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1. General description
The TEA1611T is a monolithic integrated circuit implemented in a high voltage Diffusion Metal Oxide Semiconductor (DMOS) process, which is a high voltage controller for a zero voltage switching resonant converter. The IC provides the drive function for two discrete power MOSFETs in a half-bridge conguration. It also includes a level-shift circuit, an oscillator with accurately programmable frequency range, a latched shut-down function and a transconductance error amplier. To guarantee an accurate 50 % switching duty factor, the oscillator signal passes through a divide-by-two ip-op before being fed to the output drivers. The circuit is very exible and enables a broad range of applications for different mains voltages.
Vhs bridge voltage supply (high side) MOSFET SWITCH HALFBRIDGE CIRCUIT RESONANT CONVERTER
VAUX
TEA1611
signal ground
power ground
014aaa681
Fig 1.
Basic conguration
2. Features
I I I I I I Integrated high voltage level-shift function Integrated high voltage bootstrap diode Low start-up current (green function) Adjustable non-overlap time Internal OverTemperature Protection (OTP) OverCurrent Protection (OCP) that activates a shut-down timer
NXP Semiconductors
TEA1611T
Zero voltage switching resonant converter controller
I I I I I I I
Soft start timing pin Transconductance error amplier for ultra high-ohmic regulation feedback Latched shut-down circuit for OverVoltage Protection (OVP) Adjustable minimum and maximum frequencies UnderVoltage LockOut (UVLO) Fault latch reset input Wide (max 20 V) supply voltage range
3. Applications
I TV and monitor power supplies I High voltage power supplies
4. Ordering information
Table 1. Ordering information Package Name TEA1611T SO20 Description plastic small outline package; 20 leads; body width 7.5 mm Version SOT163-1 Type number
TEA1611T_1
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NXP Semiconductors
TEA1611T
Zero voltage switching resonant converter controller
5. Block diagram
VAUX VDD
13 V
BOOTSTRAP VDD(FLOAT) SUPPLY LEVEL SHIFTER HIGH SIDE DRIVER GH SH LOW SIDE DRIVER
TEA1611
reset OVER TEMPERATURE PROTECTION start/stop oscillation LOGIC shut-down reset SGND
5 A gm 0.3 V
GL PGND OCP
start-up :2
2.33 V
SD
RESET P
Ich
TIMER
CT
2.5 V
2.5 V 3V
OSCILLATOR
0.6 V 16 Idch
BUFFER
CSS
VCO IRS
VREF IFS
CF
014aaa680
Fig 2.
Block diagram
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TEA1611T
Zero voltage switching resonant converter controller
6. Pinning information
6.1 Pinning
1 2 3 4 5 6 7 8 9
TEA1611
VDD(FLOAT) 10
Fig 3.
Pin conguration
Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Description error amplier non-inverting input error amplier output soft start capacitor input timer capacitor input overcurrent protection input power ground not connected[1] high side switch source connection high side switch gate connection oating supply high side driver signal ground low side switch gate connection supply voltage auxiliary supply voltage latch reset input oscillator discharge current input oscillator capacitor oscillator charge input current shut-down input reference voltage
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NXP Semiconductors
TEA1611T
Zero voltage switching resonant converter controller
7. Functional description
7.1 Start-up
When the applied voltage at VDD reaches VDD(init) (see Figure 4), the low side power switch is turned on while the high side power switch remains in the non-conducting state. This start-up output state guarantees the initial charging of the bootstrap capacitor (Cboot) used for the oating supply of the high side driver. During start-up, the voltage on the frequency capacitor pin (CF) is zero and denes the start-up state. The voltage at the soft start pin (CSS) is set to 2.5 V. The CSS pin voltage is copied to the VCO pin via a buffer and switching starts at about 80 % of the maximum frequency at the moment VDD reaches the start level. The start-up state is maintained until VDD reaches the start level (13.5 V), the oscillator is activated and the converter starts operating.
VDD
VDD(startup) VDD(init)
0 GH-SH 0
GL 0 t
014aaa036
Fig 4.
Start-up
7.2 Oscillator
The internal oscillator is a current-controlled sawtooth oscillator. The frequency of the sawtooth is determined by the external capacitor Cf and the currents owing into the IFS and IRS pins. The minimum frequency and the non-overlap time are set by the capacitor Cf and the resistors Rf(min) and Rno. The maximum frequency is set by resistor Rf (see Figure 7). The oscillator frequency is exactly twice the bridge frequency to achieve an accurate 50 % duty factor. An overview of the oscillator and driver signals is given in Figure 5.
TEA1611T_1
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NXP Semiconductors
TEA1611T
Zero voltage switching resonant converter controller
CF
Fig 5.
TEA1611T_1
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TEA1611T
Zero voltage switching resonant converter controller
TEA1611T_1
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TEA1611T
Zero voltage switching resonant converter controller
fosc(min)
IIRS
014aaa038
Fig 6.
Frequency range
TEA1611T_1
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TEA1611T
Zero voltage switching resonant converter controller
7.9 Shut-down
The shut-down input (SD) has an accurate threshold level of 2.33 V. When the voltage on input SD reaches 2.33 V, the TEA1611T enters shut-down mode. During shut-down mode, pin VDD is clamped by an internal 12 V Zener diode with a 1 mA input current. This clamp prevents VDD rising above the rating of 14 V due to low supply current to the TEA1611T in shut-down mode. When the TEA1611T is in the shut-down mode, it can be activated again only by lowering VDD below the VDD(rst) level (typically 5.3 V) or by making the reset input active. The shut-down latch is then reset and a new start-up cycle can begin. In shut-down mode the GL pin is HIGH and the GH pin is LOW. In this way the bootstrap capacitor remains charged, allowing a new, well dened cycle to start after a reset.
8. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Vdrv(hs) VDD VCC(AUX) Parameter high-side driver voltage supply voltage auxiliary supply voltage
[1] [1]
Conditions
Min 0 0 0
Max 600 14 20
Unit V V V
Supply voltages
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NXP Semiconductors
TEA1611T
Zero voltage switching resonant converter controller
Table 3. Limiting values continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI Currents IIFS IIRS IVREF Ptot Tamb Tstg Handling VESD electrostatic discharge voltage Human body model Machine model
[1] [2] [3]
[2]
Parameter input voltage current on pin IFS current on pin IRS current on pin VREF total power dissipation ambient temperature storage temperature
Conditions
Min 0 -
Unit V mA mA mA W C C V V
[3]
It is recommended that a buffer capacitor is placed as close as possible to the VDD pin (as indicated in Figure 7 and in the application note). Human body model class 2: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Machine model class 2: equivalent to discharging a 200 pF capacitor through a 0.75 mH coil and 10 resistor.
9. Thermal characteristics
Table 4. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air Typ 100 Unit K/W
10. Characteristics
Table 5. Characteristics All voltages are referred to the ground pins which must be connected externally; positive currents ow into the IC; VDD = 13 V and Tamb = 25 C; tested using the circuit shown in Figure 7, unless otherwise specied. Symbol Ileak Parameter leakage current Conditions VDD(F), VGH and VSH = 600 V dened driver output; low side on; high side off Min Typ Max 30 Unit A High voltage pins VDD(FLOAT), GH and SH
Supply pins VDD, VAUX VDD(init) initial supply voltage 12.9 9.0 3.8 4 13.4 9.4 4.0 5 13.9 9.8 4.2 V V V V
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TEA1611T
Zero voltage switching resonant converter controller
Table 5. Characteristics continued All voltages are referred to the ground pins which must be connected externally; positive currents ow into the IC; VDD = 13 V and Tamb = 25 C; tested using the circuit shown in Figure 7, unless otherwise specied. Symbol VDD(reg) VDD Parameter regulation supply voltage supply voltage Conditions VAUX = 17 V current capability series regulator; VCC(AUX) = 17 V; IDD = 50 mA clamp voltage in shut-down state; low side on; high side off; IDD = 1 mA Vrst IDD reset voltage supply current start-up operating shut-down Reference voltage on pin VREF Vref Iref Zo TC reference voltage reference current output impedance temperature coefcient Iref = 0 mA source only Iref = 1 mA Iref = 0 mA; Tj = 25 C to 150 C IIRS = 15 A; VCF = 2 V IIRS = 200 A; VCF = 2 V IIRS = 200 A IIFS = 50/16 A; VCF = 2 V IIFS = 1/16 A; VCF = 2 V IIFS = 1/16 mA Cf = 100 pF; IIFS = 0.5/16 mA; IIRS = 50 A; f OSC fbridge = -----------2 fbridge(max) maximum bridge frequency Cf = 100 pF; IIFS = 1/16 mA; IIRS = 200 A; f OSC fbridge = -----------2 Vtrip(L) Vtrip(H)
TEA1611T_1
Min -
Typ 12.6 12
Max -
Unit V V
11.0
12.0
13.0
4.5
[1]
V A mA A V mA mV/K
Current controlled oscillator pins IRS, IFS, CF Ich(CF)min Ich(CF)max VIRS Idch(CF)min Idch(CF)max VIFS fbridge(min) minimum charge current on pin CF maximum charge current on pin CF voltage on pin IRS minimum discharge current on pin CF maximum discharge current on pin CF voltage on pin IFS minimum bridge frequency 28 340 590 47 0.89 570 156 30 380 620 50 0.94 600 167 32 420 650 53 0.99 630 178 A A mV A mA mV kHz
[2]
395
440
485
kHz
1.27 2.97
V V
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NXP Semiconductors
TEA1611T
Zero voltage switching resonant converter controller
Table 5. Characteristics continued All voltages are referred to the ground pins which must be connected externally; positive currents ow into the IC; VDD = 13 V and Tamb = 25 C; tested using the circuit shown in Figure 7, unless otherwise specied. Symbol VCF(p-p) tno Parameter peak-to-peak voltage on pin CF non-overlap time Conditions DC level Cf = 100 pF; IIFS = 0.5/16 mA; IIRS = 50 A IIFS = 0.5/16 mA; Min 1.6 0.58 Typ 1.7 0.63 Max 1.8 0.68 Unit V s
Idch(osc)/IIFS oscillator discharge current to current on pin IFS ratio Output drivers Isource(GH) source current on pin GH
14.4
16
17.6
high side; VDD(F) = 11.2 V; VSH = 0 V; VGH = 0 V high side; VDD(F) = 11.2 V; VSH = 0 V; VGH = 11.2 V low side; VGL = 0 V low side; VGL = 13 V pin GH; high side; VDD(F) = 11.2 V; VSH = 0 V; IGH = 10 mA pin GL; low side; IGL = 10 mA
300
mA
Isink(GH)
480
mA
mA mA V
12.6 0.17
V V
VOL
pin GL; high side; VDD(F) = 11.2 V; VSH = 0 V; IGH = 10 mA pin GL; low side; IGL = 10 mA
1.3 2.26
V V A V A V mV A/mV dB MHz V mA V
bootstrap diode forward voltage input current threshold voltage on pin SD common-mode input current common-mode input voltage offset input voltage transconductance open-loop gain gain bandwidth product maximum VCO voltage maximum VCO current output voltage
IO = 5 mA VSD = 2.33 V
Error amplier pins P, VCO VI(CM) = 1 V VI(CM) = 1 V; IVCO = 10 mA VI(CM) = 1 V; source only RL = 10 k to GND; VI(CM) = 1 V RL = 10 k to GND; VI(CM) = 1 V operating; RL = 10 k to GND operating; VVCO = 1 V during start-up; IVCO = 0.3 mA 2 3.2 0.4 2.5
TEA1611T_1
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NXP Semiconductors
TEA1611T
Zero voltage switching resonant converter controller
Table 5. Characteristics continued All voltages are referred to the ground pins which must be connected externally; positive currents ow into the IC; VDD = 13 V and Tamb = 25 C; tested using the circuit shown in Figure 7, unless otherwise specied. Symbol Reset pin Vrst Vrst(hys) II(rst) CSS pin Istart(soft) CT pin Ich Idch Ileak Ich/Idch Vtrip(H) Vtrip(L) OCP pin Vref OTP Totp(act) activation overtemperature protection temperature 120 135 150 C reference voltage 280 305 330 mV charge current discharge current leakage current charge current to discharge current ratio HIGH-level trip voltage LOW-level trip voltage 21 8 0.1 2.4 2.7 0.6 27 10 0.3 2.7 3 0.7 33 12 1 3.0 3.3 0.8 A A A A V V soft start current 12 15 18 A reset voltage hysteresis of reset voltage reset input current 2.15 2.4 0.65 2.65 1 V V A Parameter Conditions Min Typ Max Unit
[1]
The supply current IDD increases with an increasing bridge frequency to drive the capacitive load of two MOSFETs. Typical MOSFETs for the TEA1611T application are 8N50 (NXP type PHX80N50E, QG(tot) = 55 nC typ.) and these will increase the supply current at 150 kHz according to the following formula:
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Zero voltage switching resonant converter controller
output voltage
CVDD
VDD
18 V
VAUX 14
12.6 V
13
10 VDD(FLOAT)
Lp
TEA1611
LEVEL SHIFTER
9 GH
Lr(ext)
on/off
8 SH
Cboot
12 GL
Cp Cr
6 PGND
5 OCP
0.3 V
19 SD overvoltage protection
P 1 (1)
gm
:2
2.5 V 2.7 V
(2)
start-up 3V
OSCILLATOR TIMER
600 mV 3 CSS
CSS
600 mV 20 VREF
Rno
2 VCO
Rf
18 IRS
Rf(min)
16 IFS
17 CF
Cf CT
014aaa683
(1) Construction 1: Regulation feedback connected to pin 1. (2) Construction 2: Regulation feedback connected to pin 19 with resistor.
Fig 7.
Application diagram
TEA1611T_1
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TEA1611T
Zero voltage switching resonant converter controller
A X
c y HE v M A
Z 20 11
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
8 o 0
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION
Fig 8.
TEA1611T_1
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TEA1611T
Zero voltage switching resonant converter controller
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TEA1611T
Zero voltage switching resonant converter controller
Denition This document contains data from the objective specication for product development. This document contains data from the preliminary specication. This document contains the product specication.
Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Denitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Denitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofce. In case of any inconsistency or conict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specied use without further testing or modication. Limiting values Stress above one or more limiting values (as dened in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/prole/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
14.3 Disclaimers
General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
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Zero voltage switching resonant converter controller
16. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Non-overlap time resistor . . . . . . . . . . . . . . . . . 6 Minimum frequency resistor . . . . . . . . . . . . . . . 6 Maximum frequency resistor. . . . . . . . . . . . . . . 7 Error amplier . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Soft start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Overcurrent protection and timer . . . . . . . . . . . 9 Shut-down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 OverTemperature Protection (OTP) . . . . . . . . . 9 Latch reset input . . . . . . . . . . . . . . . . . . . . . . . . 9 VAUX input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal characteristics. . . . . . . . . . . . . . . . . . 10 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 September 2009 Document identifier: TEA1611T_1