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EPON Resins

and Modifiers

SC:3059-02 / EPON Resins and Modifiers

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EPON Resins and Modifiers

Introduction

Qualifying a resin system that offers the best balance of performance and processability can be a significant task. You not only need quality products from a reliable supplier; you need a company that is willing to share its extensive technical expertise and provide services that will help satisfy your unique requirements. Thats where we come in. Were Resolution Performance Products LLC (RPP), one of the leading suppliers of epoxy resins, curing agents, modifiers, and resin systems. We offer a diverse line of epoxy resins that vary in chemical structure, molecular weight, viscosity and functionality providing the formulator with a multitude of options. Whats more, our products have over 50 years of innovation and success in a variety of markets and end-use applications. At our world-class technology centers in Houston, Texas, and Louvain-la-Neuve, Belgium, we pursue advanced processing technologies while creating new resin products and systems with broad performance ranges. By continually working on technical challenges in our application laboratories, we are able to translate real application requirements into high quality, production-oriented materials. EPON Resins and Modifiers offer advantages such as: Low room temperature viscosity Very long working life Low moisture absorption Good epoxy performance characteristics Flexibility Reactivity High elongation Adjustable cure times Good chemical and corrosion resistance Heat resistance Fire retardance Compliance with MIL-R-9300B specifications (in some resin systems)

SC:3059-02 / EPON Resins and Modifiers

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At A Glance

EPON Resins This family of resins was developed to provide superior overall performance in a variety of end-use applications. These products enable manufacturers to achieve practically any desired performance level, while optimizing processability and strength retention at elevated temperatures. Liquid EPON Resins and Resin Blends (see page 5-6) This segment of our product line represents the most widely used products in a number of industries. The most commonly used EPON Resin/HELOXY Modifier blends are available in several types and viscosity grades. Epoxy Acrylate EPON Resins (see page 7) These products offer excellent wetting characteristics with rapid reaction rates. Brominated EPON Resins (see page 8) These products can be used to obtain fire retardance in a base epoxy resin formulation. Semi-Solid and Solid EPON Resins (see page 9) Both of these product groups have a higher molecular weight, providing the ability to vary the viscosity, flexibility and reactivity of a system. Powder Grade Solid EPON Resins (see page 10-11) These epoxy resins are in the molecular weight range most suitable for use in powder coating applications. These products have a good balance of properties, including appropriate epoxy functionality for proper curing, good physical stability (sintering resistance), and good melt flow (low melt viscosity). They are carefully filtered during manufacture to remove particulate contaminants. EPON Multi-Functional Epoxy Resins (see pages 12-13) These products are specifically designed to provide increased levels of thermal stability and chemical resistance, and are used in composites, structural adhesives, electronics/electrical, and coating applications. Elastomer Modified EPON Resins (see page 14) These products offer improved adhesive properties, thermal shock resistance and toughness, with good fatigue resistant properties. EPI-REZ Waterborne Epoxy Resins (see page 15-16) These non-ionic aqueous dispersions of our epoxy resins provide benefits such as low/zero VOCs, extended potlife, high crosslink density, high temperature performance, very good chemical resistance, B-stage capability, low color, and complete water-reducibility. Many of RPPs EPIKURE Curing Agents can be used with these epoxy dispersions. In addition, since dicyandiamide is water soluble, it may be used to provide extended potlife formulations.

SC:3059-02 / EPON Resins and Modifiers

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At A Glance (cont.)

HELOXY Modifiers (see page 17-18) HELOXY Monofunctional Modifiers are low viscosity epoxy functional modifiers that provide maximum viscosity reduction at the lowest cost. HELOXY Polyfunctional Modifiers are reactive modifiers that provide good viscosity reduction while maintaining very good physical performance in liquid epoxy resin systems. HELOXY Flexibilizers are reactive modifiers that provide good viscosity reduction while imparting flexibility to the epoxy resin system. All of our products are manufactured to high standards of quality and have very specific property ranges. To help you assess the many production and performance advantages of RPPs complete product line of resins and modifiers, weve coupled typical properties and resin characteristics in the technical charts which follow. The data contained in this brochure are intended to give only basic product information for quick reference individual product technical bulletins with additional information are available for many of the products listed in the following pages. For additional information about any or all of these products, visit our website at:

The Formulators Choice

www.resins.com
For answers to technical questions, call our toll-free technical assistance hotline at:

1-800-TEC-EPON
(1-800-832-3766)

Table 1/Typical Properties of Liquid EPON Resins*

Product Liquid 40-70


EPON Resin 828/HELOXY Modifier blends.

Chemical type Comments


Low viscosity alternative to EPON Resin 862 and

Physical form 192-204

Viscosity at 25 C, P

Weight per epoxide SC:1971

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPON Resin 824

Modified DGEBPA Liquid 60-65 175-180


High purity resin with strong crystallization tendency. Provides chemical resistance, high solids formulations.

EPON Resin 825

DGEBPA

RP:3073

EPON Resin 826 Liquid 65-95

DGEBPA

178-186

General Bisphenol A epoxy resin providing chemical resistance. Subject to crystallization when cold.

RP:3074

EPON Resin 828 Liquid 110-150


grade epoxy resin.

DGEBPA

185-192

General Bisphenol A, moderate viscosity, standard

RP:3075

EPON Resin 830 Viscous liquid 170-225 Liquid 25-45 166-177

DGEBPA

190-198

Minimal crystallization tendency; higher viscosity.

EPIKOTE Resin 862

DGEBPF

Low viscosity Bisphenol F epoxy resin used alone or in blends with other resins. Allows high solids formulations with good chemical resistance. A high performance alternative to blends of EPON Resin 828 with HELOXY Modifiers.

SC:772

EPON Resin 8280 Liquid

DGEBPA

110-150

185-195

Anti-settling and anti-foaming resin for use in filled systems.

SC:894

EPON Resin 8281 Liquid

DGEBPA

110-140

182-195

Anti-settling and anti-foaming resin for silica fillers.

SC:940
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*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 2/Typical Properties of Liquid EPON Resin Blends*


Viscosity at 25 C, P Comments
Blend of BPA and BPF resins. Provides improved crystallization resistance over BPA or BPF resins, along with moderate viscosity. Good chemical and crystallization resistance. Superior wetting characteristics. Modified BPA resin that provides flexibility and toughness. Used in applications where thermal shock or impact resistance is important. Higher viscosity version of EPON Resin 815C. Flexible resin for flooring and adhesive applications. Primary resin for flooring systems. Anti-settling and anti-foaming resin for highly filled systems. Highest viscosity version of EPON Resin 8132 for flooring. Medium viscosity version of EPON Resin 8132 for flooring. High molecular weight BPA solid resin solution. Used in coatings applications where high toughness and non-HAP solvents are required.

Product DGEBPA/ DGEBPF 177-182 HELOXY Modifier 62 180-195 175-195 625-725 HELOXY Modifier 61 15-38 5-7 5-7 60-80

Modifier/solvent used

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPON Resin 235

EPON Resin 813

RP:3072 SC:2431 SC:2143

EPON Resin 815C

EPON Resin 872

EPON Resin 8112 HELOXY Modifier 61 HELOXY Modifier 505 HELOXY Modifier 8 HELOXY Modifier 62 HELOXY Modifier 8 HELOXY Modifier 8 Propylene Glycol Methyl Ether Acetate Z1-Z2
(Gardner Holdt)

7-11 182-190 245-275 195-215 180-195 190-200 195-205 1600-1900 11-16 5-7 50-65 22.5-27.5 13.5-18.5 40-65

SC:1534 SC:1425 SC:1972 SC:1972

EPON Resin 8131

EPON Resin 8132

EPON Resin 8201

EPON Resin Custom Solution 241

EPON Resin Custom Solution 242

EPON Resin Custom Solution 258

EPON Resin Custom Solution 267 Propylene Glycol Methyl Ether Acetate/Toluene

2700-3300

Modified high molecular weight BPA solid resin solution. Used in coatings applications where high toughness is required.

SC:694

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*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 3/Typical Properties of Epoxy Acrylate EPON Resins*


Viscosity at 25 C, cP Equivalent weight Comments Very low viscosity resin that imparts viscosity reduction, flexibility and superior wetting characteristics into a resin system. Moderate viscosity resin with superior wetting. Used in flooring, casting, encapsulation and grouting compounds. Produces exceptionally rapid reaction rates. Uses include various high-build sealers, wear resistant surfacing, and low temperature curing applications. Moderate viscosity resin that imparts flexibility and superior wetting into a resin system. Ultimate reactivity when combined with aliphatic amines. Used alone or as a highly reactive modifier for adhesives, grouting, high build sealers, and various low temperature applications. 130 177 Moderate viscosity resin. Performance properties similar to EPON Resin 828. Applications include flooring, grouts, adhesives, casting and encapsulation systems. 150 85-115 SC:1525

Product Liquid

Chemical type

Physical form

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPON Resin 8021

Aromatic epoxy polyacrylate

EPON Resin 8101

Aromatic epoxy polyacrylate 192

Liquid

400-800

SC:1535

EPON Resin 8111

Aromatic epoxy polyacrylate 140

Liquid

800-1100

SC:2362

EPON Resin 8115

Aromatic epoxy polyacrylate 229-237 Liquid 2,700-3,700

Liquid

500-700

EPON Resin 8121

Aromatic epoxy polyacrylate

SC:2389

EPON Resin 8161

Aromatic epoxy polyacrylate

Liquid

1,800-2,400

SC:1527

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*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 4/Typical Properties of Lightfast EPONEX Resins*


Viscosity at 25 C, cP Equivalent weight Comments Low viscosity cycloaliphatic glycidyl ether. Building block resin for higher molecular weight epoxies. Resists chalking, yellowing. 210-238 1,300-2,500 SC:729

Product Liquid

Chemical type

Physical form

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPONEX Resin 1510

Hydrogenated DGEBPA

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 5/Typical Properties of Brominated EPON Resins*


Softening point, F Comments
Low melting semi-solid with 48% by weight bromine. Imparts fire retardancy. Non-sintering solid epoxy with 42% by weight bromine. Imparts fire retardancy.

Product Solid 140 380-410 625-725 425-445 360-390 350-400 360-390 207 Solid Acetone solution Methyl Ethyl Ketone solution MEK/PGME solution Methyl Ethyl Ketone solution

Chemical type

Physical form

Weight per epoxide

Refer to Technical Bulletin No. SC:2449 SC:2450

EPON Resin 1163

Brominated DGEBPA

EPON Resin 1183

Brominated DGEBPA

EPON Resin 1124-A-80

Brominated DGEBPA

Conventional brominated resin for FR-4 applications.

SC:0928
Brominated resin/Dicy-free curing agent solution.

EPON Resin 1213-B-80

Brominated DGEBPA

SC:2887
Brominated resin/Dicy-free curing agent solution.

EPON Resin CS-373

Brominated resin

SC:4012
Brominated resin/Dicy-free curing agent solution.

EPON Resin CS-382

Brominated resin

SC:4014
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*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 6/Typical Properties of Semi-Solid and Solid EPON Resins*


Viscosity at 25 C, cP Comments Used for pre-pregs and adhesive property modification. Used for pre-pregs and adhesive property modification. Low molecular weight, Bisphenol A epoxy resin used to provide improved toughness, flexibility, flow control, and tack. Basic coating/pre-preg resin; sinters upon storage. Sinter-resistant grade of EPON Resin 1001F. Medium molecular weight, Bisphenol A epoxy resin containing hydroxyl groups. Often reacted with vegetable oil acids to produce epoxy ester resins. Can also add toughness, flexibility, and rheology control. Moderately high molecular weight resin used for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. 1,700-2,300 2,300 3,800 275 Very high molecular weight resin for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. O-V1 80 230-280 SC:2145 Softening point, F

Product Semi-solid

Chemical type

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPON Resin 834

DGEBPA

EPON Resin 836 Semi-solid 97 290-335

DGEBPA

L-U2

SC:2144

EPON Resin 1001F Solid 174 525-550

DGEBPA

7.0-9.63

RP:3062

EPON Resin 1002F Solid 185 205 800-950 Solid 15-253 600-700

DGEBPA

9.2-13.63

RP:3063 RP:3064

EPON Resin 1004F

DGEBPA

EPON Resin 1007F Solid 257

DGEBPA

50-1003

RP:3065

EPON Resin 1009F Solid

DGEBPA

100-2503

RP:3066

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70% solution in butyl DIOXITOL. 75% solution in MIBK. 40% weight solution in MEK.

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 7/Typical Properties of Powder Grade Solid EPON Resins*


Viscosity at 25 C, cP Comments Medium molecular weight, Bisphenol A epoxy resin containing hydroxyl groups used primarily for thin film epoxy powder coating applications. Medium molecular weight, Bisphenol A epoxy resin containing flow control agent. Medium molecular weight, Bisphenol A epoxy resin containing hydroxyl groups used primarily for thin or thick film epoxy powder coating applications. Medium molecular weight, Bisphenol A epoxy resin used primarily for thin or thick film epoxy powder coating applications. Moderately high molecular weight, Bisphenol A epoxy resin used primarily for thick or intermediate film epoxy powder coating applications. 1200-1400 10-171 55-60 675-760 RP:3068 Softening point, F

Product Solid

Chemical type

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPON Resin 2002

DGEBPA

EPON Resin 2002-FC-10 Solid 760-875

DGEBPA

RP:3069

EPON Resin 2003 Solid 725-825

DGEBPA

13.5-181

EPON Resin 2004 Solid 875-975

DGEBPA

18-271

RP:3070

EPON Resin 2005 Solid 230-248

DGEBPA

25-551

SC:1020

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40% weight solution in MEK.

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 7/Typical Properties of Powder Grade Solid EPON Resins*


Viscosity at 25 C, cP Comments Blend of solid BPA fusion resin and epoxy BPF novolac resin used primarily in high performance powder coating applications, due to superior chemical and corrosion resistance. Medium molecular weight, Bisphenol A epoxy resin containing flow control agent. Modified, solid BPA resin with lower melt viscosity with high softening point. Modified, solid BPA resin for low melt viscosity and high reactivity. Primarily used for electrical encapsulation applications. Modified, solid BPA resin for low melt viscosity and high reactivity. Primarily used for electrical encapsulation applications. 35-751 100-120 750-850 SC:1557 Softening point, F

Continued

Product Solid

Chemical type

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPON Resin 2014

DGEBPA/ Epoxy BPF novolac

EPON Resin 2024 Solid 95-105 17-261

DGEBPA

850-950

RP:3071

EPON Resin 2042 Solid 75-85

Modified DGEBPA Solid 5.6-7.2 440-500

8-121 700-750

SC:1654

EPON Resin 3001

Modified DGEBPA

EPON Resin 3002 Solid

Modified DGEBPA

7.4-9.5 520-590

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40% weight solution in MEK.

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 8/Typical Properties of EPON Multi-Functional Epoxy Resins*


Viscosity at 25 C, P Comments
An epoxy phenolic novolac resin with a functionality of about 3.6. Produces high strength cured systems with good chemical resistance and elevated temperature stability.

Product 310-400 176-181

Chemical type

Physical form

Softening Weight point, per F epoxide SC:1823

Refer to Technical Bulletin No.

EPON HPT Resin 1050

SC:3059-02 / EPON Resins and Modifiers

(aka EPIKOTE Resin 154)

Epoxy phenolic novolac

Semisolid

EPON Resin 160 345-385 168-178 Viscous liquid


and chemical resistance.

Functionality of 2.5. Low viscosity version of EPON HPT Resin 1050. Multi-functional novolac epoxy resin with low viscosity, easy processing, good thermal stability,

Epoxy BPF novolac

SC:1366

EPON Resin 161 180-280 169-178 Viscous liquid

Functionality of 2.5. Lower viscosity version of EPON Resin 160. Multi-functional novolac epoxy resin with low viscosity, easy processing, good thermal stability, and chemical resistance.

Epoxy BPF novolac

SC:2915

EPON Resin 164 Solid 70-100 174


(at 248 F)

200-240

Functionality of 4.1. High temperature and chemical resistance.

Epoxy cresol novolac Solid


(at 150 C)

SC:735

EPON Resin 165

100-200

197

200-230

An epoxy cresol novolac resin with a functionality of about 5.5. Produces high strength cured systems with good chemical resistance and elevated temperature stability.

Epoxy cresol novolac

SC:2733

EPON Resin 1031 Solid

39
(at 248 F)

172

195-230

Functionality of 3.5. High temperature and chemical resistance.

Tetraglycidyl ether of tetraphenolethane

RP:3067
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*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 8/Typical Properties of EPON Multi-Functional Epoxy Resins*

Continued

Product Comments
Functionality of 2.5. An epoxy Bisphenol A novolac providing good thermal stability and chemical resistance. Useful for electrical, adhesives, and composites applications.

Chemical type 20-60


(at 120 F)

Physical form Viscosity, P 180-200 Viscous liquid

Weight per epoxide SC:1578

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPON Resin SU-2.5

Epoxy BPA novolac 150-450 187-207


adhesives, and composites applications.
(at 125 F)

EPON Resin SU-3

Epoxy BPA novolac Solid1 10-60 195-230


(at 266 F)

Semisolid

Functionality of 3. An epoxy Bisphenol A novolac providing good thermal stability and chemical resistance. Useful for electrical,

SC:1579

EPON Resin SU-8

Functionality of 8. An epoxy Bisphenol A novolac providing rapid development of green strength, with good high temperature performance. Useful for electrical, adhesives, and composites applications.

SC:1580

(aka EPIKOTE Resin 157)

Epoxy BPA novolac

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Melts at approximately 83 C.

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 9/Typical Properties of Elastomer Modified EPON Resins*


Viscosity at 25 C, P Comments
CTBN-elastomer modified Bisphenol F epoxy resin with an elastomer content of 40% wt. Provides improved adhesive properties, thermal shock resistance, and toughness with good fatigue resistant properties. CTBN-elastomer modified Bisphenol A epoxy resin with an elastomer content of 40% wt. Provides improved adhesive properties, thermal shock resistance, and toughness with good fatigue resistant properties. CTBN-elastomer modified Bisphenol A epoxy resin with an elastomer content of 40% wt. Provides improved adhesive properties, thermal shock resistance, and toughness with good fatigue resistant properties. CTBN-elastomer modified with HELOXY Modifier 68 resin that has an elastomer content of about 50% wt. Provides improved adhesive properties, thermal shock resistance, and toughness with good fatigue resistant properties. CTBN-elastomer modified with HELOXY Modifier 107 resin that has an elastomer content of about 50% wt. Lower viscosity aids in processing. Provides good flexibility, adhesion, fatigue resistance, and toughness properties. CTBN-elastomer modified epoxy-functional adduct formed with EPON Resin 828 with an elastomer content of about 5% wt. Provides tack and early green strength to composites and adhesives.

Product 1,500-3,000 285-330

Physical form

Weight per epoxide SC:2366

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPON Resin 58003

Viscous liquid

EPON Resin 58005 3,000-8,000

Viscous liquid 325-375

SC:1499

EPON Resin 58006 1500-3000

Viscous liquid 330-360

SC:1500

EPON Resin 58034 40-80

Moderate viscous liquid 275-305 150-300 325-375

SC:1501

EPON Resin 58042

Medium viscosity liquid 1,000-5,000 195-210

SC:1502

EPON Resin 58901

Viscous liquid

SC:1504

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*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 10/Typical Properties of EPI-REZ Waterborne Epoxy Resins*


Viscosity at 77 F, cP Comments
Water dispersion of an epoxidized Bisphenol A epoxy resin with an average functionality of 8. Water dispersible Bisphenol A epoxy resin. Water dispersible Bisphenol A epoxy resin. Waterborne dispersion of a low molecular weight liquid Bisphenol A epoxy resin (EPON Resin 828-type). Waterborne dispersion of a semi-solid Bisphenol A epoxy resin. Waterborne dispersion of a CTBN (butadiene-acrylonitrile) polymer modified epoxy resin. For industrial maintenance ambient cure coatings. Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON Resin 1002-type).

Product Liquid 5,000-12,000 210-250

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPI-REZ Resin DPW-5108

EPI-REZ Resin WD-510 8,000-12,000 50,000 500-5,000 185-215 195-210 Liquid Liquid

Liquid 190-205

SC:1523 SC: 1524 SC:1551

EPI-REZ Resin WD-512

EPI-REZ Resin 3510-W-60

EPI-REZ Resin 3515-W-60 4,000-15,000

Liquid 225-275

SC:1554

EPI-REZ Resin 3519-W-50 5,000-15,000

Liquid 560-660

SC:1550

EPI-REZ Resin 3520-WY-55 7,000-17,000 8,000-18,000 615-715 Liquid

Liquid 485-555

SC:1558 SC:1560

EPI-REZ Resin 3522-W-60

EPI-REZ Resin 3540-WY-55 7,000-17,000

Liquid

1600-2000

For industrial baked coatings and modifier for ambient coatings.

SC:1552

EPI-REZ Resin 3546-WH-53

Liquid

1,000-15,000

1900-2200

For non-HAPs baked coatings, fiber sizes and finishes.

SC:3046

Page 15

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 10/Typical Properties of EPI-REZ Waterborne Epoxy Resins* SC:XXXX-01 / Title Goes Here
Page X

Continued

Product Liquid 5,000-15,000 195-215


Waterborne dispersion of an epoxy Bisphenol A novolac resin with an average functionality of 3 (EPON Resin SU-3 type). Waterborne dispersion of a urethane-modified Bisphenol A epoxy resin. Multi-functional for corrosion resistant finishes. Waterborne dispersion of an epoxidized o-cresylic novolac resin with an average functionality of 6. Waterborne HAPS-free NEWGEN Technology dispersion of a solid Bisphenol A epoxy resin (EPON Resin 1001-type) with a non-HAPs co-solvent.

Physical form Comments

Viscosity at 77 F, cP SC:1553

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

EPI-REZ Resin 5003-W-55

EPI-REZ Resin 5520-W-60 5,000-15,000 480-560

Liquid

SC:1556

EPI-REZ Resin 5522-WY-55 8,000-19,000 6,000-13,000 230-270 550-700 Liquid

Liquid

SC:1559 SC:2328

EPI-REZ Resin 6006-W-70

Developmental Epoxy Resin Dispersion DPW-6520 3,000 500-600

Liquid

SC:2856

Page 16

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Table 11/Typical Properties of HELOXY Modifiers*


Viscosity at 77 F, cP Comments

Product

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

Monofunctional Glycidyl Ethers Liquid 3-5 6-10 1-2 145-155 280-300 Liquid Liquid 220-235
Alkyl C8-C10 glycidyl ether. Provides good dilution efficiency and has low volatility (some odor present). Alkyl C12-C14 glycidyl ether. Provides good dilution efficiency and has lower volatility and odor than HELOXY Modifier 7. Butyl glycidyl ether. Provides the maximum viscosity reduction with minimum loss of physical performance, good substrate wetting, and allows for increased filler loading. Cresyl glycidyl ether with good performance and low volatility. Phenyl glycidyl ether with good performance and low volatility. Nonylphenyl glycidyl ether. Provides moderate dilution efficiency and is used as a chemical intermediate. p-tert-Butylphenyl glycidyl ether. Provides moderate dilution efficiency, low volatility and good electrical properties. 2-Ethylhexyl glycidyl ether. Provides good dilution efficiency and may be a substitute for butyl glycidyl ether. Glycidyl ester of neodecanoic acid. Provides good dilution efficiency and has low volatility. Good pigment wetting properties

HELOXY Modifier 7

SC:1519 SC:1520 SC:1511

HELOXY Modifier 8

HELOXY Modifier 61

HELOXY Modifier 62 5-10 4-7 90-130 20-30 2-4 5-10 244-256 215-225 225-240 300-325 150-165 Liquid Liquid Liquid Liquid Liquid

Liquid

175-195

SC:1512 SC:1513 SC:1514 SC:1515 SC:1506 SC:1416

HELOXY Modifier 63

HELOXY Modifier 64

HELOXY Modifier 65

HELOXY Modifier 116

CARDURA Glycidyl Ester E-10P

Page 17

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Continued

Table 11/Typical Properties of HELOXY Modifiers*


Viscosity at 77 F, cP Comments

Continued

Product

Physical form

Weight per epoxide

Refer to Technical Bulletin No.

SC:3059-02 / EPON Resins and Modifiers

Polyfunctional Glycidyl Ethers Liquid 125-250 13-18 13-18 55-75 155-165 130-145 120-135 Liquid Liquid Liquid 135-155
Triglycidyl ether of trimethylolpropane. Efficient viscosity reducer with increased crosslink density and reactivity. Diglycidyl ether of 1,4-butanediol. Offers good viscosity reduction with minimum loss of performance. Diglycidyl ether of neopentyl glycol. Low volatility resin that provides good viscosity reduction with minimum loss of performance. Diglycidyl ether of cyclohexane dimethanol. Offers moderate viscosity reduction with minimum loss of properties, especially for maintenance of deformation under load.

HELOXY Modifier 48

SC:1509 SC:1516 SC:1517 SC:1505

HELOXY Modifier 67

HELOXY Modifier 68

HELOXY Modifier 107

Flexibilizers Liquid 400-900 200-320 300-500 550-650 620-680 Liquid Liquid 390-470
Dimer acid diglycidyl ester. Provides flexibility, improved impact strength, and toughness. Polyglycidyl ether of aliphatic polyol used as an epoxy flexibilizer to improve thermal shock, impact resistance. Polyglycidyl ether of castor oil. Provides good flexibility, water resistance, low volatility, and low odor.

HELOXY Modifier 71

SC:1355 SC:1521 SC:1510

HELOXY Modifier 84

HELOXY Modifier 505

Page 18

*Resolution Performance Products LLC (RPP) offers resin products in addition to those listed here. Please see the RPP publication, Physical Properties Guide for Epoxy Resins and Related Products (SC:21) for a more complete listing.

Resolution Performance Products P.O. Box 4500 Houston, Texas 77210-4500 For product prices, availability, or order placement, call our toll-free customer service number at:

1.877.859.2800
For sales in North and South America outside the United States, call:

1.832.366.2365

For technical literature and additional technical assistance, visit our website at:

www.resins.com

SAFETY & HANDLING These products are capable of producing adverse health effects ranging from minor skin irritation to serious systemic effects. Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Resolution Performance Products LLC (RPPLLC) products should be directed to your RPPLLC sales representative, or the nearest RPPLLC sales office. Information and MSDSs on non-RPPLLC products should be obtained from the respective manufacturer. WARRANTY NOTHING CONTAINED HEREIN CONSTITUTES AN OFFER FOR THE SALE OF ANY PRODUCT. ALL PRODUCTS SUPPLIED BY RESOLUTION PERFORMANCE PRODUCTS LLC (RPPLLC) ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE APPLICABLE SALES CONTRACT AND NOTHING CONTAINED HEREIN SHALL AMEND OR MODIFY ANY SUCH CONTRACT. SUBJECT TO THE FOREGOING, RPPLLC WARRANTS ONLY THAT ITS PRODUCTS WILL MEET SPECIFICATIONS SET FORTH IN THE APPLICABLE SALES CONTRACT. RPPLLC MAKES NO OTHER WARRANTIES, EITHER EXPRESS OR IMPLIED, WITH RESPECT TO ITS PRODUCTS OR THE RESULTS TO BE OBTAINED FROM THE USE THEREOF, OR WITH RESPECT TO ANY INFORMATION PROVIDED BY RPPLLC, INCLUDING WITHOUT LIMITATION THAT ANY PRODUCT WILL BE MERCHANTABLE OR FIT FOR ANY PARTICULAR PURPOSE OR THAT THE USE OF ANY PRODUCT OR INFORMATION PROVIDED BY RPPLLC WILL NOT INFRINGE ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS. ALL SUCH WARRANTIES ARE HEREBY DISCLAIMED AND EXCLUDED.

2002 Resolution Performance Products LLC. All rights reserved. Printed in the U.S.A.

SC:3059-01 (Formerly SC:1844-99 and SC:2326-99) 09/02 1.5M

E P I KOT E

EPON

E P IKURE

EPI-REZ

H E LOX Y

C A R D U R A

V E O VA

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