TECH SPOTLIGHT

Making The Right Connections

A guide to selecting electrically conductive adhesives

Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA Phone +1.201.343.8983 | Fax +1.201.343.2132 | WhitePaper@masterbond.com

Making The Right Connections

Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications.
Electronic devices are everywhere. Theyre the computing workhorses on our desks, entertainment devices in our homes, and portable communicators in our pockets. Major advances in medicine, aerospace, transportation and military systems, have been made possible largely through the use of electronics for diagnostics, data crunching, and automated control. Once operated only by skilled personnel in climate controlled rooms, electronic devices are now employed by all sorts of users in every imaginable setting from underwater research labs to space stations, from sterile operating rooms to contaminated worksites, and from office cubicles to battered and beaten weather stations. Todays powerful, versatile electronic circuits are engineered into ever-shrinking packages and must withstand a variety of environmental conditions while complying with regulatory and industry requirements. While the proper design and implementation of electronic circuitry is critical to its functionality, the assembly and packaging of the electronics are just as important especially if the device is to perform appropriately under stressful real life operating conditions. is conducted faster along the shortened paths between components. To avoid thermal damage, temperature sensitive components must be manually assembled after solder processing increasing processing time and cost. This problem is exacerbated by the use of lead-free solders, which require higher processing temperatures and more costly circuit board materials than traditional solder alloys. Ultra-fine pitch technology can make soldering more difficult and may produce unreliable results. And packing

Modern assembly techniques present new challenges

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Advances such as flip-chip assemblies, system in a package (SiP) designs (in which chips and other components are stacked on top of one another), and ultra-fine pitch technology enable engineers to cram more computing power in smaller devices. This, in turn, presents a new set of challenges. With shorter leads and interconnects, the likelihood of thermal damage to temperature sensitive components is increased, since heat produced during solder processing

Two component electrically conductive epoxy systems are available for use in premixed and frozen syringes. electronics into closer quarters increases the need for shielding sensitive electronic components. Environmental concerns pose another set of problems. Some printed circuit assemblies (PCAs) must undergo a post-assembly cleaning process that uses harsh cleaning agents which may break down solder bonds. Exposure to extreme temperatures can affect the integrity of the bond between components with very different coefficients of thermal expansion and contraction. For products in which

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lead-free solder is used, excessive shock or vibration of electronic components may weaken the lead-free solder bonds, which are more brittle than traditional solder bonds. To address these challenges, design engineers are choosing environmentally friendly adhesives that achieve high bond strength, are electrically conductive, and meet other stringent performance requirements.

Versatile adhesives strengthen product performance

Electrically conductive adhesives often consist of an epoxy or silicone resin filled with randomly distributed metallic or conductive carbon particles. When fully cured, the adhesive provides an electrically conductive pathway between bonding substrates via a network of particleto-particle contacts. Just how conductive an adhesive is depends on the choice of filler material and the number and quality of the particle-to-particle contacts. For a given material, a higher proportion of filler particles results in higher conductivity, but it also weakens the bond since the additional filler effectively displaces some of the adhesive material. Conductivity may be reduced if the surfaces of the conductive particles contain any contaminants, such as metal oxides or by-products from the filler manufacturing process, which can impede the flow of electricity. Metal oxides may form as the result of metal molecules reacting with oxygen in air or water. Both the choice of filler material

Volume resistivity, which measures the electrical resistance of a defined volume of conductive material, is used to compare the conductivity of electrically conductive adhesives. Nonreactive metals such as gold and platinum offer superb conductivity with no surface oxides, but their costs are prohibitively high for practical use. Because silver offers excellent conductivity and has relatively conductive oxides, silver-filled adhesives have extremely low volume resistivity and are often used to replace solder in electronics applications. Economical nickel- and graphitefilled adhesives provide sufficiently low volume resistivity for a variety of applications, such as EMI/RFI shielding, radio frequency ID (RFID) tagging, and bonding and sealing electronic components. The choice of filler material depends on the conductivity requirements and budget considerations for a specific application. Electrically conductive adhesives can be engineered to combine bond strength and electrical conductivity with other service-critical properties. Adhesive manufacturers can optimize a formulation to meet one or more specific application requirements, such as elongation, shock absorption, moisture resistance, chemical resistance, or thermal cycling. Formulations can also be designed to withstand cryogenic or ultra-high temperatures, to bond specific substrate materials, or to meet industry standards, such as NASA low outgassing specifications or USP Class VI biocompatibility tests. Many electrically conductive adhesives are also thermally conductive, and can serve multiple purposes in a circuit assembly: bonding the component to the board, providing an electrical connection, and cooling the component. Processing requirements for electrically conductive adhesives vary from snap cures to elevated temperature fast cures, to prolonged cures at room temperature. Typically temperatures required for rapid adhesive curing range from 250F to 350F and most adhesives offer two or more curing schedules designed to suit a variety of processing needs. Adhesive curing temperatures are substantially lower than the 230C (450F) minimum temperature required for lead-free solder processing, and nearly all electrically conductive adhesives can be cured at temperatures well below the 361F minimum temperature required for lead-bearing solder processing.

Microscopic image of silver filler particles in an epoxy compound. and precision control of the manufacturing process are important factors in determining the conductivity of these adhesives. Its also true that within each adhesive family, thermal and chemical resistance often go hand in hand. Cross-linked adhesives, like the ones just mentioned, tend to have the best chemical resistance below their glass transition temperatures (Tg). So grades with higher Tg can often beat the heat and tolerate more chemicals.

Adhesives offer optimized performance properties

Electrically conductive adhesives are designed to optimize performance across a broad range of applications in multiple vertical markets. These specially formulated adhesives often consist of an epoxy or silicone resin filled with one of four different types of conductive material: silver, silver-coated nickel, nickel, or graphite. To accommodate a variety of production scenarios, most

Master Bond Inc. | Tel: +1 (201) 343-8983 | www.masterbond.com | whitepaper@masterbond.com

Applications of Master Bond Electrically Conductive Adhesives

Electrical modules PCBs High frequency shields Wave guides EMI/RFI shielding Entertainment systems Specialty heat sinks Interconnection repair Digital signal processors Solar cell manufacturing Electrical ground plane interface RFID tagging Printed wiring board applications LED packaging Wireless headsets Wafer lamination Membrane switches Antenna assemblies Stack bonding Copper/polymide (PI) circuits Integrated circuitry Flip chip packaging Thermistors Microprocessors Stress control devices Wire tacking SMD attachment Hermetic lid-seal processes Communication systems Electronic test equipment Hybrid microelectronic packaging

formulations offer both room temperature curing and rapid, elevated temperature curing, and some formulations may be snap cured at high temperatures within minutes. Formulations differ in their electrical and thermal conductivity, viscosity, cure schedule, temperature performance, peel and shear strength, moisture and chemical resistance, outgassing, and other properties. Electrically conductive adhesives are formulated to be RoHS-compliant, solvent-free, and include grades that are halogen-free and meet NASA low outgassing specifications and USP Class VI biocompatibility requirements. High performance adhesives can be found in optoelectronics, medical devices, wireless communications systems, and aerospace/defense systems. Other pertinent applications include EMI/RFI shielding, PCB assembly and repair, component bonding and sealing, electrostatic discharge, and RFID tagging.

By selecting an electrically conductive adhesive with the appropriate mechanical properties, engineers have a viable solution to the increasing challenges associated with the assembly and packaging of complex electronic circuitry. With dozens of electrically conductive adhesive grades and custom formulations from which to choose, design and process engineers are assured of satisfying the unique physical, functional, environmental, and regulatory requirements of their target applications while staying within budget.

For further information on this article, for answers to any adhesives applications questions, or for information on any Master Bond products, please contact our technical experts at Tel: +1 (201) 343-8983.

Master Bond Inc. | Tel: +1 (201) 343-8983 | www.masterbond.com | whitepaper@masterbond.com

Two Component Epoxy Systems

Master Bond Grade
EP21TDCS

Mix Ratio Mixed Set-Up Cure Schedule by weight Viscosity Time Temp/Time, F RT, cps Minutes, RT
100/100 paste 30-40 24-36 hrs @ RT 1-2 hrs @ 200F

Service Temp Range, F

4K to +275F

Filler

Volume Applications Resistivity ohm-cm

<10-3 High performance adhesive/sealant. Convenient handling, excellent physical strength properties. High peel and shear strength. Widely used in microelectronics. Unique formulation, high flexibility version of EP21TDCS, exceptionally high elongation. Very high peel strength. Cryogenic serviceability. Easily repairable. NASA low outgassing approved adhesive/ sealant. Superior durability, thermal shock and chemical resistance Class VI approved medical grade formulation. Excellent physical properties. Widely used in medical electronics. General purpose graphite filled system. Cost effective adhesive/sealant and coating for EMI / RFI type applications. Utilized when nonmetallic filler is required. Easy to use, 1:1 system. Excellent adhesive/ sealant. Superior physical and mechanical strength properties. Fast setting, silver filled system. Convenient handling. Particularly useful in manufacturing, circuit board repair and other applications where rapid tack is required . Low resistance, cost effective alternative to silver filled systems. Excellent physical properties.

silver

EP21TDCSFL 100/100

paste

45-60

24-48 hrs @ RT 2-3 hrs @ 200F

4K to +250F

silver

<10-3

EP21TDCSLO EP21TDCS Med EP75-1

100/100

smooth paste smooth paste paste

30-40

24-48 hrs @ RT 2-3 hrs @ 200F 24-48 hrs @ RT 1-2 hr @ 200F 24-48 hrs @ RT 1-2 hrs @ 200F

4K to +275F

silver

<10-3

100/100

30-40

4K to +250F

silver

<10-3

100/15

60

-60 to +250F

graphite

50-100

EP76M

100/100

paste

45-60

24-48 hrs @ RT 2 hrs @ 200F 8-12 hrs @ RT

-60 to +250F

nickel

5-10

EP77M-F

100/100

paste

5-10

-60 to +250F

silver

<10-3

EP79

100/100

paste

45-60

24-48 hrs @ RT 2 hrs @ 200F

4K to +275F

silver coated nickel

<0.04

One Component Epoxy Systems

Master Bond Viscosity Shelf Life Grade RT, cp s
Supreme 10HTS paste 3 months

Cure Schedule Temp/Time, F

1 hr @ 250F 45 min @ 300F

Service Temp Range, F

4K to +400F

Filler

Volume Applications Resistivity ohm-cm

<10-3 High performance adhesive/sealant. NASA approved for low outgassing. Excellent shear & peel strength. Cryogenically serviceable. Widely used in microelectronics. Can withstand up to 400F. Screen printable High performance film adhesive/sealant. Exceptionally convenient handling. Low resistance. Standard size is 2 x 6 x 3 mils thick. Other sizes and die cuts available. Fast curing, low resistance, smooth consistency and convenient handling.

silver

FL901S

film

6 months refrigerated 6 months

1 hr @ 250F 30-40 min @ 300F 20-40 min @300F 40-90 min @250F

-100 to +400F

silver

<2x10-4

EP3HTS

paste

-60 to 400F

silver

<10-3

Miscellaneous Systems
Master Bond Grade
MasterSil 705S LTX117N

Type of Viscosity Cure Type System RT, cps

silicone paste RT

Shelf Life Cure Schedule Service Temp Filler Temp/Time, F Range, F

6 months 24 hrs @ RT -60 to 400F silver

Volume Applications Resistivity ohm-cm

<10-2 Room temperature curing RTV. Outstanding temperature resistance, conductivity and flexibility. Non-corrosive. Low cost water-based adhesive, sealant and coating. Shielding effectiveness as a coating is >40dB.

latex

paste

water evaporation

6 months

4-6 hrs @ RT

-80 to +250F graphite 15-25

Master Bond Inc. | Tel: +1 (201) 343-8983 | www.masterbond.com | whitepaper@masterbond.com