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TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS

SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

D Low Power Consumption D Wide Common-Mode and Differential


Voltage Ranges

D Low Input Bias and Offset Currents D Output Short-Circuit Protection D Low Total Harmonic
Distortion . . . 0.003% Typ

D D D D

High Input Impedance . . . JFET-Input Stage Latch-Up-Free Operation High Slew Rate . . . 13 V/s Typ Common-Mode Input Voltage Range Includes VCC+

description/ordering information
The TL08x JFET-input operational amplifier family is designed to offer a wider selection than any previously developed operational amplifier family. Each of these JFET-input operational amplifiers incorporates well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature high slew rates, low input bias and offset currents, and low offset-voltage temperature coefficient. Offset adjustment and external compensation options are available within the TL08x family. The C-suffix devices are characterized for operation from 0C to 70C. The I-suffix devices are characterized for operation from 40C to 85C. The Q-suffix devices are characterized for operation from 40C to 125C. The M-suffix devices are characterized for operation over the full military temperature range of 55C to 125C. ORDERING INFORMATION
TJ VIOmax AT 255C PDIP (P) PDIP (N) PACKAGE Tube of 50 Tube of 50 Tube of 25 Tube of 75 Reel of 2500 Tube of 75 SOIC (D) 0C to 70C 15 mV SOP (PS) SOP (NS) Reel of 2500 Tube of 50 Reel of 2500 Reel of 2000 Reel of 2000 Reel of 2000 Tube of 150 Reel of 2000 TSSOP (PW) Tube of 90 Reel of 2000 ORDERABLE PART NUMBER TL081CP TL082CP TL084CN TL081CD TL081CDR TL082CD TL082CDR TL084CD TL084CDR TL081CPSR TL082CPSR TL084CNSR TL082CPW TL082CPWR TL084CPW TL084CPWR T084 T082 TL084C T081 T082 TL084 TL082C TL081C TOP-SIDE MARKING TL081CP TL082CP TL084CN

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

On products compliant to MIL PRF 38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
description/ordering information (continued)
ORDERING INFORMATION
TJ VIOmax AT 255C PDIP (P) PDIP (N) PACKAGE Tube of 50 Tube of 50 Tube of 25 Tube of 75 Reel of 2500 6 mV Tube of 75 SOIC (D) Reel of 2500 Tube of 50 Reel of 2500 SOP (PS) 0C to 70C SOP (NS) PDIP (P) PDIP (N) Reel of 2000 Reel of 2000 Tube of 50 Tube of 50 Tube of 25 Tube of 75 3 mV SOIC (D) Reel of 2500 Tube of 75 Reel of 2500 Tube of 50 Reel of 2500 Tube of 50 PDIP (P) PDIP (N) Tube of 50 Tube of 25 Tube of 75 Reel of 2500 40C to 85C 6 mV SOIC (D) Tube of 75 Reel of 2500 Tube of 50 Reel of 2500 TSSOP (PW) 40C to 125C 9 mV 9 mV 55C to 125C 6 mV SOIC (D) CDIP (J) LCCC (FK) CDIP (JG) Reel of 2000 Tube of 50 Reel of 2500 Tube of 25 Reel of 55 Tube of 50 ORDERABLE PART NUMBER TL081ACP TL082ACP TL084ACN TL081ACD TL081ACDR TL082ACD TL082ACDR TL084ACD TL084ACDR TL082ACPSR TL084ACNSR TL081BCP TL082BCP TL084BCN TL081BCD TL081BCDR TL082BCD TL082BCDR TL084BCD TL084BCDR TL081IP TL082IP TL084IN TL081ID TL081IDR TL082ID TL082IDR TL084ID TL084IDR TL082IPWR TL084QD TL084QDR TL084MJ TL084FK TL082MJG TL084QD TL084MJ TL084FK TL082MJG TL084I Z082 TL082I TL081I TL084BC TL081IP TL082IP TL081IN 082BC 081BC TL084AC T082A TL084A TL081BCP TL082BCP TL084BCN 082AC 081AC TOP-SIDE MARKING TL081ACP TL082ACP TL084ACN

LCCC (FK) Tube of 55 TL082MFK TL082MFK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

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TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B D, P, OR PS PACKAGE (TOP VIEW)

TL082, TL082A, TL082B D, JG, P, PS, OR PW PACKAGE (TOP VIEW)

TL084, TL084A, TL084B D, J, N, NS, OR PW PACKAGE (TOP VIEW)

OFFSET N1 IN IN + VCC

1 2 3 4

8 7 6 5

NC VCC + OUT OFFSET N2

1OUT 1IN 1IN + VCC

1 2 3 4

8 7 6 5

VCC + 2OUT 2IN 2IN +

NC No internal connection

1OUT 1IN 1IN + VCC + 2IN + 2IN 2OUT

1 2 3 4 5 6 7

14 13 12 11 10 9 8

4OUT 4IN 4IN + VCC 3IN + 3IN 3OUT

TL082M . . . FK PACKAGE (TOP VIEW)

TL084M . . . FK PACKAGE (TOP VIEW)

NC 1OUT NC VCC+ NC

NC 1IN NC 1IN + NC

4 5 6 7 8

3 2 1 20 19 18 17 16 15 14 9 10 11 12 13

NC 2OUT NC 2IN NC

1IN + NC VCC + NC 2IN +

4 5 6 7 8

3 2 1 20 19 18 17 16 15 14 9 10 11 12 13

1IN 1OUT NC 4OUT 4IN 4IN + NC VCC NC 3IN +


NC No internal connection TL081 TL082 (EACH AMPLIFIER) TL084 (EACH AMPLIFIER) + OUT IN + IN + OUT

NC VCC NC 2IN + NC

NC No internal connection

symbols

OFFSET N1 IN + IN OFFSET N2

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2IN 2OUT NC 3OUT 3IN

SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
schematic (each amplifier)
VCC +

IN + 64 OUT 128 64 C1

IN

1080 VCC OFFSET N1

1080

OFFSET N2

TL081 Only Component values shown are nominal.

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TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
TL08_C TL08_AC TL08_BC Supply voltage, VCC + (see Note 1) Supply voltage VCC (see Note 1) Differential input voltage, VID (see Note 2) Input voltage, VI (see Notes 1 and 3) Duration of output short circuit (see Note 4) Continuous total power dissipation Operating free-air temperature range, TA D package (8-pin) D package (14-pin) N package (14-pin) Package thermal impedance, JA (see Notes 5 and 6) NS package (14-pin) P package (8-pin) PS package (8-pin) PW package (8-pin) PW package (14-pin) Operating virtual junction temperature Case temperature for 60 seconds, TC Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds FK package J or JG package 0 to 70 97 86 76 80 85 95 149 113 150 113 150 150 150 260 300 C C C 85 95 18 18 30 15 Unlimited TL08_I 18 18 30 15 Unlimited 40 to 85 97 86 76 C/W TL084Q 18 18 30 15 Unlimited 40 to 125 TL08_M 18 18 30 15 Unlimited 55 to 125 C UNIT V V V V

See Dissipation Rating Table

Storage temperature range, Tstg 65 to 150 65 to 150 65 to 150 65 to 150 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC + and VCC . 2. Differential voltages are at IN+ with respect to IN . 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. 4. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded. 5. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. DISSIPATION RATING TABLE PACKAGE D (14 pin) FK J JG TA 25C POWER RATING 680 mW 680 mW 680 mW 680 mW DERATING FACTOR 7.6 mW/C 11.0 mW/C 11.0 mW/ C 8.4 mW/C DERATE ABOVE TA 60C 88C 88C 69C TA = 70C POWER RATING 604 mW 680 mW 680 mW 672 mW TA = 85C POWER RATING 490 mW 680 mW 680 mW 546 mW TA = 125C POWER RATING 186 mW 273 mW 273 mW 210 mW

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TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET-INPUT OPERATIONAL AMPLIFIERS SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

6 TEST CONDITIONS MIN 25C Full range 20 18 5 2 30 10 11 12 12 10 25 15 3 1012 70 86 75 25 3 1012 86 75 200 50 200 12 10 12 12 13.5 12 13.5 12 12 10 50 25 3 1012 86 75 12 200 12 to 15 11 11 12 to 15 12 to 15 13.5 7 400 30 200 30 200 7 11 12 12 10 50 25 3 1012 86 MHz dB 12 200 V/mV Full range 25C 25C VIC = VICRmin, VO = 0, RS = 50 25C VCC = 15 V to 9 V, VO = 0, RS = 50 25C 70 VO = 0, No load 25C 86 12 to 15 13.5 V 2 2 30 200 5 100 5 100 18 18 18 5 100 10 200 20 7.5 5 Full range 25C VO = 0 Full range 25C VO = 0 Full range 25C RL = 10 k RL 10 k RL 2 k VO = 10 V, 25C VO = 10 V, RL 2 k RL 2 k Full range 25C 9 3 15 3 6 2 3 3 6 mV VO = 0 VO = 0 RS = 50 RS = 50 TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX TA UNIT TL081C TL082C TL084C TL081AC TL082AC TL084AC TLO81BC TL082BC TL084BC TL081I TL082I TL084I V/C pA nA pA nA V 80 86 80 86 80 86 dB 1.4 2.8 1.4 2.8 1.4 2.8 1.4 2.8 mA

electrical characteristics, VCC = 15 V (unless otherwise noted)

PARAMETER

VIO

Input offset voltage

VIO

Temperature coefficient of input offset voltage

IIO

Input offset current

IIB

Input bias current

VICR

Common-mode input voltage range

VOM

Maximum peak output voltage swing

AVD

Large-signal differential voltage amplification

B1

Unity-gain bandwidth

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ri

Input resistance

CMRR

Common-mode rejection ratio

kSVR

ICC

Supply-voltage rejection ratio ( VCC / VIO) Supply current (per amplifier)

VO1/ VO2 Crosstalk attenuation AVD = 100 25C 120 120 120 120 dB All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise specified. Full range for TA is 0C to 70C for TL08_C, TL08_AC, TL08_BC and 40C to 85C for TL08_I. Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 17. Pulse techniques must be used that maintain the junction temperature as close to the ambient temperature as possible.

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

electrical characteristics, VCC = 15 V (unless otherwise noted)


PARAMETER VIO VIO Input offset voltage Temperature coefficient of input offset voltage Input offset current Input bias current Common-mode input voltage range RL = 10 k RL 10 k RL 2 k VO = 10 V, VO = 10 V, RL 2 k RL 2 k TEST CONDITIONS VO = 0, VO = 0 RS = 50 RS = 50 TL081M, TL082M TA 25C Full range Full range 25C VO = 0 VO = 0 125C 25C 125C 25C 25C Full range 25C Full range 25C 25C VIC = VICRmin, VO = 0, RS = 50 VCC = 15 V to 9 V, VO = 0, RS = 50 VO = 0, No load 25C 80 11 12 12 10 25 15 3 1012 86 80 12 200 12 to 15 13.5 30 18 5 100 20 200 50 11 12 12 10 25 15 3 1012 86 MHz dB 12 200 V/mV 12 to 15 13.5 V 30 MIN TYP 3 MAX 6 9 18 5 100 20 200 50 TL084Q, TL084M MIN TYP 3 MAX 9 15 mV UNIT

V/C pA nA pA nA V

IIO IIB VICR

VOM

Maximum peak output voltage swing Large-signal differential voltage amplification Unity-gain bandwidth Input resistance Common-mode rejection ratio Supply-voltage rejection ratio (VCC /VIO) Supply current (per amplifier)

AVD B1 ri CMRR

kSVR ICC

25C

80

86

80

86

dB

25C

1.4

2.8

1.4

2.8

mA

VO1/ VO2 Crosstalk attenuation AVD = 100 25C 120 120 dB All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 17. Pulse techniques must be used that maintain the junction temperatures as close to the ambient temperature as possible.

operating characteristics, VCC = 15 V, TA = 25C (unless otherwise noted)


PARAMETER VI = 10 V, SR tr Slew rate at unity gain Rise time Overshoot factor Vn In THD Equivalent input noise voltage Equivalent input noise current Total harmonic distortion VI = 20 mV, RS = 20 RS = 20 , VIrms = 6 V, f = 1 kHz RL = 2 k, f = 1 kHz f = 10 Hz to 10 kHz f = 1 kHz AVD = 1, RS 1 k, RL 2 k, CL = 100 pF, See Figure 1 VI = 10 V, TA = 55 C to 125 C, 55C 125C, TEST CONDITIONS RL = 2 k, RL = 2 k, See Figure 1 CL = 100 pF, CL = 100 pF, See Figure 1 MIN 8 5 0.05 20 18 4 0.01 0.003 TYP 13 V/s s % nV/Hz V pA/Hz % MAX UNIT

On products compliant to MIL-PRF-38535, this parameter is not production tested.

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
operating characteristics, VCC = 15 V, TA = 25C
PARAMETER SR tr Slew rate at unity gain Rise time Overshoot factor Vn In THD Equivalent input noise voltage Equivalent input noise current Total harmonic distortion VI = 20 mV, RS = 20 RS = 20 , VIrms = 6 V, f = 1 kHz RL = 2 k, f = 1 kHz f = 10 Hz to 10 kHz f = 1 kHz AVD = 1, RS 1 k, RL 2 k, CL = 100 pF, See Figure 1 VI = 10 V, TEST CONDITIONS RL = 2 k, CL = 100 pF, See Figure 1 MIN 8 TYP 13 0.05 20 18 4 0.01 0.003 MAX UNIT V/ s s % nV/Hz V pA/Hz %

PARAMETER MEASUREMENT INFORMATION

10 k

Figure 1
100 k

C2 C1 500 pF

IN

IN +

IN

N1 OUT

Figure 3

Figure 4

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+ CL = 100 pF RL = 2 k

VI

VI

OUT RL CL = 100 pF

OUT

1 k

Figure 2

TL081 OUT N2 N1

100 k

1.5 k VCC

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS Table of Graphs


FIGURE vs Frequency vs Free-air temperature vs Load resistance vs Supply voltage vs Free-air temperature vs Frequency vs Frequency with feed-forward compensation vs Free-air temperature vs Free-air temperature vs Supply voltage vs Free-air temperature vs Time vs Elapsed time vs Free-air temperature vs Frequency vs Frequency 5, 6, 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

VOM

Maximum peak output voltage

AVD PD ICC IIB VO CMRR Vn THD

Large-signal differential voltage amplification Differential voltage amplification Total power dissipation Supply current Input bias current Large-signal pulse response Output voltage Common-mode rejection ratio Equivalent input noise voltage Total harmonic distortion

MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY


15 VOM Maximum Peak Output Voltage V VCC = 15 V 12.5 VOM Maximum Peak Output Voltage V RL = 10 k TA = 25C See Figure 2 15

MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY


RL = 2 k TA = 25C See Figure 2

12.5 10

VCC = 15 V

10

VCC = 10 V

VCC = 10 V 7.5 5 VCC = 5 V 2.5

7.5

VCC = 5 V

2.5

0 100

0 1k 10 k 100 k 1M 10 M 100 1k 10 k 100 k 1M f Frequency Hz f Frequency Hz

10 M

Figure 5

Figure 6

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
TYPICAL CHARACTERISTICS
MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY
15 VOM Maximum Peak Output Voltage V VOM Maximum Peak Output Voltage V VCC = 15 V RL = 2 k See Figure 2 15 TA = 25C

MAXIMUM PEAK OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE

12.5

12.5

10 TA = 55C 7.5 TA = 125C

10

7.5

2.5

2.5

VCC = 15 V See Figure 2 25 0 25 50 75 100 125

0 10 k

40 k 100 k

400 k

1M

4M

10 M

0 75 50

f Frequency Hz

TA Free-Air Temperature C

Figure 7
MAXIMUM PEAK OUTPUT VOLTAGE vs LOAD RESISTANCE
15 VOM Maximum Peak Output Voltage V VOM Maximum Peak Output Voltage V VCC = 15 V TA = 25C See Figure 2 15 RL = 10 k TA = 25C

MAXIMUM PEAK OUTPUT VOLTAGE vs SUPPLY VOLTAGE

12.5

12.5

10

10

7.5

7.5

2.5

2.5

0 0.1

0 0.2 0.4 0.7 1 2 4 7 10 0 2 4 6 8 10 12 14 16 RL Load Resistance k | VCC | Supply Voltage V

Figure 9

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

10

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RL = 10 kW RL = 2 kW

Figure 8

Figure 10

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREE-AIR TEMPERATURE
1000 700 400 AVD Large-Signal Differential Voltage Amplification V/mV 200 100 70 40 20 10 7 4 2 1 75 VCC = 15 V VO = 10 V RL = 2 k 50 25 0 25 50 75 100 125

TA Free-Air Temperature C

Figure 11
LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREQUENCY
106 VCC = 5 V to 15 V RL = 10 k TA = 25C

105 AVD Large-Signal Differential Voltage Amplification V/mV

104

103

45

102 Phase Shift (right scale)

90

101

135 180 10 M

1 1 10 100 1k 10 k 100 k 1M f Frequency Hz

Figure 12
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

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Phase Shift

Differential Voltage Amplification (left scale)

11

SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
TYPICAL CHARACTERISTICS
DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREQUENCY WITH FEED-FORWARD COMPENSATION
106 AVD Differential Voltage Amplification V/mV VCC = 15 V C2 = 3 pF TA = 25C See Figure 3 250 225 PD Total Power Dissipation mW 200 175 150 125 100 75 50 25 1 100 0 75 50 25 0 25 50 75 100 125 TL081 TL082, TL083 TL084, TL085 VCC = 15 V No Signal No Load

TOTAL POWER DISSIPATION vs FREE-AIR TEMPERATURE

105

104

103

102

10

1k

10 k

100 k

1M

10 M

f Frequency With Feed-Forward Compensation Hz

TA Free-Air Temperature C

Figure 13
SUPPLY CURRENT PER AMPLIFIER vs FREE-AIR TEMPERATURE
2.0 1.8 I CC Supply Current mA 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 75 VCC = 15 V No Signal No Load I CC Supply Current mA 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 50 25 0 25 50 75 100 125 0 0 2 4 TA = 25C No Signal No Load

Figure 14
SUPPLY CURRENT vs SUPPLY VOLTAGE

10

12

14

16

TA Free-Air Temperature C

| VCC | Supply Voltage V

Figure 15

Figure 16

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

12

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TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
INPUT BIAS CURRENT vs FREE-AIR TEMPERATURE
100 V CC = 15 V Input and Output Voltages V 4 Output 2 6

VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE


VCC = 15 V RL = 2 k CL = 100 pF TA = 25C

I IB Input Bias Current nA

10

2 Input 4

0.1

0.01 50

6 25 0 25 50 75 100 125 0 0.5 1 1.5 2 2.5 3 3.5 TA Free-Air Temperature C t Time s

Figure 17
OUTPUT VOLTAGE vs ELAPSED TIME
28 24 VO Output Voltage mV 20 16 12 8 4 0 4 0 0.2 0.4 0.6 0.8 1.0 1.2 t Elapsed Time s VCC = 15 V RL = 2 k CL = 100 pF TA = 25C See Figure 1 CMRR Common-Mode Rejection Ratio dB 89

Figure 18
COMMON-MODE REJECTION RATIO vs FREE-AIR TEMPERATURE
VCC = 15 V RL = 10 k

88

87

86

85

84

83 75

50

25

25

50

75

100

125

TA Free-Air Temperature C

Figure 19

Figure 20

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
TYPICAL CHARACTERISTICS
EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY
50 Vn Equilvalent Input Noise Voltage nV/ Hz VCC = 15 V AVD = 10 RS = 20 TA = 25C 1 0.4 THD Total Harmonic Distortion % VCC = 15 V AVD = 1 VI(RMS) = 6 V TA = 25C

TOTAL HARMONIC DISTORTION vs FREQUENCY

40

0.1 0.04

30

20

0.01 0.004

10

0 10 40 100 400 1 k 4 k 10 k 40 k 100 k f Frequency Hz

0.001

10

400

1k

4k

10 k

40 k 100 k

f Frequency Hz

Figure 21

Figure 22

Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

APPLICATION INFORMATION
RF = 100 k VCC + 15 V TL081 + CF = 3.3 F 1 k 15 V R3 3.3 k f= 1 2 RF CF 9.1 k C1 C2 R1 = R2 = 2(R3) = 1.5 M C1 = C2 = C3 = 110 pF 2 1 fo = = 1 kHz 2 R1 C1 3.3 k Output Input R1 C3 R2 TL081 + VCC Output

Figure 23

Figure 24

14

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TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

APPLICATION INFORMATION
VCC + TL084 + Output A VCC + TL084 VCC + VCC + TL084 + Output C + 100 k 100 k 100 k 100 F 100 k Output B 1N4148 15 V 18 pF 18 pF VCC + 1/2 TL082 88.4 k 18 pF + VCC 88.4 k VCC+ 1/2 TL082 + VCC 1 k 15 V 1N4148 88.4 k NOTE A: These resistor values may be adjusted for a symmetrical output. 18 k (see Note A) 6 cos t 1 k 18 k (see Note A) 1 M VCC + 1 F Input + TL084 6 sin t
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Figure 25. Audio-Distribution Amplifier

Figure 26. 100-KHz Quadrature Oscillator

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SLOS081G FEBRUARY 1977 REVISED SEPTEMBER 2004

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B JFET INPUT OPERATIONAL AMPLIFIERS
APPLICATION INFORMATION
16 k 220 pF 43 k VCC +
1/4 TL084

16 k 220 pF 30 k 43 k VCC + VCC +


1/4 TL084

30 k

43 k Input

220 pF

VCC + 43 k
1/4 TL084

220 pF 43 k

1.5 k

VCC

1.5 k VCC

VCC

Output A Output A Output B

2 kHz/div Second-Order Bandpass Filter fo = 100 kHz, Q = 30, GAIN = 4

2 kHz/div Cascaded Bandpass Filter fo = 100 kHz, Q = 69, GAIN = 16

Figure 27. Positive-Feedback Bandpass Filter

16

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1/4 TL084

43 k

Output B

VCC

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

PACKAGING INFORMATION
Orderable Device 5962-9851501Q2A 5962-9851501QPA 5962-9851503Q2A 5962-9851503QCA TL081ACD TL081ACDE4 TL081ACDG4 TL081ACDR TL081ACDRE4 TL081ACDRG4 TL081ACJG TL081ACP TL081ACPE4 TL081BCD TL081BCDE4 TL081BCDG4 TL081BCDR TL081BCDRE4 TL081BCDRG4 TL081BCP TL081BCPE4 Status
(1)

Package Type Package Drawing LCCC CDIP LCCC CDIP SOIC SOIC SOIC SOIC SOIC SOIC CDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP FK JG FK J D D D D D D JG P P D D D D D D P P

Pins 20 8 20 14 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 1 1 1 1 75 75 75 2500 2500 2500

Eco Plan TBD TBD TBD TBD

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

POST-PLATE N / A for Pkg Type A42 A42 N / A for Pkg Type N / A for Pkg Type POST-PLATE N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS)

50 50 75 75 75 2500 2500 2500 50 50

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

Orderable Device TL081CD TL081CDE4 TL081CDG4 TL081CDR TL081CDRE4 TL081CDRG4 TL081CP TL081CPE4 TL081CPSR TL081CPSRE4 TL081CPSRG4 TL081CPWLE TL081ID TL081IDE4 TL081IDG4 TL081IDR TL081IDRE4 TL081IDRG4 TL081IP TL081IPE4

Status

(1)

Package Type Package Drawing SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SO SO SO TSSOP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP D D D D D D P P PS PS PS PW D D D D D D P P

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 75 75 75 2500 2500 2500 50 50 2000 2000 2000

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

75 75 75 2500 2500 2500 50 50

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

Orderable Device TL081MFKB TL081MJG TL081MJGB TL082ACD TL082ACDE4 TL082ACDG4 TL082ACDR TL082ACDRE4 TL082ACDRG4 TL082ACP TL082ACPE4 TL082ACPSR TL082ACPSRE4 TL082ACPSRG4 TL082BCD TL082BCDE4 TL082BCDG4 TL082BCDR TL082BCDRE4 TL082BCDRG4

Status

(1)

Package Type Package Drawing LCCC CDIP CDIP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SO SO SO SOIC SOIC SOIC SOIC SOIC SOIC FK JG JG D D D D D D P P PS PS PS D D D D D D

Pins 20 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty

Eco Plan TBD TBD TBD

(2)

Lead/ Ball Finish Call TI Call TI Call TI

MSL Peak Temp Call TI Call TI Call TI

(3)

Samples (Requires Login)

OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

75 75 75 2500 2500 2500 50 50 2000 2000 2000 75 75 75 2500 2500 2500

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

Orderable Device TL082BCP TL082BCPE4 TL082CD TL082CDE4 TL082CDG4 TL082CDR TL082CDRE4 TL082CDRG4 TL082CJG TL082CP TL082CPE4 TL082CPSR TL082CPSRG4 TL082CPW TL082CPWE4 TL082CPWG4 TL082CPWLE TL082CPWR TL082CPWRE4 TL082CPWRG4

Status

(1)

Package Type Package Drawing PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC CDIP PDIP PDIP SO SO TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP P P D D D D D D JG P P PS PS PW PW PW PW PW PW PW

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 50 50 75 75 75 2500 2500 2500

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE

Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

50 50 2000 2000 150 150 150

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

2000 2000 2000

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

Orderable Device TL082ID TL082IDE4 TL082IDG4 TL082IDR TL082IDRE4 TL082IDRG4 TL082IJG TL082IP TL082IPE4 TL082IPWR TL082IPWRE4 TL082IPWRG4 TL082MFK TL082MFKB TL082MJG TL082MJGB TL084ACD TL084ACDE4 TL084ACDG4 TL084ACDR TL084ACDRE4

Status

(1)

Package Type Package Drawing SOIC SOIC SOIC SOIC SOIC SOIC CDIP PDIP PDIP TSSOP TSSOP TSSOP LCCC LCCC CDIP CDIP SOIC SOIC SOIC SOIC SOIC D D D D D D JG P P PW PW PW FK FK JG JG D D D D D

Pins 8 8 8 8 8 8 8 8 8 8 8 8 20 20 8 8 14 14 14 14 14

Package Qty 75 75 75 2500 2500 2500

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

50 50 2000 2000 2000

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI A42 A42 Call TI N / A for Pkg Type N / A for Pkg Type

1 1 1 50 50 50 2500 2500

POST-PLATE N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 5

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

Orderable Device TL084ACDRG4 TL084ACN TL084ACNE4 TL084ACNSR TL084ACNSRE4 TL084ACNSRG4 TL084BCD TL084BCDE4 TL084BCDG4 TL084BCDR TL084BCDRE4 TL084BCDRG4 TL084BCN TL084BCNE4 TL084CD TL084CDE4 TL084CDG4 TL084CDR TL084CDRE4

Status

(1)

Package Type Package Drawing SOIC PDIP PDIP SO SO SO SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC D N N NS NS NS D D D D D D N N D D D D D

Pins 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14

Package Qty 2500 25 25 2000 2000 2000 50 50 50 2500 2500 2500 25 25 50 50 50 2500 2500

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 6

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

Orderable Device TL084CDRG4 TL084CJ TL084CN TL084CNE4 TL084CNSLE TL084CNSR TL084CNSRG4 TL084CPW TL084CPWE4 TL084CPWG4 TL084CPWLE TL084CPWR TL084CPWRE4 TL084CPWRG4 TL084ID TL084IDE4 TL084IDG4 TL084IDR TL084IDRE4 TL084IDRG4

Status

(1)

Package Type Package Drawing SOIC CDIP PDIP PDIP SO SO SO TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP SOIC SOIC SOIC SOIC SOIC SOIC D J N N NS NS NS PW PW PW PW PW PW PW D D D D D D

Pins 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14

Package Qty 2500

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE OBSOLETE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS) Pb-Free (RoHS) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

25 25 2000 2000 90 90 90

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type Call TI Call TI CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

2000 2000 2000 50 50 50 2500 2500 2500

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 7

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

Orderable Device TL084IJ TL084IN TL084INE4 TL084MFK TL084MFKB TL084MJ TL084MJB TL084QD TL084QDG4 TL084QDR TL084QDRG4

Status

(1)

Package Type Package Drawing CDIP PDIP PDIP LCCC LCCC CDIP CDIP SOIC SOIC SOIC SOIC J N N FK FK J J D D D D

Pins 14 14 14 20 20 14 14 14 14 14 14

Package Qty

Eco Plan TBD

(2)

Lead/ Ball Finish Call TI

MSL Peak Temp Call TI

(3)

Samples (Requires Login)

OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

25 25 1 1 1 1 50 50 2500 2500

Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD TBD TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 A42 N / A for Pkg Type N / A for Pkg Type

CU NIPDAU Level-1-220C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 8

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jul-2011

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M :

Catalog: TL082, TL084 Automotive: TL082-Q1, TL082-Q1 Military: TL082M, TL084M


NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Military - QML certified for Military and Defense Applications

Addendum-Page 9

PACKAGE MATERIALS INFORMATION


www.ti.com 8-Jul-2011

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC SOIC SOIC SO SOIC SOIC SO SOIC SOIC SO TSSOP SOIC TSSOP SOIC SO SOIC SOIC SO D D D PS D D PS D D PS PW D PW D NS D D NS 8 8 8 8 8 8 8 8 8 8 8 8 8 14 14 14 14 14

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 12.4 12.4 12.4 16.4 12.4 12.4 16.4 12.4 12.4 16.4 12.4 12.4 12.4 16.4 16.4 16.4 16.4 16.4 6.4 6.4 6.4 8.2 6.4 6.4 8.2 6.4 6.4 8.2 7.0 6.4 7.0 6.5 8.2 6.5 6.5 8.2

B0 (mm) 5.2 5.2 5.2 6.6 5.2 5.2 6.6 5.2 5.2 6.6 3.6 5.2 3.6 9.0 10.5 9.0 9.0 10.5

K0 (mm) 2.1 2.1 2.1 2.5 2.1 2.1 2.5 2.1 2.1 2.5 1.6 2.1 1.6 2.1 2.5 2.1 2.1 2.5

P1 (mm) 8.0 8.0 8.0 12.0 8.0 8.0 12.0 8.0 8.0 12.0 8.0 8.0 8.0 8.0 12.0 8.0 8.0 12.0

W Pin1 (mm) Quadrant 12.0 12.0 12.0 16.0 12.0 12.0 16.0 12.0 12.0 16.0 12.0 12.0 12.0 16.0 16.0 16.0 16.0 16.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1

TL081ACDR TL081BCDR TL081CDR TL081CPSR TL081IDR TL082ACDR TL082ACPSR TL082BCDR TL082CDR TL082CPSR TL082CPWR TL082IDR TL082IPWR TL084ACDR TL084ACNSR TL084BCDR TL084CDR TL084CNSR

2500 2500 2500 2000 2500 2500 2000 2500 2500 2000 2000 2500 2000 2500 2000 2500 2500 2000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION


www.ti.com 8-Jul-2011

Device

Package Package Pins Type Drawing TSSOP SOIC SOIC PW D D 14 14 14

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 12.4 16.4 16.4 6.9 6.5 6.5

B0 (mm) 5.6 9.0 9.0

K0 (mm) 1.6 2.1 2.1

P1 (mm) 8.0 8.0 8.0

W Pin1 (mm) Quadrant 12.0 16.0 16.0 Q1 Q1 Q1

TL084CPWR TL084IDR TL084QDR

2000 2500 2500

*All dimensions are nominal

Device TL081ACDR TL081BCDR TL081CDR TL081CPSR TL081IDR TL082ACDR TL082ACPSR TL082BCDR TL082CDR TL082CPSR TL082CPWR TL082IDR TL082IPWR TL084ACDR

Package Type SOIC SOIC SOIC SO SOIC SOIC SO SOIC SOIC SO TSSOP SOIC TSSOP SOIC

Package Drawing D D D PS D D PS D D PS PW D PW D

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 14

SPQ 2500 2500 2500 2000 2500 2500 2000 2500 2500 2000 2000 2500 2000 2500

Length (mm) 340.5 340.5 340.5 346.0 340.5 346.0 346.0 340.5 346.0 346.0 346.0 346.0 346.0 346.0

Width (mm) 338.1 338.1 338.1 346.0 338.1 346.0 346.0 338.1 346.0 346.0 346.0 346.0 346.0 346.0

Height (mm) 20.6 20.6 20.6 33.0 20.6 29.0 33.0 20.6 29.0 33.0 29.0 29.0 29.0 33.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION


www.ti.com 8-Jul-2011

Device TL084ACNSR TL084BCDR TL084CDR TL084CNSR TL084CPWR TL084IDR TL084QDR

Package Type SO SOIC SOIC SO TSSOP SOIC SOIC

Package Drawing NS D D NS PW D D

Pins 14 14 14 14 14 14 14

SPQ 2000 2500 2500 2000 2000 2500 2500

Length (mm) 346.0 333.2 333.2 346.0 346.0 333.2 346.0

Width (mm) 346.0 345.9 345.9 346.0 346.0 345.9 346.0

Height (mm) 33.0 28.6 28.6 33.0 29.0 28.6 33.0

Pack Materials-Page 3

MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997

JG (R-GDIP-T8)
0.400 (10,16) 0.355 (9,00) 8 5

CERAMIC DUAL-IN-LINE

0.280 (7,11) 0.245 (6,22)

4 0.065 (1,65) 0.045 (1,14)

0.063 (1,60) 0.015 (0,38)

0.020 (0,51) MIN

0.310 (7,87) 0.290 (7,37)

0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN

0.023 (0,58) 0.015 (0,38) 0.100 (2,54) 0.014 (0,36) 0.008 (0,20)

015

4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE
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