ACOP

bq24751A
28LDQFN
TOP VIEW
LEARN
SRN
BAT
CELLS
SRP
SRSET
IADAPT
ACDRV
ACSET
CHGEN
ACN
ACP
ACDET
P
V
C
C
B
T
S
T
H
I
D
R
V
R
E
G
N
P
H
L
O
D
R
V
P
G
N
D
O
V
P
S
E
T
A
G
N
D
V
R
E
F
V
A
D
J
V
D
A
C
A
C
G
O
O
D
B
A
T
D
R
V
1
2
3
4
5
6
7
8 9 10 11 12 13 14
15
16
17
18
19
20
21
27 26 25 24 23 22 28

VREF
RAC
0.010
RSR
0.010
Q2 (ACFET)
SI4435
Q3(BATFET)
SI4435
N
P P
ACN
ACP
ACDRV
ACDET
ACGOOD
SRSET
ACSET
VREF
CELLS
CHGEN
VDAC
VADJ
ADC IADAPT
HOST
PVCC
BATDRV
HIDRV
N
PH
BTST
REGN
LODRV
PGND
SRP
SRN
P
PACK+
PACK-
SYSTEM ADAPTER +
ADAPTER -
ACGOOD
AGND
bq24751A
2.2 F
C1
432 k
1%
66.5 k
1%
R1
R2
10 k
R5
1 F
C4
100 pF
C5
0.1 F
C8
Q4
FDS6680A
Q5
FDS6680A
0.1 F
C9
L1
8.2 H
D1
BAT54
1 F
C10
BAT
OVPSET
422 k
1%
R3
71 k
1%
R4
LEARN
ACOP
Q1 (ACFET)
SI4435
10 F
C6
C15
0.1 F
C16
0.47 F
0.1 F
C2 C3
2
R10
0.1 F
PowerPad
10 F
C7
10 F
C12
C14
0.1 F
C13
0.1 F
C11
10 F
GPIO
DAC
DAC

VREF
RAC
0.010
RSR
0.010
Q2 (ACFET)
SI4435
Q3(BATFET)
SI4435
N
P P
ACN
ACP
ACDRV
ACDET
ACGOOD
SRSET
ACSET
VREF
CELLS
CHGEN
VDAC
VADJ
ADC IADAPT
HOST
PVCC
BATDRV
HIDRV
N
PH
BTST
REGN
LODRV
PGND
SRP
SRN
P
PACK+
PACK-
SYSTEM ADAPTER +
ADAPTER -
ACGOOD
AGND
bq24751A
2.2 F
C1
10 k
R5
1 F
C4
100 pF
C5
0.1 F
C8
Q4
FDS6680A
Q5
FDS6680A
0.1 F
C9
L1
8.2 H
D1
BAT54
1 F
C10
BAT
OVPSET
422 k
1%
R3
71 k
1%
R4
LEARN
ACOP
Q1 (ACFET)
SI4435
10 F
C6
C15
0.1 F
C16
0.47 F
0.1 F
C2 C3
2
R10
0.1 F
PowerPad
10 F
C7
10 F
C12
C14
0.1 F
C13
0.1 F
C11
10 F
GPIO
VREF
VREF
100 k
R8
66.5 k
R9
100 k
R7
43 k
R11
VREF
REGN
432 k
1%
66.5 k
1%
R1
R2

-0.20
-0.10
0
0.10
0.20
0.30
0.40
0.50
0 10 20 30 40 50
VREF-LoadCurrent-mA
R
e
g
u
l
a
t
i
o
n

E
r
r
o
r

%
PVCC=10V
PVCC=20V
-3
-2.50
-2
-1.50
-1
-0.50
0
0 10 20 30 40 50 60 70 80
REGN-LoadCurrent-mA
R
e
g
u
l
a
t
i
o
n

E
r
r
o
r

%
PVCC=10V
PVCC=20V
0
1
2
3
4
5
6
7
8
9
10
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
SRSET/VDACRatio
C
h
a
r
g
e

C
u
r
r
e
n
t

R
e
g
u
l
a
t
i
o
n

-
A
SRSET Varied,
4-Cell,
Vbat=16V
16
16.2
16.4
16.6
16.8
17
17.2
17.4
17.6
17.8
18
18.2
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
VADJ/VDACRatio
V
o
l
t
a
g
e

R
e
g
u
l
a
t
i
o
n

V
VADJ=0-VDAC,
4-Cell,
NoLoad
V =16.8V
reg
-0.2
-0.1
0
0.1
0.2
0
2000 4000
6000 8000
ChargeCurrent-mA
R
e
g
u
l
a
t
i
o
n

E
r
r
o
r

%
0
1
2
3
4
6
7
8
9
10
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
ACSET/VDACRatio
I
n
p
u
t

C
u
r
r
e
n
t

R
e
g
u
l
a
t
i
o
n

-
A
ACSET Varied,
4-Cell,
Vbat=16V
5
















SRSET Varied
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
0 2 4 6 8
I Setpoint- A
(CHRG)
-
R
e
g
u
l
a
t
i
o
n

E
r
r
o
r

%
4-Cell,VBAT =16V
VADJ=0-VDAC
-0.10
-0.08
-0.06
-0.04
-0.02
0
0.02
0.04
0.06
0.08
0.10
16.5 17 17.5 18 18.5 19
V -Setpoint-V
(BAT)
R
e
g
u
l
a
t
i
o
n

E
r
r
o
r

%
4-Cell,noload
ACSET Varied
-2
-1
0
1
2
3
4
5
6
7
8
9
10
0 1 2 3 4 5 6
InputCurrentRegulationSetpoint- A
R
e
g
u
l
a
t
i
o
n

E
r
r
o
r

%
4-Cell,VBAT =16V
Iadapt AmplifierGain
-25
-20
-15
-10
-5
0
5
0 1 2 3 4 5 6 7 8 9 10
I - A
(ACPWR)
P
e
r
c
e
n
t

E
r
r
o
r
V =20V,CHG=EN
I
V =20V,CHG=DIS
I
V =20V,
4-Cell,
V =16V
I
bat
0
1
2
3
4
5
0 1 2 3 4
SystemCurrent- A
I
c
h
r
g

a
n
d

I
i
n

-
A
InputCurrent
ChargeCurrent
SystemCurrent















V =20V,
Ichrg_set=4 A,
T =20C
4Cell
in
A
0
1
2
3
4
5
0 2 4 6 8 10 12 14 16 18
BatteryVoltage-V
C
h
a
r
g
e

C
u
r
r
e
n
t

-
A
70
80
90
100
0 2000 4000 6000 8000
BatteryChargeCurrent-mA
E
f
f
i
c
i
e
n
c
y

%
V =12.6V
reg
V =16.8V
(BAT)
V =8.4V
reg
C
h
4
5

V
/
d
i
v
C
h
1
2
V
/
d
i
v
C
h
2
2
0
V
/
d
i
v
C
h
3
5
V
/
d
i
v
t Time=100ms/div
V
ACGOOD
V
ACDRV
V
BATDRV
V
ACDET
C
h
2
2
0
V
/
d
i
v
t Time=400 s/div m
C
h
1
2
0
V
/
d
i
v
C
h
4
1
0
V
/
d
i
v
C
h
3
1
0
V
/
d
i
v
V
BAT
V
SYS
V
ACDRV
V
BATDRV













C
h
2
2
0
V
/
d
i
v
t Time=2ms/div
C
h
1
2
0
V
/
d
i
v
C
h
4
1
0
V
/
d
i
v
C
h
3
1
0
V
/
d
i
v
V
BAT
V
SYS
V
ACDRV
V
BATDRV
C
h
2
2
0
V
/
d
i
v
t Time=400ms/div
V
ACDRV
C
h
1
2
0
V
/
d
i
v
C
h
1
7
.
2
V
C
h
4
5
A
/
d
i
v
V
ACPWR
V
ACGOOD
I
L
C
h
3
5
V
/
d
i
v
C
h
3
5
A
/
d
i
v
t Time=1ms/div
C
h
1
5
V
/
d
i
v
C
h
2
5
V
/
d
i
v
V
SYS
V
ACDRV
V
ACOP
I
IN
C
h
4
5
0
0
m
V
/
d
i
v
C
h
3
2
A
/
d
i
v
V
BAT
t Time=200 s/div m
V
IN
I
L
C
h
1
5
V
/
d
i
v
C
h
4
5
V
/
d
i
v













C
h
3
2
A
/
d
i
v
t Time=4ms/div
C
h
1
1
0
V
/
d
i
v
C
h
1
1
.
8
V
C
h
4
1
V
/
d
i
v
V
CHGEN
V
PH
I
BAT
C
h
2
2
0
V
/
d
i
v
V
BAT
C
h
4
5
V
/
d
i
v
t Time=4 s/div m
V
HIDRV
V
PH
V
LDDRV
I
L
C
h
1
1
0
V
/
d
i
v
C
h
2
1
0
V
/
d
i
v
C
h
3
2
A
/
d
i
v
C
h
4
2
A
/
d
i
v
t Time=4ms/div
C
h
1
2
0
V
/
d
i
v
C
h
2
2
0
V
/
d
i
v
V
PH
V
LODRV
I
L
C
h
3
5
V
/
d
i
v
V
HIDRV
C
h
3
2
A
/
d
i
v
t Time=2 s/div m
C
h
2
1
0
V
/
d
i
v
V
PH
V
LODRV
I
L
C
h
4
5
V
/
d
i
v
C
h
3
2
A
/
d
i
v
t Time=400 s/div m
C
h
4
1
0
V
/
d
i
v
V
BAT
I
L
C
h
4
5
A
/
d
i
v
t Time=1 s/div m
C
h
1
2
0
V
/
d
i
v
C
h
2
2
0
V
/
d
i
v
V
PH
V
LODRV
I
L
C
h
3
5
V
/
d
i
v
V
HIDRV












C
h
4
2
A
/
d
i
v
t Time=1 s/div m
C
h
1
2
0
V
/
d
i
v
C
h
2
2
0
V
/
d
i
v
V
PH
V
LODRV
I
L
C
h
3
5
V
/
d
i
v
V
HIDRV







IADAPT
ACGOOD
PVCC
ACDRV
BATDRV
BTST
HIDRV
PH
REGN
LODRV
PGND
bq24751A
ACDET
CHGEN
ACP
ACN
BAT
CELLS
6V LDO
V(ACP-ACN)
+

ADAPTER DETECTED
COMP
ERROR
AMPLIFIER
V(ACN-BAT)
V(IADAPT)
+

20x
ACP
ACN
ENA_BIAS
20 A
IIN_ER
BAT_ER
ICH_ER
1V
20 A
285mV
+ _
IIN_REG
VBAT_REG
IBAT_ REG
ACN-6V
PVCC-6V
PVCC
PVCC-6V
PVCC-6V
LDO
DC-DC
CONVERTER
PWM LOGIC
PVCC
PH
4V
+
_
BTST
REFRESH
C
BTST
SYSTEM POWER
SELECTOR
LOGIC
CHGEN
CHGEN
CHG_OCP
BAT_OVP
155C
IC Tj TSHUT
BAT
185mV
+ _
PVCC
PVCC-BAT
LEVEL
SHIFTER
ACN
+
-
+

+
+

BAT_SHORT
ACOP
SYNCH
V(SRP-SRN)
CHG_OCP

+
145% X IBAT_REG
SYNCH
+

V(SRP-SRN)
SRSET
VADJ
VDAC
ACSET
VBAT_REG
IBAT_REG
IIN_REG
VBATSET
IBATSET
IINSET
RATIO
PROGRAM
+

13mV
BAT
BAT_OVP

+
104% X VBAT_REG
ACFET_ON
ACOP
OVPSET
ACOV

+
UVLO
+

3.1V
PVCC
+

4V
VREF 3.3V LDO
PVCC
AGND
FBO
EAI EAO
ENA_BIAS
ENA_BIAS
2.4V
+

ENA_BIAS 0.6V
+

5 A
VREF
Isrc=K*V(PVCC-ACP)
K=18 A/V
ACOPDET

+
2V

+
ENA_SRC
ENA_SNK
S
R
Q
Q
ACDET
PVCC_UVLO
ACOP_LATCH
Delay Rising
UVLO
ACOV
V(ACN-BAT)
700ms
LEARN
V(SRP-SRN)
+

BAT
BAT_SHORT
+

2.9V/cell
+

20x
SRP
SRN
3.5mA
3.5mA
CHRG_ON
20x







4 0.512

= +


VADJ
BATT
VDAC
V
V cell count V
V


I
CHARGE
+
V
SRSET
V
VDAC

0.10
R
SR

























































I
ADAPTER
+
V
ACSET
V
VDAC

0.10
R
AC























































f
o
+
1
2p L
o
C
o

( ) ( )
_
2

- -
= =
RIPPLE_MAX
SYN RIPPLE MAX
BAT
IN BAT IN
IN s s
RIPPLE
I
I I
and
V 1 1
V V V 1 D D
V f f
I
L L

) ACP PVCC ( V I V I Power
LIM _ ACOC sd d
- = =

) ACP PVCC ( V 18mA/V

V 2 C
i
V C
t
ACOP
ACOP
ACOP ACOP
-

=
D
= D

































700ms
2ms
A
C
O
C
,
N
o
L
a
t
c
h
-
o
f
f
ACOC, with ACOP Latch-off,
Latch-offtimeaccumulates
onlywhenincurrentlimit
regulation, ACOC. Thetime
beforelatch-offis
programmablewithCacop,
andisinverselyproportionalto
source-drainvoltageof
ACFET (power). Cacop
charge/dischargepertime
alsoprovidesmemoryfor
poweraveragingovertime.
700msdelayafter
ACDET, beforeallow
ACDRVtoturn-on
Inallcases, after 700ms
delay, haveinputover-
currentprotection,
ACOC, bylinearlylimiting
inputcurrent.
Thresholdisequaltothe
lowerofIdpm*1.5, or
10A.
8ms
AllowChargeto Turn-on
AfterLatch-Off, Latch
canonlyclearby:
1) bringing ACDET below
2.4V, thenabove 2. 4V; or
2) bringingPVCCbelow
UVLO, thenabove
UVLO.
Vin
ACDET
ACGOOD
BATDRV
ACDRV
Vsystem
InputCurrent
Vadapter
0V
Vadapter
Vbattery
AllowCharge
ChargeCurrent
Ilim= 1.5xIdpm
(100mVmax
Across ACP_ACN)
V(ACOP)






ACOC_REG
V(PVCC-ACP)
Iacop_pin
2V
V(ACOP)
ON
OFF
ACDRV_ON
LATCH-OFF
LATCH-OFF
Ilim =1.5xIdpm
Iin
LATCH-OFF
MemoryEffect
AveragesPower





5 A
REF=3.3V
Isrc=K*V(PVCC-ACP)
K=18 A/V
ACOP
ACOP Adaptor
OverPower
Comparator
ACOPDET

+
S
R Q
Q
ACDET
1s
Deglitch
ACOPDETDG
Rising-EdgeSet
andResetInputs
2 V

+
ACP
PVCC
ACDRV
ACN
ENA_SRC
ENA_SNK
+

IIN
Differential Amp
CSA
V(ACP-ACN)
VDS
Differential Amp
V(PVCC-ACP)
Regulation
Reference
Lowestof
1.5xIDPM_PRG
or
10 A (100mV)
IDPM_PRG
(100mV_max)
ACOCREG=
REGULATING
ACOCERROR
AMPLIFIERand
DRIVER
IADAPT
IDPM
Ratio-
metric
Program
ACSET
Toclearlatchfault,usermustremoveadapter
andreinsert,orPVCCbroughtbelowthen
aboveinputUVLOthreshold
PVCC_UVLO
Turn-off ACDRV
ACDET 700ms
Delay
ACDRV and
break-
before-make
logic
BATDRV
ACDRV_ON
R
AC
0.01 W
P P
ADAPTER+
ADAPTER
C1
2.2 F
R10
2 W
C3
0.1F
C2
0.1F
C8
0.1F
C
acop
0.47F
Q1(ACFET)
SI4435
Q2 (ACFET)
SI4435

Ci
Ri Li
Vi
VIN
IIN
Rc
Vc
Ci
Ri Li
Vi
VIN
IIN
Rc
Vc
( ) ( )
( )
2
sin cos e w w
w

= + = +


i
i
R
t
L i C
IN IN C i Ci t
i
R -R
V t I t R V V t t
L

w w
w



2
t
R V 1 2L
t i i
R = R + R = - I (t) = sin t
t i IN C
L C 2L L
i i i i
R
i
e

w w
w



R
t
t
R 2L
t i
V (t) = V - V t + cos t
i i Ci
2 L
i
sin e

= >
i C
L
R R 2
C











0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
0
5
10
15
20
25
30
35
I
n
p
u
t

C
a
p
a
c
i
t
o
r
V
o
l
t
a
g
e

V
Time-ms
R =0.15
i
W
L =9.3
C =40 F
i
i
mH
m
(a)V withvariousC values
c i
(b)V withvariousL values
c i
(c)V withvariousR values
c i
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
0
5
10
15
20
25
30
35
I
n
p
u
t

C
a
p
a
c
i
t
o
r
V
o
l
t
a
g
e

V
Time-ms
C =20 F
i
m
C =40 F
i
m
R =0.21
L =9.3 H
i
i
W
m
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
0
5
10
15
20
25
30
35
I
n
p
u
t

C
a
p
a
c
i
t
o
r
V
o
l
t
a
g
e

V
Time-ms
L =5 H
i
m
L =12 H
i
m
R =0.15
C =40 F
i
i
W
m
R =0.5
i
W












Rext
C1 C2
2
(0.5W,1210anti-surge)
W
2.2 F
(25V,1210)
m 0.1 F
(50V,0805,veryclosetoPVCC)
m
V
IN
V
PVCC









(a)TopLayer
(b)BottomLayer























PACKAGE OPTION ADDENDUM
www.ti.com 16-Nov-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
BQ24751ARHDR NRND VQFN RHD 28 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ24751ARHDRG4 NRND VQFN RHD 28 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ24751ARHDT NRND VQFN RHD 28 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ24751ARHDTG4 NRND VQFN RHD 28 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
BQ24751ARHDR VQFN RHD 28 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
BQ24751ARHDT VQFN RHD 28 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ24751ARHDR VQFN RHD 28 3000 367.0 367.0 35.0
BQ24751ARHDT VQFN RHD 28 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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