Vol. 20, No. 4, pp.

217 - 230, 2009

217

40 1

1 kg () Ag, Au, Pd, Al, Cu, Pb 0.79, 0.14, 0.19, 91,

187, 17.8 g Ag, Au, Pd 58%Cu 66%
11 kg Ag, Au, Pd, Al, Cu, Fe, Zn, Nd, Pb 0.79, 0.14, 0.19,
420, 320, 7,200, 77, 23, 20 g Ni, Sn, Sb, Mg, Mn 57, 28, 2.1, 1.6, 1.0 g
0.02 g Co, Nb, Cd, Te, V, Ga, Sc, 0.01 g Se, Ta, As, Bi, In,
Hf, Ir, Li, Pt, Tl, Y 2004 747
() Au, Ag, Pd 1.1, 5.9, 1.4
ton
e-waste

5) 6) 7)

(e-waste) (Au, Ag, Pd

Porte 8)

) (Ta, In )

(1,277 / 5 )

Au 10 kg/ 13.4 /

()

()

(JOGMEC) 2) 3)

82%

1, 2)

e-waste

4)

Wong 9, 10) e-waste

2008. 2. 7
2009. 3. 31
* ()

* ()

11) 12)

305 - 8506 16 - 2
()

E-mail : shira8se@cstf. kyushu-u. ac. jp

13)CD
5 14)

218

5576%
15) 16)

Basel
Action Network 17)e-waste
18)

Fig. 1 Photography of dismantled one Personal Computer

19)

40

2
2. 1

Fig. 2 Photography of dismantled Hard Disk Drive

IC )

1998
(Fujitsu FMW

Deskpower S VI265, CPU : Pentium II) 1

(HDD : Western Digital WD Caviar 24300, 4.3

GB)
29 (Fig. 1)

2. 2

(Table 1)

4 (HDD, CPU

IC Ta

(FDD), CD

(CDD)) 2

13 g

HDD 2 Fig. 2

Al

HDD (

) (()

(Al

0.51 g (Yamato


Table 1

Pretreatment of small circuit board parts for

chemical analysis

219

Plasma Reactor PR500) (O 2

0.1 MPa, 150 mL/min, 200 W, 120 h)

Low
Pressed by
Weight oil pump temperature
ashing
(g)
No Yes No Yes

Outside plastics
Outside metal
Aluminum Inside pin
capacitor Inside metal
Inside fabric
Inside plastics

0.2434
0.2394
0.1025
0.1953
0.1601
0.0499

mL 1 % HNO 3

Ceramic capacitor 1)

0.0054

Film capacitor

0.6624

Tantalum capacitor

0.6177

Pin
Resistor Metal cap
(Large 2)) Coating
Core

0.2930
0.3030
0.0050
0.6980

Resistor (Small)

0.0025

Parts

3)

C
a
p
a
c
i
t
o
r
R
e
s
i
s
t
o
r

IC chip

0.7013

Au pin

Solder 4)
Switch

2. 3

Connector

2.3258

Base board

0.1540

X (XRF) (Seiko Instruments Inc

model : SEA2210AX =Rh=3,000 cps
MnK)

(FP )

(Fig. 3)

Pin
0.3227
Surface metal 0.0888
Plastics
3.3923

HNO 3 50

1 cm 2

(Au IC

1) 25 ceramic capacitors were digested

2) Large size is over 1cm length
3) Small size is under 1cm length. 40 resistors (small) were
digested
4) It is assumed that solder contains 40% of Pb and 60% of Sn

((1))
=

[ A
1 A ]

1) XRF-1 (X-ray fluorescence spectroscopy): semi-quantitative analysis

2) XRF-2 : quantitative analysis using plastic (PP and PVC) standards

Fig. 3

Analytical methods for separate materials

(1)

220

2. 2

()

Ag, Au, Al, As, Ba, Be, Bi, Ca, Cd, Co, Cr, Cu, Fe, Ga, In,

Fig. 4 62.4wt%

Ir, K, La, Li, Mg, Mn, Mo, Na, Nb, Ni, Pb, Pd, Pt, Sb, Sc,

2.7wt%8.5wt%26.4wt% 65.1wt%

Se, Sn, Sr, Ta, Te, Ti, Tl, V, Y, Zr, Zn, Nd ICP-AES

(Seiko Instruments Inc model : VISTA-PRO)

42 Au, Ag, Nb, Nd, Pd,

34.9wt%

Pt, Ta ICP-MS (Agilent 7500 series ICP-MS)

()

Nd Nd XRF

Fig. 4

Nd 2Fe 14B

()

FeNdB=72271 20)

( 1 )

62.4wt% 73.7wt%

SnPb=6040 Pb Sn

2.7wt% 5.4wt%

21) ()

HDD 7

9 8.5wt% 10.4wt%

2
10.5wt%

Cu 100%

HD

Pb, Cr, Cd, Sb XRF

65.1wt% 79.1wt%

26.4wt% 10.5wt%

3. 1

Fig. 4

3. 2

IC
TG-DTA
30%

5 % 1
79.0% 8.6%
12.5%
3. 2

* : Circuit boards (mother boards)

** : Circuit boards from electric units
*** : Circuit boards (mother boards+circuit boards from electric units)

Fig. 4

Material distribution corresponding to dismantling steps

3. 2. 1
3. 2. 2 4
(CPU CDDFDDHDD)


Table 2

Materials and parts sorted in the first step of

dismantling

First step dismantling

Plastics

Casing

Percent
Weight
Number
of total
(g)
weight

221

70 FDD 18 41
HDD 10 33 153

2.5

2 2

32

0.3

3900

35.3

CPU CDDFDD

HIPS

274

ABS

Top cover

Bottom cover

2060

18.6

HDD 1 10

CD drive top cover

90

0.8

1,937 g

CD drive bottom cover

276

2.5

2 565 g 253 g 100 g

Metallic plate

370

3.3

Cover of power source

276

2.5

736 g

62

44

0.4

Motherboard 1

565

5.1

Circuit Motherboard 2
board Network card

253

2.3

Cu

108

1.0

Memory card

26

0.2

CPU package

251

2.3

Metal

Screw

Table 4 8 9
960 968

Drives CDD 1)
and
FDD 2)
CPU
HDD 3)

338

3.0

463

4.2

IC 153 Au 1,073 1

461

4.2

Cords

104

0.9

1 19 13,000

Copper coil

20

0.2

1146

10.4

Other

Circuit board of power source

Total

1
93

11057 100

IC

()

1) Compact disk drive

2) Floppy disk drive
3) Hard disk drive

3. 2. 2 4 (CPU CDDFDD
HDD)

3. 2. 3 8 9

HDD X

3. 2. 4

Table 4

Table 5

3. 2. 1

CPU CDD FDD

Table 2 1

(g) (mg/kg)

CPU CDD

3. 2. 3 HDD

FDDHDD 4 2

Al 37%

81% Fe 29%

Table 3

41% Al

Cu Fe Ni Zn

( 2

Fe

CPU CDDFDD

Fe, Ni, Zn 1.3%

HDD) Table 4

Nd HDD

1 (

79.6 g Nd 23 g

) 13 () 62 () 3

5 % Nd Fe-Nd-B

5 4

Nd

93

Nd

2 4 (CPU 247

22-24)

gCDD 435 gFDD 461 gHDD 459 g) Table 3

Table 2 CPU

153 CPU

CDDFDD

2 7 9 CDD 18

222

Table 3

Materials and parts sorted in the second step of dismantling

Second step dismantling

Plastics
CPU

Metal

Number

CDD
Metal

Spacer

6.4

Bottom cover

66.3

Heat sink

Clamp

4.7

47.7

Cover (black)

97.0

Plastic part (black)

13.4

Cover (beige)

50.8

Plastics

FDD

Metal

0.9

10

12.0
0.5

Plastic part for coil

Rubber part

3.4

Box

1.2

Plate

Stick

Coil cover

6.4

Coil

2.0

70

16.0
4.5

31

0.2

102.6

Supporting plate

97.6

Polyimide tape

13.1

Coil cover with rubber part

9.0

Complex part

4.4

Plastic parts

4.9

Plastic part for coil

2.5

Cover

249.6

Metal part

24.3

Metal part with magnet

21.8

Stick

Copper wire of coil

Spring, screw

41

0.1
8.6

21

5.1

Supporting plate

108.3

Core of coil

10.6

25.4
0.2

Circuit board
Complex

Contact part

Plastics

Urethane

1.3

Top and bottom cover

219.8
79.6

Metal
HDD

Neodymium magnet

Accessory of spindle motor

Disk

Screw
Circuit board
Complex

Plastics
Plastics

Power supply Metal

247.2

435

461.4

8.8
33

29.4

21

6.0

46.3

Spindle motor

45.7

Magnetic head

22.2

Copper wire
Cords

96.6

Plastic part (beige)

Circuit board

Total (g)

25.5

Plastic part (white)

Screw

Complex

Weight (g)

Circuit board

Plastics

Total

Top cover

459.1

89.5
Wire coating material

82.4

Clamp

43.6

Fan

83.5

Bottom cover

275.6

Screw

Circuit board

3.8
764.0

215.5

1126.9

223

Table 4

Electronic parts on the circuit boards

Electronic part

Weight
(g/1part)

Mother
board 1

Mother
board 2

Aluminum (large)
Aluminum (medium)
Aluminum (small)
Capacitor
Film
Ceramic
Small
Large
Resistor Small - 1
Small - 2
Large
Medium-thin
IC chip
Medium-thick
Medium-bulky
Small
Au pin
Large
Solder
Medium
Small
Switch
Connector

4.085
0.991
0.475
1.269
0.218
0.006
1.614
0.003
0.008
5.428
1.195
1.721
1.163
0.406
0.00002
0.082
0.007
0.002
0.882
1

23
34
12
0
0
400
0
340
16
2
2
0
0
60
372
20
1132
4385
1
5

0
29
5
0
0
75
0
64
9
0
0
0
0
20
0
12
1006
272
0
9

1
3
17
0
8
61
13
69
5
2
0
0
3
8
103
0
132
321
0
0

0
0
0
0
0
32
0
142
0
0
0
0
0
10
336
0
0
566
0
0

0
0
0
0
0
61
0
38
0
0
0
0
0
6
262
0
56
1055
0
0

0
8
0
0
0
110
0
130
10
1
0
0
0
19
0
0
14
538
0
0

0
0
1
0
0
14
2
34
0
0
0
0
0
2
0
0
53
87
0
1

0
0
0
0
0
66
0
75
1
1
0
3
0
14
0
0
0
300
0
4

6804

1501

746

1086

1478

830

194

464

Total number of parts

Table 5

Network Memory
CPU
card
card (2)

24
74
35
960
0
8
819
15
892 948
41
6
2
3 153
3
139
1073 1073
32
2393 9949
7524
1
1
19
19
13103

Metals contents (g) of the hard disk drive (HDD) and total metal content in four components

Second step dismantle

Ag

Au

Urethane
Top cover (white)
Bottom cover (black)
Neodymium magnet
Metal
Accessory of spindle motor
Disk
Screw
Circuit board
From Tables 3, 4
Metal (ring)
Metal (plate)
Magnet (ring)
Sleeve
Spindle motor
Spindle
Metal (small ring)
Ball bearing
Complex
part
Copper wire
Core of coil
Supporting part
Metal (spindle)
Magnetic head
Wire
Contact
Plastic

Third step

0
0
0
0
0
0
0.087
0
0
0
0
0
0
0
0
0
0
0
0
0

0
0
0
0
0
0
0.013
0
0
0
0
0
0
0
0
0
0
0
0
0

0
0
0
138
0
0
0
5.8
0
0
0
0
0.014 0.47
0
9.5
0
4.7
0
0.98
0
11
0
0.080
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0

Total metal content in four electric components

Content (g/HDD 461 g)
Concentration (mg/kg)
Content (g/CPU 247 g)
CPU
Concentration (mg/kg)
Content (g/CDD 435 g)
CDD
Concentration (mg/kg)
Content (g/FDD 461 g)
FDD
Concentration (mg/kg)

Ag
0.087
190
0.045
183
0.105
242
0.014
31

Au
0.013
28
0.008
34
0.012
49
0.001
2.8

Pd
Al
0.014
171
30 370000
0.013
154
53 620000
0.024
5.4
98 13000
0.003
105
7.5 230000

Plastic

HDD

CDD FDD HDD Total Total

Pd

Al

Cu

Fe

Zn

Sn

Pb

Nd

0
1.3
0
0
0
1.6
0.004
0.070
0
0.040
0
0.041
0
0
0
0
0
0
0
0

0
0
0
0
0
0
0.60
0
0
0
0.082
0.002
0
0
0
0
0
0
0
0

0
0.15
0
0
0
0
0.39
0
0
0.007
0.047
0.005
0
0
0
0
0
0
0
0

Ni
Zn
Cu
Fe
18.1
133 36.27
3.0
39000 290000 79000 6600
8.3
7.4 0.65 0.004
34000 30000 2700
17
24
91
1.7
33
55000 210000 4000 76000
15
299 1.25 2.65
32000 650000 2700 5800

Sn
0.68
1500
1.7
6900
1.5
3400
0.50
1100

Pb
Nd
23
0.60
1300 50000
1.1
4500
0.94
2200
0.30
650

0
55
4.1
1.0
0
55
0.012 0.012
0
0.029
0
3.0
9.30
0.24
0.29
0.100
0.13
0.049
0
2.7
0.047 0.035
0.18
1.3
0
0.84
0.002 0.48
4
0
0
3.5
0
2.7
0.074 6.0
0.000 0.85
0
0

Ni

4.5
0
0
0
27
1.4
0
0
0
2.8
0
0
0
0
0
0
0
0.53
0
0

0
0
23
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0

224

Table 5 CPU

Table 6

( Al 62%) 70%CDD

36% ( Fe 36%)FDD 92% (

9 Ag 0.79 gAu

Al 23%Fe 65%)HDD 80% ( Al

0.14 gPd 0.19 gAl 19 gCu 187 gPb

37%Fe 29%) Cu

17.8 g

34 %

HDDCPU CDDFDD Ag 190,

IC Ag 0.45, 0.15 gIC

182, 242, 31 mg/kgAu 28, 34, 49, 28 mg/kg

Au 0.081, 0.032 gIC

Pd 30, 53, 98, 75 mg/kg FDD

Pd 0.16 g Cu 153 g

Ag 0.25 gAu 0.035 gPt 0.055 gAl

Table 4 9

436 gCu 65 gFe 530 gNi 40 gZn 39 g

Ag, Au, Pd 1

2 2 9

Ag

Ag, Au, Pd

53% (0.42 g/0.79 g)Au 53% (0.082 g/0.14

g)Pd 59% (0.11 g/0.19 g)

3. 2. 3

1.7

1 2

1 2 1

30% (356 g/1,174 g) Ag, Au, Pd

6 2 4 1

40%

8 10

Ag, Au, Pd 26620, 2120, 6

1,937 g (736 g) 7

160 mg/kg Ag, Au, Pd

6, 7) ( 30240, 50500, 3070 mg/kg)

Pd Pb

Table 6

Metals content of the electronic parts of the nine circuit boards in one PC

Electronic parts

Capacitor

Ag

Au

Pd

Aluminum (large)

0.065 34000

560

2400

0.93

Aluminum (medium)

0.056

36000

180

730

1.5

55

6.5

0.18

Aluminum (small)

5300

28

130

0.53

12

0.96

1.6

0.03

0.5

Film

Ceramic

0.063

0.4

450

0.036

160

Small
Large
Resistor

Small - 1
Small - 2
Large
Medium - thin

IC chip

Medium - thick
Medium - bulky

0.048
120
1.2
36
5.0
20

5.9

1.2

0.002

5.4

1.2

5.4

0.1

19
3900

21

0.004

0.5

26

0.065

0.1

1300

3.3

0.3
46

130
0.7
130
62

1.2

0.1

Zn
0.80

Sn
27

20

130

56

80

4.7
0.006
0

180

Pb
0.11

0
35
210
0.25
310

22

32

65

1.6

10

0.14

1300

91

94

7900

2100

190

1600

1000

10100

6700

7200

4800

0.002

0.62

97

210

0.21

4.8

0.086

110

9960

1100

0.17

0.11

23

Medium

Small

Switch
Connector

3.1

0.8
3900

Ni

209

8.7

Large

(mg/circuit boards)

11
7700

0.7

1.7

Base board

890

0.23

30

Total

3.8

Fe

0.020

150

Au pin

800

Cu

27

Small

Solder

Al

2.5

190

8.8
25

32

19

15000

153000

494

1700

47

8500

4200

794

143

186

91000

187000

10000

3100

198

27900

17800

225

89025,000 mg/kg

69, 13, 17 mg/kgAl, Cu, Fe, Ni, Zn, Nd, Sb,

7) (Pb7,100 mg/kg)

Sn, Pb 3.7, 2.8, 65, 0.50, 0.68, 0.20, 0.25,

0.018, 0.18%

Ta Ta

Ag, Au, Pd 794143186 mg/kgCu, Pb

Ta

18.7, 1.8%

510 mm

Table 8 31 Ca Al

23 mm

3,900 mg/kg

IC

Ba, Mg Na mg/kgMn, Ti, Sr, K, La,

Ta

Zr Mo mg/kgCo, Nb Cd

Ta

mg/kg As, Be, Bi, Hf, In, Ir, Li, Pt,

25)

Rh, Ru, Se, Ta, Tl, Y 1 mg/kg

Ta

9 kg

3. 2. 4

(2006 )

Table 7 1

11 kg Ag, Au, Pd, Al, Cu, Fe,

Ag, Au, Pd

Pb 0.79, 0.14, 0.19, 420, 320, 7,200,

20 g Ag, Au, Pd, Al Fe

Cu Nd Sb

() Sn Pb

Ag, Au, Pd

Table 7
Component and part
Casing

Plastics HIPS
ABS
Metals Top cover
Bottom cover
CDD top cover
CDD bottom cover

Weight (g) Ag

Au

Pd

Al

Cu

Fe

Ni

Zn

Nd

Sn

273.60

Sb

Pb

0.00
1.35

32.17
3900.00

3900

11.70

2060.00

2000

6.18

90.25

90

0.27

275.56

270

0.83

Small plate

77.70

77

0.23

Large plate

0.00

0.88

276.46

280

0.92

Electric power cover

Screw

Notable and main metal content in one PC (g)

Screw

60.00

Circuit Motherboard 1
board Motherboard 2

564.50

0.35

0.067 0.089

58

77.1

3.99

1.21

0.1

0.06

253.02

0.072 0.015 0.020

19

46.7

0.75

1.01

0.0

0.01

Network card

108.43

0.073 0.015 0.015

7.1 20.4

3.80

0.14

0.1

0.01

1.5

0.00 1.05

Memory card

25.95

0.048 0.010 0.008

0.4

0.16

0.08

0.0

0.00

0.8

0.00 0.56

7.36

0.65

0.00 1.09

Drives
etc

30

5.0

1.7
1.5

0.00 0.94

300

1.25

2.7

0.00

0.5

0.00 0.30

130

36.53

3.0

23.08

0.7

0.00

0.0

0.00

91

FDD

461.82

0.014 0.001 0.003

14.9

HDD

457.18

0.087 0.013 0.014 174

18.2

Copper coil
Total (g)
Metal concentration of PC 1) (mg/kg)

20.00

20.0

0.02 8.89
0.03 4.60

0.02

5.5 23.6

Electric power board

7.5

0.01

0.045 0.008 0.013 154

0.105 0.012 0.024

87.8

14

0.0

503.60
454.00

0.00

16.6

1.73 33.2

CPU package
CDD

Others Cords

8.3

14.5

0.01 0.60
0.67 1.96

1061.60
11416.36

0.79
69

0.143 0.19
13

17

1) The weight of one PC is 11.416 kg

420

320

7200

57

76.6

37000 28000 650000 5000 6800

23.2
2000

28

2.09

2500 183

20
1800

226

Table 8

Minor metal concentrations in one PC

(mg/kg)

Table 9 Distribution of waste PCs in Japan

(thousand : PC)

Element

Concentration (mg/kg)

Ca

3900

Ba

270

Mg

140

Na

130

Mn

88

Ti

45

39

Sr

24

La, Zr

12

Mo

11

Co

2.5

Private hoarding
Private hoarding
760
Total waste
PCs

Export
3080

7470

Domestic
3630

760

Reuse in foreign countries 1230

Scraps

1850

Landfill

310

Domestic reuse of parts

700

Domestic reuse of products 1130

Domestic recycling

1490

( 16%) 185 ( 25%)

Nb

2.0

Cd. Te

1.5

20%

V, Sc, Ga

1.1

As, Be, Bi, Hf, In, Ir, Li, Pt, Rh, Ru, Se,
Ta, Tl, Y

PC 100%

Less than 1 mg/kg

PC
2)
(Cu, Ag, Au, Pd)

3. 3

(Cu, Pb, Ag, Au,

Fig. 5(a) Fig. 5(b)

Pd)

Cu, Pb, Ag, Au, Pd

Fig. 5(c)

()

20002003 1,000 1,177

(2004 )1,286 (2005 )

()

747 (2004) 27)

Fig. 6 Fig. 7

Table 9

Pd

113 (

15%) 149 ( 20%) 1/2

26)

123

(a) Annual domestic demand for silver in Japan

(b) Ag in EE products and products PCs
(c) Ag flow accompanied with waste PCs flow
1)
Ag concentration in product PCs is assumed to be equal to those in waste PCs determined in this study

Fig. 5

Silver amount in new products and waste PCs

10

227

(a) Annual domestic demand for gold in Japan

(b) Au in EE products and products PCs
(c) Au flow accompanied with waste PCs flow
1)
Au concentration in product PCs is assumed to be equal to those in waste PCs determined in this study

Fig. 6

Gold amount in new products and waste PCs

(a)Annual domestic demand for palladium in Japan

(b)Pd in EE products and products PCs
(c)Pd flow accompanied with waste PCs flow
1)
Pd concentration in product PCs is assumed to be equal to those in waste PCs determined in this study

Fig. 7

3. 3. 1

Palladium amount in new products and waste PCs

Cu

(Fig. 5(c)) 2)

Cu 123 ton (2004 )

9.3 ton (0.79 g/)

(41 ton)

1.4%

(18 ton) (10 ton)

Ag

2)

5.9 ton

1,177 Cu

2.9 ton 2.4 ton

3,800 ton

0.6 ton

747 Cu 2,400 ton

Ag 1.17 ton

3. 3. 3 Au

3. 3. 2

Au 282 ton (2004 )

134 ton (48%) 2)

Ag

Ag 2,597 ton (2004 )

1.68 ton (0.14 g/)

1,243 ton (

1.2%

) 672 ton (26%)

Au 1.05 ton

11

228

0.5 ton

Au, Pd 5359% 40%

Au 0.4 ton 0.1 ton

1.7

3. 3. 4

Pd

Pd 50 ton 22

3)

11 kg Ag, Au, Pd, Al, Cu,

ton 7 ton

Fe, Ni, Zn, Nd, Sn, Sb, Pb, Mg, Mn

Pd 60% 100%

0.79, 0.14, 0.19, 420, 320, 7,200, 57, 77,

2)

23, 28, 2.1, 20, 1.6, 1.0g 0.02

2.24 ton (0.19 g/)

g Co, Nb, Cd, Te, V, Ga, Sc

32% Ag

0.01 g Se, Ta, As,

Au Pd
Pd 1.4 ton

Bi, In, Hf, Ir, Li, Pt, Tl, Y

4)

1,177 (2004 )

0.69 ton

747

Pd 0.59 ton 0.14 ton

(Cu, Ag, Au, Pd, Pb)

3. 3. 5

Pb

Pb 21.9 ton

16.8 ton (77%) 2.6 ton (12%)

Cu, Ag, Au, Pd, Pb

1.3 ton (4.63%)

3,800, 9.3, 1.7, 2.2,

95% 2) 16 ton

235 ton

235 ton (20

2,400, 5.9, 1.1, 1.4, 149 ton

g/)
Pb 1.8%

()

Pb 149 ton

40

1 )
(2004)

http : //www. meti. go. jp/report/downloadfiles/g40728a01j.

pdf
2 ) ()
2006 (2007)
3)

4
pp. 537 - 571 (2007)

1)

1 ()

4 ) 3R

62% 2.7% 8.5%

79% 9.6% 16.4%

(2007)
5)

6 %

71

2)

9 pp. 801 - 808 (2007)

9 Ag 0.79 gAu 0.14 gPd

6)

Ag
IC Au IC

INDUST 23 4 pp. 13 - 17 (2008)

7 )
11

Pd IC Cu
Ag,
12

0.19 gAl 91 gCu 187 gPb 17.8 g

Ipp. 42 - 44 (2000)
8)

M. S. Porte, R. Widmer, A. Jain, H-P. Bader, R.


Scheidegger and S. Kytzia : Key Drivers of the E-waste

10 (1991), Vol. 1991 Page 54. II. 1 - 54. II. 16 (1992),

Recycling System : Assessing and Modeling E-waste

Vol. 1992 Page 55 II. 1 - 55. II. 9 (1993), Vol. 1993 Page

Processing in the Informal Sector in Dehli, Environmental Impact Assessment Review, Vol. 25, Issue 5, pp.

51. II. I - 51. II. 9 (1994)

17)

472 - 491(2005)
9)

10)

Asia, p. 44 (2002)

Wong : Evidence of Excessive Release of Metals from

18)

Primitive E-waste Processing in Guiyu, China, Envi-

ronmental Pollution, Vol. 148, pp. 62 - 77 (2007)

E-waste 20

A. O. W. Leung, W. J. Luksemburg, A. S. Wong and

4 pp. 265 - 277 (2007)

19)
16

Diphenyl Ethers and Polychlorinated Dibenzo-p-dioxins

and Dibenzofurans in Soil and Combusted Residue at

pp. 216 - 217 (2007)

Guiyu, An Electronic Waste Recycling Site in Southeast

20) ()

China, Environ. Sci. Technol., Vol. 41, pp. 2730 - 2737

http : //www. hitachi-metals. co. jp/prod/prod03/pdf/hg-a22.

pdf

(2007)

21)

Ipp. 510 - 512

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(1998)

13)

14)

and D. H. Hwang : Recovery of High Coercivity of the

Powders Obtained by Crushing Nd-Fe-B Sintered

Magnet Scraps, Phys. Stat. Sol.(a), Vol. 201, No. 8, pp.

18 pp. 83 - 87 (2000)

1794 - 1797 (2004)

23)

O. Takeda, T. H. Okabe and Y. Umetsu : Recovery of

Neodymium from a Mixture of Magnet Scrap and Other

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Scrap, Journal of Alloys and Compounds, Vol. 408 - 412,

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25) ()ICP

Vol. 1990 Page 64. II. 1-64. II. 15

ICP Chapter 2

(1991), Vol. 1991 Page 54. I. 1 - 54. I. 8 (1992), Vol. 1992

Page 55. I. 1 - 55. I. 9 (1993), Vol. 1993 Page 51. I. 1 - 51.

p. 41 (2008)
26) ()20062009
p. 40 (2006)

I. 8 (1994)
16)

T. S. Jang, D. H. Lee, A. S. Kim, S. Namgung, H. W. Kwon

12
15)

JIS C
60068-2-20

12)

The Basel Action Network and Silicon Valley Toxics

Coalition : Exporting Harm-The High-Tech Trashing of

C. S. C. Wong, N. S. Duzgoren-Aydin, A. Aydin and M. H.

M. H. Wong : Spatial Distribution of Polybrominated

11)

229

27) ()IT

p. 23

Vol. 1990 Page 64. I. 1 - 64. I.

(2006)

13

230

Metals Contents in One Waste Personal Computer by Detailed Dismantling

Tomoko Shirahase* and Akiko Kida*
* National Institute for Environmental Studies,
Research Center for Material Cycle and Waste Management
(Kyushu University)
* National Institute for Environmental Studies,
Research Center for Material Cycle and Waste Management

Correspondence should be addressed to Tomoko Shirahase :

(16 - 2 Onogawa, Tsukuba, Ibaraki 305 - 8506 Japan)

Abstract
In this study, we determined the amount of metal in one desktop personal computer (PC) as a case
study of electronic and electrical waste (e-waste). Using a three-step process, we dismantled the PC. We
then analyzed the metal content of each part. The circuit boards contained 0.794 g of Ag, 0.143 g of Au, 0.186
g of Pd, 91 g of Al, 187 g of Cu, and 17.8 g of Pb. In total, the PC contained 0.79 g of Ag, 0.143 g of Au, 0.19 g of
Pd, 420 g of Al, 320 g of Cu, 7200 g of Fe, 77 g of Zn, 23 g of Nd, and 20 g of Pb. We also evaluated the
maximum recoverable amount of metal (M-max) from waste PCs in Japan per year and determined that
the M-max for Au, Ag and Pd are 1.1, 5.9, and 1.4 t per year, respectively.
Key words : electronic and electrical waste, metal resources, hazardous metal, maximum recoverable
amount of metal

14