LM337...

KTE, KTP, OR KVU PACKAGE

(TOPVIEW)
OUTPUT
INPUT
ADJUSTMENT
I
N
P
U
T
I
N
P
U
T
LM337...KTT (TO-263) PACKAGE
(TOPVIEW)
OUTPUT
INPUT
ADJUSTMENT
LM237, LM337...KC (TO-220) PACKAGE
(TOPVIEW)
INPUT
OUTPUT
ADJUSTMENT
INPUT
OUTPUT
LM337...KCS (TO-220) PACKAGE
(TOPVIEW)
ADJUSTMENT
I
N
P
U
T
I
N
P
U
T




w w w . t i . c o m

www.ti.com
ADJUSTMENT
OUTPUT
INPUT

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C1
+
C2
R1
R2
+
INPUT OUTPUT
ADJUSTMENT
LM237
or
LM337
V
O
V
I
C1 is a 1-F solid tantalum capacitor required only if the regulator is more than 10 cm (4 in) from the power-supply filter capacitor.
C2 is a 1-F solid tantalum or 10-F aluminum electrolytic capacitor required for stability.
R2 + R1
V
O
1..25
*1
R1 typically is 120 .
, where V
O
is the output in volts.
ADJUSTMENT
OUTPUT INPUT V
I
R
S
V
O
LM237
or
LM337

R
S
=
1.25 V
I
LIMIT







PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
LM237KC OBSOLETE TO-220 KC 3 TBD Call TI Call TI
LM237KCE3 OBSOLETE TO-220 KC 3 TBD Call TI Call TI
LM237KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free
(RoHS)
CU SN N / A for Pkg Type
LM237KTER OBSOLETE PFM KTE 3 TBD Call TI Call TI
LM337KC OBSOLETE TO-220 KC 3 TBD Call TI Call TI
LM337KCE3 OBSOLETE TO-220 KC 3 TBD Call TI Call TI
LM337KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free
(RoHS)
CU SN N / A for Pkg Type
LM337KTER OBSOLETE PFM KTE 3 TBD Call TI Call TI
LM337KTPR OBSOLETE PFM KTP 2 TBD Call TI Call TI
LM337KTPRG3 OBSOLETE PFM KTP 2 TBD Call TI Call TI
LM337KTTR ACTIVE DDPAK/
TO-263
KTT 3 500 Green (RoHS &
no Sb/Br)
CU SN Level-3-245C-168 HR
LM337KTTRG3 ACTIVE DDPAK/
TO-263
KTT 3 500 Green (RoHS &
no Sb/Br)
CU SN Level-3-245C-168 HR
LM337KVURG3 ACTIVE PFM KVU 3 2500 Green (RoHS &
no Sb/Br)
CU SN Level-3-260C-168 HR
LM337Y OBSOLETE DIESALE Y 0 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Mar-2009
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 2-Mar-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
LM337KTTR DDPAK/
TO-263
KTT 3 500 330.0 24.4 10.6 15.8 4.9 16.0 24.0 Q2
LM337KVURG3 PFM KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM337KTTR DDPAK/TO-263 KTT 3 500 340.0 340.0 38.0
LM337KVURG3 PFM KVU 3 2500 340.0 340.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA


MPFM001E OCTOBER 1994 REVISED JANUARY 2001
1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
KTE (R-PSFM-G3) PowerFLEX PLASTIC FLANGE-MOUNT
0.360 (9,14)
0.350 (8,89)
0.080 (2,03)
0.070 (1,78)
0.010 (0,25) NOM
0.040 (1,02)
Seating Plane
0.050 (1,27)
0.001 (0,03)
0.005 (0,13)
0.010 (0,25)
NOM
Gage Plane
0.010 (0,25)
0.031 (0,79)
0.041 (1,04)
4073375/F 12/00
NOM
3 1
0.350 (8,89)
0.220 (5,59)
0.360 (9,14)
0.295 (7,49)
NOM
0.320 (8,13)
0.310 (7,87)
0.025 (0,63)
0.031 (0,79)
Thermal Tab
(See Note C)
0.004 (0,10)
M 0.010 (0,25) 0.100 (2,54)
36
0.410 (10,41)
0.420 (10,67)
0.200 (5,08)
0.365 (9,27)
0.375 (9,52)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. The center lead is in electrical contact with the thermal tab.
D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).
E. Falls within JEDEC MO-169
PowerFLEX is a trademark of Texas Instruments.
MECHANICAL DATA


MPSF001F JANUARY 1996 REVISED JANUARY 2002
1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
KTP (R-PSFM-G2) PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE
0.228 (5,79)
0.218 (5,54)
0.233 (5,91)
0.243 (6,17)
0.001 (0,02)
0.005 (0,13)
0.070 (1,78)
Seating Plane
0.080 (2,03)
0.010 (0,25) NOM
Gage Plane
0.010 (0,25)
4073388/M 01/02
0.037 (0,94)
0.047 (1,19)
0.247 (6,27)
0.237 (6,02)
NOM
0.215 (5,46)
0.371 (9,42)
0.381 (9,68)
0.090 (2,29)
0.100 (2,54)
0.287 (7,29)
0.031 (0,79)
0.032 (0,81) MAX
0.277 (7,03)
0.025 (0,63)
0.130 (3,30) NOM
0.090 (2,29)
0.180 (4,57)
M 0.010 (0,25)
0.004 (0,10)
26
0.040 (1,02)
0.050 (1,27)
Thermal Tab
(See Note C)
0.010 (0,25) NOM
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. The center lead is in electrical contact with the thermal tab.
D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).
E. Falls within JEDEC TO-252 variation AC.
PowerFLEX is a trademark of Texas Instruments.