A be absorb in access control list active attack activeX control ActiveX advanced encryption standard AES, algorithm alteration

ation of message application level attack argument asymmetric key cryptography attribute certificate authentication authority availability Abrupt junction Accelerated testing Acceptor Acceptor atom Accumulation Accumulating contact Accumulation region Accumulation layer Active region Active component Active device Activation Activation energy Active region Admittance Allowed band Alloy-junction device Aluminum(Aluminium) Aluminum oxide Aluminum passivation Ambipolar Ambient temperature Amorphous Amplifier Analogue(Analog) comparator Angstrom Anneal Anisotropic Anode Arsenic (AS)

Auger Auger process Avalanche Avalanche breakdown Avalanche excitation B brute-force attack Background carrier Background doping Backward Backward bias Ballasting resistor Ball bond Band Band gap Barrier Barrier layer Barrier width Base Base contact Base stretching Base transit time Base transport efficiency Base-width modulation Basis vector Bias Bilateral switch Binary code Binary compound semiconductor Bipolar Bipolar Junction Transistor (BJT) Bloch Blocking band Blocking contact Body - centered Body-centred cubic structure Boltzmann Bond Bonding electron Bonding pad Bootstrap circuit Bootstrapped emitter follower Boron Borosilicate glass Boundary condition

Bound electron Breadboard Break down Break over Brillouin Brillouin zone Built-in Build-in electric field Bulk / Bulk absorption Bulk generation Bulk recombination Burn - in Burn out Buried channel Buried diffusion region C Caesar cipher capacitance capture categorize chaining mode challenge cipher feedback collision combine compatibility n.[] component confidentiality constraint corresponding to Cryptography Can Capacitance Capture cross section Capture carrier Carrier Carry bit Carry-in bit Carry-out bit Cascade Case Cathode Center Ceramic

Channel Channel breakdown Channel current Channel doping Channel shortening Channel width Characteristic impedance Charge Charge-compensation effects Charge conservation Charge neutrality condition Charge drive/exchange/sharing/transfer/storage / / / / Chemmical etching Chemically-Polish Chemmically-Mechanically Polish (CMP) Chip Chip yield Clamped Clamping diode Cleavage plane Clock rate Clock generator Clock flip-flop Close-packed structure Close-loop gain Collector Collision Compensated OP-AMP Common-base/collector/emitter connection / / Common-gate/drain/source connection / / Common-mode gain Common-mode input Common-mode rejection ratio (CMRR) Compatibility Compensation Compensated impurities Compensated semiconductor Complementary Darlington circuit Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS) Complementary error function Compound Semiconductor Conductance Conduction band (edge) ( ) Conduction level/state Conductor

Conductivity Configuration Conlomb Conpled Configuration Devices Constants Constant energy surface Constant-source diffusion Contact Contamination Continuity equation Contact hole Contact potential Continuity condition Contra doping Controlled Converter Conveyer Copper interconnection system Couping Covalent Crossover Critical Crossunder Crucible Crystal defect/face/orientation/lattice / / / Current density Curvature Cut off Current drift/dirve/sharing / / Current Sense Curvature Custom integrated circuit Cylindrical Czochralshicrystal Czochralski technique Cz J D dedicate denial of service(DOS) diffusion digital signature algorithm dynamic Dangling bonds Dark current Dead time Debye length De.broglie Decderate

Decibel (dB) Decode Deep acceptor level Deep donor level Deep impurity level Deep trap Defeat Degenerate semiconductor Degeneracy Degradation Degree Celsius(centigrade) /Kelvin / Delay Density Density of states Depletion Depletion approximation Depletion contact Depletion depth Depletion effect Depletion layer Depletion MOS MOS Depletion region Deposited film Deposition process Design rules Die dice Diode Dielectric Dielectric isolation Difference-mode input Differential amplifier Differential capacitance Diffused junction Diffusion Diffusion coefficient Diffusion constant Diffusivity Diffusion capacitance/barrier/current/furnace / / / Digital circuit Dipole domain Dipole layer Direct-coupling Direct-gap semiconductor Direct transition Discharge

Discrete component Dissipation Distribution Distributed capacitance istributed model Displacement Dislocation Domain Donor Donor exhaustion Dopant Doped semiconductor oping concentration Double-diffusive MOS(DMOS) MOS. Drift Drift field Drift mobility Dry etching Dry/wet oxidation / Dose Duty cycle Dual-in-line package DIP Dynamics Dynamic characteristics Dynamic impedance E expertise extractor Early effect Early failure Effective mass Einstein relation(ship) Electric Erase Programmable Read Only Memory(E2PROM) Electrode Electrominggratim Electron affinity Electronic -grade Electron-beam photo-resist exposure Electron gas Electron-grade water Electron trapping center Electron Volt (eV) Electrostatic Element / / Elemental semiconductor Ellipse Ellipsoid

Emitter Emitter-coupled logic Emitter-coupled pair Emitter follower Empty band Emitter crowding effect Endurance test =life test Energy state Energy momentum diagram - (E-K) Enhancement mode Enhancement MOS MOS Entefic ( ) Environmental test Epitaxial Epitaxial layer Epitaxial slice Expitaxy Equivalent curcuit Equilibrium majority /minority carriers / Erasable Programmable ROM (EPROM) Error function complement Etch Etchant Etching mask Excess carrier Excitation energy Excited state Exciton Extrapolation Extrinsic Extrinsic semiconductor F fabrication fleshed out Face - centered Fall time Fan-in Fan-out Fast recovery Fast surface states Feedback Fermi level Fermi-Dirac Distribution - Femi potential Fick equation

Field effect transistor Field oxide Filled band Film Flash memory Flat band Flat pack Flicker noise Flip-flop toggle Floating gate Fluoride etch Forbidden band Forward bias Forward blocking /conducting / Frequency deviation noise Frequency response Function G grid Gain Gallium-Arsenide(GaAs) Gamy ray r Gate Gate oxide Gauss ian Gaussian distribution profile Generation-recombination - Geometries Germanium(Ge) Graded Graded (gradual) channel Graded junction Grain Gradient Grown junction Guard ring Gummel-Poom model - Gunn - effect H handle hierarchical Hardened device Heat of formation Heat sink

Heavy/light hole band / Heavy saturation Hell - effect Heterojunction Heterojunction structure Heterojunction Bipolar Transistor HBT High field property High-performance MOS.( H-MOS) MOS. Hormalized Horizontal epitaxial reactor Hot carrior Hybrid integration I implement inductance initialization vector IV integrity interception interruption Image - force Impact ionization Impedance Imperfect structure Implantation dose Implanted ion Impurity Impurity scattering Incremental resistance In-contact mask Indium tin oxide (ITO) Induced channel Infrared Injection Input offset voltage Insulator Insulated Gate FET(IGFET) FET Integrated injection logic Integration Interconnection Interconnection time delay Interdigitated structure Interface Interference International system of unions Internally scattering

Interpolation Intrinsic Intrinsic semiconductor Inverse operation Inversion Inverter Ion Ion beam Ion etching Ion implantation Ionization Ionization energy Irradiation Isolation land Isotropic J java applet Java Junction FET(JFET) Junction isolation Junction spacing Junction side-wall K key wrapping L Latch up Lateral Lattice Layout Lattice binding/cell/constant/defect/distortion / / / / / Leakage current Level shifting Life time linearity Linked bond Liquid Nitrogen Liquid phase epitaxial growth technique Lithography Light Emitting Diode(LED) Load line or Variable Locating and Wiring Longitudinal Logic swing Lorentz Lumped model

M masquerade message digest modification multidrop , Majority carrier Mask Mask level Mask set Mass - action law Master-slave D flip-flop D Matching Maxwell Mean free path Meandered emitter junction Mean time before failure (MTBF) Megeto - resistance Mesa MESFET-Metal Semiconductor FET Metallization Microelectronic technique Microelectronics Millen indices Minority carrier Misfit Mismatching Mobile ions Mobility Module Modulate Molecular crystal Monolithic IC IC MOSFET Mos. Transistor(MOST )MOS. Multiplication Modulator Multi-chip IC IC Multi-chip module(MCM) Multiplication coefficient N network level attack non-repudiation Naked chip Negative feedback Negative resistance

Nesting Negative-temperature-coefficient Noise margin Nonequilibrium Nonrolatile Normally off/on / Numerical analysis O optimize Occupied band Officienay Offset On standby Ohmic contact Open circuit Operating point Operating bias Operational amplifier (OPAMP) Optical photon =photon Optical quenching Optical transition Optical-coupled isolator Organic semiconductor Orientation Outline Out-of-contact mask Output characteristic Output voltage swing Overcompensation Over-current protection Over shoot Over-voltage protection Overlap Overload Oscillator Oxide Oxidation Oxide passivation P parallel parasitic partition []n., , , , vt., , presentation n., , , primitive private probably

proceeding profound property pseudocollision Package Pad Parameter Parasitic effect Parasitic oscillation Passination Passive component Passive device Passive surface Parasitic transistor Peak-point voltage Peak voltage Permanent-storage circuit Period Periodic table Permeable - base Phase-lock loop Phase drift Phonon spectra Photo conduction Photo diode Photoelectric cell Photoelectric effect Photoenic devices Photolithographic process (photo) resist Pin Pinch off Pinning of Fermi level Planar process Planar transistor Plasma Plezoelectric effect Poisson equation Point contact Polarity Polycrystal Polymer semiconductor Poly-silicon Potential ( ) Potential barrier

Potential well Power dissipation Power transistor Preamplifier Primary flat Principal axes Print-circuit board(PCB) Probability Probe Process Propagation delay Pseudopotential method Punch through Pulse triggering/modulating / Pulse Widen Modulator(PWM) Punchthrough Push-pull stage Q Quality factor Quantization Quantum Quantum efficiency Quantum mechanics Quasi Fermi level Quartz R release of message contents register registration , , resistance routing running key cipher Radiation conductivity Radiation damage Radiation flux density Radiation hardening Radiation protection Radiative - recombination Radioactive Reach through Reactive sputtering source Read diode Recombination Recovery diode

Reciprocal lattice Recovery time Rectifier Rectifying contact Reference Refractive index Register Registration Regulate Relaxation lifetime Reliability * Resonance Resistance Resistor Resistivity Regulator Relaxation Resonant frequency Response time Reverse Reverse bias S scratch scratchpad secret substrate synchronize synthesize symmetric key cryptography sophisticate suspend Sampling circuit Sapphire Al2O3 Satellite valley Saturated current range Saturation region Saturation Scaled down Scattering Schockley diode Schottky Schottky barrier Schottky contact Schrodingen

Scribing grid Secondary flat Seed crystal Segregation Selectivity Self aligned Self diffusion Semiconductor Semiconductor-controlled rectifier Sendsitivity Serial / Series inductance Settle time Sheet resistance Shield Short circuit Shot noise Shunt Sidewall capacitance Signal Silica glass Silicon Silicon carbide Silicon dioxide (SiO2) Silicon Nitride(Si3N4) Silicon On Insulator Siliver whiskers Simple cubic Single crystal Sink Skin effect Snap time Sneak path Sulethreshold Solar battery/cell Solid circuit Solid Solubility Sonband Source Source follower Space charge Specific heat(PT) Speed-power product Spherical

Spin Split Spontaneous emission Spreading resistance Sputter Stacking fault Static characteristic Stimulated emission Stimulated recombination Storage time Stress Straggle Sublimation Substrate Substitutional Superlattice Supply Surface Surge capacity Subscript Switching time Switch T token trace traffic analysis Trojan horse Tailing Terminal Tensor Tensorial Thermal activation Thermal conductivity Thermal equilibrium Thermal Oxidation Thermal resistance Thermal sink Thermal velocity Thermoelectricpovoer Thick-film technique Thin-film hybrid IC Thin-Film Transistor(TFT) Threshlod Thyistor Transconductance

Transfer characteristic Transfer electron Transfer function Transient Transistor aging(stress) Transit time Transition Transition-metal silica Transition probability Transition region Transport Transverse Trap Trapping Trapped charge Triangle generator Triboelectricity Trigger Trim Triple diffusion Truth table Tolerahce Tunnel(ing) Tunnel current Turn over Turn - off time U Ultraviolet Unijunction Unipolar Unit cell Unity-gain frequency Unilateral-switch V variety vector verify victory vertical via virus Vacancy Vacuum Valence(value) band

Value band edge Valence bond Vapour phase Varactor Varistor Vibration Voltage W Worm Wafer Wave equation Wave guide Wave number Wave-particle duality Wear-out Wire routing Work function Worst-case device X x Y Yield Z Zener breakdown Zone melting