the product:

A world class lead free, high reliability water soluble paste offering best in class printing, resistance to BGA voids and cleanability.

ALPHA WS-819 Solder Paste

product guide

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

A world class lead free, high reliability water soluble paste offering best in class printing, resistance to BGA voids and cleanability.

Welcome to the ALPHA WS-819 Product Guide

CONTENTS 1. Introduction 2. Performance Summary 3. Print Performance 4. Reflow Performance 5. Post Reflow Cleaning 6 . Shelf Life 7. Summary 8. Technical Bulletin 9. MSDS 3 4 5-9 10 - 19 20 - 22 23 24 - 26 27 - 30 31 - 36

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

Introduction

Introducing ALPHA WS-819,

the state of the art in Water Soluble, Lead Free Solder Paste.
Water soluble solder pastes are commonly used for high reliability medical, military and telecom infrastructure applications. Until now, high reliability has had a price-namely poor resistance to variations in temperature and humidity in the print process, and poor resistance to BGA voiding. WS-819 was developed to offer the widest possible print process window, with consistent high print deposit volumes, IPC Class III resistance to voiding, and ease of cleanability in a ORH0 class solder paste. As with all Alpha brand products, WS-819 comes with complete process and product support whenever and however you need us. Its the kind of support you would expect from a company thats remained dedicated to serving the needs of the Global circuit assembly market for over 50 years.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

Performance Summary
WS-819 Performance Capability Excellent print definition and consistant volumetric performance Fine Feature Print to 0.30mm (12 mil) circles and 0.4mm (16 mil) pitch rectangular Performance QFP pads. Stencil Life 8 hours at 35-65% Relative Humidity Capable of printing in temperatures from 20C to 28C at Humidity/Temperature Window Relative Humidities of 50% +-15% (35% to 65%) Print Process Window 3 to 10 prints per wipe, depending on smallest feature printed, Stencil Cleaning Frequency and use of apeture reduction and stencil thickness Print Speed Range Solder Spread Resistance to Voids Reflow Yield Resistance to Hot and Cold Slump Reflow Process Window Residue Cleaning Cleanability Post Reflow J-STD-004 Classification Halide Content 25mm/second to 100mm/second (1 inch/second to 4 inches/second) down to 0.30mm (12 mil) circles and .4mm (16 mil) pitch QFP pads. Optimal results found at 100mm/second. 88.6% (Average) per JIS-Z-3197:1999 8.3.1.1 Exceeds requirements of IPC 7095 Class lll using soak and ramp reflow profiles on OSP, Immersion Tin, Immersion Silver and ENIG finishes. Exceeds the requirements of IPC J-STD-005. No slump at 0.2mm gap per JIS-Z-3284. Straight Ramp, or <60 second soak profile in air. Nitrogen recommended for longer (>60 second) soak profiles. Meets IPC requirements over range of cleaning temperatures and water pressures, using DI water without additives. Meets/Exceeds IPC Bellcore and HP EL-EN861-00 Requirements ORH0 Halide Free SMT Process Step Performance Indicator

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

8 Hour Stencil Life at High Humidity (66% RH @ 27C)
PWS0608A #70329576 - 8hr Stencil Life Volume Chart
BGA56-12 (12 mil Circles)

PWS0608A #70329576 - 8hr Stencil Life Volume Chart

BGA36 (15 mil Circles)
Condition 80F/65-67% RH

600 500 400

Theoretical Volume (565 cubic mils)

900 800 700 600

Theoretical Volume (884 cubic mils)

Condition 80F/65-67% RH

Volume

Volume

300 200 100 0 Time Condition

500 400 300 200 100

55% Trans Effi ciency

50% Trans Effi ciency

T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 80F/65-67% RH

0 Time Condition

T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 80F/65-67% RH

PWS0608A #70329576 - 8hr Stencil Life Volume Chart

QFP120-1 (16 mil pitch QFP deposits, 63x10x5 mils)

PWS0608A #70329576 - 8hr Stencil Life Volume Chart

BGA256 (20 mil Circles)
Condition 80F/65-67% RH

3500
Theoretical Volume (3150 cubic mils)

1600 1400 1200

Theoretical Volume (1571 cubic mils)

Condition 80F/65-67% RH

3000 2500

70% Trans Effi ciency

60% Trans Effi cie

Volume

2000 1500 1000 500 0 Time Condition

Volume

1000 800 600 400 200

T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 80F/65-67% RH

0 Time Condition

T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 80F/65-67% RH

PWS-0608A was the pre-commercial laboratory name for WS-819

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

8 Hour Stencil Life at Low Humidity (23% RH @ 29C)
PWS0608A #70329576 - 8hr Stencil Life Volume Chart
BGA56-12 (12 mil Circles)

PWS0608A #70329576 - 8hr Stencil Life Volume Chart

BGA36 (15 mil Circles)

600 500 400

Theoretical Volume (565 cubic mils)

Condition 81-94F/23-25% RH

900 800 700 600

Theoretical Volume (884 cubic mils)

Condition 81-94F/23-25% RH

Volume

Volume

300 200 100 0 Time Condition

500 400 300 200 100

55% Trans Effi ciency

50% Trans Effi ciency

T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 81-94F/23-25% RH

0 Time Condition

T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 81-94F/23-25% RH

PWS0608A #70329576 - 8hr Stencil Life Volume Chart

QFP120-2 (16 mil pitch QFP deposits, 56.7x9x5 mils)

PWS0608A #70329576 - 8hr Stencil Life Volume Chart

BGA256 (20 mil Circles)

2500 2000

Theoretical Volume (2552 cubic mils)

Condition 81-94F/23-25% RH

1800 1600 1400 1200

Theoretical Volume (1571 cubic mils)

Condition 81-94F/23-25% RH

Volume

1500 1000 500 0 Time Condition

60% Trans Effi ci ency

Volume

1000 800 600 400 200

70% Trans Effi ciency

T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 81-94F/23-25% RH

0 Time Condition

T-0hr T-1hr T-2hr T-3hr T-4hr T-5hr T-6hr T-7hr T-8hr 81-94F/23-25% RH

PWS-0608A was the pre-commercial laboratory name for WS-819

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

Fine Feature Print Performance
1 inch (25mm) 4 inches (100 mm)/second1
PWS0608A #70329576 - Volume Repeatability Chart
BGA56-12 (12 mil Circles)
Print Process Window

600 500 400

Theoretical Volume (565 cubic mils)

Print Speed 1 inch/sec. 2 inches/sec. 4 inches/sec.

Volume

300 200 100 0 Board Print Speed

50% Trans Effi ciency

2 3 4 1 inch/sec.

2 3 4 2 inches/sec.

1 2 3 4 4 inches/sec.

1) 5 mil laser cut stencil

PWS-0608A was the pre-commercial laboratory name for WS-819
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

IPC Tack Test IPC TM-650 2.4.44
Print Process Window

Tack Strength (g / sq mm)

Time Initial 16 hr 24 hr 25% RH 2.8 3.3 3.4 50% RH 2.8 3.0 3.1 75% RH 2.8 2.3 3.0

Tack < 1 unit over 16 hours at all RH

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

Wipe Frequency
Number of Print Strokes between Stencil Cleaning Step
Paste: ALPHA PWSO608A Lot Number:
70329576

Print Process Window

Solder Paste - Wipe Freqency.

Print Parameters: 1 in/s, 1.25 lbs/inch, 0.02 in/s Number of Bridges Board Set 1 QFP Device
Prints 1 2 3 4 5 6 7 8 9 10 16 (100%) 0 0 0 1 1 0 3 0 2 0 16 (90%) 0 0 0 0 0 0 0 0 0 0 20 (100%) 0 0 0 2 0 0 0 0 0 0 20 (90%) 0 0 0 0 0 0 0 0 0 0 Prints 1 2 3 4 5 6 7 8 9 10 16 (100%) 0 0 0 0 0 >10 0 0 0 0

Number of Bridges Board Set 2 QFP Device

16 (90%) 0 0 0 0 0 0 0 0 0 0 20 (100%) 0 0 0 0 0 0 0 0 0 0 20 (90%) 0 0 0 0 0 0 0 0 0 0

Inside Printer Temperature: Relative Humidity: 80*F 40 % RH Temperature: Relative Humidity:

Inside Printer 80 F 40 % RH

PWS-0608A was the pre-commercial laboratory name for WS-819

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

WS-819 solder paste

Reflow Process Guidelines
Parameter
Atmosphere Reflow Reflow Yield Yield

Guideline
Air (Straight Ramp or < 60 Second Soak) N2 for soak profiles >60 seconds up to 180 seconds SAC305: 217 220 SAC405: 217 225

Additional Information
Mass production verification both in air and N2.

SnAgCu alloy melting ranges. Lower temperature=solidus; higher temperature = liquidus

Use for reflow above liquidus setting

Profile General Guideline (Typical for SAC305)

Setting Zone 40oC to 220oC 130oC to 220oC 170oC to 220oC TAL (220oC) Peak temp. Optimal Dwell Period 105 to 180 seconds 90- 100 seconds 60 seconds 45 - 90 seconds < 240oC for standard OSP finish Extended window <210 seconds <135 seconds <90 seconds 30-90 seconds. <250C For Entek HT, Immersion Silver, Immersion Tin or ENIG finishes

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Reflow Yield

Ramp Profile 1: 0.7C/s 235C Peak 60s TAL

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Reflow Yield

Ramp Profile 2: 1.5C/s 240C Peak 60s TAL

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Reflow Yield Soak Reflow Profile: 175C/60s Soak 240C Peak 60s TAL (Nitrogen Required for Longer Soak Profiles)

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Spread Test Method
JIS-Z-3197:1999 8.3.1.1
Polish the surface of phosphor deoxidized copper plate (50500.5mm) with #500 polishing paper applying drops of alcohol. Wash the surface with alcohol and cool in room temperature. Subject to oxidizing treatment in a dryer set at 150 for 1 hour. Put approx. 0.3g of solder paste on the center of the copper plate and weigh with high accuracy. Place the test panel onto the surface of melted solder in a solder bath set at 250. Keep heating for 30sec. after the solder melts. Remove the flux residues from the test panels with solvent. Measure the height of solder with a micrometer and calculate the spreading rate from the following formula. S[(D-H)/D] 100 . S: Spreading Rate(%) H: Height of Spreading Solder (mm) D: Diameter of Solder assuming it as a sphere (mm) D 1.24 V 1/3 V: Mass / Specific Gravity of Solder
Reflow Yield

3Apparatus Solder Bath POT-200C

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Reflow Yield

Result: 88.6% Spread

Density of Solder Alloy [g/cm] 7.4 A. Weight of Paste Weight of Solder Height of Solder Spreading Rate Average [g] [g] [mm] [%] [%] 0.3206 0.2853 0.384 90.8% 0.3174 0.2825 0.441 89.4% 0.3751 0.3338 0.494 88.8% 88.6% 0.3052 0.2716 0.639 84.5% 0.3332 0.2965 0.442 89.6%

Sample #1 #2 #3 #4 #5

#1

#2

#3

#4

#5

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Reflow Yield

Reflow Yield: Application Note

Definition of Voiding Performance
Solder Outline Void Outlines Location of Void Void in Solder (Solder Sphere) Void at interface of Solder (Sphere) and Substrate Class I 60% of diameter = 36% of Area 50% of diameter = 25% of Area Class II 42% of diameter = 20.25% of Area 25% of diameter = 12.25% of Area Class III 30% of diameter = 9% of Area 0.1d 20% of diameter = 4% of Area 0.25d

Example: Total Void Diameter 0.10d +0.25d = 0.35d

IPC Criteria for Voids in BGAs, IPC 7095 7.4.1.6

The IPC criteria provide three classes of acceptance for both the solder sphere and the sphere-pad interface. Where multiple voids exist, the dimensions will be added to calculate total voiding in the joint.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Voiding Performance
Void Size Distribution BGA256 100.00% 90.00% 80.00% 70.00% % of Joints 60.00% 50.00% 40.00% 30.00% 20.00% 10.00% 0.00% ZERO 0-4% 4-8% 8-12% % of Joint area 12-16% 16-20% >20% WS-819 89.5 M17 Cerf HS 160/60 soak 240Cp WS-819 89.5 M17 Cerf St.Ramp 0.7C_S 235Cp.
Reflow Yield

WS-819 Meets Criteria for Class lll Voiding Using Soak or Ramp Profile Per IPC 7095 7.4.1.6
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Reflow Yield

Solder Balling Resistance IPC TM-650 Method 2.4.43

Initial

After 4 Hr. @ 25C, 50% RH

Both Preferred per IPC Standard

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Reflow Yield

Slump Resistance IPC TM-650 2.4.35

Cold Slump 25C / 50% / 75% RH Pad Size Largest Gap Bridged IPC max gap bridge allowed 00.63 x 2.03mm No Bridges 0.48 Pass Hot Slump Oven 150C / 10mins

0.33 x 2.03mm 0.63 x 2.03mm 0.33 x 2.03mm 0.1 0.2 Pass 0.41 0.56 Pass 0.25 0.25 Pass

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Post Reflow Cleaning

Cleanability Study
Boards were built using all five pastes and subsequently cleaned using two water tem peratures (120 and 150F) and two conveyor speed settings (2 and 5 ft/min) in order to assess the relative cleanability of the pastes. The pre-wash and wash water pressure were both set at 90 psi, while the rinse water pressure was set at approximately 70 psi. IPC J-STD-001 states that the contamination limit for assemblies tested using the dynamic method of detecting ionic surface contamination (method used with the Ionograph) is 10 g/in2 (1.56 g/cm2) sodium chloride equivalent ionic or ionizable flux residue. WS-819 (known as PWS-0608A during the product development process) showed Ionograph contamination levels of results of 1.10 to 1.58 g/in2 (0.172 to 0.256 g/cm2 ), after two reflows and a 48 hour delay before cleaning, exceeding the IPC requirement under the pressure and temperature conditions described above

Paste PWS0608A

120F/2.5 ft/min. 1.5799 g/in2 Pass

120F/5 ft/min. 1.1996 g/in2 Pass

150F/2.5 ft/min. 1.5106 g/in2 Pass

150F/5 ft/min. 1.1015 g/in2 Pass

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Post Cleaning Cosmetics
Post Reflow Cleaning

Paste Aged 21 Days in Sealed Container Prior to Reflow

QFP208

High soak profile 160C, 240C peak OSP

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Post Reflow Cleaning

Electrical Reliability
IPC SIR 85C / 85% RH, -48 V Bias SIR () 4 day Reflow & Cleaning Ramp 0.7 C/sec, 237 C peak Clean 130 C, 8 min DI H20 Within 2 hours of reflow Ramp 0.7 C/sec, 237 C peak Clean 130 C, 8 min DI H20 Delayed 48 hours after reflow 1 day 7 day

2.4 x 10

1.0 x 10

10

9.9 x 10

Req: SIR > 1 x 108 after 4 & 7 days (PASS)

1.4 x 10

2.4 x 10

2.5 x 10

Ionic Cleanliness Reflow & Cleaning Ramp 0.7 C/sec, 237 C peak Clean 130 C, 8 min DI H20 Within 2 hours of reflow Ramp 0.7 C/sec, 237 C peak Clean 130 C, 8 min DI H20 Delayed 48 hours after reflow Ionic Contamination (g/sq in)

1.36

Req: Ionic contamination < 10 g / sq in (PASS)

2.43

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Shelf Life

3 Weeks Room Temperature Stability

(25C; 77F) in Unopened Container
2500

2000

10 RPM Malcolm Viscosity (KCPS)

1500
WS-819 Viscosity
Upper Limit
Low er Limit

1000

500

6 Month Shelf Life When Stored in Sealed Jar at 1 to 10 C (34 to 50 F)

0 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Days After Manufacture

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Summary

Delivers excellent print volume and consistency

Prints .4mm (16 mil) pitch QFPs , .3mm (12 mil) circles with Type 3 Powder Consistent Print Volume Repeatability at both Low (<35%) and High (65%) Relative Humidity 8 Hour Stencil Life at Low and High Humidity Excellent post print tack life Wide print speed process window (25mm/sec to 100mm/sec)

High Post Reflow Yields

IPC Class III Voiding Performance (Using Soak Reflow Profile) Resistance to cold and hot slump Easily Cleaned with Water, after 2 lead free reflow cycles and 48 hour delay

Electrical Reliability
IPC SIR Bellcore SIR Bellcore Electromigration HP EL-EN861-00 Electromigration

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Summary

Leading Products
No Clean, SnPb
ALPHA OM-6106 ALPHA OM-5100

No Clean, Lead-free
ALPHA OM-338 T ALPHA OM-338 PT ALPHA OM-350

Water Soluble, SnPb

ALPHA WS-809

Water Soluble, Lead-free

ALPHA WS-819

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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WS-819 solder paste

Summary

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

26

SM919

ALPHA WS-819 Water Soluble Lead-Free Solder Paste

DESCRIPTION
ALPHA WS-819 is the newest Alpha brand lead free, halide free solder paste offering the ideal combination of printability under varying environmental conditions, 8 hour stencil life, resistance to BGA voids, high spread combined with cleanability with water based cleaning systems.

FEATURES & BENEFITS

Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features 8 hour stencil life at 35% to 65% Relative humidity High spread/wetting lead free paste compatible with lead free alloys and surface finishes High Reflow Yield with IPC Class III Voiding Performance when used to solder BGA components Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP. Cleanable with water based cleaning systems

PHYSICAL PROPERTIES
Alloys: Application : Powder Size: RoHS Status: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu), SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) Stencil printing (89.5% Metal Loading, M-17 Viscosity) Dispense application (85% Metal Loading, Type 4 Powder, M9 Viscosity) Type 3 (25-45) Completely free of Hazardous Materials per RoHS Directive 2002/95/EC

APPLICATIONS
Alpha WS-819 was formulated to meet the requirements of water soluble solder lead free applications. Alpha WS-819 was developed to offer best in class resistance to heat and humidity variations in the printing process, while offering exceptional post reflow cleanability and low BGA voiding. This paste is designed to enable users of Alpha WS-609; WS-709 and WS-809 and other leading water soluble paste brands to comply with RoHS and customer based demand for lead free materials.

SAFETY
While the ALPHA WS-819 flux system is not considered toxic, its use in typical reflow will generate a small amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. Consult the MSDS for additional safety information.

SHIPPING AND STORAGE

ALPHA WS-819 is shipped in thermally controlled boxes and should be stored refrigerated upon receipt at 340 450F (10 - 70C). ALPHA WS-819 should be permitted to reach room temperature before opening the package prior to use.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07

14 Tuas Avenue 10, Singapore 639138, 65-68611977, www.alphametals.com

ALPHA WS-819 TECHNICAL DATA

Physical Properties Items
Appearance (flux residues after reflowed) Metal content (%) Viscosity (Poise, Malcom spiral viscometer @10rpm) Stencil life (50%+- 15%RH, 25C) Printability

ALPHA WS-819 SAC 305/405 89.5-3-M17 (stencil printing)

Light yellowish color (before water washed) 89.4% +- 0.2% M17 for stencil printing M9 for dispensing >8 hours Suitable for fine pitch printing applications (Down to 16 mil (0.4mm) pitch QFP components, 12 mil (0.3mm) BGA circles @) up to 100 mm/sec squeegee speed, using 5 mil (125) thick laser cut stencil 0-1 Knead Stroke Required Initial 2.0 g/mm; 1.8 g/mm after 4 hours at 25C and 50% R.H. Preferred (Both Initial and after 4 hours at 25C and 50% R.H. Pass

Test Method
CEAMG PUT 001.05 CEAMG STM 0355 CEAMG STM 0541 CEAMG PUT 001.01 CEAMG PUT 001.01

Response to pause Tack Random Solder Balls Slump Resistance

CEAMG PUT 001.08 IPC TM-650 2.4.44 IPC TM-650 2.4.43 IPC TM-650 2.4.35

Chemical Properties Items

Halide content Corrosivity (IPC J-Std-004) (IPC J-Std-004)

ALPHA WS-819 Flux System

ORH0 Not applicable for water soluble solder paste

ALPHA WS-819 PROCESSING GUIDELINES

STORAGE-HANDLING
Refrigerate to guarantee stability @ 34-45F (1-7C) Warm-up of 500g jar to room temperature (should be ~ 6 hours). Set up printer with room temperature paste. Check paste temperature with a thermometer. Do not remove worked paste from stencil and mix with unused paste in jar. This will alter rheology of unused paste. Do not shake or mix paste using automatic paste shaking equipment prior to opening jar. The plunger insert used may submerge into paste and produce difficulties with plunger removal.

PRINTING / DISPENSING
STENCIL: Recommend ALPHA CUT Laser Cut Stencil @ 0.005 inch (5 mil, 127) thick for 0.012 inch (.30 mml) pitch QFPs SQUEEGEE: Metal (Recommended) Print Speed: 2.0 -4.0 in./sec (50-100 mm/sec.) 4.0 in/sec. optimal SQUEEGEE: Pressure: 1.5 to 2.0 lbs./ linear in. (0357 Kg/cm) Stencil Release Speed: .02 in/sec (0.5 mm/second) Compatible with DEK Pro-Flow Enclosed print head. Report available upon request.

REFLOW
ATMOSPHERE: Clean-dry air If soak temp 160C) and soak time > 45-60 seconds Nitrogen recommended for longer soak profiles (60 to 180 seconds). PROFILE (PRINTING): See profiles evaluated in product development below o Slow ramp from 130 C to o 180 C for 90~120 seconds o Ramp @ 0.5~2 C/sec to peak o o temperature 230 C - 250 C TAL for 40~80 seconds. Ramp down to R.T. @ o 1~3 C/sec.

CLEANING
ALPHA WS-819 is designed to be water rinsed in washing operations. with minimal foaming in recirculating systems. The flux residues from ALPHA WS-819 are completely water soluble. This allows for more flexible washing conditions which can be board design specific. If lower/no foaming is desired in cleaning equipment, Alpha P-2000 defoamer may be used.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07

Reflow Profiles Tested, using Clean, Dry Air CERF Straight Ramp 0.7C/s 235C Peak 60s TAL

CERF Straight Ramp 1.5C/s 240C Peak 60s TAL

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07

CERF 60s Soak @ 175C/ 240C Peak 60s TAL

Note- profiles using a soak time > 60 seconds may require nitrogen for satisfactory results Use of air for long soak profiles have resulted in dull, grainy joints, and possible de-wetting of solder joints.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07

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1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATION

PRODUCT NAME: MANUFACTURER'S NAME: ADDRESS: ALPHA WS-819 SOLDER PASTE SAC305 & SAC405

ALPHA METALS, INC 600 ROUTE 440 JERSEY CITY, NJ 07304 TRANSPORT EMERGENCY #: CHEMTREC: 1-800-424-9300 BUSINESS PHONE: 1-201-434-6778

2. INGREDIENT AND EXPOSURE LIMIT INFORMATION

CHEMICAL NAME TIN SILVER COPPER Ethoxylated-N-Tallow Alkyltrimethylenediamine FORAL AX Ethoxylated octylphenol **SENSITIZER CAS # 7440-31-5 7440-22-4 7440-50-8 61790-85-0 65997-06-0 9002-93-1 % 80 1 0.2 1 W/W - 90 - 5 - 1 - 3 OSHA PEL - TWA 2.0 mg/m3 0.01 mg/m3 0.1 mg/m3 (fume) NE ** NE

1 - 3 1 - 5

3. HAZARDS IDENTIFICATION
EMERGENCY OVERVIEW: MODERATE EYE IRRITANT. WILL NOT BURN TOXIC BY INHALATION. MODERATE GASTROINTESTINAL TRACT IRRITANT. MODERATE RESPIRATORY TRACT IRRITANT. CAUSES SKIN IRRITATION HMIS RATING SYSTEM: Health: 1 ; Flammability: 0 NFPA RATING SYSTEM: Health: 2 ; Flammability: 0 ROUTES OF ENTRY: ; ; Reactivity: 0 Reactivity: 0 ; Protection: C

INHALATION; INGESTION; SKIN CONTACT; EYE CONTACT; ABSORPTION; TARGET ORGANS: BLOOD; DIGESTIVE TRACT; KIDNEYS; NERVOUS SYSTEM; EYES; SKIN. MEDICAL CONDITIONS AGGRAVATED: DIGESTIVE TRACT DISEASE; KIDNEY DISEASE EYE DISEASE. SKIN DISEASE INCLUDING ECZEMA AND SENSITIZATION. IMMEDIATE (ACUTE) SYMPTOMS OVER-EXPOSURE BY ROUTE OF EXPOSURE: INHALATION: CAN CAUSE MODERATE RESPIRATORY IRRITATION, DIZZINESS, WEAKNESS, FATIGUE, NAUSEA AND HEADACHE. MAY CAUSE AN

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3. HAZARDS IDENTIFICATION (Cont.)
ALLERGIC REACTION. MAY CAUSE RESPIRATORY TRACT SENSITIZATION, CHARACTERIZED BY ASTHMA-LIKE SYMPTOMS. CAN CAUSE MODERATE IRRITATION, TEARING AND REDDENING, BUT NOT LIKELY TO PERMANENTLY INJURE EYE TISSUE. CAN CAUSE SLIGHT IRRITATION. IRRITATING TO MOUTH, THROAT, AND STOMACH. CAN CAUSE ABDOMINAL DISCOMFORT, NAUSEA, VOMITING AND DIARRHEA.

EYES: SKIN CONTACT: INGESTION:

LONG TERM (CHRONIC) HEALTH EFFECTS: CARCINOGENICITY: NONE OF THE SUBSTANCES HAVE BEEN SHOWN TO CAUSE CANCER IN LONG TERM ANIMAL STUDIES. NOT A CARCINOGEN ACCORDING TO NTP, IARC, OR OSHA. REPRODUCTION: NO DATA AVAILABLE TO INDICATE PRODUCT OR ANY COMPONENTS PRESENT AT GREATER THAN 0.1% MAY CAUSE BIRTH DEFECTS. MUTAGENICITY: NO DATA AVAILABLE TO INDICATE PRODUCT OR ANY COMPONENTS PRESENT AT GREATER THAN 0.1% IS MUTAGENIC OR GENOTOXIC.

4. FIRST AID MEASURES

SKIN EXPOSURE: EYE EXPOSURE: WASH WITH SOAP AND WATER. REMOVE CONTAMINATED CLOTHING AND LAUNDER. GET MEDICAL ATTENTION IF IRRITATION DEVELOPS OR PERSISTS. FLUSH EYES WITH PLENTY OF WATER FOR AT LEAST 20 MINUTES RETRACTING EYELIDS OFTEN. TILT THE HEAD TO PREVENT CHEMICAL FROM TRANSFERRING TO THE UNCONTAMINATED EYE. GET IMMEDIATE MEDICAL ATTENTION. REMOVE TO FRESH AIR. IF BREATHING IS DIFFICULT, HAVE A TRAINED INDIVIDUAL ADMINISTER OXYGEN. IF NOT BREATHING, GIVE ARTIFICIAL RESPIRATION AND HAVE A TRAINED INDIVIDUAL ADMINISTER OXYGEN. GET MEDICAL ATTENTION IMMEDIATELY SEEK MEDICAL ATTENTION IMMEDIATELY. NO ADDITIONAL FIRST AID INFORMATION AVAILABLE

INHALATION:

INGESTION: NOTES TO DOCTOR:

5. FIRE FIGHTING MEASURES

FLAMMABILITY SUMMARY: FLASH POINT: AUTOIGNITION TEMPERATURE: EXPLOSIVE LIMITS % IN AIR: EXTINGUISHING MEDIA: NOT COMBUSTIBLE N/A N/E N/E USE ALCOHOL RESISTANT FOAM, CARBON DIOXIDE, OR DRY CHEMICAL WHEN FIGHTING FIRES. WATER OR FOAM MAY CAUSE FROTHING IF LIQUID IS BURNING BUT IT STILL MAY BE USEFUL EXTINGUISHING AGENT IF CAREFULLLY APPLIED TO THE SURFACE OF THE FIRE. DO NOT DIRECT A STREAM OF WATER INTO

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5. FIRE FIGHTING MEASURES (Cont.)

MOLTEN MATERIAL. MATERIAL MAY BE IGNITED ONLY IF PREHEATED TO TEMPETURES ABOVE THE HIGH FLASH POINT, FOR EXAMPLE IN A FIRE. DUST AT SUFFICIENT CONCENTRATIONS CAN FORM EXPLOSIVE MIXTURES WITH AIR. FIRE FIGHTING METHODS: WILL NOT BURN, NO SPECIAL INSTRUCTIONS AVAILABLE. USE METHODS APPROPRIATE FOR SURROUNDING MATERIALS. HAZARDOUS COMBUSTION PRODUCTS: CARBON MONOXIDE; CARBON DIOXIDE; METAL FUMES; TOXIC FUMES. FIRE AND EXPLOSION METHODS:

6. ACCIDENTAL RELEASE MEASURES

PRECAUTIONS AND EQUIPMENT: EXPOSURE TO THE SPILLED MATERIAL MAY BE IRRITATING OR HARMFUL. FOLLOW PERSONAL PROTECTIVE EQUIPMENT RECOMMENDATIONS FOUND IN SECTION VIII OF THIS MSDS. WEAR COMPLETE AND PROPER PERSONAL PROTECTIVE EQUIPMENT FOLLOWING THE RECOMMENDATION OF SECTION VIII GATHER AND STORE IN A SEALED CONTAINER PENDING A WASTE DISPOSAL EVALUATION. DO NOT USE BROOM OR AIR CLEANING ETC.

METHODS FOR CLEAN-UP:

7. HANDLING AND STORAGE

HANDLING MEASURES: HARMFUL OR IRRITATING MATERIAL. AVOID CONTACTING AND AVOID BREATHING THE MATERIAL. USE ONLY IN A WELL VENTILATED AREA. AS WITH ALL CHEMICALS, GOOD INDUSTRIAL HYGIENE PRACTICES SHOULD BE FOLLOWED WHEN HANDLING THIS MATERIAL. AVOID CONTACT WITH MATERIAL, AVOID BREATHING DUSTS OR FUMES, USE ONLY IN A WELL VENTILATED AREA. WASH THOROUGHLY AFTER HANDLING; WASH HANDS BEFORE EATING; DO NOT GET IN EYES, ON SKIN AND CLOTHING; MINIMIZE DUST GENERATION AND ACCUMULATION; AVOID CREATING DUSTS AS AN EXPLOSIVE HIGH CONCENTRATIONS. NO SPECIAL REQUIREMENTS KEEP AWAY FROM FOOD AND DRINKING WATER. DRY PLACE. STORE IN A COOL

STORAGE MEASURES:

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8. EXPOSURE CONTROLS AND PERSONAL PROTECTION

ENGINEERING MEASURES: USE LOCAL EXHAUST VENTILATION OR OTHER ENGINEERING CONTROLS TO MINIMIZE EXPOSURES AND MAINTAIN OPERATOR COMFORT. ENGINEERING CONTROLS MUST BE DESIGNED TO MEET THE OSHA CHEMICAL SPECIFIC STANDARD IN 29 CFR 1910. VENTILATION IS REQUIRED TO MAINTAIN OPERATOR EXPOSURE BELOW PUBLISHED EXPOSURE LIMITS. USE PROCESS ENCLOSURES, LOCAL EXHAUST VENTILATION, OR OTHER ENGINEERING CONTROLS TO CONTROL AIRBORNE LEVELS BELOW RECOMMENDED EXPOSURE LIMITS; EXPLOSION PROOF EXHAUST VENTILATION SHOULD BE USED. FACILITIES STORING OR USING THIS MATERIAL SHOULD BE EQUIPPED WITH AN EYEWASH AND SAFETY SHOWER. RESPIRATORY PROTECTION MAY BE REQUIRED TO AVOID OVEREXPOSURE WHEN HANDLING THIS PRODUCT. GENERAL OR LOCAL EXHAUST VENTILATION IS THE PREFERRED MEANS OF PROTECTION. USE A RESPIRATOR IF GENERAL ROOM VENTILATION IS NOT AVAILABLE OR SUFFICIENT TO ELIMINATE SYMPTOMS. FOLLOW A RESPIRATORY PROTECTION PROGRAM THAT MEETS 29 CFR 1910.134 AND ANSI Z88.2 REQUIREMENTS WHENEVER WORK PLACE CONDITIONS WARRANT THE USE OF A RESPIRATOR. WEAR A NIOSH APPROVED RESPIRATOR IF ANY EXPOSURE IS POSSIBLE. WEAR CHEMICALLY RESISTANT SAFETY GLASSES WITH SIDE SHIELDS WHEN HANDLING THIS PRODUCT. DO NOT WEAR CONTACT LENSES. WEAR GOGGLES AND A FACE SHIELD WEAR PROTECTIVE GLOVES. INSPECT GLOVES FOR CHEMICAL BREAK-THROUGH AND REPLACE AT REGULAR INTERVALS. CLEAN PROTECTIVE EQUIPMENT REGULARLY. WASH HANDS AND OTHER EXPOSED AREAS WITH MILD SOAP AND WATER BEFORE EATING, DRINKING, AND WHEN LEAVING WORK ----------ACGIH EXPOSURE LIMITS---------------TLV-TWA STEL CEILING Sensitizer;keep exposure as low as possible. 2 mg/m3 TWA 0.01 mg/m3 TWA 0.1 mg/m3 TWA (fume)

RESPIRATORY PROTECTION:

EYE PROTECTION:

SKIN PROTECTION:

CONTROL PARAMETERS: CHEMICAL NAME Forax AX TIN SILVER COPPER

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9. PHYSICAL AND CHEMICAL PROPERTIES

COLOR: ODOR: pH:

GREY NONE N/A

10. STABILITY AND REACTIVITY

DECOMPOSITION PRODUCTS: INCOMPATIBLE MATERIALS: CONDITIONS TO AVOID: CONTAMINATION: METAL FUMES; TOXIC FUMES. STRONG ACIDS; STRONG OXIDIZING AGENTS; NONE KNOWN CONTACT WITH AIR. CONTACT WITH WATER

11. TOXICOLOGICAL INFORMATION

COMPONENT TOXICOLOGY DATA (NIOSH) CHEMICAL NAME Ethoxylated octylphenol Ethoxylated-N-Tallow Alkyltrimethylenediamine Floral AX

LD50/LC50 Acute oral toxicity (LD50):1800 mg/kg(Rat) LD50: 945 mg/kg oral rat Sensitizer

12. ECOLOGICAL INFORMATION

OVERVIEW: SLIGHT ECOLOGICAL HAZARD. IN HIGH CONCENTRATIONS, THIS PRODUCT MAY BE DANGEROUS TO PLANTS AND/OR WILDLIFE.

13. DISPOSAL CONSIDERATIONS

WASTE DESCRIPTION: DISPOSAL METHODS: SPENT OR DISCARDED MATERIAL IS PROBABLY A HAZARDOUS WASTE. DISPOSE OF IN ACCORDANCE WITH FEDERAL, STATE, LOCAL, OR PROVINCIAL LAWS AND REGULATIONS.

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14. TRANSPORT INFORMATION

SHIPPING BASIC DESCRIPTION:

DOT & IATA:

NOT RESTRICTED

15. REGULATORY INFORMATION

TSCA STATUS: ALL COMPONENTS OF THIS PRODUCT ARE LISTED ON THE TSCA INVENTORY OF EXISTING CHEMICAL SUBSTANCES. REGULATED CHEMICALS: CHEMICAL NAME SILVER WHMIS rating: D2B 7440-22-4 REGULATION SARA 313

16. OTHER INFORMATION

The information contained herein is based on data considered accurate. However, no warranty is expressed of implied regarding the accuracy of these data or the results to be obtained from the use thereof. Additionally, Alpha Metals, Inc. assumes no responsibility for injury to the vendee or third persons proximately caused by the material even if reasonable safety procedures are followed. Furthermore, vendee assumes the risk in his use of the material.