LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS

SLOS068R JUNE 1976 REVISED JULY 2010

D Wide Supply Range:

Single Supply . . . 3 V to 32 V (26 V for LM2904) or Dual Supplies . . . +1.5 V to +16 V (+13 V for LM2904) Low Supply-Current Drain, Independent of Supply Voltage . . . 0.7 mA Typ Common-Mode Input Voltage Range Includes Ground, Allowing Direct Sensing Near Ground Low Input Bias and Offset Parameters: Input Offset Voltage . . . 3 mV Typ A Versions . . . 2 mV Typ Input Offset Current . . . 2 nA Typ Input Bias Current . . . 20 nA Typ A Versions . . . 15 nA Typ Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . 32 V (26 V for LM2904) Open-Loop Differential Voltage Amplification . . . 100 V/mV Typ Internal Frequency Compensation

LM158, LM158A . . . JG PACKAGE LM258, LM258A . . . D, DGK, OR P PACKAGE LM358 . . . D, DGK, P, PS, OR PW PACKAGE LM358A . . . D, DGK, P, OR PW PACKAGE LM2904 . . . D, DGK, P, PS, OR PW PACKAGE (TOP VIEW)

D D D

1OUT 1IN 1IN+ GND

1 2 3 4

8 7 6 5

VCC 2OUT 2IN 2IN+

LM158, LM158A . . . FK PACKAGE (TOP VIEW)

D D D

NC 1OUT NC V CC+ NC NC 1IN NC 1IN+ NC

4 5 6 7 8 3 2 1 20 19 18 17 16 15 14 9 10 11 12 13

NC 2OUT NC 2IN NC

description/ordering information

These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904), and VCC is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional 5-V supplies.

NC No internal connection

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 2010, Texas Instruments Incorporated

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

NC GND NC 2IN+ NC

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

ORDERING INFORMATION{
TA VIOmax AT 25C MAX TESTED VCC PDIP (P) PACKAGE} Tube of 50 Tube of 75 SOIC (D) 7 mV 30 V SOP (PS) Reel of 2500 Reel of 2500 Reel of 2000 Tube of 150 TSSOP (PW) 0 C 70 C 0C to 70C MSOP/VSSOP (DGK) PDIP (P) SOIC (D) 3 mV 30 V TSSOP (PW) MSOP/VSSOP (DGK) PDIP (P) Reel of 2000 Reel of 2000 Reel of 2500 Tube of 50 Tube of 75 Reel of 2500 Tube of 150 Reel of 2000 Reel of 2500 Tube of 50 Tube of 75 5 mV 25C to 85C 25 C 85 C 30 V SOIC (D) MSOP/VSSOP (DGK) PDIP (P) 3 mV 30 V SOIC (D) MSOP/VSSOP (DGK) PDIP (P) Reel of 2500 Reel of 2500 Reel of 2500 Tube of 50 Tube of 75 Reel of 2500 Reel of 2500 Tube of 50 Tube of 75 SOIC (D) 7 mV 40C to 125 C 40 C 125C 26 V SOP (PS) Reel of 2500 Reel of 2500 Reel of 2000 Tube of 150 TSSOP (PW) MSOP/VSSOP (DGK) SOIC (D) 7 mV 2 mV 5 mV 55C to 125C 55C 2 mV

ORDERABLE PART NUMBER LM358P LM358D LM358DR LM358DRG3 LM358PSR LM358PW LM358PWR LM358PWRG3 LM358DGKR LM358AP LM358AD LM358ADR LM358APW LM358APWR LM358ADGKR LM258P LM258D LM258DR LM258DRG3 LM258DGKR LM258AP LM258AD LM258ADR LM258ADGKR LM2904P LM2904D LM2904DR LM2904DRG3 LM2904PSR LM2904PW LM2904PWR LM2904PWRG3 LM2904DGKR LM2904VQDR LM2904VQPWR LM2904AVQDR LM2904AVQPWR LM158JG LM158FK LM158AJG LM158AFK

TOP-SIDE MARKING LM358P

LM358 L358

L358 M5_ LM358AP LM358A L358A M6_ LM258P

LM258 M2_ LM258AP LM258A M3_ LM2904P

LM2904 L2904

Reel of 2000 Reel of 2000 Reel of 2500 Reel of 2500 Reel of 2000 Reel of 2500 Reel of 2000 Tube of 50 Tube of 55 Tube of 50 Tube of 55

L2904 MB_ L2904V L2904V L2904AV L2904AV LM158JG LM158FK LM158AJG LM158AFK

32 V 32 V 30 V 30 V

TSSOP (PW) SOIC (D) TSSOP (PW) CDIP (JG) LCCC (FK) CDIP (JG) LCCC (FK)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

The actual top-side marking has one additional character that designates the wafer fab/assembly site.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

symbol (each amplifier)

IN+ IN + OUT

schematic (each amplifier)

VCC+ 6-A Current Regulator 6-A Current Regulator 100-A Current Regulator

IN

OUT

IN+

50-A Current Regulator GND (or VCC) To Other Amplifier COMPONENT COUNT Epi-FET Diodes Resistors Transistors Capacitors 1 2 7 51 2

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
LM158, LM158A LM258, LM258A LM358, LM358A LM2904V Supply voltage, VCC (see Note 1) Differential input voltage, VID (see Note 2) Input voltage, VI (either input) Duration of output short circuit (one amplifier) to ground at (or below) 25C free-air temperature (VCC 15 V) (see Note 3) D package DGK package Package thermal impedance, qJA (see Notes 4 and 5) P package PS package PW package Package thermal impedance qJC (see Notes 6 and 7) impedance, FK package JG package LM158, LM158A LM258, LM258A Operating free air temperature range TA free-air range, LM358, LM358A LM2904 Operating virtual junction temperature, TJ Case temperature for 60 seconds Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds Storage temperature range, Tstg

LM2904 13 or 26 26 0.3 to 26 Unlimited 97 172 85 95 149

UNIT

16 or 32 32 0.3 to 32 Unlimited 97 172 85 95 149 5.61 14.5 55 to 125 25 to 85 0 to 70 40 to 125 150 FK package JG package 260 300 65 to 150

V V V

C/W C/W

C/W

C 40 to 125 150 300 65 to 150 C C C C

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground terminal. 2. Differential voltages are at IN+ with respect to IN. 3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 4. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/qJA. Operating at the absolute maximum TJ of 150C can affect reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. Maximum power dissipation is a function of TJ(max), qJC, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) TC)/qJC. Operating at the absolute maximum TJ of 150C can affect reliability. 7. The package thermal impedance is calculated in accordance with MIL-STD-883.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS VCC = 5 V to MAX, VIC = VICR(min), VO = 1.4 V TA MIN 25C Full range Full range 25C Full range Full range 25C Full range 25C VCC = 5 V to MAX Full range RL 2 k VOH High level High-level output voltage p g Low-level output voltage Large-signal differential voltage amplification Common-mode rejection ratio Supply-voltage rejection ratio (VDD/VIO) Crosstalk attenuation RL 10 k VCC = MAX RL 10 k VCC = 15 V, VO = 1 V to 11 V V, RL 2 k VCC = 5 V to MAX, VIC = VICR(min) VCC = 5 V to MAX f = 1 kHz to 20 kHz VCC = 15 V, VID = 1 V, V VO = 0 Source Full range 25C Full range 25C 25C Full range Full range 10 10 5 12 30 40 0.7 1 60 1.2 2 20 10 mA 10 5 12 30 40 0.7 1 60 1.2 2 mA A mA 20 RL = 2 k RL 10 k 25C 25C Full range Full range Full range 25C Full range 25C 50 25 70 80 26 27 28 5 100 20 25 15 65 80 dB 26 27 28 5 100 V/mV 20 mV 0 to VCC 1.5 0 to VCC 2 VCC 1.5 10 20 150 300 0 to VCC 1.5 0 to VCC 2 VCC 1.5 V 7 2 30 100 10 20 250 500 VIO Input offset voltage Average temperature coefficient of input offset voltage Input offset current Average temperature coefficient of input offset current Input bias current VO = 1.4 V 14 VO = 1.4 V 14 LM158 LM258 TYP 3 MAX 5 7 7 2 50 150 MIN LM358 TYP 3 MAX 7 mV 9 V/C UNIT

aV IIO aI IIB

IO

nA

IO

pA/C

nA

VICR C

Common mode Common-mode input voltage range

VOL AVD CMRR

kSVR VO1/VO2

25C 25C 25C

65

100 120

65

100 120

dB dB

20

30

20

30

IO

Output current

IO IOS

Output current Short-circuit output current Supply current (two amplifiers)

VCC = 15 V, Sink VID = 1 V, 1V VO = 15 V VID = 1 V, VO = 200 mV VCC at 5 V, GND at 5 V, VO = 0 VO = 2.5 V, No load VCC = MAX, VO = 0.5 V, No load

ICC

All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for the LM2904 and 30 V for others. Full range is 55C to 125C for LM158, 25C to 85C for LM258, 0C to 70C for LM358, and 40C to 125C for LM2904. All typical values are at T = 25C. A

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS TA 25C VIO Input offset voltage VCC = 5 V to MAX, VIC = VICR(min), VO = 1.4 V Non-A Non A devices A-suffix A suffix devices Full range 25C Full range Full range 25C Non-V Non V device IIO Input offset current VO = 1.4 V 14 V suffix device V-suffix aI Average temperature coefficient of input offset current Input bias current 14 VO = 1.4 V Full range 25C Full range Full range 25C IIB Full range 25C VCC = 5 V to MAX Full range RL 10 k VOH High-level output voltage High level VCC = MAX, Non-V device VCC = MAX, V-suffix device VOL AVD CMRR kSVR VO1/VO2 Low-level output voltage Large signal Large-signal differential voltage amplification Common mode rejection ratio Common-mode Supply-voltage rejection ratio (VDD/VIO) Crosstalk attenuation RL 10 k VCC = 15 V, VO = 1 V to 11 V, RL 2 k VCC = 5 V to MAX, VIC = VICR(min) VCC = 5 V to MAX f = 1 kHz to 20 kHz VCC = 15 V, VID = 1 V, VO = 0 IO Output current VCC = 15 V, VID = 1 V, 1V VO = 15 V VID = 1 V, 1 VO = 200 mV IOS ICC

LM2904 MIN TYP 3 1 MAX 7 10 2 4 7 2 2 50 300 50 150 10 20 0 to VCC 1.5 0 to VCC 2 VCC 1.5 22 23 26 27 25 15 50 65 65 80 80 100 120 20 10 10 5 30 12 40 40 0.7 1 60 1.2 2 20 30 dB dB dB mA mA mA mA A A mA mA 28 5 100 V/mV 20 mV 24 V 250 500 nA pA/C nA V/C mV UNIT

aV

IO

Average temperature coefficient of input offset voltage

IO

VICR

Common mode Common-mode input voltage range

25C RL = 2 k RL 10 k RL = 2 k RL 10 k Full range Full range Full range Full range Full range 25C Full range 25C 25C 25C 25C 25C Source Full range 25C Sink Full range Non-V device V-suffix device 25C 25C 25C Full range Full range

Non-V device V-suffix device

Short-circuit output current Supply current (two amplifiers)

VCC at 5 V, GND at 5 V, VO = 0 VO = 2.5 V, No load VCC = MAX, VO = 0.5 V, No load

All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for the LM2904, 32 V for the LM2904V, and 30 V for others. Full range is 55C to 125C for LM158, 25C to 85C for LM258, 0C to 70C for LM358, and 40C to 125C for LM2904. All typical values are at T = 25C. A

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS VCC = 5 V to 30 V, VIC = VICR(min), VO = 1.4 V TA 25C Full range LM158A MIN TYP MAX 2 4 MIN LM258A TYP 2 MAX 3 mV 4 UNIT

VIO

Input offset voltage Average temperature coefficient of input offset voltage Input offset current Average temperature coefficient of input offset current Input bias current

aV

IO

Full range

15*

15

V/C

IIO aI

VO = 1.4 V 14

25C Full range Full range

10 30

15 30

nA

IO

10

200

10

200

pA/C

IIB

VO = 1.4 V 14

25C Full range 25C 0 to VCC 1.5 0 to VCC 2 VCC 1.5 26 27

15

50 100 0 to VCC 1.5 0 to VCC 2 VCC 1.5 26

15

80 100

nA

VICR C

Common mode Common-mode input voltage range

VCC = 30 V Full range RL 2 k VCC = 30 V RL 10 k VCC = 15 V, VO = 1 V to 11 V V, RL 2 k RL = 2 k RL 10 k 25C Full range Full range Full range 25C Full range 25C

VOH

High-level High level output voltage Low-level output voltage Large-signal differential voltage amplification Common-mode rejection ratio Supply-voltage rejection ratio (VDD/VIO) Crosstalk attenuation

V 28 5 20 mV

28 5 20

27

VOL AVD CMRR

50 25 70

100

50 25

100 V/mV

80

70

80

dB

kSVR VO1/VO2

25C

65

100

65

100

dB

f = 1 kHz to 20 kHz VCC = 15 V, VID = 1 V, V VO = 0

25C 25C 20 10 10 5 12

120 30 60 20 10

120 30 60

dB

Source Full range 25C Full range 25C 25C Full range Full range mA 20 10 5 30 40 0.7 1 60 1.2 2 12 30 40 0.7 1 60 1.2 2 mA A mA 20

IO

Output current

VCC = 15 V, Sink VID = 1 V, 1V VO = 15 VID = 1 V, VO = 200 mV VCC at 5 V, GND at 5 V, VO = 0 VO = 2.5 V, No load VCC = MAX, VO = 0.5 V, No load

IOS

Short-circuit output current Supply current (two amplifiers)

ICC

*On products compliant to MIL-PRF-38535, this parameter is not production tested. All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V CC for testing purposes is 26 V for LM2904 and 30 V for others. Full range is 55C to 125C for LM158A, 25C to 85C for LM258A, and 0C to 70C for LM358A. All typical values are at T = 25C. A

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS VCC = 5 V to 30 V, VIC = VICR(min), VO = 1.4 V TA 25C Full range Full range 25C IIO aI Input offset current Average temperature coefficient of input offset current Input bias current VO = 1.4 V 14 VO = 1.4 V 14 Full range Full range 25C IIB Full range 25C VICR Common-mode Common mode input voltage range VCC = 30 V Full range RL 2 k VOH VOL AVD CMRR kSVR VO1/VO2 High level High-level output voltage Low-level output voltage Large signal Large-signal differential voltage amplification Common-mode rejection ratio Supply-voltage rejection ratio (VDD/VIO) Crosstalk attenuation f = 1 kHz to 20 kHz VCC = 15 V, VID = 1 V, V VO = 0 IO Output current VCC = 15 V, VID = 1 V, 1V VO = 15 V Source Full range 25C Sink Full range 25C 25C Full range Full range 5 30 40 0.7 1 60 1.2 2 A mA mA 10 mA 10 20 VCC = 30 V RL 10 k VCC = 15 V, VO = 1 V to 11 V, RL 2 k RL = 2 k RL 10 k 25C Full range Full range Full range 25C Full range 25C 25C 25C 25C 20 25 15 65 65 80 100 120 30 60 0 to VCC 1.5 0 to VCC 2 VCC 1.5 26 27 28 5 100 V/mV dB dB dB 20 mV V 10 15 7 2 LM358A MIN TYP 2 MAX 3 5 20 30 75 300 100 200 nA nA pA/C mV V/C UNIT

VIO aV

Input offset voltage Average temperature coefficient of input offset voltage

IO

IO

VID = 1 V, VO = 200 mV IOS ICC

Short-circuit output current Supply current (two amplifiers)

VCC at 5 V, GND at 5 V, VO = 0 VO = 2.5 V, No load VCC = MAX, VO = 0.5 V, No load

All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for LM2904 and 30 V for others. Full range is 55C to 125C for LM158A, 25C to 85C for LM258A, and 0C to 70C for LM358A. All typical values are at T = 25C. A

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS
SLOS068R JUNE 1976 REVISED JULY 2010

operating conditions, VCC = 15 V, TA = 25C

PARAMETER SR B1 Vn Slew rate at unity gain Unity-gain bandwidth Equivalent input noise voltage TEST CONDITIONS RL = 1 M, CL = 30 pF, VI = 10 V (see Figure 1) RL = 1 M, CL = 20 pF (see Figure 1) RS = 100 , VI = 0 V, f = 1 kHz (see Figure 2) TYP 0.3 0.7 40 UNIT V/s MHz nV/Hz

VCC+ VI + VCC CL RL VO

Figure 1. Unity-Gain Amplifier

900 VCC+ RS + VCC VO

100 VI = 0 V

Figure 2. Noise-Test Circuit

10

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

16-Aug-2012

PACKAGING INFORMATION
Orderable Device 5962-87710012A 5962-8771001PA 5962-87710022A 5962-8771002PA LM158AFKB LM158AJG LM158AJGB LM158FKB LM158JG LM158JGB LM258AD LM258ADE4 LM258ADG4 LM258ADGKR LM258ADGKRG4 LM258ADR LM258ADRE4 LM258ADRG4 LM258AP LM258APE4 LM258D LM258DE4 Status
(1)

Package Type Package Drawing LCCC CDIP LCCC CDIP LCCC CDIP CDIP LCCC CDIP CDIP SOIC SOIC SOIC VSSOP VSSOP SOIC SOIC SOIC PDIP PDIP SOIC SOIC FK JG FK JG FK JG JG FK JG JG D D D DGK DGK D D D P P D D

Pins 20 8 20 8 20 8 8 20 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 1 1 1 1 1 1 1 1 1 1 75 75 75 2500 2500 2500 2500 2500 50 50 75 75

Eco Plan TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

(2)

Lead/ Ball Finish Call TI Call TI Call TI Call TI A42 A42 A42 A42

MSL Peak Temp Call TI Call TI Call TI Call TI N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

POST-PLATE N / A for Pkg Type

POST-PLATE N / A for Pkg Type

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

16-Aug-2012

Orderable Device LM258DG4 LM258DGKR LM258DGKRG4 LM258DR LM258DRE4 LM258DRG3 LM258DRG4 LM258P LM258PE4 LM2904AVQDR LM2904AVQDRG4 LM2904AVQPWR LM2904AVQPWRG4 LM2904D LM2904DE4 LM2904DG4 LM2904DGKR LM2904DGKRG4 LM2904DR

Status

(1)

Package Type Package Drawing SOIC VSSOP VSSOP SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC TSSOP TSSOP SOIC SOIC SOIC VSSOP VSSOP SOIC D DGK DGK D D D D P P D D PW PW D D D DGK DGK D

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 75 2500 2500 2500

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM

2500 2500 50 50 2500 2500 2000 2000 75 75 75 2500 2500 2500

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 2

PACKAGE OPTION ADDENDUM

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16-Aug-2012

Orderable Device LM2904DRE4 LM2904DRG3 LM2904DRG4 LM2904P LM2904PE4 LM2904PSR LM2904PSRE4 LM2904PSRG4 LM2904PW LM2904PWE4 LM2904PWG4 LM2904PWLE LM2904PWR LM2904PWRG3 LM2904QD LM2904QDR LM2904QDRG4 LM2904QP LM2904VQDR LM2904VQDRG4

Status

(1)

Package Type Package Drawing SOIC SOIC SOIC PDIP PDIP SO SO SO TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP SOIC SOIC SOIC PDIP SOIC SOIC D D D P P PS PS PS PW PW PW PW PW PW D D D P D D

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 2500 2500 2500 50 50 2000 2000 2000 150 150 150

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

2000 2000

CU NIPDAU Level-1-260C-UNLIM CU SN Call TI Level-1-260C-UNLIM Call TI

2500 2500

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

2500 2500

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 3

PACKAGE OPTION ADDENDUM

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16-Aug-2012

Orderable Device LM2904VQPWR LM2904VQPWRG4 LM358AD LM358ADE4 LM358ADG4 LM358ADGKR LM358ADGKRG4 LM358ADR LM358ADRE4 LM358ADRG4 LM358AP LM358APE4 LM358APW LM358APWE4 LM358APWG4 LM358APWR LM358APWRE4 LM358APWRG4 LM358D

Status

(1)

Package Type Package Drawing TSSOP TSSOP SOIC SOIC SOIC VSSOP VSSOP SOIC SOIC SOIC PDIP PDIP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP SOIC PW PW D D D DGK DGK D D D P P PW PW PW PW PW PW D

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 2000 2000 75 75 75 2500 2500 2500 2500 2500 50 50 150 150 150 2000 2000 2000 75

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

16-Aug-2012

Orderable Device LM358DE4 LM358DG4 LM358DGKR LM358DGKRG4 LM358DR LM358DRE4 LM358DRG3 LM358DRG4 LM358P LM358PE3 LM358PE4 LM358PSLE LM358PSR LM358PSRE4 LM358PSRG4 LM358PW LM358PWE4 LM358PWG4 LM358PWLE LM358PWR

Status

(1)

Package Type Package Drawing SOIC SOIC VSSOP VSSOP SOIC SOIC SOIC SOIC PDIP PDIP PDIP SO SO SO SO TSSOP TSSOP TSSOP TSSOP TSSOP D D DGK DGK D D D D P P P PS PS PS PS PW PW PW PW PW

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 75 75 2500 2500 2500 2500 2500 2500 50 50 50 2000 2000 2000 150 150 150

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU SN Call TI N / A for Pkg Type Call TI CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

2000

CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 5

PACKAGE OPTION ADDENDUM

www.ti.com

16-Aug-2012

Orderable Device LM358PWRE4 LM358PWRG3 LM358PWRG4

Status

(1)

Package Type Package Drawing TSSOP TSSOP TSSOP PW PW PW

Pins 8 8 8

Package Qty 2000 2000 2000

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM258A, LM2904 :

Automotive: LM2904-Q1 Enhanced Product: LM258A-EP

Addendum-Page 6

PACKAGE OPTION ADDENDUM

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16-Aug-2012

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 7

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing VSSOP VSSOP SOIC SOIC VSSOP VSSOP SOIC SOIC SOIC SOIC TSSOP VSSOP VSSOP SOIC SOIC SOIC SOIC SO DGK DGK D D DGK DGK D D D D PW DGK DGK D D D D PS 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 16.4 5.3 5.3 6.4 6.4 5.3 5.3 6.4 6.4 6.4 6.4 7.0 5.3 5.3 6.4 6.4 6.4 6.4 8.2

B0 (mm) 3.4 3.4 5.2 5.2 3.4 3.4 5.2 5.2 5.2 5.2 3.6 3.4 3.4 5.2 5.2 5.2 5.2 6.6

K0 (mm) 1.4 1.4 2.1 2.1 1.4 1.4 2.1 2.1 2.1 2.1 1.6 1.4 1.4 2.1 2.1 2.1 2.1 2.5

P1 (mm) 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 12.0

W Pin1 (mm) Quadrant 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 16.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1

LM258ADGKR LM258ADGKR LM258ADR LM258ADR LM258DGKR LM258DGKR LM258DR LM258DR LM258DRG4 LM258DRG4 LM2904AVQPWR LM2904DGKR LM2904DGKR LM2904DR LM2904DR LM2904DRG4 LM2904DRG4 LM2904PSR

2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2000 2500 2500 2500 2500 2500 2500 2000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Device

Package Package Pins Type Drawing TSSOP TSSOP TSSOP SOIC TSSOP VSSOP VSSOP SOIC SOIC TSSOP TSSOP TSSOP VSSOP VSSOP SOIC SOIC SOIC SOIC SO TSSOP TSSOP TSSOP TSSOP PW PW PW D PW DGK DGK D D PW PW PW DGK DGK D D D D PS PW PW PW PW 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 16.4 12.4 12.4 12.4 12.4 7.0 7.0 7.0 6.4 7.0 5.3 5.3 6.4 6.4 7.0 7.0 7.0 5.3 5.3 6.4 6.4 6.4 6.4 8.2 7.0 7.0 7.0 7.0

B0 (mm) 3.6 3.6 3.6 5.2 3.6 3.4 3.4 5.2 5.2 3.6 3.6 3.6 3.4 3.4 5.2 5.2 5.2 5.2 6.6 3.6 3.6 3.6 3.6

K0 (mm) 1.6 1.6 1.6 2.1 1.6 1.4 1.4 2.1 2.1 1.6 1.6 1.6 1.4 1.4 2.1 2.1 2.1 2.1 2.5 1.6 1.6 1.6 1.6

P1 (mm) 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 12.0 8.0 8.0 8.0 8.0

W Pin1 (mm) Quadrant 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 16.0 12.0 12.0 12.0 12.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1

LM2904PWR LM2904PWR LM2904PWRG3 LM2904QDR LM2904VQPWR LM358ADGKR LM358ADGKR LM358ADR LM358ADR LM358APWR LM358APWR LM358APWRG4 LM358DGKR LM358DGKR LM358DR LM358DR LM358DRG4 LM358DRG4 LM358PSR LM358PWR LM358PWR LM358PWRG3 LM358PWRG4

2000 2000 2000 2500 2000 2500 2500 2500 2500 2000 2000 2000 2500 2500 2500 2500 2500 2500 2000 2000 2000 2000 2000

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

*All dimensions are nominal

Device LM258ADGKR LM258ADGKR LM258ADR LM258ADR LM258DGKR LM258DGKR LM258DR LM258DR LM258DRG4 LM258DRG4 LM2904AVQPWR LM2904DGKR LM2904DGKR LM2904DR LM2904DR LM2904DRG4 LM2904DRG4 LM2904PSR LM2904PWR LM2904PWR

Package Type VSSOP VSSOP SOIC SOIC VSSOP VSSOP SOIC SOIC SOIC SOIC TSSOP VSSOP VSSOP SOIC SOIC SOIC SOIC SO TSSOP TSSOP

Package Drawing DGK DGK D D DGK DGK D D D D PW DGK DGK D D D D PS PW PW

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

SPQ 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2000 2500 2500 2500 2500 2500 2500 2000 2000 2000

Length (mm) 332.0 364.0 340.5 367.0 364.0 332.0 340.5 367.0 340.5 367.0 367.0 332.0 364.0 367.0 340.5 340.5 367.0 367.0 367.0 364.0

Width (mm) 358.0 364.0 338.1 367.0 364.0 358.0 338.1 367.0 338.1 367.0 367.0 358.0 364.0 367.0 338.1 338.1 367.0 367.0 367.0 364.0

Height (mm) 35.0 27.0 20.6 35.0 27.0 35.0 20.6 35.0 20.6 35.0 35.0 35.0 27.0 35.0 20.6 20.6 35.0 38.0 35.0 27.0

Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Device LM2904PWRG3 LM2904QDR LM2904VQPWR LM358ADGKR LM358ADGKR LM358ADR LM358ADR LM358APWR LM358APWR LM358APWRG4 LM358DGKR LM358DGKR LM358DR LM358DR LM358DRG4 LM358DRG4 LM358PSR LM358PWR LM358PWR LM358PWRG3 LM358PWRG4

Package Type TSSOP SOIC TSSOP VSSOP VSSOP SOIC SOIC TSSOP TSSOP TSSOP VSSOP VSSOP SOIC SOIC SOIC SOIC SO TSSOP TSSOP TSSOP TSSOP

Package Drawing PW D PW DGK DGK D D PW PW PW DGK DGK D D D D PS PW PW PW PW

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

SPQ 2000 2500 2000 2500 2500 2500 2500 2000 2000 2000 2500 2500 2500 2500 2500 2500 2000 2000 2000 2000 2000

Length (mm) 364.0 367.0 367.0 332.0 364.0 367.0 340.5 367.0 364.0 367.0 364.0 332.0 340.5 367.0 340.5 367.0 367.0 364.0 367.0 364.0 367.0

Width (mm) 364.0 367.0 367.0 358.0 364.0 367.0 338.1 367.0 364.0 367.0 364.0 358.0 338.1 367.0 338.1 367.0 367.0 364.0 367.0 364.0 367.0

Height (mm) 27.0 35.0 35.0 35.0 27.0 35.0 20.6 35.0 27.0 35.0 27.0 35.0 20.6 35.0 20.6 35.0 38.0 27.0 35.0 27.0 35.0

Pack Materials-Page 4

MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997

JG (R-GDIP-T8)
0.400 (10,16) 0.355 (9,00) 8 5

CERAMIC DUAL-IN-LINE

0.280 (7,11) 0.245 (6,22)

4 0.065 (1,65) 0.045 (1,14)

0.063 (1,60) 0.015 (0,38)

0.020 (0,51) MIN

0.310 (7,87) 0.290 (7,37)

0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN

0.023 (0,58) 0.015 (0,38) 0.100 (2,54) 0.014 (0,36) 0.008 (0,20)

015

4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE
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