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1
2
3
4
8
7
6
5
R
RE
DE
D
V
CC
B
A
GND
DORPPACKAGE
(TOPVIEW)
1
2
3
4
6
7
A
B
R
RE
DE
D





























































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60 1%
V
OD 0or3V
_
+
7V<V
(test)
<12V
DE
V
CC
A
B
D
375 1%
375 1%
I
OA
V
OD 54 1% 0or3V
V
OA
V
OB
I
OB
DE
V
CC
I
I
V
I
A
B
V
OC
27 1%
Input
A
B
V
A
V
B
V
OC(PP)
V
OC(SS)
V
OC
27 1%
C
L
= 50 pF 20%
D
A
B
DE
V
CC
Input: PRR = 500 kHz, 50% Duty Cycle,t
r
<6ns, t
f
<6ns, Z
O
= 50
C
L
Includes Fixture and
Instrumentation Capacitance
V
OD
R
L
= 54
1%
50
Generator: PRR = 500 kHz, 50% Duty Cycle, t
r
<6 ns, t
f
<6 ns, Z
o
= 50
t
PLH
t
PHL
1.5 V 1.5 V
3 V
2 V
2 V
90%
10%
0 V
V
I
V
OD
t
r
t
f
C
L
= 50 pF 20%
C
L
Includes Fixture
and Instrumentation
Capacitance
D
A
B
DE
V
CC
V
I
Input
Generator
90%
0 V
10%
R
L
= 110
1%
Input
Generator
50
Generator: PRR = 500 kHz, 50% Duty Cycle, t
r
<6 ns, t
f
<6 ns, Z
o
= 50
3 V
S1
0.5 V
3 V
0 V
V
OH
0 V
t
PHZ
t
PZH
1.5 V 1.5 V
V
I
V
O
C
L
= 50 pF 20%
C
L
Includes Fixture
and Instrumentation
Capacitance
D
A
B
DE
V
O
V
I
2.3 V

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Input
Generator
50
3 V
V
O
S1
3 V
1.5 V 1.5 V
t
PZL
t
PLZ
2.3 V
0.5 V
3 V
0 V
V
OL
V
I
V
O
Generator: PRR = 500 kHz, 50% Duty Cycle, t
r
<6 ns, t
f
<6 ns, Z
o
= 50
R
L
= 110
1%
C
L
= 50 pF 20%
C
L
Includes Fixture
and Instrumentation
Capacitance
D
A
B
DE
V
I
3 V
V
ID
V
A
V
B
I
O
A
B
I
B
V
O
R
I
A
V
IC
V
A
+ V
B
2
Input
Generator
50
Generator: PRR = 500 kHz, 50% Duty Cycle, t
r
<6 ns, t
f
<6 ns, Z
o
= 50
V
O
1.5 V
0 V
1.5 V 1.5 V
3 V
V
OH
V
OL
1.5 V
10%
1.5 V
t
PLH
t
PHL
t
r
t
f
90%
V
I
V
O
C
L
= 15 pF 20%
C
L
Includes Fixture
and Instrumentation
Capacitance
A
B
RE
V
I
R
0 V
90%
10%

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50
Generator: PRR = 500 kHz, 50% Duty Cycle, t
r
<6 ns, t
f
<6 ns, Z
o
= 50
V
O
RE
R
A
B
3 V
0 V or 3 V
3 V
1.5 V 1.5 V
t
PZH(1)
t
PHZ
1.5 V
V
OH
0.5 V
3 V
0 V
V
OH
0 V
V
O
C
L
= 15 pF 20%
C
L
Includes Fixture
and Instrumentation
Capacitance
V
I
DE
D
1 k 1%
V
I
A
B
S1
D at 3 V
S1 to B
t
PZL(1)
t
PLZ
1.5 V
V
OL
+0.5 V
3 V
V
OL
V
O
D at 0 V
S1 to A
Input
Generator

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Input
Generator 50
Generator: PRR = 100 kHz, 50% Duty Cycle, t
r
<6 ns, t
f
<6 ns, Z
o
= 50
V
O
RE
R
A
B
3 V
1.5 V
t
PZH(2)
1.5 V
3 V
0 V
V
OH
GND
V
I
V
O
0 V or 1.5 V
1.5 V or 0 V C
L
= 15 pF 20%
C
L
Includes Fixture
and Instrumentation
Capacitance
V
I
1 k 1%
A
B
S1
A at 1.5 V
B at 0 V
S1 to B
t
PZL(2)
1.5 V
3 V
V
OL
V
O
A at 0 V
B at 1.5 V
S1 to A
Pulse Generator,
15 s Duration,
1% Duty Cycle
t
r
, t
f
100 ns
100
1%
_
+
A
B
R
D
DE
RE
0 V or 3 V
NOTE
:
This test is conducted to test survivability only. Data stability at the R output is not specified.
3 V or 0 V









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9 V
1 k
100 k
Input
V
CC
D and RE Inputs
9 V
1 k
100 k
Input
V
CC
DE Input
16 V
16 V
R3
R1
R2
Input
A Input
16 V
16 V
R3
R1
R2
Input
B Input
16 V
16 V
V
CC
A and B Outputs
9 V
V
CC
R Output
5
Output
V
CC
SN65HVD10
SN65HVD11
SN65HVD12
R1/R2
9 k
36 k
36 k
R3
45 k
180 k
180 k
V
CC
Output






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30
40
50
60
70
0 2.5 5 7.5 10
V
CC
= 3.6 V
V
CC
= 3.3 V
V
CC
= 3 V
Signaling Rate Mbps
I
C
C

R
M
S

S
u
p
p
l
y

C
u
r
r
e
n
t

m
A
T
A
= 25C
RE at V
CC
DE at V
CC
R
L
= 54
C
L
= 50 pF
30
40
50
60
70
0 5 10 15 20 25 30 35 40
I
C
C
T
A
= 25C
RE at V
CC
DE at V
CC
V
CC
= 3.6 V
V
CC
= 3.3 V
V
CC
= 3 V

R
M
S

S
u
p
p
l
y

C
u
r
r
e
n
t

m
A
Signaling Rate Mbps
R
L
= 54
C
L
= 50 pF
30
40
50
60
70
100 400 700 1000
V
CC
= 3.6 V
V
CC
= 3.3 V
V
CC
= 3 V
Signaling Rate kbps
I
C
C

R
M
S

S
u
p
p
l
y

C
u
r
r
e
n
t

m
A
T
A
= 25C
RE at V
CC
DE at V
CC
R
L
= 54
C
L
= 50 pF
200
150
100
50
0
50
100
150
200
250
300
765 4321 0 1 2 3 4 5 6 7 8 9 1011 12

B
u
s

I
n
p
u
t

C
u
r
r
e
n
t

I
I
A

V
I
Bus Input Voltage V
V
CC
= 0 V
V
CC
= 3.3 V
T
A
= 25C
DE at 0 V
















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200
150
100
50
0
50
100
150
4 2 0 2 4 6
T
A
= 25C
DE at V
CC
D at V
CC
V
CC
= 3.3 V
V
OH
Driver High-Level Output Voltage V
I
O
H

H
i
g
h
-
L
e
v
e
l

O
u
t
p
u
t

C
u
r
r
e
n
t

m
A
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
7654321 0 1 2 3 4 5 6 7 8 9 1011 12

B
u
s

I
n
p
u
t

C
u
r
r
e
n
t

I
I
A

V
I
Bus Input Voltage V
V
CC
= 0 V
V
CC
= 3.3 V
T
A
= 25C
DE at 0 V

D
r
i
v
e
r

D
i
f
f
e
r
e
n
t
i
a
l

O
u
t
p
u
t

V
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
40 15 10 35 60 85
V
O
D
T
A
Free-Air Temperature C
V
CC
= 3.3 V
DE at V
CC
D at V
CC
20
0
20
40
60
80
100
120
140
160
180
200
4 2 0 2 4 6 8
T
A
= 25C
DE at V
CC
D at 0 V
V
CC
= 3.3 V
V
OL
Driver Low-Level Output Voltage V
I
O
L

L
o
w
-
L
e
v
e
l

O
u
t
p
u
t

C
u
r
r
e
n
t

m
A
















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V
CC
Supply Voltage V
35
30
25
20
40
15
10
5

D
r
i
v
e
r

O
u
t
p
u
t

C
u
r
r
e
n
t

m
A
I
O
0
0 0.50 1 1.50 2 2.50 3 3.50
T
A
= 25C
DE at V
CC
D at V
CC
R
L
= 54
HVD12
HVD11
0
100
400
500
600
-7 -2 3 8 13
HVD10
E
n
a
b
l
e

T
i
m
e

n
s
V
(TEST)
Common-ModeVoltage V
200
300
60 W
1%
50 W
375 W 1%
-7V<V <12V
(TEST)
V
OD
V (low)
OD
t (diff)
pZL
t (diff)
pZH
V
0or3V
375 W 1%
50%
0V
1.5V
D
Z
DE
Y
-1.5V
V (high)
OD
Input
Generator




















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R
T
R
T
Device
HVD10
HVD11
HVD12
Number of Devices on Bus
64
256
256
NOTE
:
The line should be terminated at both ends with its characteristic impedance (R
T
= Z
O
). Stub lengths off the main line
should be kept as short as possible.
Stub
Driver Input
Driver Output
Receiver Input
Receiver Output
















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PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN65HVD10D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD10DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD10DR ACTIVE SOIC D 8 1 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD10DRG4 ACTIVE SOIC D 8 1 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD10P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD10PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD10QD ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD10QDG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD10QDR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD10QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD10QP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD10QPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD11D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD11DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD11DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD11DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD11P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD11PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD11QD ACTIVE SOIC D 8 75 TBD CU NIPDAU Level-1-220C-UNLIM
SN65HVD11QDR ACTIVE SOIC D 8 2500 TBD CU NIPDAU Level-1-220C-UNLIM
SN65HVD11QDRG4 ACTIVE SOIC D 8 TBD Call TI Call TI
SN65HVD11QP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD11QPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD12D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD12DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD12DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 2-Oct-2006
Addendum-Page 1
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN65HVD12DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65HVD12P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN65HVD12PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN75HVD10D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD10DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD10DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD10DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD10P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN75HVD10PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN75HVD11D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD11DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD11DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD11DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD11P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN75HVD11PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN75HVD12D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD12DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD12DR ACTIVE SOIC D 8 1 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD12DRG4 ACTIVE SOIC D 8 1 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN75HVD12P ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN75HVD12PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Oct-2006
Addendum-Page 2
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Oct-2006
Addendum-Page 3
MECHANICAL DATA
MPDI001A JANUARY 1995 REVISED JUNE 1999
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M 0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TIs terms
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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