The Development Tendency to PCB Board Base Material As we know, there are two tendency on development to PCB base

material, they are Halogen free and Pb free. The six kinds of disabled harmful material which listed into the forbidden range, the material of Pb, PBB and PBDE has direct relationship to printed circuit board. Lead is used as Tin Lead coating layer which has solderability to the pad on surface of the printed circuit board, it was formed by hot-level tin-lead solder or electroplating tin lead. PBB and PBDE bromide is used as flame retardant of prepreg and copper-clad laminate of printed circuit board, they were mixed in the resin. PCB base material: Pb Free/Lead free Lead Free (1) Coating tin lead solder on PCB already exists for a long time, and is the most widely used, ,the most effective weldability as protective layer to PCB connection plate. The technique to PCB surface coating with tin lead solder includes hot air leveling tin-lead solder or electroplating tin lead alloy, according to the European Union and relevant countries in the national rules and regulations cancelled completely before July 2006. Nowadays, the surface treatment of lead free, methods include coating weldability organic protective layer(OSP), electroplating nickel/gold, electroless nickel/gold, silver plating, electroless plating, electroless plating tin tin, hot air leveling lead-free solder, etc. Some of these surface treatment in the PCB products get a large number of applications, some still in promotion. Lead-free solder hot leveling technology and equipment is also has entered the trial. (2) The lead free solder which can replace tin lead solder includes, silver tin solder. Silver tin lead solder, tin zinc solder, tin bismuth solder, tin silver bismuth solder, and so on. Now which is adopted more is the tin silver copper solder 95.5Sn/4Ag/0.5Cu), melting point at 217 . This kind of lead-free solders melting point is about 34 higher than tin-lead solder (63 sn / 37 pb), melting point 63 , there is no doubt that when soldering temperature should be increased, printed circuit board should be with a better temperature tolerance. Lead-free solder welding temperature is about 30-40 higher than normal tin lead solder welding temperature, it requires the PCB has high substrate glass transition temperature (Tg), and good heat resistance; Also requires a reliable lamination and Plated through hole to multilayer PCB board. It is not allowed to appear delamination or hole wall broken when be heated. This is the new requirement from lead free to the performance of printed circuit board. http://www.wonderfulpcb.com
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Laura Xie