TL/H/5030

March 1995
LM1875 20W Aud|o Power Amp||I|er
Genera| Descr|pt|on
The LM1875 is a monolithic power ampliIier oIIering very
low distortion and high quality perIormance Ior consumer
audio applications.
The LM1875 delivers 20 watts into a 4 or 8 load on
25V supplies. Using an 8 load and 30V supplies, over
30 watts oI power may be delivered. The ampliIier is de-
signed to operate with a minimum oI external components.
Device overload protection consists oI both internal current
limit and thermal shutdown.
The LM1875 design takes advantage oI advanced circuit
techniques and processing to achieve extremely low distor-
tion levels even at high output power levels. Other outstand-
ing Ieatures include high gain, Iast slew rate and a wide
power bandwidth, large output voltage swing, high current
capability, and a very wide supply range. The ampliIier is
internally compensated and stable Ior gains oI 10 or great-
er.
Features

Up to 30 watts output power

A
VO
typically 90 dB

Low distortion: 0.015%, 1 kHz, 20 W

Wide power bandwidth: 70 kHz

Protection Ior AC and DC short circuits to ground

Thermal protection with parole circuit

High current capability: 4A

Wide supply range 16V-60V

lnternal output protection diodes

94 dB ripple rejection

Plastic power package TO-220

App||cat|ons

High perIormance audio systems

Bridge ampliIiers

Stereo phonographs

Servo ampliIiers

lnstrument systems
Connect|on D|agram
TL/H/50301
Front V|ew
Order Number LM1875T
See NS Package Number T05B
Typ|ca| App||cat|ons
TL/H/50302
1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Abso|ute Max|mum Rat|ngs
II M|||tary/Aerospace spec|I|ed dev|ces are requ|red,
p|ease contact the Nat|ona| Sem|conductor Sa|es
OII|ce/D|str|butors Ior ava||ab|||ty and spec|I|cat|ons.
Supply Voltage 60V
lnput Voltage V
EE
to V
CC
Storage Temperature 65yC to 150yC
Junction Temperature 150yC
Lead Temperature (Soldering, 10 seconds) 260yC

JC
3yC

JA
73yC
E|ectr|ca| Character|st|cs
V
CC
25V, V
EE
25V, T
AMBlENT
25yC, R
L
8, A
V
20 (26 dB), I
o
1 kHz, unless otherwise speciIied.
Parameter Cond|t|ons Typ|ca| Tested L|m|ts Un|ts
Supply Current P
OUT
0W 70 100 mA
Output Power (Note 1) THD1% 25 W
THD (Note 1) P
OUT
20W, I
o
1 kHz 0.015 %
P
OUT
20W, I
o
20 kHz 0.05 0.4 %
P
OUT
20W, R
L
4, I
o
1 kHz 0.022 %
P
OUT
20W, R
L
4, I
o
20 kHz 0.07 0.6 %
OIIset Voltage 1 15 mV
lnput Bias Current 0.2 2 A
lnput OIIset Current 0 0.5 A
Gain-Bandwidth Product I
o
20 kHz 5.5 MHz
Open Loop Gain DC 90 dB
PSRR V
CC
, 1 kHz, 1 Vrms 95 52 dB
V
EE
, 1 kHz, 1 Vrms 83 52 dB
Max Slew Rate 20W, 8, 70 kHz BW 8 V/s
Current Limit V
OUT
V
SUPPLY
10V 4 3 A
Equivalent lnput Noise Voltage R
S
600, CClR 3 Vrms
Note 1: Assumes the use oI a heat sink having a thermal resistance oI 1yC/W and no insulator with an ambient temperature oI 25yC. Because the output limiting
circuitry has a negative temperature coeIIicient, the maximum output power delivered to a 4 load may be slightly reduced when the tab temperature exceeds
55yC.
Typ|ca| App||cat|ons (Continued)
Typ|ca| S|ng|e Supp|y Operat|on
TL/H/50303
2
Typ|ca| PerIormance Character|st|cs
THD vs Power Output THD vs Frequency Vo|tage
Power Output vs Supp|y
Vo|tage
Supp|y Current vs Supp|y
PSRR vs Frequency Amb|ent Temperaturen
Dev|ce D|ss|pat|on vs
Power Output
Power D|ss|pat|on vs
Power Output
Power D|ss|pat|on vs
SaIe Operat|ng Area Boundary
I
OUT
vs V
OUT
-Current L|m|t/
Phase vs Frequency
Open Loop Ga|n and
vs Supp|y Vo|tage
Input B|as Current
TL/H/50304
Thermal shutdown with inIinite heat sink
Thermal shutdown with 1yC/W heat sink
nlNTERFACE 1yC/W.
See Application Hints.
3
Schemat|c D|agram
4
App||cat|on H|nts
STABILITY
The LM1875 is designed to be stable when operated at a
closed-loop gain oI 10 or greater, but, as with any other
high-current ampliIier, the LM1875 can be made to oscillate
under certain conditions. These usually involve printed cir-
cuit board layout or output/input coupling.
Proper layout oI the printed circuit board is very important.
While the LM1875 will be stable when installed in a board
similar to the ones shown in this data sheet, it is sometimes
necessary to modiIy the layout somewhat to suit the physi-
cal requirements oI a particular application. When designing
a diIIerent layout, it is important to return the load ground,
the output compensation ground, and the low level (Ieed-
back and input) grounds to the circuit board ground point
through separate paths. Otherwise, large currents Ilowing
along a ground conductor will generate voltages on the con-
ductor which can eIIectively act as signals at the input, re-
sulting in high Irequency oscillation or excessive distortion.
lt is advisable to keep the output compensation compo-
nents and the 0.1 F supply decoupling capacitors as close
as possible to the LM1875 to reduce the eIIects oI PCB
trace resistance and inductance. For the same reason, the
ground return paths Ior these components should be as
short as possible.
Occasionally, current in the output leads (which Iunction as
antennas) can be coupled through the air to the ampliIier
input, resulting in high-Irequency oscillation. This normally
happens when the source impedance is high or the input
leads are long. The problem can be eliminated by placing a
small capacitor (on the order oI 50 pF to 500 pF) across the
circuit input.
Most power ampliIiers do not drive highly capacitive loads
well, and the LM1875 is no exception. lI the output oI the
LM1875 is connected directly to a capacitor with no series
resistance, the square wave response will exhibit ringing iI
the capacitance is greater than about 0.1 F. The ampliIier
can typically drive load capacitances up to 2 F or so with-
out oscillating, but this is not recommended. lI highly capaci-
tive loads are expected, a resistor (at least 1) should be
placed in series with the output oI the LM1875. A method
commonly employed to protect ampliIiers Irom low imped-
ances at high Irequencies is to couple to the load through a
10 resistor in parallel with a 5 H inductor.
DISTORTION
The preceding suggestions regarding circuit board ground-
ing techniques will also help to prevent excessive distortion
levels in audio applications. For low THD, it is also neces-
sary to keep the power supply traces and wires separated
Irom the traces and wires connected to the inputs oI the
LM1875. This prevents the power supply currents, which
are large and nonlinear, Irom inductively coupling to the
LM1875 inputs. Power supply wires should be twisted to-
gether and separated Irom the circuit board. Where these
wires are soldered to the board, they should be perpendicu-
lar to the plane oI the board at least to a distance oI a
couple oI inches. With a proper physical layout, THD levels
at 20 kHz with 10W output to an 8 load should be less
than 0.05%, and less than 0.02% at 1 kHz.
CURRENT LIMIT AND SAFE OPERATING AREA (SOA)
PROTECTION
A power ampliIier's output transistors can be damaged by
excessive applied voltage, current Ilow, or power dissipa-
tion. The voltage applied to the ampliIier is limited by the
design oI the external power supply, while the maximum
current passed by the output devices is usually limited by
internal circuitry to some Iixed value. Short-term power dis-
sipation is usually not limited in monolithic audio power am-
pliIiers, and this can be a problem when driving reactive
loads, which may draw large currents while high voltages
appear on the output transistors. The LM1875 not only limits
current to around 4A, but also reduces the value oI the limit
current when an output transistor has a high voltage across
it.
When driving nonlinear reactive loads such as motors or
loudspeakers with built-in protection relays, there is a possi-
bility that an ampliIier output will be connected to a load
whose terminal voltage may attempt to swing beyond the
power supply voltages applied to the ampliIier. This can
cause degradation oI the output transistors or catastrophic
Iailure oI the whole circuit. The standard protection Ior this
type oI Iailure mechanism is a pair oI diodes connected be-
tween the output oI the ampliIier and the supply rails. These
are part oI the internal circuitry oI the LM1875, and needn't
be added externally when standard reactive loads are driv-
en.
THERMAL PROTECTION
The LM1875 has a sophisticated thermal protection scheme
to prevent long-term thermal stress to the device. When the
temperature on the die reaches 170yC, the LM1875 shuts
down. lt starts operating again when the die temperature
drops to about 145yC, but iI the temperature again begins to
rise, shutdown will occur at only 150yC. ThereIore, the de-
vice is allowed to heat up to a relatively high temperature iI
the Iault condition is temporary, but a sustained Iault will
limit the maximum die temperature to a lower value. This
greatly reduces the stresses imposed on the lC by thermal
cycling, which in turn improves its reliability under sustained
Iault conditions.
Since the die temperature is directly dependent upon the
heat sink, the heat sink should be chosen Ior thermal resist-
ance low enough that thermal shutdown will not be reached
during normal operation. Using the best heat sink possible
within the cost and space constraints oI the system will im-
prove the long-term reliability oI any power semiconductor
device.
POWER DISSIPATION AND HEAT SINKING
The LM1875 must always be operated with a heat sink,
even when it is not required to drive a load. The maximum
idling current oI the device is 100 mA, so that on a 60V
power supply an unloaded LM1875 must dissipate 6W oI
power. The 54yC/W junction-to-ambient thermal resistance
oI a TO-220 package would cause the die temperature to
rise 324yC above ambient, so the thermal protection circuit-
ry will shut the ampliIier down iI operation without a heat
sink is attempted.
5
App||cat|on H|nts (Continued)
ln order to determine the appropriate heat sink Ior a given
application, the power dissipation oI the LM1875 in that ap-
plication must be known. When the load is resistive, the
maximum average power that the lC will be required to dissi-
pate is approximately:
P
D(MAX)

V
S
2
2
2
R
L
P
Q
where V
S
is the total power supply voltage across the
LM1875, R
L
is the load resistance, and P
Q
is the quiescent
power dissipation oI the ampliIier. The above equation is
only an approximation which assumes an ''ideal'' class B
output stage and constant power dissipation in all other
parts oI the circuit. The curves oI ''Power Dissipation vs
Power Output'' give a better representation oI the behavior
oI the LM1875 with various power supply voltages and re-
sistive loads. As an example, iI the LM1875 is operated on a
50V power supply with a resistive load oI 8, it can develop
up to 19W oI internal power dissipation. lI the die tempera-
ture is to remain below 150yC Ior ambient temperatures up
to 70yC, the total junction-to-ambient thermal resistance
must be less than
150yC70yC
19W
4.2yC/W.
Using
JC
2yC/W, the sum oI the case-to-heat-sink inter-
Iace thermal resistance and the heat-sink-to-ambient ther-
mal resistance must be less than 2.2yC/W. The case-to-
heat-sink thermal resistance oI the TO-220 package varies
with the mounting method used. A metal-to-metal interIace
will be about 1yC/W iI lubricated, and about 1.2yC/W iI dry.
lI a mica insulator is used, the thermal resistance will be
about 1.6yC/W lubricated and 3.4yC/W dry. For this exam-
ple, we assume a lubricated mica insulator between the
LM1875 and the heat sink. The heat sink thermal resistance
must then be less than
4.2yC/W2yC/W1.6yC/W0.6yC/W.
This is a rather large heat sink and may not be practical in
some applications. lI a smaller heat sink is required Ior rea-
sons oI size or cost, there are two alternatives. The maxi-
mum ambient operating temperature can be reduced to
50yC (122yF), resulting in a 1.6yC/W heat sink, or the heat
sink can be isolated Irom the chassis so the mica washer is
not needed. This will change the required heat sink to a
1.2yC/W unit iI the case-to-heat-sink interIace is lubricated.
Note: When using a single supply, maximum transIer oI heat away Irom the
LM1875 can be achieved by mounting the device directly to the heat
sink (tab is at ground potential); this avoids the use oI a mica or other
type insulator.
The thermal requirements can become more diIIicult when
an ampliIier is driving a reactive load. For a given magnitude
oI load impedance, a higher degree oI reactance will cause
a higher level oI power dissipation within the ampliIier. As a
general rule, the power dissipation oI an ampliIier driving a
60y reactive load (usually considered to be a worst-case
loudspeaker load) will be roughly that oI the same ampliIier
driving the resistive part oI that load. For example, a loud-
speaker may at some Irequency have an impedance with a
magnitude oI 8 and a phase angle oI 60y. The real part oI
this load will then be 4, and the ampliIier power dissipation
will roughly Iollow the curve oI power dissipation with a 4
load.
Component Layouts
Sp||t Supp|y
TL/H/50306
S|ng|e Supp|y
TL/H/50307
6
7
Phys|ca| D|mens|ons inches (millimeters)
TO-220 Power Package (T)
Order Number LM1875T
NS Package Number T05B
LIFE SUPPORT POLICY
NATlONAL'S PRODUCTS ARE NOT AUTHORlZED FOR USE AS CRlTlCAL COMPONENTS lN LlFE SUPPORT
DEVlCES OR SYSTEMS WlTHOUT THE EXPRESS WRlTTEN APPROVAL OF THE PRESlDENT OF NATlONAL
SEMlCONDUCTOR CORPORATlON. As used herein:
1. LiIe support devices or systems are devices or 2. A critical component is any component oI a liIe
systems which, (a) are intended Ior surgical implant support device or system whose Iailure to perIorm can
into the body, or (b) support or sustain liIe, and whose be reasonably expected to cause the Iailure oI the liIe
Iailure to perIorm, when properly used in accordance support device or system, or to aIIect its saIety or
with instructions Ior use provided in the labeling, can eIIectiveness.
be reasonably expected to result in a signiIicant injury
to the user.
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