Model Gallery

Copper Deposition In A Trenchh

Model ID: 2112

This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track of the deformation of the mesh. Furthermore, electrochemical reaction kinetics through use of the Butler-Volmer equation for copper deposition are freely entered at the boundaries. The model is inherently time-dependent and results clearly
ELECTRODEPOSITION: This model demonstrates the effect of a moving boundary in the application of copper electrodeposition on circuit boards. The model is timedependent and results clearly show that the mouth of the trench narrows, due to the non-uniform deposition of the copper.

show that the mouth of the trench narrows, due to nonuniform deposition of the copper. In addition, the simulation shows a substantial variation in copper ion concentration along the length of the trench. Such effects can be detrimental to the quality of the deposition, create corrosion possibilities, and lead to material waste.
> REQUEST FOR MODEL INFORMATION

Secondary Current Distribution In A Zinc Electrowinning Cell

electrowinning cell.

Model ID: 10188

This is a model of the secondary current distribution in a zinc

The model investigates the impact on the current distribution when changing the electrode alignment in a parametric
Electrolyte current density displacement of +40 mm distribution for a cathode

study. The geometry is in 2D..

> REQUEST FOR MODEL INFORMATION

Electrode Growth Next To An Insulator

Model ID: 10212

This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator.

> REQUEST FOR MODEL INFORMATION Electrolyte potential (surface) and electrolyte current direction (arrows) at t=96 h.

Decorative Plating

Model ID: 10320

Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by dissolution of the anode surface.

> REQUEST FOR MODEL INFORMATION DECORATIVE ELECTROPLATING In this example, the anode is planar and dissolves, while the cathode is a furniture fitting that is to be decorated by the dissolved metal