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DATA SHEET
Philips Semiconductors
Product specication
TDA8561Q
Identical inputs (inverting and non-inverting). GENERAL DESCRIPTION The TDA8561Q is an integrated class-B output amplifier in a 17-lead single-in-line (SIL) power package. It contains 4 12 W Single-Ended (SE) or 2 24 W Bridge-Tied Load (BTL) amplifiers. The device is primarily developed for car radio applications.
UNIT
mA A
Stereo BTL application output power supply voltage ripple rejection noise output voltage input impedance DC output offset voltage 24 70 W dB V k mV
Quad single-ended application output power THD = 10% RL = 4 RL = 2 RR Vno ZI supply voltage ripple rejection noise output voltage input impedance Rs = 0 46 50 7 12 50 W W dB V k
ORDERING INFORMATION TYPE NUMBER TDA8561Q PACKAGE NAME DESCRIPTION VERSION SOT243-1
1999 Jun 30
Philips Semiconductors
Product specication
TDA8561Q
V P1 5 non-inverting input 1 1 60 k VA 2 k 18 k mute switch 60 k 3 VA 2 k 18 k VP power stage power stage mute switch Cm
VP2 13
TDA8561Q
6 output 1
Cm
inverting input 2
output 2
14 stand-by switch VA 15 k x1 supply voltage ripple rejection 4 15 k mute reference voltage Cm mute switch 60 k VA 2 k 18 k mute switch 60 k VA 2 k 18 k power stage 10 power stage 12 PROTECTIONS thermal short-circuit stand-by reference voltage mute switch 16
diagnostic output
non-inverting input 4
17
output 4
Cm
inverting input 3
15
output 3
7 GND1
ground (signal)
not connected
1999 Jun 30
Philips Semiconductors
Product specication
TDA8561Q
1999 Jun 30
Philips Semiconductors
Product specication
TDA8561Q
During this short-circuit condition, pin 16 is LOW for 20 ms and HIGH for 50 s (see Fig.5). The power dissipation in any short-circuit condition is very low.
MGA705
V16 VP 0 t
handbook, halfpage VO
MGA706
V16 VP 0 t
Fig.4
1999 Jun 30
Philips Semiconductors
Product specication
TDA8561Q
in output stage
MGL214
V16 VP
t 50 s
TEMPERATURE DETECTION When the virtual junction temperature Tvj reaches 150 C, pin 16 will be active LOW. OPEN-COLLECTOR OUTPUT Pin 16 is an open-collector output, which allows pin 16 of more devices being tied together. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL vP operating non-operating load dump protection IOSM IORM Tstg Tamb Tvj Vpsc Vpr Ptot non-repetitive peak output current repetitive peak output current storage temperature operating ambient temperature virtual junction temperature AC and DC short-circuit safe voltage reverse polarity total power dissipation during 50 ms; tr 2.5 ms PARAMETER positive supply voltage 55 40 18 30 45 6 4 +150 +85 150 18 6 60 V V V A A C C C V V W CONDITIONS MIN. MAX. UNIT
1999 Jun 30
Philips Semiconductors
Product specication
TDA8561Q
handbook, halfpage
output 1
handbook, halfpage
output 1
virtual junction
2.2 K/W
2.2 K/W
0.7 K/W
MEA860 - 2
case
0.2 K/W
case
Fig.6
Fig.7
1999 Jun 30
Philips Semiconductors
Product specication
TDA8561Q
MAX.
UNIT
V mA V mV
V mV mV
STANDBY CONDITION Vsb Isb Isw VDIAG Notes 1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V. 2. At 18 V < VP < 30 V the DC output voltage 0.5VP. standby voltage standby current switch-on current 0 any short-circuit or clipping 12 2 100 40 V A A
1999 Jun 30
Philips Semiconductors
Product specication
TDA8561Q
MAX.
UNIT
Stereo BTL application (measured in Fig.8) Po output power note 1 THD = 0.5% THD = 10% THD Po total harmonic distortion output power Po = 1 W VP = 13.2 V THD = 0.5% THD = 10% B fl fh Gv SVRR power bandwidth low frequency roll-off high frequency roll-off closed loop voltage gain supply voltage ripple rejection on mute standby ZI Vno input impedance noise output voltage on on mute cs Gv THD channel separation channel unbalance V16 0.6 V; no short-circuit note 1 THD = 0.5% THD = 10% THD PO total harmonic distortion output power Po = 1 W RL = 2 ; note 1 THD = 0.5% THD = 10% fl fh Gv low frequency roll-off high frequency roll-off closed loop voltage gain at 1 dB; note 2 at 1 dB 7.5 10 20 19 10 12 25 20 21 W W Hz kHz dB 4 5.5 5 7 0.06 W W % Rs = 0 ; note 4 Rs = 10 k; note 4 notes 4 and 5 Rs = 10 k 40 70 100 60 60 10 200 1 V V V dB dB note 3 48 46 80 25 30 38 dB dB dB k THD = 0.5%; Po = 1 dB; with respect to 15 W at 1 dB; note 2 at 1 dB 20 25 16 20 20 to 15000 45 26 27 Hz kHz dB W W Hz 15 20 19 24 0.06 W W %
1999 Jun 30
Philips Semiconductors
Product specication
TDA8561Q
MAX. 75 100 1
UNIT dB dB dB k V V V dB dB
3. Ripple rejection measured at the output with a source impedance of 0 , maximum ripple amplitude of 2 V (p-p) and at a frequency of between 100 Hz and 10 kHz. 4. Noise measured in a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage independent of Rs (Vi = 0 V).
1999 Jun 30
10
Philips Semiconductors
Product specication
TDA8561Q
VP 10 k 16 5 13 100 nF 2200 F
14 220 nF
TDA8561Q TDA8564Q
6
reference voltage 9 60 k
not connected
non-inverting input 4
17 12
60 k 10 inverting input 3 15
11
MEA862 - 2
1999 Jun 30
11
Philips Semiconductors
Product specication
TDA8561Q
mode switch
VP 10 k 16 5 13 100 nF 2200 F
14 220 nF
TDA8561Q TDA8564Q
6 1000 F 60 k
inverting input 2
220 nF
8 3 2 60 k 1000 F
ground (signal)
4 supply voltage ripple rejection non-inverting input 4 220 nF 60 k 220 nF 100 1/2Vp F 17 60 k
reference voltage 9
not connected
12 1000 F
10 15 1000 F
inverting input 3
11
MEA863 - 2
1999 Jun 30
12
Philips Semiconductors
Product specication
TDA8561Q
mode switch
VP 10 k 16 5 13 100 nF 2200 F
14 220 nF
TDA8561Q TDA8564Q
6
ground (signal)
not connected
9 60 k
reference voltage 4
VP 2 100 F 12 D1
17
60 k 220 nF 10 15
inverting input 3
11
MEA864 - 2
2200 F
(1) When short-circuiting the single-ended capacitor, the dissipation will be reduced due to diode D1.
1999 Jun 30
13
Philips Semiconductors
Product specication
TDA8561Q
handbook, halfpage
10 k
100
47 F
MGA708
10 2 THD (%) 10
MGA709
1 (1)
10 1
(2) (3)
10 1
10
P o (W)
10 2
1999 Jun 30
14
Philips Semiconductors
Product specication
TDA8561Q
50
MGA710
Po (W) 40
(1) 30 (2) 20
(3)
10
0 8 (1) THD = 30%. (2) THD = 10%. (3) THD = 0.5%. 10 12 14 16 VP (V) 18
MGA711
20 Po (W) 18
16
14
12
10 10
10 2
10 3
10 4
f (Hz)
10 5
1999 Jun 30
15
Philips Semiconductors
Product specication
TDA8561Q
MGA712
THD (%)
(1) 10 1 (2)
(3)
10 2
10 3
10 4
f (Hz)
10 5
MGA713
70
80
90
(3)
10 2
10 3
10 4
f (Hz)
10 5
1999 Jun 30
16
Philips Semiconductors
Product specication
TDA8561Q
100
MGA714
Iq (mA) 92
84
76
68
60 8 10 12 14 16 VP (V) 18
SINGLE-ENDED APPLICATION
10 2 THD (%) 10
MGA715
(1)
(2) 10 1 (3)
10 2 10 2 (1) f = 10 kHz.
10 1 (2) f = 1 kHz.
10
P o (W)
10 2
1999 Jun 30
17
Philips Semiconductors
Product specication
TDA8561Q
15
MGA716
Po (W) 12
(1)
(2) 6 (3)
0 8 (1) THD = 30%. (2) THD = 10%. (3) THD = 0.5%. 10 12 14 16 VP (V) 18
MGA717
10 Po (W) 8
0 10
10 2
10 3
10 4
f (Hz)
10 5
1999 Jun 30
18
Philips Semiconductors
Product specication
TDA8561Q
MGA718
THD (%)
(1) 10
1
(2)
10 2
10 3
10 4
f (Hz)
10 5
30
MGA719
cs (dB)
40
50
60
70
80 10
10 2
10 3
10 4
f (Hz)
10 5
1999 Jun 30
19
Philips Semiconductors
Product specication
TDA8561Q
14 P tot (W) 12
MGA720
10
2 0 4 8 12 16 20 24 Po (W) 28
Fig.23 Total power dissipation as a function of output power; VP = 14.4 V, RL = 4 (1 channel driven BTL or 4 channels in single-ended mode).
1999 Jun 30
20
Philips Semiconductors
Product specication
TDA8561Q
SOT243-1
non-concave D x Dh
Eh
A2
B j E A
L3
Q c v M
1 Z e e1 bp w M
17 m e2
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
1999 Jun 30
21
Philips Semiconductors
Product specication
TDA8561Q
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications. suitable suitable(1) WAVE
1999 Jun 30
22
Philips Semiconductors
Product specication
TDA8561Q
1999 Jun 30
23
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 66
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
545002/04/pp24
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