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TABLE OF CONTENTS

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Service Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Epoxy Resin Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Curing Agent Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Modifier Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Table 1: Physical Properties of EPON Resins used in Chemical Resistant Systems . . . . . . . . . . . . . . . . . . . . . . 3 Table 2: Physical Properties of Modified and Multifunctional EPON Resins used in Chemical Resistant Systems . . . . . . 3 Table 3: Physical Properties of EPI-CURE Curing Agents used in Chemical Resistant Systems . . . . . . . . . . . . . . . . 4 Test Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Table 4: Physical Properties of HELOXY Epoxy Functional Modifiers used in Chemical Resistant Systems . . . . . . . . . 5 Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Chemical Resistance for EPON Resins and EPI-CURE 3200 Series Aliphatic Amine Curing Agents % Weight Change as a Function of Time: Chart 1: EPON Resin 828, Ambient Cured . . . . . 6-7 Chart 2: EPON Resin 828, Post Cured . . . . . . . . 8-9 Chart 3: EPON Resin 862, Ambient Cured . . . . 10-1 1 Chart 4: EPON Resin 862, Post Cured . . . . . . 12-13 Chart 5: EPON Resin 824, Ambient Cured . . . . 14-15 Chart 6: EPON Resin 824, Post Cured . . . . . . 16-17 Chemical Resistance for EPON Resins and EPI-CURE 3300 Series Cycloaliphatic Amine Curing Agents % Weight Change as a Function of Time: Chart 7: EPON Resin 828, Ambient Cured . . . . 18-19 Chart 8: EPON Resin 828, Post Cured . . . . . . 20-21 Chart 9: EPON Resin 862, Ambient Cured . . . 22-23 Chart 10: EPON Resin 862, Post Cured . . . . . . 24-25 Chart 11: EPON Resin 824, Ambient Cured . . . 26-27 Chart 12: EPON Resin 824, Post Cured . . . . . . 28-29 Handling Precautions . . . . . . . . . . . . . . . . . . . . . Back Cover

hell Chemical Company has been a leading supplier of epoxy resins and related products for over 40 years. Our diverse family of epoxy resins, curing agents and modifiers enable formulators to develop protective coatings for industrial flooring and secondary containment that help protect infrastructure, while safeguarding the environment and your companys investment dollar. Shells epoxy resins and related products vary in chemical structure, molecular weight, viscosity, and functionality, which allows for the optimization of any number of properties, including chemical resistance, reactivity, flexibility, and heat resistance. This brochure is intended to provide a basis for choosing an epoxy formulation to meet your specific application and performance requirements.

SERVICE CONDITIONS
To be effective, chemical resistant coatings must be formulated to provide adequate protection under specific conditions. Factors affecting performance include chemical type, duration of exposure and storage temperature. It is important to remember that higher performance systems are required when dealing with aggressive chemicals, such as methylene chloride or sulfuric acid, or for areas under long-term, continuous exposure. However, a high performance system may not be necessary when dealing with water, mild acids and bases, or in areas subject only to occasional or intermittent exposure. In general, chemicals become more corrosive as temperatures increase, so systems should be carefully selected for elevated temperature service.

APPLICATIONS
Concrete used in the construction of secondary containment and industrial flooring is brittle and subject to cracking, and is usually porous enough to allow migration of relatively inert chemicals problems which can all be overcome with Shells flexible curing agents and resins. Applying a protective coating to these surfaces can also significantly counteract chemical attacks and surface degradation. Our products allow formulators to develop specialized coatings for areas where chemical resistance is vital including floors, secondary containment, joint adhesives, and tank linings.

EPOXY RESIN SELECTION


Among Shells EPON Resins, three products stand out as being particularly well-suited for civil engineering applications. The first is EPON Resin 828, Shells standard bisphenol A-based epoxy and the most economical resin available for most applications. Next is EPON Resin 862, a low viscosity epoxy resin based on Bisphenol F. This product provides maximum chemical resistance to acids and solvents, based on the liquid epoxy resins evaluated. Additionally, EPON Resin 824 is an excellent economical alternative to EPON Resin 862. Please refer to Table 1 for the physical properties of these resins. If you require additional performance or modification, please refer to Table 2 for Shells other commonly used resins.

CURING AGENT SELECTION


Shells EPI-CURE Curing Agent 3200 Series aliphatic amine curing agents provide the best overall balance of chemical resistance, mechanical strength and cure characteristics. These low viscosity products are available in both ambient and low temperature formulations. Shells EPI-CURE Curing Agent 3300 Series cycloaliphatic amine curing agents provide good chemical resistance in combination with non-blush, high gloss, and low-yellowing characteristics. Please refer to Table 3 for a comprehensive list of curing agents suitable for chemical resistant applications.

MODIFIER SELECTION
HELOXY Modifiers are used to reduce the viscosity of epoxy resins, which improves cured system flexibility and resin wetting action while increasing the level of filler loading (due to the lower viscosity). In most cases, the addition of a modifier will lower chemical resistance. However, the use of HELOXY Modifier 48 or HELOXY Modifier 62 can preserve your formulations chemical resistant properties. Please refer to Table 4 for a comprehensive list of modifiers commonly used for chemical resistant applications.

Table 1: Physical Properties of EPON Resins used in Chemical Resistant Systems


Product EPON Resin 824 Chemical Type Modified DGEBPA Viscosity Color, Gardner Pounds Weight per at 25 C, cP Max per Gallon Epoxide Comments 40-70 1 9.6 192-204 Low viscosity alternative to EPON Resin 828 and economical replacement for EPON Resin 862. General purpose epoxy resin. A base resin used for its balance of handling characteristics and end performance properties. Low viscosity BPF resin. High performance alternative to blends of EPON Resin 828 with HELOXY Modifiers.

EPON Resin 828

DGEBPA

1 10-150

9.7

185-192

EPON Resin 862

DGEBPF

30-45

9.9

166-177

Table 2: Physical Properties of Modified and Multifunctional EPON Resins used in Chemical Resistant Systems
Product EPON Resin 813 EPON Resin 8132 Chemical Type EPON Resin 828/ HELOXY Modifier 62 blend EPON Resin 828/ HELOXY Modifier 9 blend Viscosity Color, Gardner Pounds Weight per at 25 C, cP Max per Gallon Epoxide Comments 5-7 5-7 75* 1 9.5 9.2 180-195 195-215 Good chemical and crystallization resistance. Standard modified resin with good viscosity reduction but lowered chemical resistance. Functionality of 3.6. High temperature and chemical resistance. Functionality of 2.5. Low viscosity version of EPON Resin 155. Functionality of 2.5. Lowest viscosity version of the SUseries. High temperature and chemical resistance. Functionality of 3.0. Slightly better chemical resistance than EPON Resin 2.5.

EPON Resin 155

Epoxidized Phenolic Novolac Epoxidized BPF Novolac

2.5-4.0 @ 248 F 320-460 @ 25 C 20-60 @ 120 F

10.2

174-180

EPON Resin 160

9.9

168-178

EPON Resin SU-2.5

Epoxidized BPA Novolac

9.8

180-200

EPON Resin SU-3.0

Epoxidized BPA Novolac

150-450 @ 125 F

10

187-207

*ASTM D-1209-84 (Test for Platinum-Cobalt Color).

Table 3: Physical Properties of EPI-CURE Curing Agents used in Chemical Resistant Systems
Product EPI-CURE Curing Agent 3218 Viscosity at 25 C, cP 3000 Color, Gardner Max 12 Pounds Equivalent Gel Time, per Gallon Weight Minutes Comments 8.2 44 18 Potential aromatic amine replacement. Used with plural component spray equipment. Used with EPON Resin 155 or EPON Resin 160. Cures at low temperatures and high humidity. Very good film properties. Very good chemical resistance. High reactivity curing agent designed for co-curing and acceleration purposes. High HDTs possible. High reactivity applications. Also used as an accelerator. High reactivity curing agent. High reactivity and chemical resistance. Modified aliphatic amine with good solvent resistance. Low viscosity cycloaliphatic amine with good chemical resistance. Standard cycloaliphatic amine curing agent with good chemical resistance. Accelerated EPI-CURE Curing Agent 3380. Very good gloss and water spot resistance under high humidity conditions while maintaining very good chemical resistance. Superior film properties under high humidity conditions offering very good chemical resistance.

EPI-CURE Curing Agent 3251

400-700

8.3

76

14

EPI-CURE Curing Agent 3255

1000-1600

10

8.9

38

10

EPI-CURE Curing Agent 3271 EPI-CURE Curing Agent 3282 EPI-CURE Curing Agent 3290 EPI-CURE Curing Agent 3295 EPI-CURE Curing Agent 3370

100-200 2900-4900 300-500 125-205 80-145

6 6 4 3 1

8.5 8.9 8.5 8.3 8.3

34 38 48 45 72

13 15 25 26 25

EPI-CURE Curing Agent 3380

200-400

8.5

114

40

EPI-CURE Curing Agent 3381 EPI-CURE Curing Agent 3382

50-100 1000-1500

1 5

8.3 8.4

95 118

35 23

EPI-CURE Curing Agent 3383

250-350

8.5

114

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TEST PARAMETERS
Service conditions for secondary containment and industrial flooring applications are typically at ambient temperatures (25 C). Crosslink density in these conditions can be improved by applying external heat to the coating, which results in better chemical resistance. Because ambient and heat cured systems are utilized, evaluations of both cure schedules were performed to simulate potential field conditions. The ambient cure schedule was seven days at 25 C,

while the post cure schedule consisted of 24 hours at ambient, followed by two hours at 100 C. The test specimens were prepared and tested per ASTM D-543 using one-inch by three-inch coupons. Coupons were exposed for a total period of 28 days, and weight gain or loss was measured at intervals of 24 hours, seven days and 28 days. Lower weight changes implied better resistance to the particular chemical tested. Coupons designated as NR were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended.

Table 4: Physical Properties of HELOXY Epoxy Functional Modifiers used in Chemical Resistant Systems
Product HELOXY Modifier 8 Chemical Type Alkyl C12 and C14 Viscosity Color, Gardner Pounds Weight per at 25 C, cP Max per Gallon Epoxide Comments 6-9 1 7.5 280-295 Efficient viscosity reduction of conventional epoxy resins. Low volatility. FDA approved for certain applications. Reduction in chemical resistance. Similar to HELOXY Modifier 8. Non-offensive odor. Reduction in chemical resistance. Reduces viscosity, but retains reactivity of conventional and polyfunctional resins. Trifunctionality increases crosslink density. A low viscosity aromatic monoepoxide. Excellent retention of mechanical and chemical resistance. Good viscosity reduction with minimum loss of properties. Low vapor pressure compared to other modifiers. Slight reduction in chemical resistance.

HELOXY Modifier 9

Alkyl C13 to C14

6-9

7.5

275-295

HELOXY Modifier 48

Trimethylolpropane triglycidyl ether

125-250

9.6

140-160

HELOXY Modifier 62

o-cresyl glycidyl ether

5-10

175-195

HELOXY Modifier 68

Diglycidyl ether of neopentyl glycol Glycidyl ester of neodecanoic acid

13-18

8.9

130-140

CARDURA E-10 Glycidyl Ester

5-10

244-256

TEST RESULTS
The following results can be seen in bar charts 112 of the chemical resistance study: 1. EPON Resin 862 has the best overall performance, compared to EPON Resin 828 and EPON Resin 824. 2. EPI-CURE Curing Agent 3218, EPI-CURE Curing Agent 3255 and EPI-CURE Curing Agent 3271 show the best overall resistance, especially to strong acids and solvents. 3. The EPI-CURE Curing Agent 3300 Series is not recommended for concentrated sulfuric acid or solvents. However, chemical resistance can be improved by blending the EPI-CURE Curing Agent 3300 Series with an aliphatic amine from the EPI-CURE Curing Agent 3200 Series.

TEST EXAMPLE:
If resistance to 98% sulfuric acid is required for a secondary containment area, please refer to Chart 3 which shows EPON Resin 862 cured with EPI-CURE 3218 Curing Agent under ambient conditions. Chart 3 shows that weight gain after 28 days exposure is 1.45%. This low weight gain indicates a good starting point formulation which can then be blended with fillers and additives. The final formulation should then be tested in the chemical media under anticipated service conditions to determine specific performance properties.

Chart 1: Chemical Resistance for EPON Resin 828 and EPI-CURE 3200 Series Aliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Ambient Cured at 25 C


2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.60 1.18 0.88 0.65 0.46 0.27 0.11 3218 0.07 3251 0.09 3255 0.35 0.12 3271 EPI-CURE Curing Agent 0.48 0.09 3282 0.39 0.22 3290 0.12 3295 1.15 0.95 0.70 0.44

% Wt. Gain

1.03

5% NaOH Ambient Cured at 25 C


1.5 1.2 % Wt. Gain 0.9 0.6 0.41 0.3 0.10 0.0 3218 0.06 3251 0.24 0.09 3255 0.59 0.43 0.31 0.11 3271 EPI-CURE Curing Agent 0.09 3282 0.36 0.18 3290 0.11 3295 1.39 1.05 0.81 1.05 0.87 0.60 0.38 0.92

5% Acetic Acid Ambient Cured at 25 C


22 20 18 16 14 12 10 8 6 4 2 0 19.30 15.02

% Wt. Gain

8.36 2.92 3255 4.30 2.26 3271 EPI-CURE Curing Agent 4.42 5.93 0.50 1.35 3282 2.39 NR NR NR 3290 3.80 1.61 3295 6.06

3218

0.08 0.31 0.73 3251

1.54

24 Hours

7 Days

28 Days

NR Not Recommended

50/50 IPA/Xylene Ambient Cured at 25 C


22 20 18 16 14 12 10 8 6 4 2 0 20.84 17.06 13.02 9.08 6.82 1.36 1.50 1.60 3218 3251 2.24 2.61 2.65 NR 3255 3271 EPI-CURE Curing Agent 3282 3290 3295 2.88 3.33 3.49 4.12 5.62 6.60 17.45 14.22 15.51

% Wt. Gain

Methyl Ethyl Ketone Ambient Cured at 25 C


40 35 30 % Wt. Gain 25 20 15 10 5 0 NR 3218 NR NR 3251 NR NR 3255 NR NR 3271 NR NR NR 3282 NR NR 3290 NR NR NR 3295 13.25 17.28 19.24 21.94 24.35 34.62

EPI-CURE Curing Agent

Methanol Ambient Cured at 25 C


18 16 14 12 10 8 6 4 2 0 16.47 14.25 12.53 7.91 5.63 3.49 2.20 NR 3218 3251 3255 3271 EPI-CURE Curing Agent 3282 3290 2.75 4.69 2.82 NR 3295 NR 4.80 8.96 7.05 4.85

% Wt. Gain

6.14 2.25 3.49

6.91

*NOTE: Coupons immersed in 98% Sulfuric Acid or Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
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Chart 2: Chemical Resistance for EPON Resin 828 and EPI-CURE 3200 Series Aliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.2 1.0 % Wt. Gain 0.8 0.64 0.6 0.4 0.2 0.0 0.21 0.16 3218 3251 0.49 0.35 0.20 0.20 0.19 0.45 0.48 0.55 0.41 0.23 0.22 0.49 0.97 0.85 1.05 0.93 0.77 0.93

3255

3271 EPI-CURE Curing Agent

3282

3290

3295

5% NaOH Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.91 0.80 0.72 0.59 0.47 0.33 0.23 0.18 0.24 0.43 0.28 0.47 0.38 0.24 0.32 0.18 0.50 0.46 0.97 0.89 0.87

% Wt. Gain

3218

3251

3255

3271 EPI-CURE Curing Agent

3282

3290

3295

5% Acetic Acid Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


6 5 % Wt. Gain 4 3 2 1.30 1 0 0.53 3218 0.13 0.35 3251 0.64 0.21 0.55 3255 1.05 0.29 1.30 0.68 0.23 3271 EPI-CURE Curing Agent 0.55 3282 3290 1.10 1.04 0.35 3295 0.91 2.60 2.89 1.80 5.89

50/50 IPA/Xylene Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.5 1.4 % Wt. Gain/Loss 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -0.1 1.44 0.61

0.35 0.18 0.03 0.04 0.03 3218 0.04 3251 -0.01 -0.01 -0.01 3255 0.02 0.02 0.02 3271 0.05 3282 0.05 0.02 0.01 3290 0.07 0.03 0.03 3295

EPI-CURE Curing Agent

24 Hours

7 Days

28 Days

NR Not Recommended

Methyl Ethyl Ketone Post Cured 24 Hours at 25 C and then 2 Hours at 100 C
11.0 9.0 7.0 5.0 3.0 2.0 1.5 1.0 0.5 0.0 9.27 6.84

% Wt. Gain

2.18

0.83 0.10 0.13 3218 0.31 NR NR 3251 0.10 0.08 0.14 3255 0.11 0.16 3271 EPI-CURE Curing Agent 0.37 NR 3282 0.11 0.16 3290 0.39 0.10 0.25 3295

Methanol Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


11 10 9 8 7 6 5 4 3 2 1 0 10.32 9.90

% Wt. Gain

4.58 3.70 1.70 0.69 3218 3251 NR 0.40 3255 3.76 1.34 3.20 2.17 0.89 3271 EPI-CURE Curing Agent 1.45 3282 3.20

5.10

5.53 4.50 1.83 0.96 3290 3295 2.54

Methylene Chloride Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


30 25 % Wt. Gain 20 15 10 5 0 NR 3218 NR NR NR 3251 7.56 2.80 NR 3255 3271 EPI-CURE Curing Agent 4.26 NR NR NR NR 3282 NR NR 3290 NR NR 3295 13.77 9.14 20.46 14.33 27.33

*NOTE: Coupons immersed in 98% Sulfuric Acid were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
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Chart 3: Chemical Resistance for EPON Resin 862 and EPI-CURE 3200 Series Aliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Ambient Cured at 25 C


1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.40

% Wt. Gain

0.92 0.65 0.54 0.37 0.26 0.11 3218 0.09 3251 0.09 3255 0.38 0.27 0.12 3271

0.91 0.71 0.62 0.42 0.31 0.09 3282 3290 0.21 0.13 3295

0.99

EPI-CURE Curing Agent

5% NaOH Ambient Cured at 25 C


1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.25 0.90 0.68 0.56 0.35 0.24 0.10 3218 0.09 3251 0.08 3255 0.25 0.11 3271 EPI-CURE Curing Agent 0.09 3282 3290 0.31 0.20 0.12 3295 0.38

% Wt. Gain

0.88 0.61 0.50 0.35

0.85

5% Acetic Acid Ambient Cured at 25 C


10 9 8 7 6 5 4 3 2 1 0 8.91 8.03 6.30 5.71

% Wt. Gain

3.31 1.87 0.56 0.10 0.27 3251 0.54 1.15 3255 1.05 1.95

2.96 0.64 3282 1.25 NR NR NR 3290

3.06

0.21 3271 EPI-CURE Curing Agent

3218

3295

50/50 IPA/Xylene Ambient Cured at 25 C


14 13 6 5 4 3 2 1 0 % Wt. Gain 6.12 13.41

3.81 2.89 0.98 1.42 1.66 2.13 0.90 1.15 3290 3295 1.85

0.05 0.10 0.16 3218

NR 3251

0.34 0.44 0.47 3255

0.12 0.23 0.37 3271

3282

EPI-CURE Curing Agent

10

24 Hours

7 Days

28 Days

NR Not Recommended

98% Sulfuric Acid Ambient Cured at 25 C


9 8 7 6 5 4 3 2 1 0 7.99

% Wt. Gain

4.56 3.70 3.03 1.39 1.45 0.70 NR 3218 NR NR 3251 1.70 1.64 0.83 3255 2.22 2.26 1.03 NR 3271 EPI-CURE Curing Agent 3282 3290 3295 1.38 0.91 NR 2.23

Methyl Ethyl Ketone Ambient Cured at 25 C


26 24 22 20 18 16 14 12 10 8 6 4 2 0 24.65 18.27 13.74 9.28 18.74 13.84 20.23 16.33

% Wt. Gain

17.51 14.67 10.48 4.55 5.98 7.16

NR 3218

NR NR 3251

3255

3271 EPI-CURE Curing Agent

NR NR 3282

3290

NR NR 3295

Methanol Ambient Cured at 25 C


13 12 11 10 9 8 7 6 5 4 3 2 1 0 12.24 10.50 8.52 7.05 5.48 3.81 1.33 2.14 NR NR 3251 1.40 2.11 3.35 1.75 3271 EPI-CURE Curing Agent 3.10 2.02 NR 3255 3282 3290 3295 3.23 6.03 4.61 3.46

% Wt. Gain

3218

*NOTE: Coupons immersed in Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
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Chart 4: Chemical Resistance for EPON Resin 862 and EPI-CURE 3200 Series Aliphatic Amine Curing Agents % Weight Change as a Function of Time

Deionized Water Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.0 0.8 % Wt. Gain 0.6 0.4 0.25 0.2 0.08 0.0 3218 0.06 3251 0.20 0.07 3255 0.21 0.07 3271 EPI-CURE Curing Agent 0.23 0.07 3282 0.23 0.12 3290 0.10 3295 0.62 0.45 0.45 0.57 0.56 0.40 0.32 0.93 0.74

5% NaOH Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


0.8 0.7 0.6 % Wt. Gain 0.5 0.4 0.3 0.2 0.1 0.0 0.09 3218 0.06 3251 0.24 0.17 0.06 3255 0.18 0.07 3271 EPI-CURE Curing Agent 0.39 0.55 0.41 0.33 0.21 0.07 3282 0.21 0.10 3290 0.09 3295 0.29 0.50 0.49 0.75 0.65

5% Acetic Acid Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


24 18 10 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 % Wt. Gain 4.27 3.23 1.52 0.51 3218 0.07 0.23 3251 0.54 0.09 0.29 3255 0.67 0.22 0.65 3271 EPI-CURE Curing Agent 1.62 0.10 0.32 3282 0.73 3290 0.58 3295 3.38 21.27 10.90

1.35

50/50 IPA/Xylene Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


15 5 0.42 0.40 0.35 0.30 0.25 0.20 0. 15 0.10 0.05 0.00 -0.05 -0.10 % Wt. Gain/Loss 3.46 9.60

0.04 -0.04 -0.07 -0.07 3218 -0.02 -0.03 -0.02 3251 3255 -0.01 -0.01 3271 EPI-CURE Curing Agent -0.02 -0.01 3282

0.05 0.00 -0.01 3290

0.06 -0.02 -0.01 3295

0.05

12

24 Hours

7 Days

28 Days

NR Not Recommended

98% Sulfuric Acid Post Cured 24 Hours at 25 C and then 2 Hours at 100 C
7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 6.73

% Wt. Gain

3.09

0.18 0.26 0.30 3218 3251

NR

0.12 0.13 0.05 3255

0.23 0.30 0.38 3271

0.17 0.19 0.18 3282

0.65 0.38 0.59 3290

0.30 0.41 0.50 3295

EPI-CURE Curing Agent

Methyl Ethyl Ketone Post Cured 24 Hours at 25 C and then 2 Hours at 100 C
1.0 0.5 % Wt. Gain/Loss 0.2 0.13 0.1 0.0 -0.1 -0.2 -0.04 -0.06 -0.04 3218 3251 NR NR NR -0.04 -0.07 3255 -0.04 -0.04 -0.02 -0.10 3271 EPI-CURE Curing Agent 3282 3290 3295 -0.04 -0.02 -0.04 -0.02 -0.01 0.16 0.13 0.75

Methanol Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 13.18 12.76

% Wt. Gain

6.23 5.25 2.03 0.24 0.89 3218 3251 NR 0.13 0.63 3255 3.00 1.40 0.50 1.44 0.35 3271 EPI-CURE Curing Agent 1.12 3282 3290 2.39 2.43 1.05 3295 2.75

5.60

Methylene Chloride Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


20 18 16 14 12 10 8 6 4 2 0 18.06 14.37

% Wt. Gain

8.72 5.50 2.94 1.05 3218 NR NR NR NR 3251 0.34 3255 0.65 3271 EPI-CURE Curing Agent NR NR NR 3282 NR NR 3290 NR NR NR 3295 5.01

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Chart 5: Chemical Resistance for EPON Resin 824 and EPI-CURE 3200 Series Aliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Ambient Cured at 25 C


1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.30 1.01 0.64 0.39 0.28 0.08 3218 0.07 3251 0.07 3255 0.27 0.09 3271 EPI-CURE Curing Agent 0.08 3282 3290 0.68 0.38 0.32 0.92 0.77 0.59 0.42 0.22 0.12 3295 1.02

% Wt. Gain

5% NaOH Ambient Cured at 25 C


1.2 1.0 % Wt. Gain 0.8 0.6 0.4 0.2 0.0 0.08 3218 0.36 0.26 0.07 3251 0.06 3255 0.24 0.09 3271 EPI-CURE Curing Agent 0.07 3282 3290 0.59 0.60 0.51 0.36 0.38 0.29 0.17 0.10 3295 0.93 0.88 0.71 1.15 0.93

5% Acetic Acid Ambient Cured at 25 C


15 14 8 7 6 5 4 3 2 1 0 7.86 5.50 3.73 2.63 0.67 0.07 0.29 3251 0.23 0.65 3255 1.27 1.31 0.52 3271 0.14 0.50 3282 2.23 1.11 NR NR 3290 1.68 3295 5.52 % Wt. Gain 14.14

3218

EPI-CURE Curing Agent

14

24 Hours

7 Days

28 Days

NR Not Recommended

50/50 IPA/Xylene Ambient Cured at 25 C


18 16 14 12 10 8 6 4 2 0 15.25 13.55 11.37 8.85 6.17 4.07 NR NR 3251 4.69 9.39 7.01 4.53 NR 3255 3271 EPI-CURE Curing Agent 3282 NR NR 3290 NR 3295 9.11 7.12 9.82 6.37 8.93

% Wt. Gain

3218

Methyl Ethyl Ketone Ambient Cured at 25 C


20 18 16 14 12 10 8 6 4 2 0 17.54 14.79 15.05

% Wt. Gain

NR NR 3218

NR

NR NR 3251

NR NR 3255

NR NR 3271

NR

NR NR 3282

NR

NR NR 3290

NR

NR NR 3295

EPI-CURE Curing Agent

Methanol Ambient Cured at 25 C


22 20 18 16 14 12 10 8 6 4 2 0 19.44

% Wt. Gain

12.83 8.87 6.66 3.20 NR 3218 NR NR 3251 6.89 5.05 2.57 3255 2.82 3271 EPI-CURE Curing Agent 5.79 3.25 NR 3282 3290 10.28 7.25 5.51 9.10

11.74

NR 3295

*NOTE: Coupons immersed in 98% Sulfuric Acid or Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
15

Chart 6: Chemical Resistance for EPON Resin 824 and EPI-CURE 3200 Series Aliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.93 0.80 0.71 0.62 0.51 0.36 0.23 0.14 3218 0.09 3251 0.13 3255 0.43 0.30 0.12 3271 EPI-CURE Curing Agent 0.32 0.12 3282 0.32 0.18 0.14 3290 3295 0.36 0.67 0.79

% Wt. Gain

5% NaOH Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.84 0.75 0.66 0.57 0.45 0.33 0.22 0.13 3218 0.08 3251 0.12 3255 0.28 0.13 3271 EPI-CURE Curing Agent 0.31 0.11 3282 0.28 0.16 0.14 3290 3295 0.61 0.39 0.72

% Wt. Gain

0.33

5% Acetic Acid Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 5.87

% Wt. Gain

2.79 1.86 0.84 0.34 3218 0.10 0.25 3251 0.53 0.68 0.18 0.98 0.46 3271 EPI-CURE Curing Agent 0.15 0.35 3282 0.74 0.97 0.25 3290 3295 0.70 1.51 0.13 0.32 3255

50/50 IPA/Xylene Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


11 8 5 2 0.2 0.1 0.0 -0.1 -0.2 8.27 2.21

% Wt. Gain/Loss

0.00 -0.03 -0.02 3218 3251

NR

0.02 -0.05 3255 -0.01 -0.03 -0.03 -0.11 3271 EPI-CURE Curing Agent -0.02 -0.05 -0.05 3282 -0.01 -0.02 3290

0.07

0.12 0.01 0.02

3295

16

24 Hours

7 Days

28 Days

NR Not Recommended

Methyl Ethyl Ketone Post Cured 24 Hours at 25 C and then 2 Hours at 100 C
6.0 5.0 4.0 3.0 1.0 0.8 0.6 0.4 0.2 0.0 0.90 0.53 0.37 0.04 0.09 3218 NR NR NR 3251 0.00 0.05 3255 0.04 0.15 3271 EPI-CURE Curing Agent 0.12 3282 0.19 3290 0.63 0.26 3295 5.32 3.42 1.44 0.85

% Wt. Gain

2.67

Methanol Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


10 9 8 7 6 5 4 3 2 1 0 8.69 9.22

% Wt. Gain

6.56 5.85 5.83 4.04 2.54 1.59 0.75 3218 NR NR 3251 0.46 3255 0.98 3271 EPI-CURE Curing Agent 2.63 1.36 NR 3282 3290 3295 NR 5.86 3.99 3.43 2.32

Methylene Chloride Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


14 12 % Wt. Gain 10 8 6 4 2 0 NR NR 3218 NR NR NR 3251 NR NR 3255 NR NR 3271 NR NR NR 3282 NR NR NR 3290 NR NR NR 3295 8.75 12.74 11.56

EPI-CURE Curing Agent

*NOTE: Coupons immersed in 98% Sulfuric Acid were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
17

Chart 7: Chemical Resistance for EPON Resin 828 and EPI-CURE 3300 Series Cycloaliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Ambient Cured at 25 C


2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.66 1.66 1.75 1.55

% Wt. Gain

1.12 0.87 0.49 0.14 3370 0.27 3380 0.25 3381 EPI-CURE Curing Agent 0.24 3382 0.29 3383 0.81 0.90 0.75

5% NaOH Ambient Cured at 25 C


1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.50 1.60 1.44 1.41

% Wt. Gain

1.02 0.79 0.44 0.13 3370 0.24 3380 0.20 3381 EPI-CURE Curing Agent 0.21 3382 0.26 3383 0.70 0.69 0.81

5% Acetic Acid Ambient Cured at 25 C


3.0 2.58 2.5 % Wt. Gain 2.0 1.5 1.0 0.5 0.0 0.44 3370 0.98 0.46 3380 0.32 3381 EPI-CURE Curing Agent 1.81 1.37 1.00 0.27 3382 0.88 0.48 1.98 1.79 1.36 2.61

3383

18

24 Hours

7 Days

28 Days

NR Not Recommended

50/50 IPA/Xylene Ambient Cured at 25 C


18 16 14 12 10 8 6 4 2 0 16.61 13.95 10.15 7.51 5.29 3.85 1.47 NR 3370 3380 3381 EPI-CURE Curing Agent NR 3382 NR 3383 8.21 4.46 2.13 NR 7.15

Methanol Ambient Cured at 25 C


10 9 8 7 6 5 4 3 2 1 0 9.17 7.82 7.64 7.38 7.72

% Wt. Gain

% Wt. Gain

NR 3370

NR

NR 3380

NR

NR 3381

NR

NR 3382

NR

NR 3383

NR

EPI-CURE Curing Agent

*NOTE: Coupons immersed in 98% Sulfuric Acid, Methyl Ethyl Ketone or Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
19

Chart 8: Chemical Resistance for EPON Resin 828 and EPI-CURE 3300 Series Cycloaliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.64 1.55 1.42 1.54

% Wt. Gain

0.96 0.76 0.40 0.20 3370 3380 0.41 0.42

0.86

0.77 0.32 0.39

0.89

3381 EPI-CURE Curing Agent

3382

3383

5% NaOH Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.6 1.4 1.2 % Wt. Gain 1.0 0.8 0.6 0.4 0.2 0.0 0.17 3370 3380 3381 EPI-CURE Curing Agent 3382 3383 0.37 0.71 0.42 0.43 0.89 0.81 0.69 0.49 0.36 0.82 1.52 1.43 1.29 1.42

5% Acetic Acid Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.21 2.35 2.00 1.56 1.19 0.79 0.40 0.15 3370 3380 3381 EPI-CURE Curing Agent 3382 3383 0.47 0.49 0.35 1.23 0.80 0.52 1.08

20

% Wt. Gain

24 Hours

7 Days

28 Days

NR Not Recommended

50/50 IPA/Xylene Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


6.1 6.0 5.9 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 % Wt. Gain 6.02

0.65

0.64

0.04

0.02 3370

0.03

0.04

0.05 3380

0.05

0.06 3381

0.11 NR 3382

0.10

0.10 3383

0.17

EPI-CURE Curing Agent

Methyl Ethyl Ketone Post Cured 24 Hours at 25 C and then 2 Hours at 100 C
12 11 10 9 8 7 6 5 4 3 2 1 0 10.72

% Wt. Gain

4.50 3.28 2.38 0.42 NR 3370 NR NR 3380 NR 3381 EPI-CURE Curing Agent NR NR NR 3382 NR NR 3383 NR

Methanol Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 12.39 11.25 10.02 6.67 3.82 3.35 NR 3370 3380 3381 EPI-CURE Curing Agent NR 3382 NR 3383 9.97 8.75 6.11 6.73 6.62 4.55

*NOTE: Coupons immersed in 98% Sulfuric Acid or Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
21

% Wt. Gain

Chart 9: Chemical Resistance for EPON Resin 862 and EPI-CURE 3300 Series Cycloaliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Ambient Cured at 25 C


1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.69 1.63 1.48 1.68

% Wt. Gain

0.94

0.95

0.85

0.93 0.80

0.47 0.30 0.14 3370 3380 3381 EPI-CURE Curing Agent 0.27 0.25 3382 0.30

3383

5% NaOH Ambient Cured at 25 C


1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.57 1.52 1.60 1.42

% Wt. Gain

0.86 0.43 0.27 0.12 3370

0.87

0.80

0.88 0.75

0.24 3380 3381 EPI-CURE Curing Agent

0.23 3382

0.28 3383

5% Acetic Acid Ambient Cured at 25 C


3.0 2.5 % Wt. Gain 2.0 1.5 1.0 0.5 0.0 0.26 3370 0.73 0.43 3380 0.45 3381 EPI-CURE Curing Agent 0.29 3382 0.46 3383 1.29 1.30 1.36 0.95 2.30 2.40 1.79 1.45 2.54

22

24 Hours

7 Days

28 Days

NR Not Recommended

50/50 IPA/Xylene Ambient Cured at 25 C


12 11 10 9 8 7 6 5 4 3 2 1 0 11.10 10.88

% Wt. Gain

7.68 5.07 3.83 2.30 NR 3370 0.68 3380 0.72 3381 EPI-CURE Curing Agent 3382 4.08 2.80 3.22 1.05 NR 3383 4.07

98% Sulfuric Acid Ambient Cured at 25 C


11 10 9 8 7 6 5 4 3 2 1 0 9.90 7.49

% Wt. Gain

3.92 2.98 2.76 NR 3381 NR NR 3382 NR NR 3383 NR

NR 3370

NR

NR 3380

NR

EPI-CURE Curing Agent

Methanol Ambient Cured at 25 C


10 9 8 7 6 5 4 3 2 1 0 9.06 7.21 7.43 6.90 7.44

% Wt. Gain

NR 3370

NR

NR 3380

NR

NR 3381

NR

NR 3382

NR

NR 3383

NR

EPI-CURE Curing Agent

*NOTE: Coupons immersed in Methyl Ethyl Ketone or Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
23

Chart 10: Chemical Resistance for EPON Resin 862 and EPI-CURE 3300 Series Cycloaliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.55 1.49 1.28 0.84 1.47

% Wt. Gain

0.75 0.35 0.12 3370 0.29

0.79

0.81 0.68 0.23 0.30

0.28 3380 3381 EPI-CURE Curing Agent

3382

3383

5% NaOH Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.6 1.4 1.2 % Wt. Gain 1.0 0.8 0.6 0.4 0.2 0.0 0.13 3370 3380 3381 EPI-CURE Curing Agent 0.32 0.27 0.26 0.21 3382 0.65 0.74 0.67 0.73 0.60 0.29 1.35 1.28 1.12 1.27

3383

5% Acetic Acid Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


3.3 3.0 2.7 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0.0 3.10 3.01

% Wt. Gain

2.13 1.63 1.08 0.81 0.53 0.15 3370 3380 3381 EPI-CURE Curing Agent 0.56 0.53 0.28 3382 0.37 3383 1.55 1.55 1.13

50/50 IPA/Xylene Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


6 5 4 3 2 1 0.4 0.3 0.2 0.1 0.0 -0.1 0.34 5.31

% Wt. Gain/Loss

1.90

2.12 1.28 0.37 0.20 0.79 1.28 0.76

0.01 -0.02 3370 3380

0.01 3381 EPI-CURE Curing Agent 3382

NR

0.04 3383

24

24 Hours

7 Days

28 Days

NR Not Recommended

98% Sulfuric Acid Post Cured 24 Hours at 25 C and then 2 Hours at 100 C
12 11 10 9 8 7 6 5 4 3 2 1 0 11.23

% Wt. Gain

7.69 6.79 4.21 1.64 3370 2.01 1.08 3380 2.55 1.01 1.82 3381 EPI-CURE Curing Agent 2.22 3.03 1.02 3382 1.87 3383 2.04

Methyl Ethyl Ketone Post Cured 24 Hours at 25 C and then 2 Hours at 100 C
10 9 8 7 6 5 4 3 2 1 0 8.74 7.82 6.55

% Wt. Gain

NR

NR 3370

NR

NR 3380

NR

NR 3381

NR

NR

NR 3382

NR

NR 3383

NR

EPI-CURE Curing Agent

Methanol Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


10 9 8 7 6 5 4 3 2 1 0 9.12 6.59 4.75 7.02 6.98

% Wt. Gain

NR 3370

NR

NR 3380

NR

NR 3381

NR

NR 3382

NR

NR 3383

NR

EPI-CURE Curing Agent

*NOTE: Coupons immersed in Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
25

Chart 11: Chemical Resistance for EPON Resin 824 and EPI-CURE 3300 Series Cycloaliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Ambient Cured at 25 C


1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.69 1.50 1.10 0.91 0.52 0.16 3370 0.28 3380 0.26 3381 EPI-CURE Curing Agent 0.25 3382 0.26 3383 0.79 0.79 0.86 1.47 1.60

% Wt. Gain

5% NaOH Ambient Cured at 25 C


1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.59 1.39 1.04 0.84 0.50 0.16 3370 0.26 3380 0.23 3381 EPI-CURE Curing Agent 0.24 3382 0.26 3383 0.72 0.75 0.83 1.40 1.51

% Wt. Gain

5% Acetic Acid Ambient Cured at 25 C


2.5 2.20 2.0 % Wt. Gain 1.5 1.0 0.69 0.5 0.0 0.25 3370 0.38 3380 0.37 3381 EPI-CURE Curing Agent 0.30 3382 0.35 3383 1.34 1.16 1.10 0.87 1.08 2.04 1.63 1.99

26

24 Hours

7 Days

28 Days

NR Not Recommended

50/50 IPA/Xylene Ambient Cured at 25 C


20 18 16 14 12 10 8 6 4 2 0 17.07 14.03 10.50 8.44 5.19 2.93 NR 3370 NR 3380 3381 EPI-CURE Curing Agent NR NR 3382 NR 3383 7.24 4.00 NR 13.10

% Wt. Gain

Methanol Ambient Cured at 25 C


9 8 7 6 5 4 3 2 1 0 8.29 7.49 7.43 6.99 7.12

% Wt. Gain

NR 3370

NR

NR 3380

NR

NR 3381

NR

NR 3382

NR

NR 3383

NR

EPI-CURE Curing Agent

*NOTE: Coupons immersed in 98% Sulfuric Acid, Methyl Ethyl Ketone or Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
27

Chart 12: Chemical Resistance for EPON Resin 824 and EPI-CURE 3300 Series Cycloaliphatic Amine Curing Agents % Weight Change as a Function of Time*

Deionized Water Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.6 1.4 1.2 % Wt. Gain 1.0 0.8 0.6 0.4 0.2 0.0 0.16 3370 3380 0.37 0.30 0.26 0.81 0.73 0.62 0.29 0.69 0.74 1.30 1.16 1.30 1.33

0.28

3381 EPI-CURE Curing Agent

3382

3383

5% NaOH Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


1.5 1.2 % Wt. Gain 0.9 0.6 0.34 0.3 0.0 0.14 3370 0.24 0.75 0.63 0.57 0.23 3380 3381 EPI-CURE Curing Agent 0.26 0.62 0.26 1.16 1.05 0.67 1.18 1.20

3382

3383

5% Acetic Acid Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.93 1.76 1.49 1.00 0.77 0.39 0.33 3380 3381 EPI-CURE Curing Agent 0.28 3382 0.75 0.35 1.49

% Wt. Gain

0.88 0.39 0.16 3370

0.92

3383

28

24 Hours

7 Days

28 Days

NR Not Recommended

50/50 IPA/Xylene Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


10 9 8 7 6 5 4 3 2 1 0 8.85 7.00 4.59

% Wt. Gain

4.23 2.83 2.65 0.58 3383

0.94 0.19 3370

1.41 0.28 3380 0.07 0.34 3381 EPI-CURE Curing Agent 0.64 3382 NR

Methyl Ethyl Ketone Post Cured 24 Hours at 25 C and then 2 Hours at 100 C
13 12 11 10 9 8 7 6 5 4 3 2 1 0 11.45 9.42 6.46

% Wt. Gain

NR

NR 3370

NR

NR 3380

NR

NR 3381

NR

NR

NR 3382

NR

NR 3383

NR

EPI-CURE Curing Agent

Methanol Post Cured 24 Hours at 25 C and then 2 Hours at 100 C


14 12 % Wt. Gain 10 8 6 4 2 0 NR 3370 NR 3380 NR 3381 EPI-CURE Curing Agent NR NR 3382 NR NR 3383 NR 4.71 6.85 5.84 12.42 11.92 8.68 6.87

*NOTE: Coupons immersed in 98% Sulfuric Acid or Methylene Chloride were destroyed due to complete degradation, severe deformation, or excessive swelling, and are therefore not recommended (NR).
29

For technical assistance, call toll free:

1-800-TEC-EPON
(1-800-832-3766)

For immediate technical literature, via fax, call toll free:

1-800-FAX-EPON
(1-800-329-3766) (1-800-872-7435)

For customer service, including order placement, call toll free:

1-800-USA-SHELL

Shell Chemical Company Sales Office P . O. Box 2463 15th Floor OSP Resins Houston, Texas 77252-2463 (713) 241-81 19 Fax: (713) 241-8107
Look for us on the Internet at: www.shellus.com

For sales outside the U.S., please contact: Pecten Chemicals, Inc. P . O. Box 4407 Houston, Texas 77210 (713) 241-6161 Fax: (713) 241-5194

HANDLING PRECAUTIONS
These products and the auxiliary materials normally combined with them are capable of producing adverse health effects ranging from minor skin irritation to serious systemic effects. Exposure to these materials should be minimized and avoided if feasible through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. Each of these preventive measures depends upon responsible action by adequately informed persons. None of these materials should be used, stored, or transported until the handling precautions as stated in the Material Safety Data Sheets (MSDSs) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Shell products should be directed to your Shell Chemical Company Sales Representative. Information and MSDSs on non-Shell products should be obtained from the respective manufacturer or vendor.

WARRANTY
All products purchased from or supplied by Shell are subject to terms and conditions set out in the contract, order acknowledgment and/or bill of lading. Shell warrants only that its product will meet those specifications designated as such herein or in other publications. All other information, including that herein, supplied by Shell is considered accurate but is furnished upon the express condition that the customer shall make its own assessment to determine the products suitability for a particular purpose. Shell makes no other warranty, either express or implied, regarding such other information, the data upon which the same is based, or the results to be obtained from the use thereof; that any products shall be merchantable or fit for any particular purpose; or that the use of such other information or product will not infringe any patent.

SC: 2288-95 Printed in the U.S.A. 6M 1 1/95

Never underestimate what we can do together.SM

Copyright 1995, Shell Oil Company. All rights reserved.

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