What is MEMS Technology?

Micro-Electro-Mechanical Systems (MEMS) is the integration of

mechanical elements, sensors, actuators, and electronics on a
common silicon substrate through microfabrication technology.
While the electronics are fabricated using integrated circuit (IC)
process sequences (e.g., CMOS, Bipolar, or BICMOS processes),
the micromechanical components are fabricated using compatible
"micromachining" processes that selectively etch away parts of the
silicon wafer or add new structural layers to form the mechanical
and electromechanical devices.

MEMS promises to revolutionize nearly every product category by

bringing together silicon-based microelectronics with
micromachining technology, making possible the realization of
complete systems-on-a-chip. MEMS is an enabling technology
allowing the development of smart products, augmenting the
computational ability of microelectronics with the perception and
control capabilities of microsensors and microactuators and
expanding the space of possible designs and applications.

Microelectronic integrated circuits can be thought of as the "brains"

of a system and MEMS augments this decision-making capability
with "eyes" and "arms", to allow microsystems to sense and control
the environment. Sensors gather information from the environment
through measuring mechanical, thermal, biological, chemical,
optical, and magnetic phenomena. The electronics then process
the information derived from the sensors and through some
decision making capability direct the actuators to respond by
moving, positioning, regulating, pumping, and filtering, thereby
controlling the environment for some desired outcome or purpose.
Because MEMS devices are manufactured using batch fabrication
techniques similar to those used for integrated circuits,
unprecedented levels of functionality, reliability, and sophistication
can be placed on a small silicon chip at a relatively low cost.

Applications
Commercial applications include:

• Inkjet printers, which use piezoelectrics or thermal bubble ejection

to deposit ink on paper.
• Accelerometers in modern cars for a large number of purposes
including airbag deployment in collisions.
• Accelerometers in consumer electronics devices such as game
controllers (Nintendo Wii), personal media players / cell phones
(Apple iPhone )[9] and a number of Digital Cameras (various Canon
Digital IXUS models). Also used in PCs to park the hard disk head
when free-fall is detected, to prevent damage and data loss.
• MEMS gyroscopes used in modern cars and other applications to
detect yaw; e.g. to deploy a roll over bar or trigger dynamic
stability control.
• Silicon pressure sensors e.g. car tire pressure sensors, and
disposable blood pressure sensors.
• Displays e.g. the DMD chip in a projector based on DLP
technology has on its surface several hundred thousand
micromirrors.
• Optical switching technology which is used for switching
technology and alignment for data communications.
• Bio-MEMS applications in medical and health related technologies
from Lab-On-Chip to MicroTotalAnalysis (biosensor,
chemosensor).
• Interferometric modulator display (IMOD) applications in
consumer electronics (primarily displays for mobile devices). Used
to create interferometric modulation - reflective display technology
as found in mirasol displays.

Companies with strong MEMS programs come in many sizes. The larger
firms specialize in manufacturing high volume inexpensive components
or packaged solutions for end markets such as automobiles, biomedical,
and electronics. The successful small firms provide value in innovative
solutions and absorb the expense of custom fabrication with high sales
margins. In addition, both large and small companies work in R&D to
explore MEMS technology.

What are Microsystems / MEMS?

MEMS is an abbreviation for Micro Electro Mechanical

Systems. This is a rapidly emerging technology combining
electrical, electronic, mechanical, optical, material,
chemical, and fluids engineering disciplines. As the
smallest commercially produced "machines", MEMS
devices are similar to traditional sensors and actuators
although much, much smaller. e.g. Complete systems are
typically a few millimeters across, with individual features
devices of the order of 1-100 micrometers across.

MEMS devices are manufactured either using processes

based on Integrated Circuit fabrication techniques and
materials, or using new emerging fabrication technologies
such as micro injection molding. These former processes
involve building the device up layer by layer, involving
several material deposition and etch steps. A typical MEMS
fabrication technology may have a 5 step process. Due to
the limitations of this "traditional IC" manufacturing
process MEMS devices are substantially planar, having
very low aspect ratios (typically 5 -10 micro meters thick).
It is important to note that there are several evolving
fabrication techniques that allow higher aspect ratios such
as deep x-ray lithography, electrodeposition, and micro
injection molding.

MEMS devices are typically fabricated onto a substrate

(chip) that may also contain the electronics required to
interact with the MEMS device. Due to the small size and
mass of the devices, MEMS components can be actuated
electrostatically (piezoelectric and bimetallic effects can
also be used). The position of MEMS components can also
be sensed capacitively. Hence the MEMS electronics
include electrostatic drive power supplies, capacitance
charge comparators, and signal conditioning circuitry.
Connection with the macroscopic world is via wire bonding
and encapsulation into familiar BGA, MCM, surface mount,
or leaded IC packages.

A common MEMS actuator is the "linear comb drive"

(shown above) which consists of rows of interlocking
teeth; half of the teeth are attached to a fixed "beam",
the other half attach to a movable beam assembly. Both
assemblies are electrically insulated. By applying the
same polarity voltage to both parts the resultant
electrostatic force repels the movable beam away from
the fixed. Conversely, by applying opposite polarity the
parts are attracted. In this manner the comb drive can be
moved "in" or "out" and either DC or AC voltages can be
applied. The small size of the parts (low inertial mass)
means that the drive has a very fast response time
compared to its macroscopic counterpart. The magnitude
of electrostatic force is multiplied by the voltage or more
commonly the surface area and number of teeth.
Commercial comb drives have several thousand teeth,
each tooth approximately 10 micro meters long. Drive
voltages are CMOS levels.

The linear push / pull motion of a comb drive can be

converted into rotational motion by coupling the drive to
push rod and pinion on a wheel. In this manner the comb
drive can rotate the wheel in the same way a steam
engine functions!

Microelectromechanical systems description

MEMS technology can be implemented using a number of different
materials and manufacturing techniques; the choice of which will depend
on the device being created and the market sector in which it has to
operate.

Silicon
Silicon is the material used to create most integrated circuits used in
consumer electronics in the modern world. The economies of scale, ready
availability of cheap high-quality materials and ability to incorporate
electronic functionality make silicon attractive for a wide variety of
MEMS applications. Silicon also has significant advantages engendered
through its material properties. In single crystal form, silicon is an almost
perfect Hookean material, meaning that when it is flexed there is virtually
no hysteresis and hence almost no energy dissipation. As well as making
for highly repeatable motion, this also makes silicon very reliable as it
suffers very little fatigue and can have service lifetimes in the range of
billions to trillions of cycles without breaking. The basic techniques for
producing all silicon based MEMS devices are deposition of material
layers, patterning of these layers by photolithography and then etching to
produce the required shapes.
 Polymers

Even though the electronics industry provides an economy of scale for

the silicon industry, crystalline silicon is still a complex and relatively
expensive material to produce. Polymers on the other hand can be
produced in huge volumes, with a great variety of material
characteristics. MEMS devices can be made from polymers by processes
such as injection moulding, embossing or stereolithography and are
especially well suited to microfluidic applications such as disposable
blood testing cartridges.

Metals
Metals can also be used to create MEMS elements. While metals do not
have some of the advantages displayed by silicon in terms of mechanical
properties, when used within their limitations, metals can exhibit very
high degrees of reliability.

Metals can be deposited by electroplating, evaporation, and sputtering

processes.

Commonly used metals include gold, nickel, aluminum, chromium,

titanium, tungsten, platinum, and silver