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DATA SHEET
Philips Semiconductors
Product specication
TDA8356
The TDA8356 is a power circuit for use in 90 and 110 colour deflection systems for field frequencies of 50 to 120 Hz. The circuit provides a DC driven vertical deflection output circuit, operating as a highly efficient class G system.
MAX.
UNIT
V mA
A A V
A V C C C
Thermal data (in accordance with IEC 747-1) storage temperature operating ambient temperature virtual junction temperature +150 +75 150
ORDERING INFORMATION TYPE NUMBER TDA8356 PACKAGE NAME SIL9P DESCRIPTION plastic single in-line power package; 9 leads VERSION SOT131-2
1999 Sep 27
Philips Semiconductors
Product specication
TDA8356
VP VO(guard)
VFB 6
3 VP
CURRENT SOURCE
TDA8356
I drive(pos)
I drive(neg)
2 V IS
4 VO(B)
VO(B)
5 GND
MGC091
1999 Sep 27
Philips Semiconductors
Product specication
TDA8356
The vertical driver circuit is a bridge configuration. The deflection coil is connected between the output amplifiers, which are driven in opposite phase. An external resistor (RM) connected in series with the deflection coil provides internal feedback information. The differential input circuit is voltage driven. The input circuit has been adapted to enable it to be used with the TDA9150, TDA9151B, TDA9160A, TDA9162, TDA8366 and TDA8376 which deliver symmetrical current signals. An external resistor (RCON) connected between the differential input determines the output current through the deflection coil. The relationship between the differential input current and the output current is defined by: Idiff RCON = Icoil RM. The output current is adjustable from 0.5 A (p-p) to 2 A (p-p) by varying RM. The maximum input differential voltage is 1.8 V. In the application it is recommended that Vdiff = 1.5 V (typ). This is recommended because of the spread of input current and the spread in the value of RCON. The flyback voltage is determined by an additional supply voltage VFB. The principle of operating with two supply voltages (class G) makes it possible to fix the supply voltage VP optimum for the scan voltage and the second supply voltage VFB optimum for the flyback voltage. Using this method, very high efficiency is achieved. The supply voltage VFB is almost totally available as flyback voltage across the coil, this being possible due to the absence of a decoupling capacitor (not necessary, due to the bridge configuration). Built-in protections are: Thermal protection Short-circuit protection of the output pins (pins 4 and 7) Short-circuit protection of the output pins to VP. A guard circuit VO(guard) is provided. The guard circuit is activated at the following conditions: During flyback During short-circuit of the coil and during short-circuit of the output pins (pins 4 and 7) to VP or ground
handbook, 2 columns
I drive(pos)
1 2
3 4 5 6 7 8 9
MGC092
TDA8356
During open loop When the thermal protection is activated. This signal can be used for blanking the picture tube screen.
1999 Sep 27
Philips Semiconductors
Product specication
TDA8356
MAX.
UNIT
40 25 50
V V V
A V
A C C C hr
Thermal data (in accordance with IEC 747-1) storage temperature operating ambient temperature virtual junction temperature short-circuiting time
1999 Sep 27
Philips Semiconductors
Product specication
TDA8356
CHARACTERISTICS VP = 14.5 V; Tamb = 25 C; VFB = 45 V; fi = 50 Hz; II(sb) = 400 A; measured in test circuit of Fig.3; unless otherwise specied. SYMBOL DC supply VP VFB IP VO operating supply voltage yback supply voltage supply current no signal; no load 9.0 VP 13.2 14.5 30 25 50 55 V V mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Vertical circuit output voltage swing (scan) Idiff = 0.6 mA (p-p); Vdiff = 1.8 V (p-p); IO = 2 A (p-p) IO = 2 A (p-p); note 1 IO = 50 mA (p-p); note 1 VO VDF Ios Vos VosT VO(A) Gvo output voltage swing (yback); VO(A) VO(B) forward voltage of the internal efciency diode (VO(A) VFB) output offset current offset voltage at the input of the feedback amplier (VI(fb) VO(B)) output offset voltage as a function of temperature DC output voltage V 7-4 open-loop voltage gain --------- V 1-2 V 7-4 open loop voltage gain --------- ; V 1 2 = 0 V 9-4 VR V 1-2 voltage ratio --------V 9-4 frequency response (3 dB) current gain (IO/Idiff) current gain drift as a function of temperature signal bias current yback supply current power supply ripple rejection DC input voltage common mode input voltage input bias current common mode output current II(sb) = 0 II(sb) = 0 II(sb) = 300 A (p-p); fi = 50 Hz; Idiff = 0 6 during scan note 6 open loop; note 5 Idiff = 0.3 mA; IO = 1 A IO = 1 A; Idiff = 0.3 mA Idiff = 0; II(sb) = 50 to 500 A Idiff = 0; II(sb) = 50 to 500 A Idiff = 0 Idiff = 0; note 2 notes 3 and 4 V
LE
linearity error
50 0
1 1 40 6.5 80
% % V V mA mV V/K V dB
note 3
80
dB
dB
Hz K A A dB V V A mA
1999 Sep 27
Philips Semiconductors
Product specication
TDA8356
PARAMETER
CONDITIONS
MIN. 1 4.6
TYP.
MAX. UNIT A mA V V
not active; VO(guard) = 0 V active; VO(guard) = 3.6 V IO = 100 A maximum leakage current = 10 A;
50 2.5 5.5 40
VO(guard)
Notes 1. The linearity error is measured without S-correction and based on the same measurement principle as performed on the screen. The measuring method is as follows: Divide the output signal I4 I7 (VRM) into 22 equal parts ranging from 1 to 22 inclusive. Measure the value of two succeeding parts called one block starting with part 2 and 3 (block 1) and ending with part 20 and 21 (block 10). Thus part 1 and 22 are unused. The equations for linearity error for adjacent blocks (LEAB) and linearity error for not adjacent blocks (LENAB) are given below: a max a min ak a( k + 1 ) LEAB = --------------------------- ; LENAB = ----------------------------a avg a avg 2. Related to VP. 3. The V values within formulae relate to voltages at or across relative pin numbers, i.e. V7-4/V1-2 = voltage value across pins 7 and 4 divided by voltage value across pins 1 and 2. 4. V9-4 AC short-circuited. 5. Frequency response V7-4/V9-4 is equal to frequency response V7-4/V1-2. 6. At V(ripple) = 500 mV eff; measured across RM; fi = 50 Hz.
1999 Sep 27
Philips Semiconductors
Product specication
TDA8356
2.2 k VO(guard) 8 I I(sb) signal bias I drive(pos) R CON 3 k I drive(neg) signal bias I I(sb) I diff 2 V 4 1 FEEDBACK 9 INPUT 6 3 VP
VFB
TDA8356
7 R = 6.0
R M = 0.7
5 GND
MGC093
I diff I sb 0
I sb
I sb 1
R CON
TDA8356
I sb 0
1999 Sep 27
Philips Semiconductors
Product specication
TDA8356
VO(guard) 8 6 3
II(sb) signal bias Idrive(pos) RCON 3 k Idrive(neg) signal bias II(sb) Idiff 2 V 1
TDA8356
5 GND
MGC095
VP = 13.5 V; IO(p-p) = 1.87 A; II(sb) = 400 A; Idiff(p-p) = 500 A; VFB = 42 V; tFB = 0.6 ms.
1999 Sep 27
Philips Semiconductors
Product specication
TDA8356
SOT131-2
non-concave x Dh
D Eh
B seating plane j E
A1 b
c 1 Z e bp w M 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT131-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A1 max. 2.0 A2 4.6 4.2 b max. 1.1 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 Eh 6 j 3.4 3.1 L 17.2 16.5 Q 2.1 1.8 w 0.25 x 0.03 Z (1) 2.00 1.45 10 mm 9 Q
1999 Sep 27
10
Philips Semiconductors
Product specication
TDA8356
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications. suitable suitable(1) WAVE
1999 Sep 27
11
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
545004/03/pp12
Sep 27