DesigN Analysis - Infrastructure

Earl J. Lum
+1-650-430-2221
elum@ejlwireless.com

Ericsson RU22 W-CDMA 850MHz

Model KRC 118 22/1 R1D/B
May 2009

Entire contents 2009 EJL Wireless Research LLC. All Rights Reserved. Reproduction of this publication in any form without prior
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2009 EJL Wireless Research LLC. All Rights Reserved

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TABLE OF CONTENTS
EXECUTIVE SUMMARY ........................................................................5
Active/Passive Component Summary ..................................................................5
Important Note:...............................................................................................5
CHAPTER 1: RBS 3X0X SYSTEM ...........................................................6
1.1 Overview of Ericsson RBS 3000 Platform .......................................................6
CHAPTER 2: MECHANICAL ANALYSIS .......................................................7
2.1 Mechanical Analysis ....................................................................................7
CHAPTER 3: TRANSCEIVER SUBSYSTEM .................................................12
Area A: Transceiver Baseband Digital Processing................................................16
Area B: Transceiver Power Management ...........................................................18
Area C: Transceiver Tx Section ........................................................................20
Area D: Transceiver Rx Section........................................................................22
63 PA7F17 Synthesizer Module ........................................................................25
62 PA7F16 Synthesizer Module ........................................................................26
E268C Synthesizer Module ..............................................................................28
Area E: Master Signal Generation .....................................................................30
Area F: Transmit Sample Path for DPD..............................................................32
Area G: Secondary PLL ...................................................................................34
Area H: Hex Inverter ......................................................................................35
Area I: RF Rx/Serial Connectors.......................................................................36
CHAPTER 4: POWER AMPLIFIER SYSTEM.................................................39
Area J: Power Amplifier Power Management Section ...........................................42
Area K: Driver Amplifier Section.......................................................................45
Area L: High Power Output Amplifier Section .....................................................47
Area M: RF Output Conditioning Section............................................................49
APPENDIX A - PASSIVE CASE SIZE ANALYSIS...........................................51
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS .......................55

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2009 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

TABLES
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1: Area A Bill of Materials ..................................................................................................... 17

2: Area B Bill of Materials ..................................................................................................... 19
3: Area C Bill of Materials ..................................................................................................... 21
4: Area D1, D2 Bill of Materials ............................................................................................. 24
5: 63 PA7F17 Bill of Materials ............................................................................................... 27
6: 62 PA7F16 Bill of Materials ............................................................................................... 27
7: E268C Bill of Materials ..................................................................................................... 29
8: Area E Bill of Materials ..................................................................................................... 31
9: Area F Bill of Materials ..................................................................................................... 33
10: Area G Bill of Materials ................................................................................................... 37
11: Area H Bill of Materials ................................................................................................... 37
12: Area I Bill of Materials .................................................................................................... 38
13: Area J Bill of Materials .................................................................................................... 43
14: Area K Bill of Materials ................................................................................................... 46
15: Area L Bill of Materials.................................................................................................... 48
16: Area M Bill of Materials ................................................................................................... 50
17: Passive Component Case Size Distribution by System Subsection ........................................ 52
18: Identified Passive Component Supplier Distribution by System Subsection ............................ 53
19: Active/Passive Component Distribution by System Subsection ............................................. 54
20: Active Semiconductor Vendor Distribution by System Subsection......................................... 56
21: Active Semiconductor Vendor Distribution by System Subsection (cont) .............................. 57

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2009 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

EXHIBITS
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1: Generic First Generation W-CDMA Base Station Diagram ...................................................... 6

2: RU22 Front and Rear View ................................................................................................ 7
3: RU22 RF Shield External View ........................................................................................... 8
4: RU22 RF Shield Internal View............................................................................................ 8
5: RU22 Chassis, Internal View, TRx Side ...............................................................................9
6: RU22 Chassis, Internal View, Power Amplifier Side .............................................................. 9
7: RU22 Heat Sink Mechanical Dimensions, Side View ............................................................ 10
8: RU22 Heat Sink, Top View .............................................................................................. 10
9: RU22 Heat Sink, Bottom View ......................................................................................... 11
10: RU22 Transceiver System Printed Circuit Board (Top View) ............................................... 13
11: RU22 Transceiver System Printed Circuit Board (Bottom View) .......................................... 14
12: RU22 System Level Block Diagram................................................................................. 15
13: Area A Component Diagram .......................................................................................... 16
14: Area B Component Diagram .......................................................................................... 18
15: Area C Component Diagram .......................................................................................... 20
16: Rx Section Block Diagram ............................................................................................. 22
17: Area D2 Component Diagram ........................................................................................ 23
18: 63 PA7F17 Component Diagram .................................................................................... 25
19: 62 PA7F16 Component Diagram .................................................................................... 26
20: E268C Bill of Materials.................................................................................................. 28
21: Area E Component Diagram .......................................................................................... 30
22: Area F Component Diagram .......................................................................................... 32
23: Area G Component Diagram.......................................................................................... 34
24: Area H Component Diagram .......................................................................................... 35
25: Area I Component Diagram........................................................................................... 36
26: RU22 Power Amplifier System Printed Circuit Board (Top View) ......................................... 39
27: RU22 Power Amplifier System Printed Circuit Board (Bottom View) .................................... 40
28: RU22 Tx Chain Block Diagram ....................................................................................... 41
29: Area J Component Diagram........................................................................................... 42
30: Area K Component Diagram .......................................................................................... 45
31: Area L Component Diagram .......................................................................................... 47
32: Area M Component Diagram.......................................................................................... 49
33: Passive Component Case Size Distribution ...................................................................... 51
34: Identified Passive Component Market Share by Vendor..................................................... 54
35: Active Semiconductor Component Share......................................................................... 55
36: Active Semiconductor Market Share by Vendor................................................................ 58
37: High Pin Count (64+) Active Semiconductor Market Share by Vendor................................. 58

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2009 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com