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NPN Silicon
MAXIMUM RATINGS
Rating Symbol VCEO VCBO VEBO IC 2N2219 2N2222 30 60 5.0 800 2N2219,A Total Device Dissipation @ TA = 25C Derate above 25C Total Device Dissipation @ TC = 25C Derate above 25C Operating and Storage Junction Temperature Range PD PD TJ, Tstg 0.8 4.57 3.0 17.1 2N2219A 2N2222A 40 75 6.0 800 2N2222,A 0.4 2.28 1.2 6.85 Watts mW/C Watts mW/C C Unit Vdc Vdc Vdc mAdc
3 2 1
LIFETIME BUY
Collector Emitter Voltage Collector Base Voltage Emitter Base Voltage Collector Current Continuous
65 to +200
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Symbol RqJA RqJC 2N2219,A 219 58 2N2222,A 437.5 145.8 Unit C/W C/W
OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0) CollectorBase Breakdown Voltage (IC = 10 Adc, IE = 0) EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0) Collector Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) Collector Cutoff Current (VCB = 50 Vdc, IE = 0) (VCB = 60 Vdc, IE = 0) (VCB = 50 Vdc, IE = 0, TA = 150C) (VCB = 60 Vdc, IE = 0, TA = 150C) Emitter Cutoff Current (VEB = 3.0 Vdc, IC = 0) Base Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) NonA Suffix ASuffix NonA Suffix ASuffix NonA Suffix ASuffix ASuffix ICBO NonA Suffix ASuffix NonA Suffix ASuffix IEBO ASuffix IBL ASuffix 20 nAdc 0.01 0.01 10 10 10 nAdc Adc V(BR)CEO V(BR)CBO V(BR)EBO ICEX 30 40 60 75 5.0 6.0 10 Vdc Vdc Vdc nAdc
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces 2N2218A/D)
Motorola SmallSignal Transistors, FETs and Diodes Device Data Motorola, Inc. 1996
3 2 1
ON CHARACTERISTICS
DC Current Gain (IC = 0.1 mAdc, VCE = 10 Vdc) (IC = 1.0 mAdc, VCE = 10 Vdc) (IC = 10 mAdc, VCE = 10 Vdc)(1) (IC = 10 mAdc, VCE = 10 Vdc, TA = 55C)(1) (IC = 150 mAdc, VCE = 10 Vdc)(1) (IC = 150 mAdc, VCE = 1.0 Vdc)(1) (IC = 500 mAdc, VCE = 10 Vdc)(1) Collector Emitter Saturation Voltage(1) (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) hFE 2N2219,A, 2N2222,A 2N2219,A, 2N2222,A 2N2219,A, 2N2222,A 2N2219,A, 2N2222,A 2N2219,A, 2N2222,A 2N2219,A, 2N2222,A 2N2219, 2N2222 2N2219A, 2N2222A VCE(sat) NonA Suffix ASuffix NonA Suffix ASuffix VBE(sat) NonA Suffix ASuffix NonA Suffix ASuffix 0.6 0.6 1.3 1.2 2.6 2.0 0.4 0.3 1.6 1.0 Vdc 35 50 75 35 100 50 30 40 300 Vdc
LIFETIME BUY
Base Emitter Saturation Voltage(1) (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc)
mmhos
1. 2. 3.
Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%. fT is defined as the frequency at which |hfe| extrapolates to unity. 2N5581 and 2N5582 are listed Ccb and Ceb for these conditions and values.
2N2219A, 2N2222A
SWITCHING CHARACTERISTICS
Delay Time Rise Time Storage Time Fall Time (VCC = 30 Vdc, VBE(off) = 0.5 Vdc, IC = 150 mAdc mAdc, IB1 = 15 mAdc) (Figure 12) (VCC = 30 Vdc, IC = 150 mAdc, IB1 = IB2 = 15 mAdc) (Figure 13) td tr ts tf TA 10 25 225 60 2.5 ns ns ns ns ns
Active Region Time Constant (IC = 150 mAdc, VCE = 30 Vdc) (See Figure 11 for 2N2219A, 2N2222A)
LIFETIME BUY
4.0 hFE, NORMALIZED DC CURRENT GAIN 3.0 2.0 TJ = 175C VCE = 1.0 V VCE = 10 V
25C 1.0 0.7 0.5 0.3 0.7 1.0 2.0 3.0 5.0 10 20 30 IC, COLLECTOR CURRENT (mA) 50 70 100 200 300 500 55C
This graph shows the effect of base current on collector current. o (current gain at the edge of saturation) is the current gain of the transistor at 1 volt, and F (forced gain) is the ratio of IC/IBF in a circuit. EXAMPLE: For type 2N2219, estimate a base current (IBF) to insure saturation at a temperature of 25C and a collector current of 150 mA. Observe that at IC = 150 mA an overdrive factor of at least 2.5 is required to drive the transistor well into the saturation region. From Figure 1, it is seen that hFE @ 1 volt is approximately 0.62 of hFE @ 10 volts. Using the guaranteed minimum gain of 100 @ 150 mA and 10 V, o = 62 and substituting values in the overdrive equation, we find: 5.0
0.6
IC = 300 mA
0.4
150 mA
0.2
50 mA
1.0
4.0
bo bF
2.5
+ 15062 IBF
IBF
[ 6.0 mA
0.2 0.5
1.6
VCE(sat) @ IC/IB = 10 5.0 10 20 50 100 IC, COLLECTOR CURRENT (mA) 200 500
2.4 0.5
1.0
2.0
200
500
Figure 3. On Voltages
LIFETIME BUY
h PARAMETERS
VCE = 10 Vdc, f = 1.0 kHz, TA = 25C
This group of graphs illustrates the relationship between hfe and other h parameters for this series of transistors. To obtain these curves, a highgain and a lowgain unit were selected and the same units were used to develop the correspondingly numbered curves on each graph. 20 h re , VOLTAGE FEEDBACK RATIO (X 10 4 ) 10 7.0 5.0 3.0 2.0 2 1.0 0.7 0.5 0.3 0.1 0.2 0.5 1.0 2.0 5.0 IC, COLLECTOR CURRENT (mAdc) 10 20 1 50 30 20 10 5.0 1 3.0 2.0 2 1.0 0.1 0.2 0.5 1.0 2.0 5.0 IC, COLLECTOR CURRENT (mAdc) 10 20
50 1 20 2 10 5.0 0.1
100 70 50
30 0.1
0.2
10
20
0.2
10
20
50 30 20 td @ VBE(off) = 0 V
5.0
200 300
200 300
LIFETIME BUY
300 ts , t f , STORAGE AND FALL TIME (ns) 200 ts 100 70 50 IC/IB1 = 10 30 20 LOW GAIN TYPES TJ = 25C 20 30 50 70 100 IC, COLLECTOR CURRENT (mA) 200 300 tf IC/IB1 = 20 IC/IB1 = 10
300 200 IC/IB1 = 10 100 70 50 30 20 HIGH GAIN TYPES TJ = 25C 20 30 50 70 100 IC, COLLECTOR CURRENT (mA) 200 300 IC/IB1 = 10 tf IC/IB1 = 20 ts
10 10
10 10
+ 30 V 200
+ 30 V 200
9.9 V
619
1.0 k
0.5 V
Figure 13. Storage Time and Fall Time Equivalent Test Circuit
B C
SEATING PLANE
T E
F P D 3 PL 0.36 (0.014)
L K
T A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION J MEASURED FROM DIMENSION A MAXIMUM. 4. DIMENSION B SHALL NOT VARY MORE THAN 0.25 (0.010) IN ZONE R. THIS ZONE CONTROLLED FOR AUTOMATIC HANDLING. 5. DIMENSION F APPLIES BETWEEN DIMENSION P AND L. DIMENSION D APPLIES BETWEEN DIMENSION L AND K MINIMUM. LEAD DIAMETER IS UNCONTROLLED IN DIMENSION P AND BEYOND DIMENSION K MINIMUM.
H
1
2 3
DIM A B C D E F G H J K L M P R
INCHES MIN MAX 0.335 0.370 0.305 0.335 0.240 0.260 0.016 0.021 0.009 0.041 0.016 0.019 0.200 BSC 0.028 0.034 0.029 0.045 0.500 0.750 0.250 45 _BSC 0.050 0.100
MILLIMETERS MIN MAX 8.51 9.39 7.75 8.50 6.10 6.60 0.41 0.53 0.23 1.04 0.41 0.48 5.08 BSC 0.72 0.86 0.74 1.14 12.70 19.05 6.35 45 _BSC 1.27 2.54
LIFETIME BUY
A B E C T F P L K
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION J MEASURED FROM DIMENSION A MAXIMUM. 4. DIMENSION F APPLIES BETWEEN DIMENSION P AND L. DIMENSION D APPLIES BETWEEN DIMENSION L AND K MINIMUM. LEAD DIAMETER IS UNCONTROLLED IN DIMENSION P AND BEYOND DIMENSION K MINIMUM. 5. DIMENSION E INCLUDES THE TAB THICKNESS. (TAB THICKNESS IS 0.51(0.002) MAXIMUM). INCHES MIN MAX 0.209 0.230 0.178 0.195 0.170 0.210 0.016 0.021 0.030 0.016 0.019 0.100 BSC 0.036 0.046 0.028 0.048 0.500 0.250 45 _BSC 0.050 BSC 0.050 MILLIMETERS MIN MAX 5.31 5.84 4.52 4.95 4.32 5.33 0.406 0.533 0.762 0.406 0.483 2.54 BSC 0.914 1.17 0.711 1.22 12.70 6.35 45_BSC 1.27 BSC 1.27
D 3 PL 0.36 (0.014) N H
1 2 3 M
T A
N G
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*2N2219/D*
DIM A B C D E F G H J K L M N P