DATASHEET

PolyZen Protection Device for USB Applications

Tyco Electronics PolyZen devices are polymer-enhanced, precision Zener diode micro-assemblies. They offer resettable protection against multi-Watt fault events and spare the need for large heavy heat sinks. A unique feature of the PolyZen micro-assembly is that the Zener diode is thermally coupled to a resistively non-linear, polymer PTC (Positive Temperature Coefficient) layer. This PTC layer is fully integrated into the device, and is electrically in series between VIN and the diode clamped VOUT. This polymer PTC layer responds to either extended diode heating or overcurrent events by transitioning from a low to high resistance state, also known as tripping. A tripped PTC will limit current and generate voltage drop. It helps to protect both the Zener diode and the follow-on electronics and effectively increases the diodes power handling capability. The Zener diode used for voltage clamping in the PolyZen micro-assembly was selected due to its relatively flat voltage vs current response. This helps improve output voltage clamping, even when input voltage is high and diode current is large. The polymer-enhanced Zener diode helps protect sensitive portable electronics from damage caused by inductive voltage spikes, voltage transients, improper power supplies, and reverse bias conditions. The PolyZen ZEN059V130A24LS device is particularly useful for USB 2.0/3.0 powered devices; typically, it draws only 500A of operating current in USB suspend mode. Benefits: Stable Zener diode helps shield downstream electronics from overvoltage and reverse bias PTC trip events help to protect the Zener diode and extend its power handling capability Analog nature of trip events minimizes upstream inductive spikes Minimal power dissipation requirements Single component placement Features: Meets USB suspend mode current requirement - 500A (typ) @ 5.0V Overvoltage transient suppression Stable VZ vs fault current Time delayed, overvoltage trip Time delayed, reverse bias trip Multi-Watt power handling capability Integrated device construction RoHS Compliant and Halogen Free Applications: USB 2.0/3.0 powered consumer electronics, external hard disk drives and solid state devices DC power port protection in systems using barrel jacks for power input DC power port protection in portable electronics and navigation devices DC output voltage regulation USB 3.0 hubs and adapter cards Laptops and desktop PCs

Typical USB 2.0/3.0 Application Block Diagram

USB 3.0 Host USB 2.0 Host USB 2.0 Controller/ Transceiver Chipset PolySwitch Device VBUS D+ D GND
ESD ESD ESD

USB 3.0 Device PolyZen Device USB 3.0 Host Connector

480 Mbps VBUS D+ D SSTX+ SSTX SSRX+ SSRX GND
ESD

USB 2.0 Device PolyZen Device USB 2.0 Host Connector VBUS D+ 480 D Mbps GND
ESD ESD

PolySwitch Device VBUS D+ D SSTX+ Host SSTX Controller SSRX+ SSRX GND

VBUS D+ D GND SESD & PESD Devices Device IC

ESD

ESD

ESD

ESD

ESD

GND SESD & PESD Devices Chassis From USB 2.0 Host Controller

SESD & PESD Devices

ESD

ESD

ESD

5,000 Mbps

ESD

Chassis

From USB 3.0 Host Controller

ESD

SESD & PESD Devices

ESD

Device IC

Electrical Characteristics for ZEN059V130A24LS

VZ(1) (V) Min. Typ. Max. IHOLD @ 20C (A) Operating(2) Current Test Voltage 5.0 Max Current (mA) 0.65 VINT MAX (V) VINT MAX (V) 24 Test Current (A) 3 IFLT MAX IFLT MAX (A) +6 -40 Test Voltage (V) +24 -16 Tripped Power Dissipation Max Test Value Voltage (W) (V) 1.0 24

IZt (A)

(1)

RTyp ()

R1Max ()

5.8

5.9

6.0

0.1

1.3

0.12

0.15

(1) IZt is the current at which VZ is measured. (2) Typical operating current is 500A @ 5.0V which meets USB suspend mode requirement.

Typical Characteristic
Typical Fault Response: ZEN059V130A24LS 24V/6A Current Limited Source (IOUT=0) 24 A = VIN (V) 22 20 B = VOUT (V) 18 C = IFLT (A) 16 14 12 10 8 6 4 2 0 0.00 A

Typical I-V (300 sec pulse) 7.0

Voltage: VOUT (V)

6.0

V (V) or I (A)

5.0

4.0 ZEN059VxxxAxxLS

C 0.05 Time (sec) 0.10 0.15

3.0 0.00001

0.0001

0.001

0.01 0.1 Current: IFLT (A)

10

Configuration Information
Pin Description
Pin Pin Number Name 1 2 3 Pin Function

Pin Configuration (Top View)

Recommended Pad Dimensions

0.94mm (0.037) 2.21mm (0.087) 0.33mm (0.013) 0.94mm (0.037) 0.56mm (0.022) 2.88mm (0.1135) 0.56mm (0.022)

VIN

VIN = Protected input to Zener diode

VIN 1

2 GND

GND GND = Ground VOUT VOUT = Zener regulated voltage output

3 VOUT

Mechanical Dimensions
W Min Length Width Height Length Diode Height Diode Offset Offset L W H Ld Hd O1 O2 3.85 mm (0.152) 3.85 mm (0.152) 1.4mm (0.055) Typical 4 mm (0.16) 4 mm (0.16) 1.7 mm (0.067) 3.0 mm (0.118) 1.0 mm (0.039) 0.6 mm (0.024) 0.7 mm (0.028) Max 4.15 mm (0.163) 4.15 mm (0.163) 2.0 mm (0.081) H O2 Ld L O1

Ld

Hd

Raychem Circuit Protection Products

308 Constitution Drive, Building H Menlo Park, CA USA 94025-1164 Tel : (800) 227-7040, (650) 361-6900 Fax : (650) 361-4600 www.circuitprotection.com www.circuitprotection.com.hk (Chinese) www.tycoelectronics.com/japan/raychem (Japanese)

PolySwitch, PolyZen, Raychem, TE (logo) and Tyco Electronics are trademarks of the Tyco Electronics group of companies and its licensors. All information, including illustrations, is believed to be reliable. Users, however, should independently evaluate the suitability of each product for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics only obligations are those in the Tyco Electronics Standard Terms and Conditions of Sale for this product, and in no case will Tyco Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition, Tyco Electronics reserves the right to make changes without notification to Buyerto materials or processing that do not affect compliance with any applicable specification. 2010 Tyco Electronics Corporation. All rights reserved. RCP0083E.0410