Professional Documents
Culture Documents
aa
O FaaDoOEngineers.com o D
Engaging Peers, Inspiring Careers!
Soldering.c s r e e n i g n E
Chapter 21
by FaaDoOEngineers.com
m o
Chapter Objectives
Explain Terms used in soldering Identify tools used for soldering List the Rules for soldering
e e List the precautions to be taken for soldering n i Explain Chip soldering g n E Explain the procedure for Chip soldering O o D a a F
by FaaDoOEngineers.com
c . rs
m o
Recall
m o physical location, power supply requirement, c . and environmental factors rs e e There are various safety considerations, n i g which need to be n considered before handling a computer OE o UPS is a device, which is used to provide a D a a steady or uninterrupted supply of current in F case of a power failure
Site preparation involves issues such as
by FaaDoOEngineers.com
using an alloy
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
Question for GD
solder connection.
Time Limit-2mins
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
Question for GD
Time Limit-2mins
List down the tools which are used during soldering. 1. _______ 2. _______ 3. _______ 4. _______ 5. _______ 6. _______ 7. _______ 8. _______ 9. _______ 10. _______ 11. _______ 12. _______
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
e e Switch 'ON' the soldering iron and wait till it n i reaches the operating temperature g n E O The hot tip has to be kept on a piece of metal to o D dissipate the excess heat a a F
by FaaDoOEngineers.com
c . rs
m o
c . s Use enough solder to cover the lead and the r e copper foil area of the connection e n i g n Use sufficient heat E O o D Check a the connection properly a F
Always remember that larger the metal surface, the longer time it will take to heat.
by FaaDoOEngineers.com
m o
Question for GD
Time Limit-2mins
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
Hands On
Perform Soldering of different components on
PCB
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
e e Do not use a spread solder on copper foil lines on n i the PCB g n E O a fan while soldering Do not sito under D a a F Position the PCB so that the gravity tends to keep
the solder in the desired position
by FaaDoOEngineers.com
c . rs
m o
c . s Avoid the vibration of PCB or components while r e soldering e n i g n Incase of a dryE solder, re-weld the joint to get a O shiny bright finish o D a a F
by FaaDoOEngineers.com
m o
Chip Soldering I
Chip soldering technology is used for connecting the
e e
c . rs
m o
Chip Soldering - II
The disadvantages of Chip soldering are:
Bumped chips are barely available. Use of PCB is difficult as the pitches become very fine Inspection of hidden joints is difficult Bare chips are difficult to handle Repairing is very difficult
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
Remove the old chips by pre-heating the board and applying hot air Use braided solder removal flux to lift all old solder off
a F
D a
O o
n E
n i g
e e
c . rs
m o
before applying solder, clean off any old flux residues with alcohol and a brush Apply fresh liquid-substrate silver flux Pre-heat the board: Turn the pre-heater on and wait for few minutes
by FaaDoOEngineers.com
a F
D a
O o
n E
n i g
e e
c . rs
m o
Test to make sure it's located by gently nudging the chip with tweezers, it should spring back into place
n E
n i g
e e
c . rs
m o
Hands On
Perform chip soldering using Hot Air Gun
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
Summary - I
m cutter, nail cutter or micro shear , Soldering iron, o c . Tweezer or noise, Blade or knife are the various tools s r used for soldering e e n i g n Soldering generally means joining two metallic parts E using an alloy O o D a a Right type of soldering iron has to be used for F
The Screwdrivers (small and medium size), Side
soldering
by FaaDoOEngineers.com
Summary - II
You need to use enough solder to cover the lead and
process
you need to use enough solder to cover the lead and the copper foil area of the connection that has to be soldered
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com
Summary III
The connection need to be checked properly before
the soldering process begins and you need to use sufficient heat for a good solder
n i chip and the supporting material on which a circuit is g n formed through solder joints E O o D a a F
by FaaDoOEngineers.com
e e
c . rs
m o
Mind Map
Draw a mind map to summarize this chapter
a F
D a
O o
n E
n i g
e e
c . rs
m o
by FaaDoOEngineers.com