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FEATURES :
* * * * * * High case dielectric strength High surge current capability High reliability Low reverse current Low forward voltage drop Ideal for printed circuit board
1.10 (27.9) MIN.
AC
AC
AC
MECHANICAL DATA :
* Case : Reliable low cost construction utilizing molded plastic technique * Epoxy : UL94V-O rate flame retardant * Terminals : Plated leads solderable per MIL-STD-202, Method 208 guaranteed * Polarity : Polarity symbols marked on case * Mounting position : Any * Weight : 1.29 grams
Rating at 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.
0.22 (5.59) 0.18 (4.57)
RATING
Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Current 0.375" (9.5 mm) lead length Tc = 50C Peak Forward Surge Current Single half sine wave Superimposed on rated load (JEDEC Method) Rating for fusing ( t < 8.3 ms. ) Maximum Forward Voltage per Diode at I F = 1.0 Amp. Maximum DC Reverse Current Ta = 25 C at Rated DC Blocking Voltage Ta = 100 C Typical Junction Capacitance per Diode (Note 1) Typical Thermal Resistance (Note 2) Operating Junction Temperature Range Storage Temperature Range
UNIT
Volts Volts Volts Amps. Amps. A2 S Volts A mA pf C/W C C
Notes :
1 ) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts. 2 ) Thermal resistance from Junction to Ambient at 0.375" (9.5 mm) lead length P.C. Board mounting.
0.8
0.375
24
T J = 55 C
0.6
18
0.4
10
20
40
60
100
CASE TEMPERATURE, ( C)
10
T J = 100 C
1.0
0.1
T J = 25 C
This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.