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May 2013 Chapter-5

PROTOTYPE DESIGN & FABRICATION

5.1 MATERIALS REQUIRED The Printed Circuit Board (PCB) fabrication technique involves the following materials; they are, 5.2 PCB PCB is used for soldering electronic components to form compact and rugged electronic circuits. A general purpose PCB is made of 2 mm thick insulation board with a copper clad on one side. Thickness of the copper clad is 30 to 40 m. 5.3 METHOD The following steps are involved in making a PCB. 1) Preparation of the lay-out of the track. 2) Transferring the lay- out of the track. 3) Etching to remove the copper from the copper clad wherever it is not required. 4) Drilling holes for components mounting. 5.4 PREPARING LAY-OUT The track lay out of the electronic circuit must be drawn on a white paper. The lay out should be made in such a way that the paths are in easy routes. This enables the PCB to be more compact and economical. Copper clad sheet Paint or nail polish Drilling machine Ferric chloride solution

Dept Of ECE

SBCEW,Elaumthitta

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May 2013

Fig.5.1 PCB layout for the proposed system

5.5 TRANSFERRING THE LAY OUT TO COPPER The lay-out made on the white paper should be redrawn on the copper clad using paint or nail polishing. 5.6 ETCHING Ferric chloride solution is the popularly used etching solution. The ferric chloride

powder is made into a solution using water and kept in a plastic tray. Marked copper clad is immersed in this solution for two hours. Due to the reaction solution will become weak and it is not recommended for another etching process. The copper in the unmarked area will be etched out. Take out the etched sheet from the tray and dry it in sun light for an hour. Later remove the paint or nail varnish using turpentine.

Dept Of ECE

SBCEW,Elavumthitta

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May 2013

5.7 DRILLING The holes are made by a drilling machine for the component insertion 5.8 SOLDERING Soldering is the process of joining two or more metals using an alloy metal having low melting point to establish electrical connection. Hand soldering and machine soldering are the two types of soldering methods. 5.8.1 MATERIALS AND TOOLS REQUIRED Soldering iron Solder Knife or blade General purpose PC Nose pliers

5.8.2 SOLDER Solder is used for joining two or more metals at temperatures below their melting point. The popularly used solders are the alloys of tin (63%) and lead (47%) that melts at 183 C (361 F) and solidifies when it cools. Melting points of tin (Sb) and lead (Pb) are 232 C and 327C respectively. When the tin and lead are mixed in 63:47 ratio, it becomes molten at 183C. This is called eutectic point. 5.8.3 SOLDERING FLUXES In order to make the surface accept the solder readily, the component terminals should be free from oxides and bother obstructing films. Soldering flux cleans the oxides from the surface of the metal. The leads should be cleaned chemically or by scraping using a blade or knife. Small amount of solder should be coated on the cleaned portion of the component leads and the bit of the soldering iron. This process is called tinning. Zinc chloride, ammonium chloride and Rosin

Dept Of ECE

SBCEW,Elavumthitta

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May 2013

are the most commonly used fluxes. These are available in petroleum jelly as paste flux. The residues which remain after the soldering may be washed out with Isopropyl alcohol or Acetone. 5.8.4 SOLDERING TOOLS 5.8.4.1 SOLDERING IRON It is the tool used to melt the solder and apply at the joints in the circuit. It operates in 230 V mains supply. The normal power ratings of the soldering iron are 10 W, 25W, 35W, 65 W and25 W, 35 W, 65 W and 125 W, 10 W and 25 W soldering irons are sufficient for light duty works. The iron bit at the tip of it gets heated up within a few minutes. Tips of the bit are either pointed of tapered. Pointed bits are useful for soldering very accurate and small circuits. It needs very little amount of solder. In the laboratory tapered bits are usually used. 5.8.4.2 SOLDERING IRON STAND It is used to place the soldering iron safely when it is not in use. 5.8.4.3 SOLDERING GUN It is a gun shaped soldering tool used especially when more heat is required. Its trigger is a switch that controls the ac power. 5.8.5 METHOD OF SOLDERING 1. Clean the component leads using a blade. Apply a little flux on the leads. Take a little solder on soldering iron and apply the molten solder on the leads. This process is called tinning. 2. Clean the tip of the soldering iron. Keep the bit always clean from oxide formation while soldering. 3. Do not over heat the PCB and the devices. Soldering must be done in minimum time to avoid dry-soldering and heating up of the components. 4. Do not use excess solder to flux.

Dept Of ECE

SBCEW,Elavumthitta

Safe lpg home

May 2013

Dept Of ECE

SBCEW,Elavumthitta