1 source, multiple technology

SOLDER MATERIALS
PB-Free
With global to move toward lead-free environment, Our company already started to research and develop Lead-Free Data since 2001 , along with co-development with Industrial Technology Research Institute, Electronics Assembly and IC-packaging manufacturers, to achieve the ability in assisting our customers in delivering their Pb-Free products to the market place.

Our lead free Sn-Ag-Cu series have added content of percentage of Ni and Ge and also have received the sub-license from Fuji Electric Holdings Co., Ltd.

" * " Japan Patent No. 3296289. U.S Patent No. 6179935B1. Germany Patent No19816671C2

" ** " Other Patent No. U.S Patent No. 5527628

Our lead free solder alloy available for paste, core solder wire, bar, ball/ semi ball, BGA Sphere, anode, etc.

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1 source, multiple technology

SOLDER MATERIALS
Assembly SMT Material

Tin Lead Solder Paste

Tin Lead solder pastes are manufactured from high purity metal and also we produce solder powder and flux by ourselves , Thus, our strict production and quality control, strong technical and development team work. As ability to offer reasonable price and to meet each customer's specific needs.

Features:
High Print Speed: 0-120 mm/Sec Excellent Wettability Reflow with or without nitrogen Low Void Over 8hrs stencil life Extended Tack Time > 12hrs

Tin Lead Solder Pastes

Lead-Free Solder Paste

Lead-Free Solder alloy have received sub-license from IOWA State University Research Foundation and Nihon Fuji Electronic Company. We provide halide-containing and halide-free fluxes for Lead-Free solder alloys, as our customers can be able to reach the lead free era comfortably. With material technologies service as a reduction of manufacturing costs, to brings your Pb-Free products to market quickly.

Features: Pb< 1000ppm, Cd< 20ppm Excellent Wettability High Print Speed: 0-120 mm/Sec Low Void Over 8hrs stencil life Extended Tack Time > 12 hrs

Lead Free Solder Pastes

t : +604 3999 396 f : +604 3988 396 e : info@radysis-asia.com w : radysisgroup.com

1 source, multiple technology

SOLDER MATERIALS
Assembly SMT Material

Water Soluble Solder Paste

Our Technology offers a full line of Water-Soluble fluxes and pastes for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations, with wide process window, have been proven to be excellent in shelf life, stencil life, wetting and clean-ability.

Water-Soluble Fluxes and Pastes

Bumping Solder Paste

Bumping Paste aims to decrease current of too much void issue in the IC Packaging Manufactureing. Our application engineers focus on research nad have develops the lower Void <100000ppm formula. Its ability to improve in decreasing void happening and optimize the performance of the manufacturing process. Our Bumping Paste use term increase from 3 months can be extended to 6 months, and keeping/storage environment only need to control at below 10 degrees.

Bumping Solder Pastes

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1 source, multiple technology

SOLDER MATERIALS
Wave Solder Assembly Products

Bar Solder
Our bar solder is manufactured solely from high purity metal, produces a low proportion of dross and its suitable for dip and wave soldering. The quality meets JIS-Z-3282. Available spec. in A grade, S grade, Anti-oxide bar, Silver added bar, Pure Tin bar, and other Lead Free bar solder.

Bar Solder

Liquid Flux
We offers a full line of Water-Soluble fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications.
We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. And also our Lead Free Liquid Flux have been approved by HP and Dell Computer. We believe our customer able to reach the lead free era comfortably with our material technologies service, then to brings their Pb-Free products to market quickly.

Vacuum Formed Solder Bar

We particularly designed vacuum formed solder bar with newest technology. Made with spectacular equipment, these cylindrical solder bars not only reduce oxidization due to the high temperature during HASL and wave soldering applications, but also greatly decrease the amount of dross, which directly increase solder-ability. Our products are made of high purity Tin/Lead alloy through vacuum forming technology. Oxidation during manufacturing and process is greatly reduced. Dross amount has been decreased at the same time. The vacuum forming technology not only decreases dross amount and solder usage, but also improves the solder-ability on wave solder.

Vacuum Formed Solder Bar

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1 source, multiple technology

SOLDER MATERIALS
Semiconductor Packaging & Assembly Materials

BGA Sphere
Our BGA and CSP solder sphere are made from Pure metals, combined to produce exact alloy compositions. We developed and produced under a strict research and quality control policy. We are committed to be at leading edge of technical development in this field. Our solder spheres for PBGA, CBGA, TBGA, CSP AND Flip Chip applications are made by a UMT ( Ultra Micron Technology) development to controls ensure spheres with accurate diameters; bright, shiny surface finishes; and high spherical. We have own developed technology reduces raw material cost and reflects on price directly, accordingly competitive price can be benefited to users. With our newest inhouse production machine, we can comply with customers request of various size.

BGA Sphere

Packaging:
Diameter Quantity /Jar 0.3 mm 4K K 0.35m m 0.4mm 0.45m m 1.25K K 0.5mm 0.6mm 0.64m m 0.76m m

2.5KK

1.5KK

1KK

500K

400K

250K

t : +604 3999 396 f : +604 3988 396 e : info@radysis-asia.com w : radysisgroup.com

1 source, multiple technology

SOLDER MATERIALS
Wave Solder Assembly Products

Electro-Plating Anodes
Our Electro-Plating Anode are made from pure metal combined to produce exact alloy compositions. We developed and produced under JIS Z 3282 specification standard. Available Diameters are 5mm, 25mm round ball; 25mm, 20mm semi round ball.

ElectroPlating Anodes

Cored Solder Wire

Our Solder Wire specially designed low residue, chlorine content less than 0.1%, flux content 2.0%+0.5 for Hand/Automatic soldering applications assembly. Available in many alloy composition, Sn60 and Sn63 are the most regular used by users and availiable type as follows: Lead free; No clean; Water soluble , High/ moderate/ low active rosin core; Solid (No Rosin) and Stainless steel. 1. MS-80 Rosin Core Solder Wire

Category
Flux Core Solder 80AA Type Flux Core Solder 80 A Type Flux Core Solder 80 B Type

Products Characteristic
Low active resin core solder wire

Mediate active resin core solder wire High active resin core solder wire

Cored Solder Wire

2. ST-10 Solder Wire for Stainless Steel Our company particularly designs special solder wire ST-10 against strongly anti-corrosion stainless steel. The ST-10 can directly go soldering by soldering iron without any high-temperature flames or equipment. Because of high activity, ST-10 has outstanding solder-ability and after soldered the surface is smooth and bright.

t : +604 3999 396 f : +604 3988 396 e : info@radysis-asia.com w : radysisgroup.com