Department of Garments Manufacturing

Submitted By:

Submitted To: Sir Qaisar Mushtaq

Types of Processor & RAMs in Current System units Friday, August 30, 2013

Types of Processor

Assignment # 2

Types of Processor & RAMs in Current System Units

Dual core: Dual-core refers to a CPU that includes two complete execution cores per physical processor. It has combined two processors and their caches and cache controllers onto a single integrated circuit (silicon chip). Dual-core processors are well-suited for multitasking environments because there are two complete execution cores instead of one, each with an independent interface to the frontside bus. Since each core has its own cache, the operating system has sufficient resources to handle most compute intensive tasks in parallel.

Core 2 Duo: The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo with two processor cores on a single Merom, Conroe, Allendale, Penryn, or Wolfdale chip. These come in a wide range of performance and power consumption, starting with the relatively slow ultra-low-power (10 W) and low-power (17 W) versions, to the more performance oriented (25 W) and (35 W) mobile versions and the (65 W) desktop models. The mobile Core 2 Duo processors with an 'S' prefix in the name are produced in a smaller FC-BGA 956 package, which allows building more compact laptops. Within each line, a higher number usually refers to a better performance, which depends largely on core and front-side bus clock frequency and amount of second level cache, which are model-specific. Core 2 Duo processors typically use the full L2 cache of 2, 3, 4, or 6 MB available in the specific stepping of the chip, while versions with the amount of cache reduced during manufacturing are sold for the low-end consumer market as Celeron or Pentium DualCore processors. Like those processors, some low-end Core 2 Duo models disable features such

Department of Garments Manufacturing

as Intel Virtualization Technology. Core 2 Duo was the first family of desktop-class microprocessors based on Core microarchitecture. While the first Core 2 Duo processors had much lower core frequency and approximately the same FSB frequency and level 2 cache size as Pentium D microprocessors, they had better performance than the fastest Pentium D 960 due to much more efficient microarchitecture. The only exception to this were the slowest (less than 2 GHz) Core 2 Duo CPUs, that could perform slightly worse in some benchmarks. Newer dualcore CPUs have such improvements as higher core and FSB frequency, larger level 2 cache size, and lower power consumption. All Core 2 Duo processors use the same socket 775 package Core i3: Intel intended the Core i3 as the new low end of the performance processor line from Intel, following the retirement of the Core 2 brand.The first Core i3 processors were launched on January 7, 2010. The first Nehalem based Core i3 was Clarkdale-based, with an integrated GPU and two cores. The same processor is also available as Core i5 and Pentium, with slightly different configurations. The Core i3-3xxM processors are based on Arrandale, the mobile version of the Clarkdale desktop processor. They are similar to the Core i5-4xx series but running at lower clock speeds and without Turbo Boost. According to an Intel FAQ they do not support Error Correction Code (ECC) memory. According to motherboard manufacturer Supermicro, if a Core i3 processor is used with a server chipset platform such as Intel 3400/3420/3450, the CPU will support ECC with UDIMM. When asked, Intel confirmed that, although the Intel 5 series chipset supports non-ECC memory only with the Core i5 or i3 processors, using those processors on a motherboard with 3400 series chipsets it will support the ECC function of ECC memory. A limited number of motherboards by other companies also support ECC with Intel Core ix
3|Page

Assignment # 2

Types of Processor & RAMs in Current System Units

processors; the Asus P8B WS is an example, but it does not support ECC memory under Windows non-server operating systems.

Core i5: The first Core i5 using the Nehalem microarchitecture was introduced on September 8, 2009, as a mainstream variant of the earlier Core i7, the Lynnfield core. Lynnfield Core i5 processors have an 8 MB L3 cache, a DMI bus running at 2.5 GT/s and support for dual-channel DDR3-800/1066/1333 memory and have Hyper-threading disabled. The same processors with different sets of features (Hyper-Threading and other clock frequencies) enabled are sold as Core i7-8xx and Xeon 3400-series processors, which should not be confused with high-end Core i79xx and Xeon 3500-series processors based on Bloomfield. The Core i5-5xx mobile processors are named Arrandale and based on the 32 nm Westmere shrink of the Nehalem microarchitecture. Arrandale processors have integrated graphics capability but only two processor cores. They were released in January 2010, together with Core i7-6xx and Core i3-3xx processors based on the same chip. The L3 cache in Core i55xx processors is reduced to 3 MB, while the Core i5-6xx will use the full cache and the Core i33xx will have no support for Turbo Boost. Clarkdale, the desktop version of Arrandale, is sold as Core i5-6xx, along with related Core i3 and Pentium brands. It has Hyper-Threading enabled and the full 4 MB L3 cache.

Department of Garments Manufacturing

Core i7: Intel Core i7 as an Intel brand name applies to several families of desktop and laptop 64bit x86-64 processors using the Nehalem, Westmere, Sandy Bridge and Ivy Bridge microarchitectures. The Core i7 brand targets the business and high-end consumer markets for both desktop and laptop computers, and is distinguished from the Core i3 (entry-level consumer), Core i5 (mainstream consumer), and Xeon (server and workstation) brands.Intel introduced the Core i7 name with the Bloomfield Quad-core processor in late 2008. In 2009 new Core i7 models based on the Lynnfield desktop quad-core processor and the Clarksfield quad-core mobile were added, and models based on the Arrandale dual-core mobile processor were added in January 2010. The first six-core processor in the Core lineup is the Gulftown, which was launched on March 16, 2010. Both the regular Core i7 and the Extreme Edition are advertised as five stars in the Intel Processor Rating. In January 2011, Intel released the second generation of Core i7 processors. Both the first and second generation of Intel Core i7 processors are rated as 5 stars in the Intel processor rating. The second generation of Intel core processors are based on the "Sandy Bridge" core and were updated in April 2012 with "Ivy Bridge".In each of the first three microarchitecture generations of the brand, Core i7 has family members using two distinct system-level architectures, and therefore two distinct sockets (for example, LGA 1156 and LGA 1366 with Nehalem). In each generation, the highest-performing Core i7 processors use the same socket and QPI-based architecture as the low-end Xeon processors of that generation, while lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the Core i5."Core i7" is a successor to the Intel Core 2 brand Intel representatives stated that the moniker Core i7 is meant to help consumers decide which processor to purchase as the newer Nehalem-based products are released in the future.

5|Page

Assignment # 2

Types of Processor & RAMs in Current System Units

Types of RAMs
Static RAM: Static random-access memory (SRAM) is a type of semiconductor memory that uses bistable latching circuitry to store each bit. The term static differentiates it from dynamic RAM (DRAM) which must be periodically refreshed. SRAM exhibits data remanence, but it is still volatile in the conventional sense that data is eventually lost when the memory is not powered. SRAM retains stored information only as long as the power supply is on. Static RAMs are costlier and consume more power. They have higher speed than D-RAMs. They store information in Hip-Hope. In static RAM, a form of flipflop holds each bit of memory. A flip-flop for a memory cell takes four or six transistors along with some wiring, but never has to be refreshed. This makes static RAM significantly faster than dynamic RAM. However, because it has more parts, a static memory cell takes up a lot more space on a chip than a dynamic memory cell. Therefore, you get less memory per chip, and that makes static RAM a lot more expensive. Static RAM is fast and expensive, and dynamic RAM is less expensive and slower. Static RAM is used to create the CPUs speedsensitive cache, while dynamic RAM forms the larger system RAM space. Dynamic RAM: Dynamic RAM loses its stored information in a very short time (for milli sec.) even when power supply is on. D-RAMs are cheaper & lower. Similar to a microprocessor chip is an Integrated Circuit (IC) made of millions of transistors and capacitors. In the most common form of computer memory, Dynamic Memory Cell, represents a single bit of data. The capacitor holds the bit of information a 0 or a 1. The transistor acts as a switch that lets the control circuitry on

Department of Garments Manufacturing

the memory chip read the capacitor or change its state. A capacitor is like a small bucket that is able to store electrons. To store a 1 in the memory cell, the bucket is filled with electrons. To store a 0, it is emptied. The problem with the capacitors bucket is that it has a leak. In a matter of a few milliseconds a full bucket becomes empty. Therefore, for dynamic memory to work, either the CPU or the Memory Controller has to come along and recharge all of the capacitors holding it before they discharge. To do this, the memory controller reads the memory and then writes it right back. This refresh operation happens automatically thousands of times per second. This refresh operation is where dynamic RAM gets its name. Dynamic RAM has to be dynamically refreshed all of the time or it forgets what it is holding. The downside of all of this refreshing is that it takes time and slows down the memory. DDR1: Double Data Rate-SDRAM, or simply DDR1, was designed to replace SDRAM. DDR1 was originally referred to as DDR-SDRAM or simple DDR. When DDR2 was introduced, DDR became referred to as DDR1. Names of components constantly change as newer technologies are introduced, especially when the newer technology is based on a previous e one. The principle applied in DDR is exactly as the name implies double data rate. The DDR actually doubles the rate data is transferred by using both the rising and falling edges of a typical digital pulse. Earlier memory technology such as SDRAM transferred data after one complete digital pulse. DDR transfers data twice as fast by transferring data on both the rising and falling edges of the digital pulse.

7|Page

Assignment # 2

Types of Processor & RAMs in Current System Units

DDR2: DDR2 is the next generation of memory developed after DDR. DDR2 increased the data transfer rate referred to as bandwidth by increasing the operational frequency to match the high FSB frequencies and by doubling the prefetch buffer data rate. There will be more about the memory prefetch buffer data rate later in this section.DDR2 is a 240 pin DIMM design that operates at 1.8 volts. The lower voltage counters the heat effect of the higher frequency data transfer. DRR operates at 2.5 volts and is a 188 pin DIMM design. DDR2 uses a different motherboard socket than DDR, and is not compatible with motherboards designed for DDR. The DDR2 DIMM key will not align with DDR DIMM key. If the DDR2 is forced into the DDR socket, it will damage the socket and the memory will be exposed to a high voltage level. Also be aware the DDR is 188 pin DIMM design and DDR2 is a 240 pin DIMM design. DDR3: DDR3 was the next generation memory introduced in the summer of 2007 as the natural successor to DDR2. DDR3 increased the pre-fetch buffer size to 8-bits an increased the operating frequency once again resulting in high data transfer rates than its predecessor DDR2. In addition, to the increased data transfer rate memory chip voltage level was lowered to 1.5 V to counter the heating effects of the high frequency. By now you can see the trend of memory to increase pre-fetch buffer size and chip operating frequency, and lowering the operational voltage level to counter heat.The physical DDR3 is also designed with 240 pins, but the notched key is in a different position to prevent the insertion into a motherboard RAM socket designed for DDR2. DDR3 is both electrical and physically incompatible with previous versions of RAM. In addition to high frequency and lower applied voltage level, the DDR3 has a memory reset option which

Department of Garments Manufacturing

DDR2 and DDR1 do not. The memory reset allows the memory to be cleared by a software reset action. Other memory types do not have this feature which means the memory state is uncertain after a system reboot. The memory reset feature insures that the memory will be clean or empty after a system reboot. This feature will result in a more stable memory system. DDR3 uses the same 240-pin design as DDR2, but the memory module key notch is at a different location.

9|Page