 C

5
10
H2 7 34
SCMD MMP_MICROSD_CMD LCD_DATA[3] WLED_3
R310 R311 0 B8 G1 R312 33 8 33
MMP_CS_N HCS0N SCLK MMP_MICROSD_CLK LCD_DATA[4] WLED_4
R313 NA A8 G3 9 32
10K NAND_ALE HCS1N SWP LCD_DATA[5] WLED_5
B7 FL302 ICVE10184E150R500FR 10 31
EBI2_OE_N HRDN LCD_DATA[6]
B9 P12 1 9 11 30
EBI2_WE_N HWRN VMCLK MMP_CAM_MCLK MMP_LCD_DATA[8] INOUT_A1 INOUT_B1 LCD_DATA[8] LCD_DATA[7] LCD_IF_MODE
A7 P10 2 8 12 29
MMP_INT_N HGINTN VPCLK MMP_CAM_PCLK MMP_LCD_DATA[9] INOUT_A2 INOUT_B2 LCD_DATA[9] LCD_DATA[8] MMP_LCD_ADS
M12 3 7 13 28 R314 51
VHREF MMP_CAM_HSYNC MMP_LCD_DATA[10] INOUT_A3 INOUT_B3 LCD_DATA[10] LCD_DATA[9] MMP_LCD_CS_N
A10 K12 4 6 14 27 R315 51
EBI2_ADDR[11] HA11 VVS MMP_CAM_VSYNC MMP_LCD_DATA[11] INOUT_A4 INOUT_B4 LCD_DATA[11] LCD_DATA[10] LCD_RESET_N
A9 15 26 R316 51
EBI2_ADDR[12] HA12 LCD_DATA[11] MMP_LCD_RD_N

G1
G2
C8 P8 16 25 R317 51
EBI2_ADDR[13] HA13 VIDA LCD_DATA[12] MMP_LCD_WE_N

5
10
C7 N8 17 24
EBI2_ADDR[14] HA14 VIDB LCD_DATA[13] MMP_LCD_VSYNC_OUT
P9 18 23 R318 0
VIDC LCD_DATA[14] OTP Program Pin
D12 M10 19 22

22p

22p

22p

22p
EBI2_DATA[0] HD0 VIDD LCD_DATA[15] VA301 LCD_VSYNC_OUT
C10 N10 FL303 ICVE10184E150R500FR 20 21
EBI2_DATA[1] HD1 VIDE C326
C12 N9 1 9
HD2 VIDF MMP_LCD_DATA[12] INOUT_A1 INOUT_B1 LCD_DATA[12] 22p

C323
EBI2_DATA[2]

C322

C324

C325
C13 N11 2 8
EBI2_DATA[3] HD3 VIDG MMP_LCD_DATA[13] INOUT_A2 INOUT_B2 LCD_DATA[13] ENBY0036001
C14 P11 3 7
EBI2_DATA[4] HD4 VIDH MMP_LCD_DATA[14] INOUT_A3 INOUT_B3 LCD_DATA[14]
B14 N12 4 6 1.0T, Socket
EBI2_DATA[5] HD5 VIDI MMP_CAM_DATA[0] MMP_LCD_DATA[15] INOUT_A4 INOUT_B4 LCD_DATA[15]
C11 N7 GB042-40S-H10-E3000
HD6 VIDJ MMP_CAM_DATA[1]

G1
G2
EBI2_DATA[6] B13 L8
D EBI2_DATA[7] A14
HD7 VIDK
P13
MMP_CAM_DATA[2] D

5
10
EBI2_DATA[8] HD8 VIDL MMP_CAM_DATA[3]
A13 L9
EBI2_DATA[9] HD9 VIDM MMP_CAM_DATA[4]
B12 N13
EBI2_DATA[10] HD10 VIDN MMP_CAM_DATA[5]
A12 M11
EBI2_DATA[11] HD11 VIDO MMP_CAM_DATA[6]
B11 M9
EBI2_DATA[12] HD12 VIDP MMP_CAM_DATA[7]
A11
EBI2_DATA[13] C9
HD13
HD14 LD0
B5
MMP_LCD_DATA[0]
LCD connector change : 35pin ZIF -> 40pin BTB
EBI2_DATA[14] B10 A5
EBI2_DATA[15] HD15 LD1 MMP_LCD_DATA[1]
B6
LD2 MMP_LCD_DATA[2]
L13 B4
NCSN LD3 MMP_LCD_DATA[3]
M13 A4
EBI2_DATA[0:15]
L12
NALE
NCLE
U302 LD4
LD5
C3
MMP_LCD_DATA[4]
MMP_LCD_DATA[5]
L11 A3
K13
NREN
NWEN
ZR3453 LD6
LD7
A2
MMP_LCD_DATA[6]
MMP_LCD_DATA[7]
M14 A1
NRBN LD8 MMP_LCD_DATA[8]
B2
CAM_VDD_IO_2.7V

CAM_VDD_IO_2.7V

CAM_VDD_IO_2.7V

LD9 MMP_LCD_DATA[9]
L14 B1
ND0 LD10 MMP_LCD_DATA[10]
L10 B3
ND1 LD11 MMP_LCD_DATA[11]
J12 C1
ND2 LD12 MMP_LCD_DATA[12]
H12 C2
E K14
ND3 LD13
C5
MMP_LCD_DATA[13] E
ND4 LD14 MMP_LCD_DATA[14]
G12 C6
ND5 LD15 MMP_LCD_DATA[15]
J13 D3
ND6 LD16
H13 D1
ND7 LD17
K11
ND15
A6
LCS0N MMP_LCD_CS_N
N2 D2
LCD BACKLIGHT CHARGE PUMP
100K

LCD LDO
R319 10K

SPICLK LCS1N
R321 1K

R322 1K

K3 D5
SPICS LRDN MMP_LCD_RD_N
L2 C4
SPIDO LWRN MMP_LCD_WE_N
R320

J3 D4
SPIDI LA0 MMP_LCD_ADS
E1
LCK TP300
M4 E4
UARTTX LHS TP301
N3 E3
MMP_STROBE_READY UARTRX LVS MMP_LCD_VSYNC_IN
M1 E2
UARTRTS LACT MMP_LCD_VSYNC_OUT LCD_VDD_2.8V
L1
UARTCTS R324 0
H3 150mA
HPCMCLK MMP_HPCM_CLK
N14 H1 R325 0
MMP_I2C_SCL SCL HPCMFS MMP_HPCM_FSYNC
P14 +VPWR U301 AAT3169IFO-T1 C328
MMP_I2C_SDA SDA C327
J2 R326 0 U300
BH28PB1WHFV 4 7
HPCMDO MMP_HPCM_DO C1+ C2+
P2 J1 R327 NA 1 5
F MMP_CAM_RESET_N
M3
GPIO0 HPCMDI MMP_HPCM_DI LCD_LDO_EN
2
STBY SEL
6
1u
5 8
1u F
MMP_STROBE_CHARGE GPIO1 R329 GND BGND C1- C2-
P7 N4 3 4 6
MMP_CAM_PWR_EN GPIO2 AMCLK MMP_A_MCLK +VPWR VIN VOUT OUTCP WLED_PWR
N1 M2
MMP_CAM_INT GPIO3 ABCLK 33 MMP_A_BCLK
P1 K2 C329 9
TP302 GPIO4 AFS MMP_A_LRCLK C330 IN
100K
R331

R333 NA M5 K1 11
MICROSD_DETECT GPIO5 ADO MMP_ADO_DACDAT 1u 1u D1 WLED_1
N6 L3 12
GPIO6 ADI MMP_ADI_ADCDAT D2 WLED_2
M6 3 13
TP303 GPIO7 LCD_BL_CTRL EN_SET D3 WLED_3
P5 P3 14
GPIO8 UDP MMP_USB_D+ D4 WLED_4
N5 P4 10 1
GPIO9 UDN MMP_USB_D- GND D5 WLED_5
J4 R335 0 15 2
C331 UVBUS VREG_5V PGND D6
G14 P6
TVDATA UID
F13 M7 C332
AGND_VDAC

AGND_USBC
VENBYPOUT

AGND_USBT

100K
22p TVREF URSET C333

R336
AVSS_PLL
VENBYPIN

1u
XTALOUT

1u
XTALIN
R338

R339

L300
GND10
GND11
GND12
GND13
GND14
GND15
GND16
390
75

GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9

+VPWR MMP_VDD_1.9V
TV_OUT
2.2uH
R340

3.3K

392ohm 1%
C334 C335
E13
E11

H14

J14

F11

F6
F7
F8
F9
G6
G7
G8
G9
H6
H7
H8
H9
J6
J7
J8
J9

F12

K5
L5

330p 330p 3.4K U303 R1114D191D-TR-F


1% +VPWR 1 3
VDD VOUT
G 4 2
G
NC GND1
MMP_XTAL_IN

6 5
MMP_XTAL_OUT

MMP_PWR_EN CE GND2

C336
0.01u C337 C338
1u 1u

27Mhz XTAL FSUSB30UMX U304


10 1
MMP_XTAL_IN USB_SELECT_N SEL HSD1+ MSM_USB_D+
9 2
R345

MMP_XTAL_OUT VCC HSD2+ MMP_USB_D+


FA-238_27MHz_9PF 8 3
X300 _OE D+ USB_D+
4 3
100K

1 2 7 4
MSM_USB_D- HSD1- GND
27MHz 6 5
C339 C340 MMP_USB_D- HSD2- D- USB_D-
H 8p 8p H

SWITCH FOR USB2.0

1 2 3 4 4 5 6 7 8 9 10 11 12

Copyright © 2007 LG Electronics. Inc. All right reserved. - 173 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12

A A

B B

MEMORY (2Gbit 70n NAND FLASH + 1Gbit SDRAM)


VREG_USIM_3.0V

J400
1 4
C1 C5
2 5
USIM_P_RST_N C2 C6
3 6

W11
W12
W13
W14
N10
N11
N12
N13

U14

V13
V14

Y11
Y12
Y13
Y14
USIM_P_CLK C3 C7
T13

W1
W2
W3
W4
N3
N4
N5
N6
N9

R2
R7
R9

U1
U3
P7
P8

V1
V2

Y1
Y2
Y3
Y4
T2
T3
T7

7 10
GND1 GND4
8 9
SDRAM_DATA[0:31] SDRAM_ADDR[0:12] GND2 GND3
NC83
NC84
NC85
NC86
NC87
NC88
NC89
NC90
NC91
NC92
NC93
NC94
NC95
NC96
NC97
NC98
NC99
NC100
NC101
NC102
NC103
NC104
NC105
NC106
NC107
NC108
NC109
NC110
NC111
NC112
NC113
NC114
NC115
NC116
NC117
NC118
NC119
NC120
NC121
NC122
NC123
R400
15K
SDRAM_DATA[0] U4 C3 SDRAM_ADDR[0]
DQ0 A0
SDRAM_DATA[1] T4 D3 SDRAM_ADDR[1]
C DQ1 A1 C
SDRAM_DATA[2] T5 E3 SDRAM_ADDR[2]
DQ2 A2 USIM_P_DATA VREG_USIM_3.0V
SDRAM_DATA[3] V5 E2 SDRAM_ADDR[3]
DQ3 A3
SDRAM_DATA[4] U5 D12 SDRAM_ADDR[4] D400
DQ4 A4
SDRAM_DATA[5] T6 C12 SDRAM_ADDR[5]
DQ5 A5 C400 C401 C402
SDRAM_DATA[6] V6 D11 SDRAM_ADDR[6] 6 1
DQ6 A6 33p 33p 1u USIM_P_DATA USIM_P_CLK
SDRAM_DATA[7] U7 C11 SDRAM_ADDR[7]
DQ7 A7
SDRAM_DATA[8] T9 D10 SDRAM_ADDR[8] 5 2
DQ8 A8
SDRAM_DATA[9] T10 C10 SDRAM_ADDR[9]
DQ9 A9
SDRAM_DATA[10] V10 E4 SDRAM_ADDR[10] 4 3
DQ10 A10 USIM_P_RST_N
SDRAM_DATA[11] T11 D9 SDRAM_ADDR[11] VREG_MSMP_2.7V
DQ11 A11
SDRAM_DATA[12] U11 C9 SDRAM_ADDR[12]
DQ12 A12
SDRAM_DATA[13] V11 PLR0504F
DQ13
SDRAM_DATA[14] T12 L6
DQ14 _WP RESOUT_N
SDRAM_DATA[15] U12 K6
SDRAM_DATA[16] P3
DQ15
DQ16
_WEN
_RAS
D5
EBI2_WE_N
SDRAM_RAS_N
R401 USIM
SDRAM_DATA[17] R3 D6 100K
DQ17 _WED SDRAM_WE_N
SDRAM_DATA[18] P4 E6
DQ18 _CAS SDRAM_CAS_N
SDRAM_DATA[19] R4 C8
DQ19 CLK SDRAM_CLK
SDRAM_DATA[20] P5 E5
DQ20 _CS1 SDRAM_CS_N
SDRAM_DATA[21] R5 D7 R404 R402 R403
D DQ21 _CS2 D
SDRAM_DATA[22] P6 M3 0
DQ22 ALE NAND_ALE 100K 10K
SDRAM_DATA[23] R6 M4
DQ23 CLE NAND_CLE
SDRAM_DATA[24] P9 M9
DQ24 _CE NAND_CS_N
SDRAM_DATA[25] P10 M10
DQ25 _RE EBI2_OE_N
SDRAM_DATA[26] R10 M2
DQ26 RY__BY NAND_READY
SDRAM_DATA[27] P11 D8
DQ27 CKE SDRAM_CLK_EN
SDRAM_DATA[28] R11 C4 VREG_MSME_1.8V
DQ28 BA0 SDRAM_ADDR[13]
SDRAM_DATA[29] P12 D4
DQ29 BA1 SDRAM_ADDR[14]
SDRAM_DATA[30] R12
DQ30
SDRAM_DATA[31] R13 C7
DQ31 VCCD1
D2
VCCD2
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u

U8 D13
SDRAM_DQM[0] DQM0 VCCD3
T8 V3
SDRAM_DQM[1]
V7
DQM1 U402 VCCD4
V8
SDRAM_DQM[2] DQM2 VCCD5
U9 V12 VREG_MSMP_2.7V +VPWR
C403
C404
C405
C406
C407
C408
C409

SDRAM_DQM[3] DQM3 TYA000BC00HOGG VCCD6


+VPWR
EBI2_DATA[0:15]
EBI2_DATA[0] M11 V4
IO1 VCCQD1
EBI2_DATA[1] M13 V9
IO2 VCCQD2
EBI2_DATA[2] L10
IO3
EBI2_DATA[3] L12 K12
IO4 VCCN2
E EBI2_DATA[4] J9 U401 MAX4701ETE+T
E
IO5
EBI2_DATA[5] H12 C6 C410 C411 1 16
IO6 VSS1 C412 MMP_MICROSD_DATA[0] NC1 COM1 MICROSD_DATA[0]
EBI2_DATA[6] H10 F7
IO7 VSS2 0.01u 0.1u 0.01u
EBI2_DATA[7] G12 G2 2 15
IO8 VSS3 MMC_SELECT_N IN1_IN2 NO1 MSM_MICROSD_DATA[0]
EBI2_DATA[8] M12 G13 U400
IO9 VSS4
EBI2_DATA[9] L9 L13 SLAS4717EPMTR2G 3 14
IO10 VSS5 MSM_MICROSD_DATA[1] NO2 V+
EBI2_DATA[10] L11 P2 1 10
IO11 VSS6 VCC NO2 MSM_MICROSD_CLK
EBI2_DATA[11] K9 P13 4 13
IO12 VSS7 MICROSD_DATA[1] COM2 NC4 MMP_MICROSD_DATA[3]
EBI2_DATA[12] H13 R8 2 9
IO13 VSS8 MSM_MICROSD_CMD NO1 COM2 MICROSD_CLK
EBI2_DATA[13] H11 U2 5 12
IO14 VSS9 MMP_MICROSD_DATA[1] NC2 COM4 MICROSD_DATA[3]
EBI2_DATA[14] H9 U6 3 8
IO15 VSS10 MICROSD_CMD COM1 IN2 MMC_SELECT_N
EBI2_DATA[15] G11 U10 6 11
IO16 VSS11 GND NO4 MSM_MICROSD_DATA[3]
U13 4 7
VSS12 IN1 NC2 MMP_MICROSD_CLK
A1 7 10
NC1 MSM_MICROSD_DATA[2] NO3 IN3_IN4
A2 J12 5 6
NC2 NC63 MMP_MICROSD_CMD NC1 GND
A3 J13 8 9
NC3 NC64 MICROSD_DATA[2] COM3 NC3 MMP_MICROSD_DATA[2]
A4 K1
NC4 NC65
A11 K2 17
NC5 NC66 PGND
A12 K3
NC6 NC67 C413
A13 K4
F NC7 NC68 0.01u F
A14 K5
NC8 NC69
B1 K10
NC9 NC70
B2 K11
NC10 NC71
B3 K13
NC11 NC72
B4 K14
NC12 NC73
B11 L1
NC13 NC74
B12 L2
NC14 NC75
B13 L3
NC15 NC76
B14 L4
NC16 NC77
C1 L5
NC17 NC78
C2 L14
NC18 NC79
C5 M5
NC19 NC80
C13 M6
NC20 NC81
C14 N2
NC21 NC82
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
NC30
NC31
NC32
NC33
NC34
NC35
NC36
NC37
NC38
NC39
NC40
NC41
NC42
NC43
NC44
NC45
NC46
NC47
NC48
NC49
NC50
NC51
NC52
NC53
NC54
NC55
NC56
NC57
NC58
NC59
NC60
NC61
NC62

MICRO SD SELECT MSM AND MMP


D1
D14
E1
E7
E8
E9
E10
E11
E12
E13
F2
F3
F4
F5
F6
F8
F9
F10
F11
F12
F13
G3
G4
G5
G6
G7
G8
G9
G10
H2
H3
H4
H5
H6
J2
J3
J4
J5
J6
J10
J11

G G

H H

1 2 3 4 5 6 6 7 8 9 10 11 12

LGE Internal Use Only - 174 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12

VREG_SYNTH_2.6V
VREG_TCXO_2.85V

VREG_BT_2.85V
VREG_WM_2.7V

VGA_VDD_1.8V
PMIC VPWR BYPASS

+VPWR U500 NUS3116MTR2G


+VPWR 10 9
VBATT P_DRAIN P_COLLECTOR
C501

C502

C503

C504

C505

C506

C507

C508

+VPWR 1 8
C509 C500 +5V_PWR EMITTER1 BASE1 CHG_CNT_N
A 4.7u 33u A
0.1u

0.1u

0.1u

4.7u

0.1u

4.7u

0.1u

4.7u

2 7
USB_VBUS EMITTER2 BASE2 USB_CNT_N
3 6
ICHARGE COLLECTOR GATE BATT_FET_N

2.2u
1u
4 5

R504
1608

1608

2012
C512 SOURCE DRAIN VBATT

0.1
C510
1u VREG_5V

C511
R533
VDD_MSMC : 4.7uF VDD_MSM : 0.1uF ICHARGEOUT C514 C513 VREG_WM_2.7V
VDD_MSME : 4.7uF VDD_ANA : 0.1uF 0.1u 10u 0
CHARGING

2.2u

2.2u
VDD_PA : 4.7uF VDD_RUIM : 0.1uF +VPWR
VSW_5V : 4.7uF C516 C517
VDD_WLAN : 0.1uF 4.7u 0.1u

C590

C515
VDD_MAIN : 0.1uF GSM_PA_PWR_CTL_REF RMT_PWR_ON_N Rev. 1.1
MIDI_3.3V
AMUX_OUT
C518 C519
4.7u 0.1u VREG_MSME_1.8V
+5V_PWR VREG_USB_3.3V
C520 C521
B R505

85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
4.7u 0.1u

GND_SLUG
VREG_TCXO
VDD_MAIN
AMUX_OUT
VREG_SYNT
REF_OUT(MPP8)
SPKR_OUT_M
SPKR_IN_M
VDD_SPKR
SPKR_IN_P
SPKR_OUT_P
SPKR_BYP
VREG_RFTX
AMUX_IN2(MPP2)
VDD_RF
AMUX_IN1(MPP1)
VREG_RFRX1
CBL0PWR_N(MPP3)
VREG_RFRX2
CBL1PWR_N(MPP4)
VDD_WLAN
VREG_WLAN
470K

JTAG_PS_HOLD
D500 U502 WM8983
1 63 C522 0.1u 13 12
ADC_BYP REF_BYP PS_HOLD DCVDD DGND
2 62 14
VCHG REF_GND RB521S-30 DBVDD
3 61 R506 121K C523 1u 26 28
ICHARGE ISNS_P REF_ISET AVDD2 AGND1
0.1u

VBATT 4 60 (1%) 31
10K
1u

CHG_CNT_N CHG_CTL_N VCOIN V_BACK_UP AVDD1


5 59 TP500 VREG_MSMA_2.6V 24
ICHARGEOUT ISNS_M MSM_INT_N PM_INT_N AGND2 C525
6 58 7 C524
VBAT TCXO_IN TCXO_PM MMP_A_LRCLK LRC 0.1u 10u
R507

VREG_5V 7 57 8
C526

C527

BATT_FET_N BAT_FET_N PS_HOLD R508 MMP_A_BCLK BCLK


8 56 9
FLSH_DRV_N FLSH_DRV_N VREG_MSMA C530 MMP_ADI_ADCDAT ADCDAT C531
9 55 10 27
C529 1u RESET_IN_N PON_RESET_N
U501 TCXO_EN TCXO_EN 0 12n MMP_ADO_DACDAT DACDAT VMID NA
RB521S-30

10 54 VREG_MSMP_2.7V 11
C528 VREG_USB VDD_ANA MMP_A_MCLK MCLK
D501

11 53 R509 51 32

C534
4.7u USB_ID TCXO_OUT BUFF_TCXO C533 MICBIAS MIC_PWR
+VPWR 12
PM6650-2M 52 C532 1u R510 R511 4

1u
VREG_5V VDD_MSM SPK_R RIP
13 51 R512 51K 5 29 HP_EAR_R
L500 4.7uH USB_OE_N USB_OE_N SBST 1K 4.7n 18K RIN ROUT1
14 50 30
VSW_5V VREG_MSMP C535 1u LOUT1 HP_EAR_L

C
smd_2520h1_6_r
USB_VBUS
USB_CNT_N
15
16
USB_CTL_N
USB_VBUS
PMIC SBCK
VBACKUP
49
48
R513 0
FM_AUDIO_R
6
R2_GPIO3
FB500
C536 1u 3 23
4.7u

17 47
47K

C537 C538

C539
USB_DAT USB_DAT SBDT SSBDT_PM FM_AUDIO_L L2_GPIO2 ROUT2 SPK_OUT+

32.768KHz
18 46 R515 1608 1608

1u
MSM_USB_D+ USB_D_P XTAL_OUT

2
4.7u 4.7u

X500
19 45 1 25
USB_SE0 USB_SE0 SLEEP_CLK SLEEP_CLK 51K C541 1u C542 MID_MICP LIP LOUT2 SPK_OUT-
RUIM_M_CLK(MPP9)

RUIM_M_RST(MPP5)
R516 R517
RUIM_M_IO(MPP11)
R514
C540

20 44 2
RUIM_CLK(MPP10)

1
MSM_USB_D- USB_D_M XTAL_IN SPK_L LIN FB501
RUIM_IO(MPP12)

21 43
GP1_DRV_N(MPP7) RUIM_RST(MPP6) USIM_P_RST_N 1K 4.7n 18K C543 C544
VREG_MSMC

VREG_MSME

19 22
KPD_DRV_N
LCD_DRV_N

VREG_RUIM
VSW_MSMC

VSW_MSME

VREG_MMC
KPDPWR_N

VDD_MSMC

VDD_MSME
VIB_DRV_N

C545 C546 C547 AUXL OUT3 MIC2P NA NA


VDD_RUIM
VREG_PA

+VPWR 21
VSW_PA

VDD_PA

22p 22p 12n OUT4


+VPWR 20
AUXR
18
MODE
Rev. 1.0 15
CSB_GPIO1
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42

R518 16

R519

100K
CODEC_I2C_SCL SCLK
17 33
10K C548 1u CODEC_I2C_SDA SDIN PGND
VREG_USIM_3.0V VREG_MMC_3.0V
HP_L
USIM_RST_N C549 1u
KYPD_LED_EN USIM_P_CLK HP_R
PM_ON_SW_N USIM_CLK
USIM_DATA
USIM_P_DATA C550 C551
VBATT
NA NA
D

L501
4.7uH VREG_MSME_1.8V C552 C553
1608 1608
ind_2x1_6h1_r
2.2u 2.2u
L502 4.7uH
VREG_RF_SMPS
R520 0
C554 C555 C556 C557
22u 10u 0.1u 1000p

C559 C558
VREG_MSMC_1.2V 1608
0.1u 4.7u

L503 4.7uH

E
AUDIO DAC/ADC, AMP etc. (WM8983) E
C561 C560
1608 MIDI_3.3V
0.1u 4.7u HP_AMP_EN

0.22u
C562
MMP_VDD_USB_3.3V
HP_EAR_L

R522

15K
Power Line --> Route carefully!!!!!
VREG_5V
R521

Draw the Artwork_line thickly !!!!! MICBIAS


NA

MIDI_3.3V
--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-
C564

17

16

15

14

13
C565 C566 47p
U503 4.7u 1u

P_G

_SHDN

INL+

INL_

SVDD1
1 6 FB502 600
VDD CE_OR_NC WM_EN R524 C563
1 12 SPM0204HE5-PB-3
PVDD OUTL MIDI_EAR_L 10u
2 5
GND1 GND2 68 P C567 22n MIC1N
2 11 4
C1P U504 SVSS G2 C569
3 4 FB503 600 3
VOUT NC MAX9722BETE R525 G1 C568 22n NA
3 10 2
C570 PGND OUTR MIDI_EAR_R O MIC1P
F C571 C572
R1180D331B
1u PQ
68
1 F
4 9 MIC500
1u 1u C1N SVDD2
SGND
L504 VREG_MSMP_2.7V
PVSS

INR+

INR_
2.2uH

PRSB6.8C

PRSB6.8C
C575 C576

C573

C574
MIC 33p 10p
5

8
100K

PQ
CN500
R529

15K
R528

21 0.22u
C578

C577
19
1u
1 FB504
FM_ANT HP_EAR_R
2
EAR_MIC_P
3
TV_OUT MIC_PWR
4
MIDI_EAR_L
5
MIDI_EAR_R C579 C580
6 10u
RMT_INT-USB_D+ SRC DRAIN 47p
7
8
RMT_ADC-USB_D-
5 4
HEADPHONE AMP +VPWR

R530

2.2K
EAR_SENSE_N GATE CNTRL
9 6 3
VBATT VREG_MSMP_2.7V
G 10
OUT GND
G
11 7 2 U506 NC7SB3157L6X
RMT_PWR_ON_N
12 1 6
VCC IN C581 CAM_MIC+ B1 S EAR_SENSE_N
13 8 1 2 5
0.01u GND VCC
14 3 4
DRAIN_THERMAL EAR_MIC_P B0 A MID_MICP
15 9
USB_VBUS NUS3065MUTAG U505
16 FSUSB30UMX U507
UART_TXD
17 10 1

C583

10p
UART_RXD +5V_PWR EAR_SENSE_N SEL HSD1+ RMT_INT C584
18
OVP 9 2
0.1u
ULCE0505C015FR

ULCE0505C015FR

VCC HSD2+ USB_D+


20
EVLC14S02050

EVLC14S02050

EVLC14S02050

EVLC14S02050

EVLC14S02050

22 8 3
_OE D+ RMT_INT-USB_D+
7 4
RMT_ADC HSD1- GND
D502

47p

47p
1u

6 5
33p

VA507

VA508

USB_D- HSD2- D- RMT_ADC-USB_D-


C588 CAM/HP MIC SEL
10p
C587
VA500

VA501

VA502

VA503

C585

C586
SD12T1G
VA504

VA505

VA506
C589

PRSB6.8C

PRSB6.8C

H H

USB/REMOCON_SEL
MMI 18Pin CONNECTOR

1 2 3 4 7 8 9 10 11 12

Copyright © 2007 LG Electronics. Inc. All right reserved. - 175 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12

VGA CAM LDO VGA_VDD_2.7V


5M CAMERA INTERFACE
A CAM_VDD_AF_2.7V

U600 BH28PB1WHFV
1 5 CAM_VDD_SA_2.7V
VGA_CAM_PWR_EN STBY SEL
2 6 CAM_VDD_CORE_1.2V CAM_VDD_SD_1.8V
GND BGND
3 4 CAM_VDD_IO_2.7V
+VPWR VIN VOUT
C601 C602 C600
0.1u 1u 10u
C603
1u
C604 C605

0.1u
1u 0.1u

1u
10
5
C606
GB042-30S-H10-E3000

G2
G1
0.1u C607

C608
C609
CN600
MMP_CAM_DATA[7] INOUT_B4 INOUT_A4 5M_CAM_DATA[7] 0.1u
6 4 30 1
MMP_CAM_DATA[6] INOUT_B3 INOUT_A3 5M_CAM_DATA[6]
7 3 R601 10 29 2
MMP_CAM_DATA[5] INOUT_B2 INOUT_A2 5M_CAM_DATA[5] MMP_I2C_SCL
8 2 R602 10 28 3
MMP_CAM_DATA[4] INOUT_B1 INOUT_A1 5M_CAM_DATA[4] MMP_I2C_SDA
9 1 R603 10 27 4
B
CAM_VDD_IO_2.7V
5MP CAM LDO CAM_VDD_SA_2.7V
ICVE10184E070R100FR FL600
MMP_CAM_VSYNC
MMP_CAM_HSYNC
R604 10 26
25
5
6
MMP_CAM_RESET_N MMP_CAM_INT
24 7
STROBE_TRIGGER
150mA 150mA 23 8
5M_CAM_DATA[6] 5M_CAM_DATA[7]
22 9
+VPWR +VPWR 5M_CAM_DATA[4] 5M_CAM_DATA[5]
21 10
5M_CAM_DATA[2] 5M_CAM_DATA[3]
20 11
5M_CAM_DATA[0] 5M_CAM_DATA[1]
19 12
R607 18 13 R608 10
5M_CAM_MCLK MMP_CAM_PCLK
U601 R1114D271D U602 R1114D271D 17 14
33

VA600

VA601
10
1 6 1 6 16 15

5
VDD CE_OR_NC MMP_CAM_PWR_EN VDD CE_OR_NC MMP_CAM_PWR_EN

VA602
G2
G1
2 5 2 5
GND1 GND2 GND1 GND2 MMP_CAM_DATA[3] INOUT_B4 INOUT_A4 5M_CAM_DATA[3]
6 4

ICVL0518100Y500FR

ICVL0518100Y500FR
MMP_CAM_DATA[2] INOUT_B3 INOUT_A3 5M_CAM_DATA[2] C610 C611 C612 C613 C614
3 4 3 4 7 3
VOUT NC VOUT NC MMP_CAM_DATA[1] INOUT_B2 INOUT_A2 5M_CAM_DATA[1] 10p 10p 10p 10p 0.1u

EVLC18S02015
8 2
MMP_CAM_DATA[0] INOUT_B1 INOUT_A1 5M_CAM_DATA[0]
9 1
C615 C616 C617 C618
1u 1u 1u 1u ICVE10184E070R100FR FL601

C C

VREG_MMC_3.0V

SWITCH FOR 5M VT CALL Strobe(Xenon Lamp) Flash Interface


MODE SWITCH

C619
D D
VREG_MMC_3.0V
C620 2200p

1u
VREG_MSMP_2.7V +VPWR VREG_5V

R610 100K
LIN_MOTOR_EN VREG_MSMP_2.7V
U603 TC7SZ86FU

51K

51K

51K
1 5 U604 NC7SB3157L6X
IN_B VCC AXK714247G
2 U606 TPA6205A1DRBR 1 6
LIN_PWM_MAG IN_A R611 100K 5M_CAM_MCLK B1 S CAM_SELECT_N
3 4 1 6 2 5 CN601
GND OUT_Y _SHUTDOWN VDD GND VCC +VPWR 1 14
U605 TC7SZ86FU 3 4

R612

R613

R614
VGA_CAM_MCLK B0 A CAM_MCLK
1 5 2 8
LIN_INVERTER IN_B VCC BYPASS VO- MOTOR- 2 13
2
LIN_PWM_FREQ IN_A R615 100K
3 4 3 5 U607 NC7SB3157L6X
GND OUT_Y IN+ VO+ MOTOR+ CAM_MODE3_N 3 12
1 6
B1 S
4 7 2 5
IN- GND GND VCC +VPWR 4 11
9 3 4
PGND CAM_MODE2_N 5M_CAM_MCLK B0 A MMP_CAM_MCLK STROBE_TRIGGER
CAM_MODE1_N 5 10
MMP_STROBE_READY

VA603

VA604

VA605
R619 100K C621 C622 6 9
0.1u 0.1u MMP_STROBE_CHARGE FLSH_DRV_N
E C623
7 8
E
0.1u C624 2200p
SW600

EVLC14S02050

EVLC14S02050

EVLC14S02050
P1 P2 P3 P4

G2 G1

G4 G3
SSP-132MHT
MODE1 MODE2 MODE3

ESSY0004701
LINEAR MOTOR DRIVER ( AUDIO AMP )
VREG_MSMP_2.7V

VREG_MMC_3.0V
VREG_BT_2.85V

F F
VBATT
+VPWR

PSD05-LF
R621

INSTPAR
470K
VREG_MSMP_2.7V
C625
CN603
G1 10u

1 40
EAR_MIC_P VBAT_SENSE

D600
CN602 2 39 R622
BT_SBST
3 38 C626 R623 80.6K
CTS BT_TX_RX_N OUT608
12 4 37
RTS TCXO_BT 0.1u 680K
11 5 36
DSR MICROSD_CLK VBAT_TEMP OUT611
10 6 35
MSM_USB_D+ NC4 UTXD BT_CLK MICROSD_DETECT
9 7 34 C627
MSM_USB_D- NC3 URXD MICROSD_CMD OUT614
8 8 33
USB_VBUS NC2 PWR MICROSD_DATA[0] 0.1u
7 9 32
VBATT VBAT VBAT MICROSD_DATA[1]
G PM_ON_SW_N
6
ON_SW ON_SW BT_SBCK
10 31
MICROSD_DATA[2]
G
5 11 30
+5V_PWR NC1 VCHAR BT_SBDT MICROSD_DATA[3]
4 12 29
UART_TXD TX TX BT_DATA
3 13 28
UART_RXD RX RX
2 14 27
GND GND V_BACK_UP CAM_MIC+
1
2.5G 3G
HOOK_SENSE_N
15
16
26
25
WHEEL_SW_R (BATTERY PAD 1.5 X 3.4)
CAM_VDD_AF_2.7V WHEEL_SW_L
17 24
CAM_VDD_SD_1.8V
18 23
MMP_CAM_PWR_EN
19 22
SPK_OUT-
20 21
SPK_OUT+
PCB ARRAY TP G2

JTAG CONNECTOR
AXK740327G
OJ600 OJ601 OJ602 OJ603 OJ604
H UART_TXD
TP600 H
TP601
UART_RXD
TP602
PM_ON_SW_N R626 TP603
VBATT
TP604
0
1608
MAIN - SUB B to B Conn.
FOR NEST JIG

1 2 3 4 5 6 7 8 9 10 11 12

LGE Internal Use Only - 176 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12

LCD_VDD_2.8V

R700

0
VREG_MSMP_2.7V
+VPWR
VREG_MSMP_2.7V

R701

51K
R702
C700 C701
700 701

R703

R704
2.7K

2.7K
1u 0.1u

R705

R706
SEND CLR

NA

51K

51K

SSC-TWH104-HL
U700 TSC2007IYZGR END

SSC-TWH104-HL
LEGG-S14G

LEGG-S14G

SSC-FR104-II1

SSC-FR104-II1
KEY_ROW[2]

LD704

LD700
LD705

LD702

LD701

LD703
CN700
A1 C1 1 R707 470
AUX SDA TOUCH_I2C_SDA KEY_ROW[0] PM_ON_SW_N END
A2 C2 2 R708 470
VDD_REF A1 KEY_ROW[1] KEY_COL[0]
A3 C3 3 R709 470
X+ X- KEY_COL[0]
B1 D1 4 R710 470

EVL14K02200

200

200
47

47

47

47
TOUCH_PENIRQ_N PENIRQ- SCL TOUCH_I2C_SCL KEY_COL[1] KEY_COL[1]
B2 D2 5
A0 GND

VA700

EVLC14S02050

EVLC14S02050
B3 D3

EVLC14S02050
Y+ Y-

R711
R716

R713

R715

R712

R714
EVLC14S02050

EVLC14S02050

EVLC14S02050
EVLC14S02050
B

KYPD_LED_EN
Rev. 1.1
X+

VA703
VA701

VA702
Y+ VA708
X- ON_SW KEY

VA707
VA704

VA705

VA706
Y- EVL14K02200
EVLC14S02050

EVLC14S02050

EVLC14S02050

EVLC14S02050

(GREEN) (WHITE) (RED) PQ

SIDE KEY
KEY
KEY PCB BACKLIGHT LEDs
VA709

VA710

VA711

VA712

C C

TOUCH SCREEN DRIVER IC


Touch Driver IC change : TSC2003 -> TSC2007

VGA_VDD_2.7V
D D
VGA_VDD_1.8V

CN701
1 30
VGA_CAM_PWDN R717 2 29
VGA_CAM_MCLK
3 28
10 VGA_CAM_RESET_N
R718 10 4 27 R719 10 +VPWR MMP_VDD_CORE_1.0V CAM_VDD_CORE_1.2V
MMP_CAM_PCLK I2C_SCL
5 26 R720 10
VGA_CAM_DATA[0] I2C_SDA
6 25
VGA_CAM_DATA[1]
7 24 R724 10
VGA_CAM_DATA[2] MMP_CAM_HSYNC L700 4.7uH
8 23 R725 10
VGA_CAM_DATA[3] MMP_CAM_VSYNC
9 22 U701 AAT2510IWP-AA-T1
VGA_CAM_DATA[4] VGA_CAM_DATA[7]
E VGA_CAM_DATA[5]
10 21
VGA_CAM_DATA[6]
12
VIN1 LX1
11 C702 100p E
11 20
MOTOR+
12 19 C703 9 2 R726 39K
MOTOR- x+ VIN2 FB1
13 18 4.7u
Y+
14 17
RCV+ x- L701 4.7uH
15 16 1 8
RCV- Y- MMP_PWR_EN EN1 LX2
4 5 C704 100p
MMP_CAM_PWR_EN EN2 FB2
VA713

VA714

VA715
R729

PGND1
PGND2

4.7u

4.7u
2.2u

2.2u
BGND
GND1
GND2
R728 56K

56K

56K
C710 C711 C712 C713 C709 C714 C715
ICVL0518100Y500FR

0.1u 0.1u 10p 10p 10p 10p


EVLC18S02015

EVLC18S02015
NA 0.1u

3
6
7
10
13

R730

R731

C705

C707
C706

C708
resistor

F F

ICVE10184E070R100FR ICVE10184E070R100FR
1 9 1 9
MMP_CAM_DATA[0] INOUT_A1 INOUT_B1 VGA_CAM_DATA[0] MMP_CAM_DATA[4] INOUT_A1 INOUT_B1 VGA_CAM_DATA[4]
2 8 2 8
MMP_CAM_DATA[1] INOUT_A2 INOUT_B2 VGA_CAM_DATA[1] MMP_CAM_DATA[5] INOUT_A2 INOUT_B2 VGA_CAM_DATA[5]
3 7 3 7
MMP_CAM_DATA[2] INOUT_A3 INOUT_B3 VGA_CAM_DATA[2] MMP_CAM_DATA[6] INOUT_A3 INOUT_B3 VGA_CAM_DATA[6]
4 6 4 6
MMP_CAM_DATA[3] INOUT_A4 INOUT_B4 VGA_CAM_DATA[3] MMP_CAM_DATA[7] INOUT_A4 INOUT_B4 VGA_CAM_DATA[7]
G1
G2

G1
G2
5
10

5
10

FL700 FL701

G G

H H

1 2 3 4 5 5 6 7 8 9 10 11 12

Copyright © 2007 LG Electronics. Inc. All right reserved. - 177 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12

A A

VREG_MSMP_2.7V

VREG_MMC_3.0V
C800 NA BT_ANT BT_GND

0
R800
L800 NA

B B

BLUETOOTH

100K

100K

100K

100K

100K
R804

100K
LG INNOTEK

16
LBRQ-2B43A M800

R801

R802

R805

R806
R803

ANT
S800 SCHA1B0102 C801 1000p 9 4 TP800
BT_CLK CLK_REF SBST BT_SBST
DAT2_RSV 11 TP801
MICROSD_DATA[2] SBCK BT_SBCK
CD_DAT3_CS 3 12 TP802
MICROSD_DATA[3] VCC_OUT SBDT BT_SBDT
CMD_DI
MICROSD_CMD
VDD 2 5
VDD_INT SYNC_DET_TX_EN BT_TX_RX_N
CLK_SCLK
MICROSD_CLK R807
VSS 10 13 0
VDD_MSM RX_BB_TX_BB BT_DATA
DAT0_DO
MICROSD_DATA[0] C803 C804
DAT1_RSV 14 7 C802 1000p
MICROSD_DATA[1] 1u 1u VDD_BAT XTAL_IN TCXO_BT
DETECT

PGND4
PGND3
PGND2
PGND1
MICROSD_DETECT

GND4
GND3
GND2
GND1
COMMON

C805

C806

C807

C808

R810

R811

C809

C810
DUMMY1

R808

R809
10K

10K
DUMMY2
C C

20
19
18
17

15
8
6
1
33p

33p

33p

33p

33p

33p

33p
1u
VREG_MSMP_2.7V
VREG_BT_2.85V

C811 C812 C813 C814


100p 0.1u 100p 2.2u

Micro SD

D D

VREG_MSMP_2.7V

VREG_MMC_3.0V
VREG_BT_2.85V

+VPWR
VREG_MSMP_2.7V

CN801
G1
E 1 40 CN800 E
EAR_MIC_P
2 39 1
BT_SBST
3 38 7
BT_TX_RX_N
4 37 2
TCXO_BT WHEEL_SW_R
5 36 6
MICROSD_CLK
6 35 3
BT_CLK MICROSD_DETECT WHEEL_SW_L
7 34 5
MICROSD_CMD
8 33 4
MICROSD_DATA[0]
9 32
MICROSD_DATA[1]
10 31
BT_SBCK MICROSD_DATA[2]
11 30
BT_SBDT MICROSD_DATA[3]
12 29
BT_DATA
13 28
14 27
V_BACK_UP CAM_MIC+
15 26
HOOK_SENSE_N WHEEL_SW_R
16 25
CAM_VDD_AF_2.7V WHEEL_SW_L
CAM_VDD_SD_1.8V
17
18
24
23
MMP_CAM_PWR_EN
WHEEL CONNECTOR
19 22
SPK_OUT-
20 21
F SPK_OUT+ F
G2
AXK840225WG
Header

MAIN - SUB B to B Conn.


SPK_OUT+ OUT800
SPEAKER PAD G
SPK_OUT- OUT801

SPEAKER +/-

5 6 7 8 9 10 11 12

LGE Internal Use Only - 178 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12

A A

5MP CAMERA POWER

B B

(VDD_SD)
+VPWR CAM_VDD_SD_1.8V

150mA +VPWR
CAM_VDD_AF_2.7V

150mA

U901 R1114D271D
U900 R1114D181D 1 6
C VDD CE_OR_NC MMP_CAM_PWR_EN C
1 3 BAT900
VDD VOUT
2 5
GND1 GND2 V_BACK_UP
4 2
NC GND1
6 5 3 4
MMP_CAM_PWR_EN CE GND2 VOUT NC C900
1u
C901 C902 C903 C904
1u 1u 1u 1u

BACK_UP BATTERY

D D

MIC900

1 CAM_MIC+
2

SPOB-413S42-RC3310BC PLW0501H-LF
INSTPAR
ZD900

E E

CAM MIC

F F
R904

NCS2200SQ2T2G
U902
100K

2
VIN+ 3 GND OUT
R905 HOOK_SENSE_N
VCC 1
EAR_MIC_P VIN- 4 5
1M

10K
R906

5.1K
VREG_MSMP_2.7V C905
R907 0.1u
Headset Hook Switch
G G

H H

1 2 3 4 5 6 7 8 9 10 11 12

Copyright © 2007 LG Electronics. Inc. All right reserved. - 179 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 4 5 6 6 7 8 9 10 11 12

A A

B B

CAM_VDD_SA_2.7V CAM_VDD_AF_2.7V

CAM_VDD_IO_2.7V

CAM_VDD_SD_1.8V CAM_VDD_CORE_1.2V
CAM_VDD_AF_2.7V

CAM_VDD_SA_2.7V

CAM_VDD_IO_2.7V
AXT628124-Header CAM_VDD_SD_1.8V CAM_VDD_CORE_1.2V
CN1001
C 32 31 C

28 1

27 2
MMP_I2C_SCL
26 3
GB042-30P-H1--E3000
MMP_I2C_SDA
CN1000
25 4
1 30
MMP_CAM_VSYNC
2 29
24 5 MMP_I2C_SCL
3 28
MMP_CAM_HSYNC MMP_I2C_SDA
4 27
23 6 MMP_CAM_VSYNC
5 26
MMP_CAM_INT MMP_CAM_RESET_N MMP_CAM_HSYNC
6 25
22 7 MMP_CAM_INT MMP_CAM_RESET_N
7 24
STROBE_TRIGGER STROBE_TRIGGER
8 23
21 8 5M_CAM_DATA[7] 5M_CAM_DATA[6]
9 22
5M_CAM_DATA[7] 5M_CAM_DATA[6] 5M_CAM_DATA[5] 5M_CAM_DATA[4]
10 21
20 9 5M_CAM_DATA[3] 5M_CAM_DATA[2]
11 20
D 5M_CAM_DATA[5] 5M_CAM_DATA[4] 5M_CAM_DATA[1] 5M_CAM_DATA[0] D
12 19
19 10
13 18
5M_CAM_DATA[3] 5M_CAM_DATA[2] MMP_CAM_PCLK MMP_CAM_MCLK
14 17
18 11
15 16
5M_CAM_DATA[1] 5M_CAM_DATA[0]
17 12

16 13
MMP_CAM_PCLK MMP_CAM_MCLK
15 14

30 29

ENBY0041601

CONNECT TO MAIN PCB


E E

CONNECT TO CAMERA MODULE

CAMERA FPCB CONNECTOR TP1000


TP1001
TP1002
TP1003

F F

G G

H H

1 2 2 3 4 5 5 6 7 7 8 9 10 11 12
LGMC

LGE Internal Use Only - 180 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 9 10

B B

C C

VGA_VDD_2.7V

VGA_VDD_1.8V
VGA_VDD_2.7V

VGA_VDD_1.8V

GB042-30P-H10-E3000
AXK720147G
CN1201
CN1200 1 30
VGA_CAM_PWDN
1 20 2 29
VGA_CAM_PWDN VGA_CAM_MCLK
2 19 3 28
VGA_CAM_MCLK VGA_CAM_RESET_N
3 18 4 27
D VGA_CAM_RESET_N CAM_PCLK I2C_SCL D
4 17 5 26
CAM_PCLK I2C_SCL VGA_CAM_DATA[0] I2C_SDA
5 16 6 25
VGA_CAM_DATA[0] I2C_SDA VGA_CAM_DATA[1]
6 15 7 24
VGA_CAM_DATA[1] VGA_CAM_DATA[2] CAM_HSYNC
7 14 8 23
VGA_CAM_DATA[2] CAM_HSYNC VGA_CAM_DATA[3] CAM_VSYNC
8 13 9 22
VGA_CAM_DATA[3] CAM_VSYNC VGA_CAM_DATA[4] VGA_CAM_DATA[7]
9 12 10 21
VGA_CAM_DATA[4] VGA_CAM_DATA[7] VGA_CAM_DATA[5] VGA_CAM_DATA[6]
10 11 11 20
VGA_CAM_DATA[5] VGA_CAM_DATA[6] MOTOR+
12 19
MOTOR- x+
13 18
Y+
14 17
RCV+ x-
15 16
RCV- Y-

RCV+ OUT1200

RECEIVER PAD
RCV- OUT1201
E E

RECEIVER +/-
CN1202
G1 G2
1 10
MOTOR+ OUT1202 2 9
Y+ x-
3 8
MOTOR- OUT1203 4 7
x+ Y-
5 6

MOTOR +/- G3 G4

F F

G G

H H

1 2 2 3 4 5 6 7 8 9 10 11 12
LGMC

Copyright © 2007 LG Electronics. Inc. All right reserved. - 181 - LGE Internal Use Only
Only for training and service purposes
7. CIRCUIT DIAGRAM

1 2 3 4 5 6 4 5 6 7 8 9 10

B B

C C

1100
D D
SW1100
CN1100
1
KEY_ROW[0] KEY_ROW[0]
2 LOCK KEY CAMERA
KEY_ROW[1]
3
KEY_COL[0]
4 FOCUS
KEY_COL[1]
5

KEY_ROW[1]

KEY_COL[0]
KEY_COL[1]

E E

F F

G G

H H

1 2 2 3 3 4 4 5 5 6 6 7 8 8 9 9 1 10
0 11 12
LGMC

LGE Internal Use Only - 182 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA IC PIN MAP

8. BGA IC PIN MAP

1. MSM6280
(Top View)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 183 - LGE Internal Use Only
Only for training and service purposes
8. BGA IC PIN MAP

1. MSM6280
(Top View)

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

A A
B B
C C
D D
E E
F F
G G
H H
J J
K K
L L
M M
N N
P P
R R
T T
U U
V V
W W
Y Y
AA AA
AB AB
AC AC
AD AD
AE AE
AF AF

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Used
Not used

LGE Internal Use Only - 184 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA IC PIN MAP

2. MCP (Top View)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 185 - LGE Internal Use Only
Only for training and service purposes
8. BGA IC PIN MAP

2. MCP (Top View)

1 2 3 4 5 6 7 8 9 10 11 12 13 14

A A
B B
C C
D D
E E
F F
G G
H H
J J
K K
Used
L L
Not used
M M
N N
P P
R R
T T
U U
V V
W W
Y Y

1 2 3 4 5 6 7 8 9 10 11 12 13 14

LGE Internal Use Only - 186 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA IC PIN MAP

3. PM6650-2 (PMIC)

Copyright © 2007 LG Electronics. Inc. All right reserved. - 187 - LGE Internal Use Only
Only for training and service purposes
8. BGA IC PIN MAP

4. WM8983 (Audio codec)

LGE Internal Use Only - 188 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA IC PIN MAP

5. FM RADIO

1 2 3 4 5 6

Copyright © 2007 LG Electronics. Inc. All right reserved. - 189 - LGE Internal Use Only
Only for training and service purposes
8. BGA IC PIN MAP

6. ZORAN(ZR3453)

1 2 3 4 5 6 7 8 9 10 11 12 13 14

LGE Internal Use Only - 190 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT

<Audio Codec>
- Headset, speaker operation

<LDO IC>
- 1.0V, 1.2V power supply

<PM IC>- Power management

<Baseband and RF IC>


- Check the battery voltage and
Outputs of LDOs-Rx operation <Charging IC>
- Check the TA and bettery

<Memory IC>- Check S/W


<Xtal> download
- Check the frequency (27MHz)
<Xtal>- Check the frequency
<Multi media IC> (19.2MHz)
- Camcorder, Camera operation
<GSM900 TX SAW filter>
<RF IC> - GSM900 TX operation
- GSM, WCDMA TX/RX operation

<UMTS Duplexer>
<UMTS RX SAW filter>
- WCDMA RX,TX separation
- WCDMA RX operation

<RF SW> <GSM PAM>- GSM TX


amplifier operation

<FEM>- RX, TX
switching selection

Copyright © 2007 LG Electronics. Inc. All right reserved. - 191 - LGE Internal Use Only
Only for training and service purposes
9. PCB LAYOUT

<FM radio IC>


- FM radio operation

<Headphone AMP>
- Headset operation

<Charge Pump>
<OVP IC> - LCD backlight charge pump
- Over voltage protection

LGE Internal Use Only - 192 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT

Copyright © 2007 LG Electronics. Inc. All right reserved. - 193 - LGE Internal Use Only
Only for training and service purposes
9. PCB LAYOUT

LGE Internal Use Only - 194 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT

Copyright © 2007 LG Electronics. Inc. All right reserved. - 195 - LGE Internal Use Only
Only for training and service purposes
9. PCB LAYOUT

LGE Internal Use Only - 196 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT

Copyright © 2007 LG Electronics. Inc. All right reserved. - 197 - LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only - 198 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. Calibration

10. Calibration

10.1 Usage of Hot-Kimchi

10.1.1 Calibration

Calibration only

Model Name

• Procedure

1. Click SETTING in menu, and logic operation in sub-menu.


Choose “1” in LOGIC MODE (means calibration alone)
2.Select the model name which you want in list box
3.Click Start button to calibrate a phone

Copyright © 2007 LG Electronics. Inc. All right reserved. - 199 - LGE Internal Use Only
Only for training and service purposes
10. Calibration

10.1.2 Basic Setting

• Contents

√ Click SETTING in menu, and logic operation in sub-menu.


√ You can select how to control AT comm, Testset, and Power supply in DLL Operating Mode.
√ You can set UART Port and logic mode. (mode 1 : Calibration alone)
√ You can set Result File’s name type. If you choose “TIME”, the saved files’ name is saved in a run -
time.
√ You can run the multi mode (S/B1,S/B2 : You can use S/B1 for only one port.)
√ You can set the path of HOTKIMCHI program.

LGE Internal Use Only - 200 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. Calibration

10.1.3 Log of Calibration and Test

• Contents

√ On Running, Log window is created in center area. It displays logs of command, and measurements
of Calibration or Autotest.
√ The result files are saved in the directory “~janghee\debug\Cal”, “~janghee\debug\Auto”, or
“~janghee\debug\CalAuto”.

Copyright © 2007 LG Electronics. Inc. All right reserved. - 201 - LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only - 202 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW

17

18 40 41
21 38 39
19 33 36 37
32
8 9 14 15 20 29 30 31
6 7 23 24 25
4 90 4
1 2 87

16 42
28

10

34 35
27
26
13 22 88
11 12
3 86 81
63 64 75 76 77 78 79 80
58 61 62
57
56
48 50 51 52 53 54
44 45 46

84

49
68 69 70
89 55 59 60 65 66 67
82
85
83

74
47 71 72 73
43

Copyright © 2007 LG Electronics. Inc. All right reserved. - 203 - LGE Internal Use Only
Only for training and service purposes
ASS'Y EXPLODED VIEW

LGE Internal Use Only - 204 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
<Mechanic component>

Location
Level Description Part Number Spec Color Remark
No.
1 IMT,BAR/FLIP TIMT0000711 Black

2 AAAY00 ADDITION AAAY0260102 Without Color

3 WSAY00 SOFTWARE,APPLICATION WSAY0113601 ; , , ,WORLD WIDE , ,

3 MCCL00 CAP,BOX MCCL0001103 BOX, TW, , , , , Without Color

3 MCJZ00 COVER MCJZ0049101 BOX, TW, , , , , Without Color

3 MLAC00 LABEL,BARCODE MLAC0004501 Export(105*40) Without Color

3 MLAJ00 LABEL,MASTER BOX MLAJ0004401 LABEL,MASTER BOX(for C1300i NEW_CGR) Without Color

3 MLAP00 LABEL,UNIT MLAP0001115 Reliance Seal Label Without Color

PACKING,BLISTER(LOWE
3 MPAA00 MPAA0002003 PRESS, PB, , , , , Without Color
R)
PACKING,BLISTER(UPPER
3 MPAB00 MPAB0001603 PRESS, PB, , , , , Without Color
)
3 MPCY00 PALLET MPCY0011201 PALLET(for G5400 O2U 1200x1000_Wooden) Silver

2 APEY00 PHONE APEY0415111 Black

3 ACGK00 COVER ASSY,FRONT ACGK0093401 Without Color

4 ACGZ00 COVER ASSY ACGZ0013901 UPPER Without Color

5 MCJZ00 COVER MCJZ0046501 MOLD, PC LUPOY SC-1004A, , , , , Black 5

6 MICA01 INSERT,FRONT MICA0013901 2.2X4.0 Without Color 9

5 MFBB00 FILTER,RECEIVER MFBB0023201 COMPLEX, (empty), , , , , Without Color 4

5 MPBM00 PAD,RECEIVER MPBM0019201 COMPLEX, (empty), , , , , Without Color 7

5 MTAF TAPE,MOTOR MTAF0006001 Without Color 6

5 MTAK00 TAPE,CAMERA MTAK0002501 COMPLEX, (empty), , , , , Without Color 8

4 ACHA00 COVER SUB ASSY,FRONT ACHA0001801 Without Color

5 MBJL00 BUTTON,SIDE MBJL0042701 MOLD, ABS MP-211, , , , , Silver 27

5 MCCC00 CAP,EARPHONE JACK MCCC0045901 COMPLEX, (empty), , , , , Black `4

5 MCJK00 COVER,FRONT MCJK0073001 MOLD, PC LUPOY SC-1004A, , , , , Black 22

6 MICA00 INSERT,FRONT MICA0019901 M1.4 D2.2 L1.5 Gold 34

5 MDAG00 DECO,FRONT MDAG0028401 MOLD, PC LUPOY SC-1004A, , , , , Black 17

5 MKBZ00 KNOB MKBZ0002101 MOLD, PC LUPOY SC-1004A, , , , , Black 25

5 MLEA00 LOCKER,BATTERY MLEA0039301 MOLD, PC LUPOY SC-1004A, , , , , Black 18

5 MPBT00 PAD,CAMERA MPBT0044701 COMPLEX, (empty), , , , , Without Color 33

5 MSDC00 SPRING,LOCKER MSDC0010601 Without Color 19

5 MSIY00 SHAFT MSIY0001201 CUTTING, STS, , , , , Silver 29

5 MTAA00 TAPE,DECO MTAA0142501 COMPLEX, (empty), , , , , Without Color 23

5 MTAA01 TAPE,DECO MTAA0142601 COMPLEX, (empty), , , , , Without Color 21

Copyright © 2007 LG Electronics. Inc. All right reserved. - 205 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
5 MTAA02 TAPE,DECO MTAA0142701 COMPLEX, (empty), , , , , Without Color 20

5 MTAA03 TAPE,DECO MTAA0142801 COMPLEX, (empty), , , , , Without Color 16

5 MTAA04 TAPE,DECO MTAA0146601 COMPLEX, (empty), , , , , Without Color 26

5 MTAB00 TAPE,PROTECTION MTAB0185401 COMPLEX, (empty), , , , , Without Color 28

5 MTAC00 TAPE,SHIELD MTAC0057901 COMPLEX, (empty), , , , , Without Color 32

5 MTAC01 TAPE,SHIELD MTAC0058101 COMPLEX, (empty), , , , , Without Color 31

5 MTAZ00 TAPE MTAZ0193901 COMPLEX, (empty), , , , , Black 11

5 MTAZ01 TAPE MTAZ0195701 COMPLEX, (empty), , , , , Without Color 12

5 MTAZ02 TAPE MTAZ0195801 COMPLEX, (empty), , , , , Without Color 15

5 MTAZ03 TAPE MTAZ0195901 COMPLEX, (empty), , , , , Without Color 24

4 MKAG00 KEYPAD,MAIN MKAG0000901 MOLD, PC LUPOY SC-1004A, , , , , Black 35

4 MLAZ00 LABEL MLAZ0038303 PRINTING, (empty), , , , , White

4 MPBG00 PAD,LCD MPBG0065101 COMPLEX, (empty), , , , , Black

4 MPBG01 PAD,LCD MPBG0068901 COMPLEX, (empty), , , , , Without Color

4 MPBT00 PAD,CAMERA MPBT0044901 COMPLEX, (empty), , , , , Without Color 38

4 MPBZ00 PAD MPBZ0193801 COMPLEX, (empty), , , , , Without Color

4 MTAB00 TAPE,PROTECTION MTAB0182801 COMPLEX, (empty), , , , , Without Color 1

4 MTAB01 TAPE,PROTECTION MTAB0182901 COMPLEX, (empty), , , , , Without Color 3

4 MTAC00 TAPE,SHIELD MTAC0058201 COMPLEX, (empty), , , , , Without Color

4 MTAD00 TAPE,WINDOW MTAD0072001 COMPLEX, (empty), , , , , Without Color

4 MWAC00 WINDOW,LCD MWAC0083101 COMPLEX, (empty), , , , , Without Color

4 SACY00 PCB ASSY,FLEXIBLE SACY0063001

5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0057301

PCB ASSY,FLEXIBLE,SMT
6 SACC00 SACC0036101
BOTTOM

CONNECTOR,BOARD TO
7 ENBY00 ENBY0018601 10 PIN,.4 mm,STRAIGHT , ,H=0.9, SOCKET
BOARD

PCB ASSY,FLEXIBLE,SMT
6 SACD00 SACD0047101
TOP

CONNECTOR,BOARD TO
7 ENBY00 ENBY0019501 20 PIN,.4 mm,ETC , ,H=1.5, Socket
BOARD

CONNECTOR,BOARD TO 30 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT


7 ENBY01 ENBY0040601
BOARD ,MALE ,SMD ,R/TP , ,

6 SPCY00 PCB,FLEXIBLE SPCY0106101 POLYI ,0.4 mm,Mutil-5,VGA-CAM ,; , , , , , , , , ,

3 V,1.0 A,10*3.6T ,2.0Vrms 175HZ linear motor 1.5G ,;


4 SJMY00 VIBRATOR,MOTOR SJMY0008502 36
,3V , , ,1.5G , , , ,

4 SURY00 RECEIVER SURY0012801 37

4 SVCY00 CAMERA SVCY0014601 CMOS ,MEGA ,5M AF, Sony 1/2.8", HPCB 39

4 SVCY01 CAMERA SVCY0014001 CMOS ,VGA ,5.5x11.4x3.2t, Magna 1/7.4"

LGE Internal Use Only - 206 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
MAIN ,240*400 ,45.08*75*2.2 ,262k ,TFT ,TM ,DAC
4 SVLM00 LCD MODULE SVLM0025501 10
IC(Sharp) ,

3 ACGM00 COVER ASSY,REAR ACGM0094701 Without Color

4 ENZY00 CONNECTOR,ETC ENZY0019901 3 PIN,3 mm,STRAIGHT , , 70

6 V,0.005 A,HORIZONTAL ,0.04 G,KU990 Wheel Switch


4 ESQY00 SWITCH,ROTARY ESQY0001201 81
,; ,2C2P ,6VDC ,0.5MA ,HORIZONTAL ,

4 MCJN00 COVER,REAR MCJN0069201 MOLD, PC LUPOY SC-1004A, , , , , Black 75

4 MDAD00 DECO,CAMERA MDAD0032801 PRESS, Al, 0.3, , , , Black 80

4 MFBC00 FILTER,SPEAKER MFBC0033001 COMPLEX, (empty), , , , , Without Color 64

4 MFBD00 FILTER,MIKE MFBD0025301 COMPLEX, (empty), , , , , Without Color 74

4 MFBD01 FILTER,MIKE MFBD0025401 COMPLEX, (empty), , , , , Black 62

4 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White

4 MPBH00 PAD,MIKE MPBH0032201 COMPLEX, (empty), , , , , Without Color 57,71

4 MPBH01 PAD,MIKE MPBH0032301 COMPLEX, (empty), , , , , Without Color

4 MPBH02 PAD,MIKE MPBH0032401 COMPLEX, (empty), , , , , Without Color 72

4 MPBM00 PAD,RECEIVER MPBM0019401 COMPLEX, (empty), , , , , Without Color 59

4 MPBT00 PAD,CAMERA MPBT0044801 COMPLEX, (empty), , , , , Without Color

4 MPBU00 PAD,CONNECTOR MPBU0007601 COMPLEX, (empty), , , , , Without Color 56

4 MPBU01 PAD,CONNECTOR MPBU0007701 COMPLEX, (empty), , , , , Without Color 68

4 MPBZ00 PAD MPBZ0187301 COMPLEX, (empty), , , , , Without Color 76

4 MPFZ01 PLATE MPFZ0029901 COMPLEX, (empty), , , , , Without Color 82

4 MSDD00 SPRING,PLATE MSDD0006701 PRESS, Bs, 0.15, , , , Gold 66

4 MSDD01 SPRING,PLATE MSDD0006901 PRESS, Bs, , , , , Gold 63

4 MTAA00 TAPE,DECO MTAA0142901 COMPLEX, (empty), , , , , Without Color 79

4 MTAC00 TAPE,SHIELD MTAC0058301 COMPLEX, (empty), , , , , Without Color 69

4 MTAD00 TAPE,WINDOW MTAD0072101 COMPLEX, (empty), , , , , Without Color 77

4 MTAJ00 TAPE,FLEXIBLE PCB MTAJ0001701 COMPLEX, (empty), , , , , Without Color 60

4 MTAZ00 TAPE MTAZ0194001 COMPLEX, (empty), , , , , Without Color 47

4 MTAZ01 TAPE MTAZ0197401 COMPLEX, (empty), 0.1, , , , Without Color 65

4 MWAE00 WINDOW,CAMERA MWAE0028001 CUTTING, Quartz Glass, , , , , Without Color 78

4 MWAE01 WINDOW,CAMERA MWAE0026401 MOLD, Polyarylamide IXEF 1032, , , , , Without Color 67

3 MLAK00 LABEL,MODEL MLAK0006901

5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color

Copyright © 2007 LG Electronics. Inc. All right reserved. - 207 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
<Main component>
Location
Level Description Part Number Spec Color Remark
No.
3.0 ,-2.0 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL
4 SNGF00 ANTENNA,GSM,FIXED SNGF0027102 58,73
,; ,QUAD ,-2.0 ,50 ,3.0

3.0 ,-2.0 dBd, ,BLUETOOTH, INTERNAL ,; ,SINGLE ,-2.0


4 SNGF01 ANTENNA,GSM,FIXED SNGF0027201
,50 ,3.0

3 GMEY00 SCREW MACHINE,BIND GMEY0010601 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK Black 84

3 SACY00 PCB ASSY,FLEXIBLE SACY0063003

4 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0057302

PCB ASSY,FLEXIBLE,SMT
5 SACD00 SACD0047102
TOP

CONNECTOR,BOARD TO 28 PIN,0.4 mm,ETC , ,B to B ,; , ,0.40MM ,[empty] ,MALE


6 CN601 ENBY0041601
BOARD ,SMD ,BK , ,

CONNECTOR,BOARD TO 30 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT


6 ENBY01 ENBY0040601
BOARD ,MALE ,SMD ,R/TP , ,

5 SPCY00 PCB,FLEXIBLE SPCY0103601 POLYI ,0.2 mm,DOUBLE ,5M-F-CAM ,; , , , , , , , , ,

3 SAFY00 PCB ASSY,MAIN SAFY0203411 44

4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0075601

5 ADCA00 DOME ASSY,METAL ADCA0069301 Without Color 43

5 SPKY00 PCB,SIDEKEY SPKY0049301 POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,

4 SAFF00 PCB ASSY,MAIN,SMT SAFF0124311

PCB ASSY,MAIN,SMT
5 SAFC00 SAFC0091501
BOTTOM

6 C100 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C101 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

6 C102 INDUCTOR,CHIP ELCH0001401 15 nH,J ,1005 ,R/TP ,Pb Free

6 C103 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C104 CAP,CERAMIC,CHIP ECCH0000196 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C105 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C106 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP

6 C107 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C108 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C110 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C111 CAP,CERAMIC,CHIP ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP

6 C112 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C116 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C117 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C118 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

LGE Internal Use Only - 208 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 C119 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C120 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C121 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C122 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C123 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C124 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C125 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C126 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C127 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C128 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C129 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C130 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

6 C131 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C132 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C133 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C134 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,


6 C135 CAP,TANTAL,CHIP ECTH0005501
,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]

6 C136 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP

6 C137 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C139 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C140 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C141 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C142 CAP,CERAMIC,CHIP ECCH0000196 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C143 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C144 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C145 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C146 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C147 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C148 CAP,CHIP,MAKER ECZH0001105 8200 pF,16V ,K ,X7R ,HD ,1005 ,R/TP

6 C149 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C152 CAP,CERAMIC,CHIP ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C153 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C154 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C155 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C156 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C159 CAP,CHIP,MAKER ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

Copyright © 2007 LG Electronics. Inc. All right reserved. - 209 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 C160 CAP,TANTAL,CHIP ECTH0004101 22 uF,6.3V ,M ,STD ,1608 ,R/TP

6 C161 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C162 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C163 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C164 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C167 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C168 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C169 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C170 CAP,CERAMIC,CHIP ECCH0000178 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP

6 C173 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C200 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C214 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C218 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C219 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C222 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP

6 C223 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP

6 C231 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C232 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C233 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C235 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C236 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C238 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C239 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP

6 C300 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C301 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C303 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C308 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C309 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C310 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C311 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C321 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C322 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C323 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C324 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C325 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C326 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C339 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP

LGE Internal Use Only - 210 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 C340 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP

6 C403 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C404 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C405 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C406 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C407 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C408 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C409 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C410 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C411 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,


6 C500 CAP,TANTAL,CHIP ECTH0005501
,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]

6 C501 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C502 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C503 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C504 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C505 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C506 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C507 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C508 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C509 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C510 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C511 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C512 CAP,CHIP,MAKER ECZH0003501 1 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,-


6 C513 CAP,TANTAL,CHIP ECTH0004807
55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]

6 C514 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C515 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP

6 C518 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C519 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C522 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C523 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C524 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,-


6 C525 CAP,TANTAL,CHIP ECTH0004807
55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]

6 C526 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C527 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C528 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

Copyright © 2007 LG Electronics. Inc. All right reserved. - 211 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 C529 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C530 CAP,CERAMIC,CHIP ECCH0000199 12 nF,16V ,K ,X7R ,HD ,1005 ,R/TP

6 C532 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C533 CAP,CERAMIC,CHIP ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP

6 C534 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C535 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C536 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C537 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C538 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C539 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C540 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C541 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C542 CAP,CERAMIC,CHIP ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP

6 C545 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C546 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C547 CAP,CERAMIC,CHIP ECCH0000199 12 nF,16V ,K ,X7R ,HD ,1005 ,R/TP

6 C548 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C549 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C552 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C553 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C554 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

6 C555 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP

6 C556 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C557 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C558 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C559 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C560 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C561 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C586 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C587 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C589 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C590 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP

6 C600 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C601 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C602 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C613 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C619 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

LGE Internal Use Only - 212 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 C620 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP

6 C623 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C624 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP

6 C625 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP

6 C626 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C627 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C702 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C703 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C704 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C705 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP

6 C706 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C707 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP

6 C708 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

CONNECTOR,BOARD TO
6 CN300 ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket
BOARD

6 CN500 CONNECTOR,I/O ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type

CONNECTOR,BOARD TO 30 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE


6 CN600 ENBY0040701
BOARD ,SMD ,R/TP ,1.0 ,

CONNECTOR,BOARD TO
6 CN601 ENBY0035201 14 PIN,0.4 mm,ETC , ,H=2.0, Socket
BOARD

CONNECTOR,BOARD TO
6 CN603 ENBY0029501 40 PIN,0.4 mm,ETC , ,H=3.0, Socket
BOARD

CONNECTOR,BOARD TO 30 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE


6 CN701 ENBY0040701
BOARD ,SMD ,R/TP ,1.0 ,

6 D400 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,


6 D501 DIODE,SWITCHING EDSY0011901
IR=30uA(VR=10V)

6 D502 DIODE,TVS EDTY0007401 SMD ,12 V,350 W,R/TP ,

6 D600 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE

6 FB500 FILTER,BEAD,CHIP SFBH0001501 120 ohm,1608 ,

6 FB501 FILTER,BEAD,CHIP SFBH0001501 120 ohm,1608 ,

1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , ,


6 FB504 FILTER,BEAD,CHIP SFBH0008103
,SMD ,R/TP

900,1800 ,1900.2100 , dB, dB, dB, dB,ETC ,GSM


6 FL100 FILTER,SEPERATOR SFAY0010002
TRIPLE, WCDMA2100 FEM, 5X4X1.3

897.5 MHz,1.4*1.1*0.6 ,SMD ,Pb-


6 FL101 FILTER,SAW SFSY0030201
free_SAW_GSM900_Tx

2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,


6 FL102 FILTER,SAW SFSY0031201 5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140
,1.4*1.1*0.62 ,SMD ,R/TP

1950 MHz,2140 MHz,1.8 dB,2.4 dB,43 dB,45


6 FL103 DUPLEXER,IMT SDMY0001202 dB,3.0*2.5*1.1 ,SMD ,SAW DUPLEXER ,; ,2140 ,45
,1950 ,43 ,2.4 ,1.8 ,3.0*2.5*1.1 ,DUAL ,SMD ,R/TP

Copyright © 2007 LG Electronics. Inc. All right reserved. - 213 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA
6 FL104 FILTER,SAW SFSY0031101
2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR

6 FL300 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)

6 FL301 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)

6 FL302 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)

6 FL303 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)

6 J400 CONN,SOCKET ENSY0018701 6 PIN,ETC , ,2.54 mm,H=1.8

6 L100 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 L101 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE

6 L103 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE

6 L104 INDUCTOR,CHIP ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE

6 L105 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE

6 L106 INDUCTOR,CHIP ELCH0005014 5.6 nH,S ,1005 ,R/TP ,

6 L107 INDUCTOR,CHIP ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE

6 L108 INDUCTOR,CHIP ELCH0005014 5.6 nH,S ,1005 ,R/TP ,

6 L109 INDUCTOR,CHIP ELCH0005004 22 nH,J ,1005 ,R/TP ,

6 L110 INDUCTOR,CHIP ELCH0004711 22 nH,J ,1005 ,R/TP ,

6 L111 INDUCTOR,CHIP ELCH0005004 22 nH,J ,1005 ,R/TP ,

6 L112 INDUCTOR,CHIP ELCH0004710 15 nH,J ,1005 ,R/TP ,

6 L113 INDUCTOR,CHIP ELCH0004704 4.7 nH,S ,1005 ,R/TP ,

6 L114 INDUCTOR,CHIP ELCH0004707 1.5 nH,S ,1005 ,R/TP ,

6 L115 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,

6 L116 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,

6 L117 INDUCTOR,CHIP ELCH0004708 2.7 nH,S ,1005 ,R/TP ,

6 L118 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,

6 L119 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,

6 L121 INDUCTOR,CHIP ELCH0004721 2.2 nH,S ,1005 ,R/TP ,

6 L123 INDUCTOR,CHIP ELCH0004710 15 nH,J ,1005 ,R/TP ,

6 L124 INDUCTOR,CHIP ELCH0004709 3.3 nH,S ,1005 ,R/TP ,

6 L125 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,

6 L126 INDUCTOR,CHIP ELCH0004705 8.2 nH,J ,1005 ,R/TP ,

6 L128 INDUCTOR,CHIP ELCH0004704 4.7 nH,S ,1005 ,R/TP ,

6 L200 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,

6 L500 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD


6 L501 INDUCTOR,SMD,POWER ELCP0008004
,2.5X2X1MM ,11MM ,R/TP

6 L502 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

6 L503 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

LGE Internal Use Only - 214 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 L700 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

6 L701 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

PIN ,42 dB,4.72*3.76*1.25 ,MEMS MIC , , , ,OMNI


6 MIC500 MICROPHONE SUMY0010603
,1.5TO5V , ,SMD

TESV ,200 mW,R/TP ,EPITAXIAL PLANAR NPN/PNP


6 Q100 TR,BJT,ARRAY EQBA0000602
TRANSISTOR

6 R100 RES,CHIP,MAKER ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP

6 R101 RES,CHIP,MAKER ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

6 R104 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP

6 R107 RES,CHIP ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP

6 R109 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R111 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

6 R112 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP

6 R113 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP

6 R114 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R115 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R117 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

6 R118 RES,CHIP,MAKER ERHZ0000411 120 ohm,1/16W ,J ,1005 ,R/TP

6 R119 RES,CHIP,MAKER ERHZ0000411 120 ohm,1/16W ,J ,1005 ,R/TP

6 R120 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R123 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

6 R124 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R125 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

6 R126 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

6 R200 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

6 R201 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP

6 R202 RES,CHIP,MAKER ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP

6 R204 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R205 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R206 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R207 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R211 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP

6 R312 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP

6 R314 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R315 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R316 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R317 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R319 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

Copyright © 2007 LG Electronics. Inc. All right reserved. - 215 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 R320 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R321 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

6 R322 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

6 R329 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP

6 R340 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP

6 R401 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R402 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R403 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

0.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012


6 R504 RES,CHIP,MAKER ERHZ0003901
,R/TP

6 R506 RES,CHIP,MAKER ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP

6 R507 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

6 R509 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R510 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

6 R511 RES,CHIP,MAKER ERHZ0000431 18 Kohm,1/16W ,J ,1005 ,R/TP

6 R512 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R514 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

6 R515 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R516 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

6 R517 RES,CHIP,MAKER ERHZ0000431 18 Kohm,1/16W ,J ,1005 ,R/TP

6 R518 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R519 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R524 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

6 R525 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

6 R603 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R608 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R610 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R611 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R612 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R613 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R614 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R615 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R619 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R621 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP

6 R622 RES,CHIP,MAKER ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP

6 R623 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP

6 R626 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP

LGE Internal Use Only - 216 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 R726 RES,CHIP,MAKER ERHZ0000476 39 Kohm,1/16W ,J ,1005 ,R/TP

6 R728 RES,CHIP ERHY0000147 56K ohm,1/16W,F,1005,R/TP

6 R730 RES,CHIP ERHY0000147 56K ohm,1/16W,F,1005,R/TP

6 R731 RES,CHIP ERHY0000147 56K ohm,1/16W,F,1005,R/TP

,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER


6 SW100 CONN,RF SWITCH ENWY0005301
,SMD ,R/TP ,AU , ,

4 V,300 mA,HORIZONTAL , G,Slide Switch ,; ,1C3P


6 SW600 SWITCH,SLIDE ESSY0004701
,[empty] ,[empty] ,[empty] ,1.5N , ,TP

QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF


6 U100 IC EUSY0300502
Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx

6 U101 PAM SMPY0013501 35 dBm,51 %, A, dBc, dB,7x7x1.1 ,SMD ,Polar Edge

6 U102 IC EUSY0278501 SON5-P-0.50 ,5 PIN,R/TP ,INVERTER GATE, Pb Free

COUPLER,RF -18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~


6 U104 SCDY0003403
DIRECTIONAL 1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP

dBm,43 %, A,-40 dBc,26 dB,4x4x1.1 ,SMD ,2.1GHz,


6 U105 PAM SMPY0013301
HSDPA

CSP ,409 PIN,R/TP ,WCDMA/GSM/GPRS/EDGE/HSDPA


6 U200 IC EUSY0295601
Base Band

FPBGA ,180 PIN,R/TP ,5M Camera,VGA30,Multi audio


6 U302 IC EUSY0330701
codec

FBGA ,225 PIN,ETC ,2G(LB/128Mx16/2.7V)


6 U402 IC EUSY0333402
NAND+1G(8Mx4x32) SDRAM ,; ,IC,MCP

WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET &


6 U500 IC EUSY0332901
DUAL Transistor

6 U501 IC EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree

QFN ,32 PIN,R/TP ,CODEC,3D, 5band equalizer,Stereo


6 U502 IC EUSY0342001
HP AMP, Stereo SPKAMP ,; ,IC,Audio Codec

6 U603 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free

6 U605 IC EUSY0140901 SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free

6 U606 IC EUSY0335701 QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP

DFN33-12 ,12 PIN,R/TP


6 U701 IC EUSY0251501
,DUALDCDC_DMBpower,400mA,600mA,1Mhz

6 VA300 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW


6 VA301 DIODE,TVS EDTY0009401
,[empty] ,[empty] ,2P ,1

6 VA500 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,

6 VA501 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,

6 VA502 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA503 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA504 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA505 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA506 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA507 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE

Copyright © 2007 LG Electronics. Inc. All right reserved. - 217 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 VA508 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE

6 VA601 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005

6 VA603 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA604 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA605 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

19.2 MHz,1.5 PPM,10 pF,SMD ,3.3*2.5*1.0 , ,; , ,2PPM


6 X100 VCTCXO EXSK0007802
,2.8V , , , , ,SMD ,P/TP

48 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,Outgoing


6 X200 RESONATOR EXRY0002401
Tolerance 0.2%, 0.05% at -40'C ~ +85C, Built-In Cap

27 MHz,50 PPM,9 pF,50 ohm,SMD ,3.2*2.5*0.7 ,30ppm


6 X300 X-TAL EXXY0023301
at -20'C ~ +70'C, Pb Free

32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9


6 X500 X-TAL EXXY0018701
,

5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0091001

6 C109 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C113 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C114 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C115 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C150 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C151 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C157 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C158 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C166 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C171 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C172 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C210 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C211 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C212 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C213 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C215 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C216 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C217 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C220 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C221 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C224 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C225 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C226 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C227 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C228 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

LGE Internal Use Only - 218 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 C229 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C230 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C234 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C302 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C304 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C305 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C306 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C307 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C312 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C313 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C314 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C315 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C316 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C317 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C318 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C319 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C327 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C328 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C329 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C330 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C331 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C332 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C333 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C334 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

6 C335 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

6 C336 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C337 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C338 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C400 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C401 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C402 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C412 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C413 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C516 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C517 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C520 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C521 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

Copyright © 2007 LG Electronics. Inc. All right reserved. - 219 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 C562 CAP,CERAMIC,CHIP ECCH0002004 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP

6 C563 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP

6 C564 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C565 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

6 C566 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C567 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

6 C568 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

6 C570 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C571 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C572 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C573 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE

6 C574 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE

6 C575 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C576 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C577 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C578 CAP,CERAMIC,CHIP ECCH0002004 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP

6 C579 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C580 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C581 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C583 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C584 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C585 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6 C588 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C603 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C604 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C605 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C606 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C607 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C608 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C609 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C610 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C611 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C612 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C614 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C615 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C616 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C617 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

LGE Internal Use Only - 220 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 C618 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C621 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C622 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C700 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C701 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C709 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C710 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C711 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C712 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C713 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C714 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C715 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,


6 D500 DIODE,SWITCHING EDSY0011901
IR=30uA(VR=10V)

6 FB300 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB301 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB502 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB503 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FL600 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)

6 FL601 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)

6 FL700 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)

6 FL701 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)

6 L120 INDUCTOR,CHIP ELCH0004722 47 nH,J ,1005 ,R/TP ,

6 L127 INDUCTOR,CHIP ELCH0009114 100 nH,J ,1005 ,R/TP ,coil

6 L300 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

6 L504 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

6 LD700 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)

6 LD701 DIODE,LED,CHIP EDLH0007901 RED ,1608 ,R/TP ,Indicator,0.4T Red LED

GREEN ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 , , , , ,[empty]


6 LD702 DIODE,LED,CHIP EDLH0014501
,[empty] ,2P

6 LD703 DIODE,LED,CHIP EDLH0007901 RED ,1608 ,R/TP ,Indicator,0.4T Red LED

6 LD704 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)

GREEN ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 , , , , ,[empty]


6 LD705 DIODE,LED,CHIP EDLH0014501
,[empty] ,2P

6 R121 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R122 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

6 R208 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R217 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

Copyright © 2007 LG Electronics. Inc. All right reserved. - 221 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 R218 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

6 R310 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R331 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R336 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R338 RES,CHIP,MAKER ERHZ0000509 75 ohm,1/16W ,J ,1005 ,R/TP

6 R339 RES,CHIP ERHY0000170 390 ohm,1/16W ,F ,1005 ,R/TP

6 R345 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R400 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

6 R505 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

6 R522 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

6 R528 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R529 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

6 R530 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

6 R601 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R602 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R604 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R607 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP

6 R701 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R703 RES,CHIP ERHY0003601 2700 ohm,1/16W ,J ,1005 ,R/TP

6 R704 RES,CHIP ERHY0003601 2700 ohm,1/16W ,J ,1005 ,R/TP

6 R705 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R706 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R707 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP

6 R708 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP

6 R709 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP

6 R710 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP

6 R711 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

6 R712 RES,CHIP,MAKER ERHZ0000527 200 ohm,1/6W ,J ,1005 ,R/TP

6 R713 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

6 R714 RES,CHIP,MAKER ERHZ0000527 200 ohm,1/6W ,J ,1005 ,R/TP

6 R715 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

6 R716 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

6 R717 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R718 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R719 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R720 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R724 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

LGE Internal Use Only - 222 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 R725 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 SPFY00 PCB,MAIN SPFY0151801 FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , ,

WLCSP(Coated) ,25 PIN,R/TP ,FM Tuner(RDS),


6 U103 IC EUSY0335301
3.35*3.3, Pb Free

HVSOF5 ,5 PIN,R/TP ,150mA, 2.8V, Auto Power Save


6 U300 IC EUSY0290701
LDO

6 U301 IC EUSY0336502 , PIN,R/TP , ,; ,IC,Charge Pump

SON1612 ,6 PIN,R/TP ,1.9V 150mA Single LDO ,;


6 U303 IC EUSY0346001
,IC,LDO Voltage Regulator

uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF


6 U304 IC EUSY0338301
6.5ohm 1.4X1.8

6 U400 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75

6 U401 IC EUSY0271201 TQFN ,16 PIN,R/TP ,Quad Analog switch, Pb Free

SON1612 ,6 PIN,R/TP ,3.3V, 150mA LDO Pb-Free,


6 U503 IC EUSY0333001
Active High

QFN,130mW Capless Stereo Headphone Driver ,16


6 U504 IC EUSY0303901
PIN,R/TP ,Capless hp amp

6 U505 IC EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP

MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1


6 U506 IC EUSY0175301
MUX/DEMUX, Pb Free

uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF


6 U507 IC EUSY0338301
6.5ohm 1.4X1.8

HVSOF5 ,5 PIN,R/TP ,150mA, 2.8V, Auto Power Save


6 U600 IC EUSY0290701
LDO

6 U601 IC EUSY0338701 SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free

6 U602 IC EUSY0338701 SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free

MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1


6 U604 IC EUSY0175301
MUX/DEMUX, Pb Free

MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1


6 U607 IC EUSY0175301
MUX/DEMUX, Pb Free

CSP ,12 PIN,R/TP ,Touchscreen Controller IC , ,IC,A/D


6 U700 IC EUSY0337101
Converter

6 VA600 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005

6 VA602 VARISTOR SEVY0003801 18 V, ,SMD ,

6 VA700 VARISTOR SEVY0000702 14 V,10% ,SMD ,

6 VA701 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA702 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA703 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA704 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA705 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA706 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA707 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA708 VARISTOR SEVY0000702 14 V,10% ,SMD ,

Copyright © 2007 LG Electronics. Inc. All right reserved. - 223 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 VA709 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA710 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA711 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA712 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA713 VARISTOR SEVY0003801 18 V, ,SMD ,

6 VA714 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005

6 VA715 VARISTOR SEVY0003801 18 V, ,SMD ,

5 WSYY00 SOFTWARE WSYY0636510

3 SAJY00 PCB ASSY,SUB SAJY0024902 52

4 SAJB00 PCB ASSY,SUB,INSERT SAJB0012001

5 AFBA00 FRAME ASSY,SHIELD AFBA0007701 Without Color

6 MFEA00 FRAME,SHIELD MFEA0015601 MOLD, ABS MP-211, , , , , Without Color 50

6 MPBJ00 PAD,MOTOR MPBJ0045901 COMPLEX, (empty), , , , , Without Color 45

6 MPBU00 PAD,CONNECTOR MPBU0007801 COMPLEX, (empty), , , , , Without Color 48

6 MPBU01 PAD,CONNECTOR MPBU0007901 COMPLEX, (empty), , , , , Without Color 49

6 MPBZ00 PAD MPBZ0190001 COMPLEX, (empty), , , , , Without Color

5 MPBU00 PAD,CONNECTOR MPBU0008001 COMPLEX, (empty), , , , , Without Color 51

5 MPBZ00 PAD MPBZ0187201 COMPLEX, (empty), , , , , Without Color 46

5 SMZY00 MODULE,ETC SMZY0016801 55

UNIT ,8 ohm,83 dB,16 mm,19.85*18.75*6.1 Module SPK


5 SUSY00 SPEAKER SUSY0026002
,; , , , , , , ,[empty]

4 SAJE00 PCB ASSY,SUB,SMT SAJE0019001

PCB ASSY,SUB,SMT
5 SAJC00 SAJC0017301
BOTTOM

6 C901 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C902 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C903 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C904 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C905 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 CN800 CONNECTOR,ETC ENZY0015301 4 PIN,2.2 mm,ETC , ,H=2.3

6 MIC900 MICROPHONE SUMY0010507 UNIT ,42 dB,4*1.35 ,SMD

6 R800 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R904 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R905 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R906 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

6 R907 RES,CHIP,MAKER ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP

6 S800 CONN,SOCKET ENSY0015801 8 PIN,ETC , ,1.1 mm,H=1.9, Detect Pin

6 U900 IC EUSY0294701 SON1612-6 ,6 PIN,R/TP ,1.8V 150mA LDO Pb-Free

LGE Internal Use Only - 224 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

Location
Level Description Part Number Spec Color Remark
No.
6 U901 IC EUSY0338701 SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free

SC70 ,5 PIN,R/TP ,Comparator, pin compatible to


6 U902 IC EUSY0250501
EUSY0077701

6 ZD900 DIODE,TVS EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE

5 SAJD00 PCB ASSY,SUB,SMT TOP SAJD0019601

2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,


6 BAT900 BATTERY,CELL,LITHIUM SBCL0001701
phi 4.8, Pb-Free

6 C801 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C802 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C803 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6 C804 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6 C805 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C806 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C807 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C808 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C809 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C810 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C811 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C812 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C813 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C814 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C900 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

CONNECTOR,BOARD TO
6 CN801 ENBY0029401 40 PIN,0.4 mm,ETC , ,H=3.0
BOARD

6 M800 MODULE,ETC SMZY0012601 4.5x3.2x1.2 Bluetooth RF Module

6 R801 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R802 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R803 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R804 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R805 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R806 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R808 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R809 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R810 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 R811 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

5 SPJY00 PCB,SUB SPJY0042101 FR-4 ,0.5 mm,BUILD-UP 4 , ,; , , , , , , , , ,

Copyright © 2007 LG Electronics. Inc. All right reserved. - 225 - LGE Internal Use Only
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST

11.3 Accessory Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC

Location
Level Description Part Number Spec Color Remark
No.
SILVER
5 MCHZ00 COMPACT DISK MCHZ0040301 COMPLEX, (empty), , , , ,
SNOW

3 MCJA00 COVER,BATTERY MCJA0047601 PRESS, Al, , , , , Black 85

3 MHBY00 HANDSTRAP MHBY0004310 COMPLEX, (empty), , , , , Without Color

3 MPHY00 PROTECTOR MPHY0011301 COMPLEX, (empty), 0.1, , , , Without Color

3.7 V,1000 mAh,1 CELL,PRISMATIC ,KU990(NYX)


BATT, Europe Label, Pb-Free ,; ,3.7 ,1000 ,0.2C
3 SBPL00 BATTERY PACK,LI-ION SBPL0091101 Black
,PRISMATIC ,46x34x55 , ,BLACK ,Innerpack
,Europe(Reverse insert OK)

; ,[empty] ,[empty] ,[empty] ,18pin 6.2mm. NYX Box


3 SGDY00 DATA CABLE SGDY0010908
Package ,BLACK , ,N

; ,10mW ,16ohm ,111dB ,20HZ ,20HZ ,[empty] ,BLACK


EAR PHONE/EAR MIKE
3 SGEY00 SGEY0005546 ,18P MMI CONNECTOR ,Plug Mold( Abnormal)
SET
,Earphone,Stereo

100-240V ,5060 Hz,5.1 V,.7 A,CE ,England, 18pin plug,


3 SSAD00 ADAPTOR,AC-DC SSAD0025003
Nyx packing ,; , , , , , ,WALL 2P ,I/O CONNECTOR ,

LGE Internal Use Only - 226 - Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Note
Note

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