DATA SHEET

PC2747TB, PC2748TB
3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS

BIPOLAR ANALOG INTEGRATED CIRCUITS

DESCRIPTION
The PC2747TB, PC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold. The PC2747TB, PC2748TB have compatible pin connections and performance to PC2747T, PC2748T of conventional minimold version. So, in the case of reducing your system size, PC2747TB, PC2748TB are suitable to replace from PC2747T, PC2748T. These ICs are manufactured using NECs 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.

FEATURES
High-density surface mounting Supply voltage Noise figure Upper limit operating frequency : 6-pin super minimold package : VCC = 2.7 to 3.3 V : PC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz : PC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz : PC2747TB ; fu = 1.8 GHz TYP. : PC2748TB ; fu = 1.5 GHz TYP.

APPLICATION
Buffer amplifiers for mobile telephones, etc. (PDC800M, GSM)

ORDERING INFORMATION
Part Number Package 6-pin super minimold Marking C1S C1T Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel.

PC2747TB-E3 PC2748TB-E3

Remark

To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:

PC2747TB, PC2748TB)

Caution

Electro-static sensitive devices

The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P13444EJ2V0DS00 (2nd edition) Date Published June 1999 N CP(K) Printed in Japan

The mark

shows major revised points.

1998, 1999

PC2747TB, PC2748TB
PIN CONNECTIONS
Pin No. Pin Name INPUT GND GND OUTPUT GND VCC

(Top View)

(Bottom View) 4 5 6 4 5 6 3 2 1

1 2 3 4 5 6

2 1

Marking is an example of PC2747TB

PRODUCT LINE-UP (TA = +25C, VCC = 3.0 V, ZL = ZS = 50 )

Part No. fu (GHz) 1.8 PO(sat) (dBm) 7.0 GP (dB) 12 NF (dB) 3.3 ICC (mA) 5.0 6-pin super minimold 6-pin minimold 0.2 to 1.5 3.5 19 2.8 6.0 6-pin super minimold C1T Package 6-pin minimold C1S Marking

PC2747T PC2747TB PC2748T PC2748TB

Remark Notice

Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. The package size distinguishes between minimold and super minimold.

SYSTEM APPLICATION EXAMPLE

EXAMPLE OF 900 MHz BAND DIGITAL CELLULER TELEPHONE Digtal Cellular System Block Diagram
RX DEMO I Q

C1S

PSC+PLL SW

PLL

I 0 TX PA

90 Q

: PC2747TB, PC2748TB applicable

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
PIN EXPLANATION
Applied Voltage (V) 0.80 Pin Voltage (V)
Note

Pin No. 1

Pin Name INPUT

Function and Applications

Internal Equivalent Circuit

0.80 4 OUTPUT

Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut. Signal output pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. Power supply pin. This pin should be externally equipped with bypass capacity to minimize ground impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
3 GND 2 GND 5

6 VCC

4 OUT

2.79

IN 1

2.72 6 VCC 2.7 to 3.3

2 3 5

GND

The above diagram is for the PC2747TB. The resistor marked with an asterisk does not exist in the PC2748TB.

Note Pin voltage is measured at VCC = 3.0 V. Above: PC2747TB, Below: PC2748TB

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Circuit Current Power Dissipation Symbol VCC ICC PD TA = +25C TA = +25C Mounted on double sided copper clad 50 50 1.6 mm epoxy glass PWB (TA = +85C) Conditions Ratings 4.0 15 200 40 to +85 55 to +150 TA = +25C 0 Unit V mA mW

Operating Ambient Temperature Storage Temperature Input Power Level

TA Tstg Pin

C C dBm

RECOMMENDED OPERATING CONDITIONS

Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 2.7 40 TYP. 3.0 +25 MAX. 3.3 +85 Unit V C

ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 3.0 V, ZS = ZL = 50 )

PC2747TB
Parameter Circuit Current Power Gain Maximum Output Level Symbol ICC GP PO(sat) Test Conditions MIN. No Signal f = 900 MHz f = 900 MHz Pin = 8 dBm f = 900 MHz 3 dB down below from gain at f = 900 MHz 3 dB down below from gain at f = 900 MHz f = 900 MHz f = 900 MHz f = 900 MHz 3.8 9 9.5 TYP. 5.0 12 7.0 MAX. 7.0 14 MIN. 4.5 16 6.0 TYP. 6.0 19 3.5 MAX. 8.0 21 mA dB dBm

PC2748TB
Unit

Noise Figure Upper Limit Operating Frequency

NF fu

1.5

3.3 1.8

4.5

1.2

2.8 1.5

4.0

dB GHz

Lower Limit Operating Frequency

fL

0.2

0.4

GHz

Isolation Input Return Loss Output Return Loss

ISL RLin RLout

35 11 7

40 14 10

35 8.5 5.5

40 11.5 8.5

dB dB dB

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 C, ZL = ZS = 50 )
Reference Parameter Circuit Current Symbol ICC Test Conditions VCC = 1.8 V, No signals VCC = 1.8 V, f = 900 MHz VCC = 1.8 V, f = 900MHz, Pin = 8 dBm VCC = 1.8 V, f = 900 MHz VCC = 1.8 V, 3 dB down below from gain at f = 900 MHz VCC = 1.8 V, 3 dB down below from gain at f = 900 MHz VCC = 1.8 V, f = 900MHz VCC = 1.8 V, f = 900MHz VCC = 1.8 V, f = 900MHz VCC = 3.0 V, Pout = 20 dBm, f1 = 900 MHz, f2 = 902 MHz VCC = 1.8 V, Pout = 20 dBm, f1 = 900 MHz, f2 = 902 MHz

PC2747TB
3.0

PC2748B
3.5

Unit mA

Power Gain

GP

5.5 13.7

11.5 10.0

dB

Maximum Output Level

PO(sat)

dBm

Noise Figure

NF

5.2

4.5

dB

Upper Limit Operating Frequency

fu

1.8

1.5

GHz

Lower Limit Operating Frequency

fL

0.2

GHz

Isolation

ISL

34

34

dB

Input Return Loss

RLin

11

10

dB

Output Return Loss

RLout

13 34

12 38

dB

3rd Order Intermodulation Distortion

IM3

dBc

20

28

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
TEST CIRCUIT
VCC 1 000 pF C3 6 50 IN 1 000 pF C1 1 4 C2 1 000 pF 50 OUT

2, 3, 5

EXAMPLE OF APPLICATION CIRCUIT

VCC 1 000 pF C3 6 50 IN 1 000 pF C1 1 4 C4 1 000 pF C5 1 000 pF R1 50 to 200 2, 3, 5 To stabilize operation, please connect R1, C5 1 6 4 C2 1 000 pF 50 OUT 1 000 pF C6

2, 3, 5

The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.

Capacitors for VCC, input and output pins 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pins ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 fZs).]

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

AMP-2

Top View
3

IN C C
1S

OUT

1 C

Mounting Direction (Marking is an example for PC2747TB) C

VCC

COMPONENT LIST
Value C 1 000 pF

Notes 1. 30 30 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes

For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC (P11976E).

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C) PC2747TB
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 10 No signal 8 8 No signal

CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10

Circuit Current ICC (mA)

Circuit Current ICC (mA)

VCC = 3.0 V 6

2 VCC = 1.8 V

0 0 1 2 3 4 Supply Voltage VCC (V) INSERTION POWER GAIN vs. FREQUENCY 20 VCC = 3.3 V

0 60 40 20

+20 +40 +60 +80 +100

Operating Ambient Temperature TA (C) INSERTION POWER GAIN vs. FREQUENCY 20 VCC = 3.0 V TA = 40 C 15 TA = +25 C

Insertion Power Gain GP (dB)

15

VCC = 3.0 V

Insertion Power Gain GP (dB)

10 VCC = 2.7 V 5

10 TA = +85 C 5

VCC = 1.8 V

0 0.1

0.3

1.0

3.0

0 0.1

0.3

1.0

3.0

Frequency f (GHz) NOISE FIGURE vs. FREQUENCY 7 VCC = 1.8 V 6

Frequency f (GHz)

Noise Figure NF (dB)

5 VCC = 3.0 V 4 VCC = 3.3 V 3

VCC = 2.7 V

2 0.1

0.3

1.0

3.0

Frequency f (GHz)

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
PC2747TB
INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 RLin (VCC = 1.8 V)
Input Return Loss RLin (dB) Output Return Loss RLout (dB)

ISOLATION vs. FREQUENCY 0

RLout (VCC = 3.0 V)

10
Isolation ISL (dB)

10

20 VCC = 1.8 V 30

20 RLin (VCC = 3.0 V) 30

RLout (VCC = 1.8 V)

40

VCC = 3.0 V

40

50 0.1

0.3

1.0

3.0

50 0.1

0.3

1.0

3.0

Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 0 f = 900 MHz VCC = 3.3 V 5
Output Power Pout (dBm) Output Power Pout (dBm)

Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 0 f = 900 MHz VCC = 3.0 V

5 VCC = 3.0 V VCC = 2.7 V TA = 40 C

TA = +85 C

10

10

15

15

TA = 40 C TA = +25 C TA = +25 C

20

20

TA = +85 C

25 30 40 35 30 25 20 15 10 Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY

Third Order Intermodulation Distorition IM3 (dBc)

25 30 40 35 30 25 20 15 10 Input Power Pin (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 50 45 40 35 30 25 20 15 10 5 0 30 28 26 24 22 20 18 16 14 12 10 Output Power of Each Tone PO (each) (dBm) VCC = 1.8 V VCC = 2.7 V VCC = 3.3 V VCC = 3.0 V f1 = 900 MHz f2 = 902 MHz

0
Saturared Output Power PO (sat) (dBm)

VCC = 3.3 V 5

Pin = 8 dBm

10

VCC = 3.0 V VCC = 2.7 V

15

20

25 0.1

0.3

1.0

3.0

Frequency f (GHz)

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
S-PARAMETER (TA = +25 C, VCC = 3.0 V) PC2747TB S11-FREQUENCY

1.0 G 3.0 G 2.0 G 0.1 G

S22-FREQUENCY

0.1 G 1.0 G 2.0 G

3.0 G

10

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
TYPICAL S-PARAMETER VALUES (TA = +25 C)

PC2747TB
VCC = 3.0 V, ICC = 5.0 mA
FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 S11 MAG. 0.091 0.105 0.136 0.165 0.179 0.185 0.189 0.189 0.182 0.180 0.174 0.160 0.148 0.134 0.124 0.110 0.099 0.089 0.084 0.085 0.087 0.092 0.102 0.114 0.126 0.136 0.154 0.168 0.180 0.196 0.208 ANG. 178.3 161.2 166.8 172.9 177.8 170.1 162.5 155.1 148.8 142.6 137.1 131.5 127.4 124.4 121.0 121.0 122.9 126.8 134.8 141.7 148.1 152.1 156.6 158.7 161.4 160.6 161.3 160.4 157.9 155.2 152.5 MAG. 3.732 3.997 4.075 4.105 4.141 4.098 4.124 4.104 4.061 4.016 3.977 3.948 3.799 3.736 3.582 3.506 3.317 3.190 3.040 2.901 2.736 2.645 2.507 2.395 2.312 2.218 2.136 2.036 1.952 1.847 1.757 S21 ANG. 3.9 13.3 23.4 32.9 41.2 49.5 57.9 66.3 74.5 83.0 91.8 99.5 108.4 115.9 124.0 131.7 138.8 145.7 152.8 159.0 164.8 170.8 176.3 177.8 172.9 168.1 162.1 157.8 151.6 147.6 141.6 MAG. 0.001 0.002 0.002 0.004 0.004 0.005 0.006 0.008 0.009 0.012 0.013 0.015 0.016 0.019 0.022 0.023 0.025 0.028 0.030 0.032 0.034 0.035 0.037 0.038 0.041 0.042 0.042 0.044 0.044 0.043 0.045 S12 ANG. 28.0 103.2 76.0 90.4 89.4 90.7 96.6 101.3 99.2 99.9 100.3 105.5 96.6 93.8 93.8 88.1 88.6 88.3 80.2 78.7 77.6 73.0 72.5 68.5 66.2 64.0 60.4 54.8 53.0 47.2 44.0 MAG. 0.290 0.294 0.292 0.286 0.298 0.302 0.307 0.309 0.313 0.316 0.318 0.318 0.318 0.313 0.311 0.312 0.308 0.305 0.305 0.303 0.299 0.304 0.304 0.305 0.317 0.319 0.323 0.331 0.330 0.332 0.331 S22 ANG. 3.7 4.3 3.9 5.6 6.9 8.4 10.2 12.2 14.4 16.9 19.7 22.6 24.9 27.4 30.1 31.8 33.3 35.1 37.2 38.8 40.9 41.5 42.2 44.7 45.8 47.8 50.8 54.1 57.5 60.9 65.5 98.96 64.71 46.80 29.99 25.94 20.69 17.38 12.59 12.26 9.45 8.22 7.49 7.42 6.36 5.83 5.55 5.37 5.05 4.98 4.97 4.99 4.97 4.93 5.01 4.76 4.78 4.88 4.88 5.07 5.45 5.49 K

Data Sheet P13444EJ2V0DS00

11

PC2747TB, PC2748TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C) PC2748TB
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 10 No signal 8
Circuit Current ICC (mA) Circuit Current ICC (mA)

CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10

No signal 8 VCC = 3.0 V 6

VCC = 1.8 V

0 0 1 2 3 4 5 Supply Voltage VCC (V) INSERTION POWER GAIN vs. FREQUENCY 25 VCC = 3.3 V
Insertion Power Gain GP (dB)

0 60 40 20

+20 +40 +60 +80 +100

Operating Ambient Temperature TA (C) INSERTION POWER GAIN vs. FREQUENCY 25 VCC = 3.0 V

VCC = 3.0 V
Insertion Power Gain GP (dB)

TA = 40 C 20

20

15 VCC = 2.7 V 10 VCC = 1.8 V 5

15

TA = +25 C TA = +85 C

10

0 0.1

0.3

1.0

3.0

0 0.1

0.3

1.0

3.0

Frequency f (GHz) NOISE FIGURE vs. FREQUENCY 7

Frequency f (GHz)

6
Noise Figure NF (dB)

VCC = 1.8 V

4 VCC = 2.7 V 3

VCC = 3.0 V

VCC = 3.3 V

2 0.1

0.3

1.0

3.0

Frequency f (GHz)

12

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
PC2748TB
INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 RLout (VCC = 3.0 V) RLout (VCC = 1.8 V)

ISOLATION vs. FREQUENCY 0

Input Return Loss RLin (dB) Output Return Loss RLout (dB)

10

10

Isolation ISL (dB)

20

20

RLin (VCC = 1.8 V)

30 VCC = 1.8 V 40 VCC = 3.0 V 50 0.1 0.3 1.0 3.0

30 RLin (VCC = 3.0 V) 40

50 0.1

0.3

1.0

3.0

Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 0 VCC = 3.3 V 5 5 VCC = 3.0 V 10 VCC = 2.7 V 0

Frequency f (GHz) OUTPUT POWER vs. INPUT POWER TA = +85 C TA = 40 C TA = 40 C TA = +25 C TA = +25 C 15 TA = +85 C

Output Power Pout (dBm)

Output Power Pout (dBm)

10

15

20

20

25 f = 900 MHz 30 40 35 30 25 20 15 10 5 0 Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY Pin = 8 dBm

25 VCC = 3.0 V f = 900 MHz 30 40 35 30 25 20 15 10 5 0 Input Power Pin (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE

Third Order Intermodulation Distortion IM3 (dBc)

+5

50 45 40 35 30 25 20 15 10 5 f1 = 900 MHz f2 = 902 MHz 0 30 28 26 24 22 20 18 16 14 12 10 Output Power of Each Tone PO (each) (dBm) VCC = 1.8 V VCC = 3.3 V VCC = 3.0 V VCC = 2.7 V

Saturated Output Power PO (sat) (dBm)

VCC = 3.3 V 0

5 VCC = 3.0 V 10 VCC = 2.7 V

15

20 0.1

0.3

1.0

3.0

Frequency f (GHz)

Data Sheet P13444EJ2V0DS00

13

PC2747TB, PC2748TB
S-PARAMETER (TA = +25 C, VCC = 3.0 V) PC2748TB S11-FREQUENCY

1.0 G 2.0 G

0.1 G

S22-FREQUENCY

0.1 G 1.0 G

3.0 G

14

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
TYPICAL S-PARAMETER VALUES (TA = +25 C)

PC2748TB
VCC = 3.0 V, ICC = 6.0 mA
FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 S11 MAG. 0.120 0.136 0.166 0.194 0.210 0.213 0.213 0.211 0.203 0.193 0.180 0.159 0.136 0.115 0.096 0.072 0.049 0.024 0.007 0.014 0.034 0.047 0.063 0.079 0.094 0.108 0.123 0.139 0.151 0.164 0.178 ANG. 177.2 167.3 174.2 179.6 169.6 160.0 150.2 140.8 131.1 121.1 110.8 100.6 90.6 79.2 70.4 60.9 47.5 36.5 6.0 126.0 141.3 147.7 156.9 161.1 165.5 169.0 174.7 178.9 175.9 170.5 166.0 MAG. 4.730 5.430 5.930 6.314 6.701 6.876 7.203 7.310 7.354 7.371 7.346 7.334 7.001 6.834 6.437 6.181 5.710 5.372 5.014 4.724 4.405 4.175 3.933 3.738 3.579 3.411 3.283 3.107 2.989 2.814 2.680 S21 ANG. 5.3 0.2 9.2 18.8 28.2 38.8 49.3 60.6 71.5 81.9 92.8 102.4 112.6 121.3 130.1 138.2 145.4 152.5 158.6 164.1 169.7 174.7 179.5 175.3 171.2 166.5 161.4 157.3 151.4 147.3 141.5 MAG. 0.000 0.001 0.001 0.003 0.004 0.005 0.006 0.009 0.010 0.012 0.014 0.015 0.016 0.018 0.019 0.020 0.020 0.021 0.021 0.024 0.024 0.026 0.026 0.028 0.030 0.030 0.032 0.031 0.032 0.033 0.034 S12 ANG. 30.4 19.3 97.8 125.4 108.7 107.4 98.7 114.1 107.6 98.3 99.1 97.5 91.4 84.1 84.8 82.4 78.9 73.5 74.1 74.9 71.5 73.6 71.2 69.1 63.8 64.7 64.6 58.9 53.2 51.6 47.3 MAG. 0.280 0.285 0.286 0.291 0.306 0.319 0.337 0.349 0.360 0.371 0.366 0.359 0.342 0.320 0.296 0.271 0.247 0.228 0.208 0.198 0.188 0.190 0.185 0.192 0.202 0.214 0.222 0.238 0.240 0.251 0.254 S22 ANG. 2.2 2.4 0.9 2.7 3.7 5.4 8.4 12.3 17.4 22.7 28.9 35.3 40.7 46.0 50.5 53.0 55.1 55.7 55.7 52.8 52.1 47.8 45.3 44.7 43.2 43.6 45.7 47.6 52.4 55.8 61.4 352.73 72.83 52.47 24.77 16.82 12.40 10.09 6.68 5.68 4.71 3.98 4.01 3.95 3.71 3.77 3.81 4.13 4.22 4.57 4.37 4.70 4.44 4.81 4.58 4.48 4.59 4.54 4.83 4.84 4.99 5.07 K

Data Sheet P13444EJ2V0DS00

15

PC2747TB, PC2748TB
PACAGE DIMENSIONS
6 pin super minimold (Unit: mm)
0.2 +0.1 0
0.1 MIN.

0.15 +0.1 0

1.25 0.1

2.1 0.1

0 to 0.1

0.65 1.3

0.65

0.7 0.9 0.1

2.0 0.2

16

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be attached to input pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 C or below Time: 30 seconds or less (at 210 C) Note Count: 3, Exposure limit: None Package peak temperature: 215 C or below Time: 40 seconds or less (at 200 C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3

VPS

VP15-00-3

Wave Soldering

WS60-00-1

Partial Heating

Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Data Sheet P13444EJ2V0DS00

17

PC2747TB, PC2748TB
[MEMO]

18

Data Sheet P13444EJ2V0DS00

PC2747TB, PC2748TB
[MEMO]

Data Sheet P13444EJ2V0DS00

19

PC2747TB, PC2748TB

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

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M7 98. 8

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