PENCHEM AG 806

Silver Epoxy
Description
AG 806 is a one-part silver conductive adhesive based on epoxy resins. It can be cured and hardened at
high temperatures. It is formulated for very good electrical and thermal conductive properties. It is
solvent-free, has little volatiles during cure and very low shrinkage. It has great adhesion and good
thermal shock performance.

Applications
1. Bonding IC chip to metal bond pad
2. General electrical connections

Guidelines for Use

1. Thaw the silver epoxy to room temperature (25ºC) before use.
2. The silver epoxy may be printed or dispensed on printed circuit boards, semiconductor elements,
electrodes or for other connections that require conductivity.
3. The silver epoxy can be cured at 150ºC in 30 minutes.

Properties
Property Unit Typical Value
Chemical type Epoxy
Appearance Silver paste
Mix ratio, by weight One component
Shelf life, -20ºC Month 6
Pot life, 25ºC Hour 48
Viscosity, Brookfield RVT, 25ºC cP 54,000
Hardness, cured 150ºC for 1 hr Shore D 75
Shear strength kgcm-2 166
Electrical conductivity ohm.cm 0.0001
Glass transition temperature, Tg ºC 80
Coef. thermal expansion, alpha-1 4.5 x 10-5
mm-1ºC-1
alpha-2 2.2 x 10-4
Conducting medium; Content by weight % Silver; 70%
Solids content % 100

Recommended Cure
Temperature Gel Time Cure Time
130ºC -- 45 min
150ºC -- 30 min

Storage
Tightly close original container of unused product and store it at below -20ºC. Storing at lower
temperatures down to - 40°C may prolong shelf life beyond 6 months. However it may take longer time to
thaw the product.

Environment, Health & Safety

This product is RoHS compliant. It does not contain any known carcinogenic, mutagenic or teratogenic
component.

Packaging
 5 ml syringe
 10 ml syringe
 500 g jar

Revision 31 Dec 2009