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com

DGG OR DGV PACKAGE

(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1DIR
1B1
1B2
GND
1B3
1B4
V
CCB
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
V
CCB
2B5
2B6
GND
2B7
2B8
2DIR
1OE
1A1
1A2
GND
1A3
1A4
V
CCA
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
V
CCA
2A5
2A6
GND
2A7
2A8
2OE

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GQL OR ZQL PACKAGE

(TOP VIEW)
J
H
G
F
E
D
C
B
A
2 1 3 4 6 5
K

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To Seven Other Channels
1DIR
1A1
1B1
1OE
To Seven Other Channels
2DIR
2A1
2B1
2OE
1
47
24
36
48
2
25
13

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V
OH
V
OL
From Output
Under Test
C
L
(see Note A)
LOAD CIRCUIT
S1
2 V
CCO
Open
GND
R
L
R
L
t
PLH
t
PHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 V
CCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
t
PZL
t
PZH
t
PLZ
t
PHZ
V
CCA
/2 V
CCA
/2
V
CCI
/2 V
CCI
/2
V
CCI
0 V
V
CCO
/2 V
CCO
/2
V
OH
V
OL
0 V
V
CCO
/2
V
OL
+ V
TP
V
CCO
/2
V
OH
V
TP
0 V
V
CCI
0 V
V
CCI
/2 V
CCI
/2
t
w
Input
V
CCA
V
CCO
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
Input
t
pd
t
PLZ
/t
PZL
t
PHZ
/t
PZH
Open
2 V
CCO
GND
TEST S1
NOTES: A. C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z
O
= 50 , dv/dt 1 V/ns,
dv/dt 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as t
en
.
G. t
PLH
and t
PHL
are the same as t
pd
.
H. V
CCI
is the V
CC
associated with the input port.
I. V
CCO
is the V
CC
associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
1.8 V 0.15 V
2.5 V 0.2 V
3.3 V 0.3 V
5 V 0.5 V
2 k
2 k
2 k
2 k
V
CCO
R
L
0.15 V
0.15 V
0.3 V
0.3 V
V
TP
C
L
15 pF
15 pF
15 pF
15 pF

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
74LVCH16T245DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74LVCH16T245DLG4 ACTIVE SSOP DL 48 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74LVCH16T245DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74LVCH16T245ZQLR ACTIVE BGA MI
CROSTA
R JUNI
OR
ZQL 56 1000 Green (RoHS &
no Sb/Br)
SNAGCU Level-1-260C-UNLIM
SN74LVCH16T245DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVCH16T245DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVCH16T245DL ACTIVE SSOP DL 48 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVCH16T245DLR ACTIVE SSOP DL 48 1000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVCH16T245KR ACTIVE BGA MI
CROSTA
R JUNI
OR
GQL 56 1000 TBD SNPB Level-1-240C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Feb-2006
Addendum-Page 1
MECHANICAL DATA
MPDS006C FEBRUARY 1996 REVISED AUGUST 2000
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
1 12
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
38 24 16
4,90
5,10 3,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M 0,07 0,40
08
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins MO-153
14/16/20/56 Pins MO-194
MECHANICAL DATA


MSSO001C JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/ E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
48 28
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M 0.005 (0,13)
0.025 (0,635)
08
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA


MTSS003D JANUARY 1995 REVISED JANUARY 1998
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/ F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M 0,08
0,10
0,50
08
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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