Galaxy 3000:

Sixpack
components and a
new cooling system

THE MERLIN GERIN KNOW-HOW

Galaxy3000 - Sixpack components and new cooling system

Contents

abstract..............................................................................................................

1. new integrated sixpack components for Galaxy 3000 ..........................

n sixpack components, a major innovation for UPSs..............................................

2. new liquid cooling system .........................................................................

n power integration requirements..........................................................................
n best solution: a liquid cooling system .................................................................
n cooling technique for Galaxy 3000 .....................................................................

3. use of cooling liquids in electronic systems..........................................

n liquid cooling solutions.......................................................................................
n applications.......................................................................................................
n examples of users .............................................................................................

4. customer benefits of a liquid cooling system ........................................

n customer benefits ..............................................................................................
n questions and answers......................................................................................

5. conclusion ..................................................................................................

MGE UPS SYSTEMS MGE0249UKI – 01/2000 1

abstract

The use of new integrated sixpack components (6 IGBTs in a single compact

module) in the new Galaxy 3000 range provides customers with a number of
advantages, notably in terms of performance, reliability, size and cost optimisation.
The associated high power densities lead to the necessity of a more effective
cooling technique than natural or forced-air convection.
To meet this requirement and ensure that customers benefit from the advantages of
component integration, MGE UPS SYSTEMS has implemented liquid cooling, the
technique offering the highest performance and reliability at a competitive price.
The selected cooling liquid meets stringent environmental criteria and has a service
life of approximately ten years, which is much longer than those of certain common
components such as DC capacitors (approximately five years).
A sealed cooling circuit fitted with a pump ensures continuous circulation of the
cooling liquid at atmospheric pressure between the cold plates and a cooling unit
comprising a liquid-air heat exchanger and a fan.
The selected design ensures direct cooling of the IGBT chips at their bases. The
operating temperature at the junctions is thus reduced and the service life of
components lengthened.
What is more, liquid cooling is used widely and has demonstrated its effectiveness in
a range of other electronics sectors (aeronautics, aerospace, computers, air-
conditioning, drives, etc.).
This technique is in fact a necessity for the cooling of new components
characterised by high power densities so that users can benefit from the many
possibilities of component integration.

This article presents the integrated sixpack components used in the new Galaxy
3000 UPSs and their many advantages.
It also presents the liquid cooling system employed by MGE UPS SYSTEMS to cool
the high power densities resulting from the use of these components.
The article also reviews the other electronics fields in which this technique is widely
used.
Finally, it discusses the advantages offered by liquid cooling and answers a number
of frequently asked questions concerning this technique.

MGE UPS SYSTEMS MGE0249UKI – 01/2000 2

1. new integrated "sixpack" components

sixpack components, a The new Galaxy 3000 range of UPSs (Uninterruptible Power Supply) is the result of
the MGE UPS SYSTEMS research and development team efforts to provide
major innovation for customers with all the advantages of the latest technological advances in the field of
UPSs component integration.
Fully in line with the innovation policy of MGE UPS SYSTEMS, Galaxy 3000 is the
first UPS range to use a new generation of high-performance components called
sixpacks that group six IGBTs or six SCRs in a single integrated circuit mounted in a
compact module (see figure 1).

Fig. 1. Sixpack module containing a 6-IGBT integrated circuit.

the advantages of sixpack components

Compared to the IGBTs used in the previous UPS generation, sixpack components
offer:
na (4 to 16 kHz);
n for an identical power rating, . A single sixpack module
replaces three dual-type IGBT modules from the previous generation, with the same
power rating (see figure 2);
n a level of , observed during real operation;
n an increase in the , due to the fact that the
components are soldered next to the corresponding control circuits;
n (PFC, inverter, automatic bypass, etc.)
which makes it possible to reduce line inductance and achieve enhanced EMC
(ElectroMagnetic Compatibility) performance.

MGE UPS SYSTEMS MGE0249UKI – 01/2000 3

1. new integrated "sixpack" components (cont.)

Fig. 2. Volume of a sixpack module (six IGBTs) compared to that of three dual
IGBT modules providing the same total power rating.

customer benefits of the sixpack modules

Use of these new components is part of a general trend in the UPS sector, i.e. offer
customers more performance and reliability in smaller units.
The improvements listed below were made possible by using the sixpack modules.
n
The high chopping frequency of these components is the basis of the PFC (Power
Factor Correction) system which reduces distortion of the input current to a very low
level (THDI < 3%), eliminating the need for harmonics filters.
n
This reduction in volume made possible by these components was used in the
Galaxy 3000 UPSs primarily to:
o reduce the UPS footprint;
o improve access to the power components and subassemblies;
o provide front access to the batteries.
n
rather than coils.
Silicon-based integrated components cost less than coils and offer much higher
performance for the same price.
n and consequently , due to:
o fewer mechanical and electrical parts;
o the possibility of directly soldering components on the power boards;
o fewer connections;
o closer positioning of the components to each other, thus eliminating wiring and
connectors.
n .
The simplification in design and the closer physical positioning of components result
in shorter cable lengths and lower circuit impedance. This in turn leads to:
o improved efficiency because less inductance means lower losses during
switching;
o a reduction in EMC disturbances because shorter circuits with fewer current loops
are less sensitive and generate lower disturbance levels.
n , due to the increase in the chopping frequency beyond the
audible spectrum.

MGE UPS SYSTEMS MGE0249UKI – 01/2000 4

1. new integrated "sixpack" components (cont.)

Figure 3 shows the results in terms of simplicity and compactness when sixpack
components are used. Galaxy 3000 power board on the left, Comet (two boards) on
the right.

Fig. 3. Comparison between power boards: Galaxy 3000 with sixpack components
(board on the left) and Comet with traditional IGBTs (two boards on the right).

MGE UPS SYSTEMS MGE0249UKI – 01/2000 5

2. new liquid cooling system

power integration The use of integrated electronic components results inevitably in

. This raises the question of a suitable cooling system if natural or forced-
requirements air convection are not sufficient to evacuate the heat losses.
For the Galaxy 3000 range, the use of sixpack components roughly
(see figure 1).
It is clear that a forced-air cooling system is no longer sufficient. This is a general
and irreversible trend for industries employing power electronics.

best solution: To take advantage of the possibilities offered by the integrated sixpack components,
it was therefore necessary to find a technique capable of cooling the components.
a liquid cooling system The only satisfactory solution from the user's point of view, i.e. providing the required
level of performance at the lowest possible cost, is a liquid-based cooling system,
already used in other sectors of the electronics industry.

. It offers
a number of key advantages that make it the best solution for UPSs.
n it offers the .
n it can be produced at a .
n it is in many other
electronics sectors confronted with the same type of problem (see section 3, "use of
cooling liquids in electronics systems").
n it constitutes a .

cooling technique for sixpack components

Sixpack components have been used widely in the Galaxy 3000 UPS, with seven
Galaxy 3000 modules in all.
n three of the seven are used for the PFC (Power Factor Correction) rectifier,
inverter, and the charger and neutral regulator stages of the power board. Soldered
directly onto the power board, the result is a simpler design and a reduction in size
that was not possible before (see figure 4).
The new cooling system concerns only these three sixpack components, plus the
switching circuits for battery power and the input-output power, which handle most of
the power involved.
n The sixpack components used for other functions are subjected to much lower
power densities for which traditional forced-air convection is sufficient. This is
notably the case for the automatic bypass.

Fig. 4. Galaxy 3000 power board, using three sixpack components.

(1) Rectifier. (2) Inverter. (3) Charger and neutral regulator.

MGE UPS SYSTEMS MGE0249UKI – 01/2000 6

2. new liquid cooling system (cont.)

principle behind the liquid cooling system

The liquid cooling system used to cool the five sixpack components on the power
boards is very traditional in design (see figure 5).
A sealed cooling circuit fitted with a pump ensures continuous circulation of the
cooling liquid between the cold plates in direct contact with the sixpack modules
and a cooling unit comprising a liquid-air heat exchanger and a fan.
The selected design ensures direct cooling of the IGBT chips at their bases using a
system of concentrated jets.
This reduces the operating temperature at the junctions (90° C instead of 125° C
approx., for a maximum permissible temperature of 150° C), which in turn lengthens
the service life of components and increases reliability by a factor of ten compared to
traditional IGBTs.

Fig. 5. Principle of the Galaxy 3000 liquid cooling system.

characteristics of the cooling liquid

The cooling liquid is a new, environmentally friendly product (innocuous for people
and the environment, 100% recyclable) developed by Elf Lubrifiant France.
These qualities are due to its composition, with a propylene glycol base (whereas
most cooling liquids on the market have an ethylene glycol base which is much more
dangerous for people and the environment and is outlawed in certain countries).
Following endurance tests carried out by Elf, the liquid has been guaranteed for ten
years of operation. The concentration employed eliminates any chemical risk for the
various materials making up the circuit. The liquid can be stored at -10° C.
A small volume of liquid is used (2 litres). The maximum temperature reached by the
liquid is 60° C. Operation is at atmospheric pressure and the pump pressure is low
(0.2 bars relative pressure).

MGE UPS SYSTEMS MGE0249UKI – 01/2000 7

2. new liquid cooling system (cont.)

characteristics of the circuit

The cooling circuit (see figure 6) is an isolated, one-piece unit that is factory
connected to the pump and the heat exchanger.
Because the circuit is not pressurised, there is no danger of the liquid being
sprayed. The circuit board with the liquid cooling system is isolated from the other
circuits by a recovery tank.

Fig. 6. Power board with the cooling circuit.

MGE UPS SYSTEMS MGE0249UKI – 01/2000 8

3. use of cooling liquids in electronic systems

liquid cooling solutions The increase in power densities in electronic components is a very general trend. As
a result, increasingly effective cooling systems must be used to maintain relatively
low junction temperatures and consequently increase component efficiencies and
service lives.
Liquid cooling techniques are the most common solution employed to counter the
problem. These techniques have already been implemented in a range of
applications at different points in time depending on the strategic or economic
importance of the applications.

applications n this type of cooling technique has been used for a number of years in
(combat aircraft) or (satellites) applications, as well as in the
field.
n also made early use of liquid cooling techniques, with the famous
Cray-One using liquid helium. These techniques are now used on a wider scale in
computers in the medium-power range.
n the field is currently the largest consumer of IGBTs for
compressors and liquid cooling techniques are widely used.
n also employ this type of technique.
n are also a major user to draw off the high quantities of heat
losses in power converters during start-up, acceleration and braking.

examples of users Among users of this type of cooling technique (listed with their permission):
n for electrical drives;
n for computers;
n for electrical vehicles;
n in the nuclear field.
What is more, a large number of established companies and start-ups are interested
in these techniques which make it possible to use integrated components
characterised by increasingly high power densities.

MGE UPS SYSTEMS MGE0249UKI – 01/2000 9

4. customer benefits of a liquid cooling system

customer benefits The advantages of using a liquid cooling system for the customer are closely linked
to the advantages provided by integrated sixpack components, in that the first
makes the second possible. These advantages were already presented in section 1.
Generally speaking, these two techniques provide the advantages listed below.
n
o use of highly integrated sixpack components simplifies design and reduces the
number of connections.
o the high-performance liquid cooling technique reduces the operating temperature
of the semi-conductors to 90° C instead of 125° C if a traditional cooling technique
were used. This reduction in temperature increases the service life of the
components and their reliability by a factor of ten compared to traditional IGBTs.
n
o integration of more functions in a reduced volume.
o efficiency is improved by the reduction in line inductance (lower losses during
switching), due to the simplification in circuits and connections.
n
o reduction of harmonics. The high chopping frequency has made it possible to offer
a new standard feature, the PFC (Power Factor Correction) system which
completely eliminates harmonics at the UPS input (THDI < 3 %) and improves the
power factor, reaching a value of up to 1.0.
o reduction in noise. Less than 51 dBA, due to the increase in frequency beyond the
audible spectrum and the reduction in the number of fans required for ventilation.
o improved electromagnetic compatibility (EMC), due to lower line inductance and
shorter circuits.
o use of an environmentally friendly liquid for the cooling system. The liquid is
innocuous and recyclable.
n
The significant integration made possible by the sixpack modules was put to use in
Galaxy 3000 UPSs to:
o reduce the UPS footprint (approximately 30% smaller).
o offer total access through the front to the power boards, the communications
cards and the battery.
n
The reduction in the size and weight of parts means easier storage, transport and
installation by maintenance technicians.
n
o optimisation of power-conversion techniques due to a better balance between
silicon-based and coil-based solutions.
o reduction in the number of parts and simplified design.

questions and answers tightness of the cooling-circuit seal

The risk of leaks is very low for a number of reasons:
n use of very common and reliable components (applications in automobiles,
drives);
n closed circuit operating at atmospheric pressure, not requiring any external
connections;
n static system (no forces created by movement), whereas numerous other similar
systems are used under conditions of much greater mechanical stress (vibrations,
etc.) due to motion (e.g. electric motors, aircraft, automobiles).
Nonetheless, a number of precautions concerning the circuit seal have been taken,
notably:
n the circuit board with the liquid cooling system is isolated from the other circuits by
a recovery tank;
n a sensor to monitor the cooling-liquid level;
n a temperature sensor for the sixpack IGBTs and the cooling liquid;
n certification by an independent organisation (TÜV);
n endurance and ageing tests.

MGE UPS SYSTEMS MGE0249UKI – 01/2000 10

4. customer benefits of a liquid cooling system (cont.)

system ageing and service life

n cooling liquid. The selected liquid has a service life of ten years. It does not have
the disadvantages of liquids with an ethylene glycol base in which the additives limit
the service life to three years.
n pump. The service life is approximately five years. The volume of liquid is small
(two litres), pump pressure is low (relative pressure 0.2 bars) and the maximum
temperature reached by the liquid is 60° C maximum.
n components. Their service life and reliability are significantly increased by the
high-performance cooling technique (direct effect of the Arrhenius law) used for the
sixpack IGBT chips, which reduces the operating temperature from 125° C to 90° C.
n ventilation. Compared to older generations of products, the number of fans is
reduced, thus enhancing reliability.

monitoring of the cooling circuit

Monitoring is provided by:
n temperature sensors for the sixpack IGBTs and the cooling liquid;
n sensors for the cooling-liquid level.
In the event of pump or fan failure, the hydraulic circuit is closed, i.e. protection is
immediate. The inverter shuts down, issues an alarm and the load is transferred to
the bypass AC input via the automatic bypass which is sized for continuous
operation and is cooled by natural ventilation. This means the load can be supplied
by the bypass for the time required to troubleshoot and repair the inverter.

aintenance
On UPSs currently on the market, the inverters are very heavy and difficult to
change.
On Galaxy 3000 UPSs, the inverter is much smaller and lighter. Emptying the
cooling circuit is no problem. All components are readily accessible and replacement
is much easier and faster.
Generally speaking, all components are lighter and more accessible because access
is through the front.

MGE UPS SYSTEMS MGE0249UKI – 01/2000 11

5. conclusion

F Use of the new (six IGBTs in a single compact

module) offers customers a number of advantages, notably in terms of
, , and .

F The associated lead to the necessity of a more effective

cooling technique than natural or forced-air convection.

F To meet this requirement and ensure that customers benefit from the
advantages of component integration, MGE UPS SYSTEMS has selected
, the technique offering the highest level of and .

F What is more,
(aeronautics, aerospace, computers, air-conditioning, drives, etc.).

MGE UPS SYSTEMS MGE0249UKI – 01/2000 12

MGE UPS SYSTEMS As standards, specifications and designs change from time
to time, please ask for confirmation of the information given
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Publication: MGE UPS SYSTEMS - 01/2000
Design and writing: P. Andréani - INTERDOC
MGE0249UKI