GE Measurement & Control

NTC Type SMD

Thermometrics Surface Mount Devices

EIA Style 1206

0.020 in (0.51 mm) typical 0.050 in (1.27 mm) maximum

Nickel barrier solder coated 3 sided wrap around

0.063 in (1.6 mm) 0.006 in (0.15 mm)

0.126 in (3.2 mm) 0.006 in (0.15 mm)

Features
Tin plated terminations for soldering High sensitivity to changes in temperature Wide operating temperature range -58F to 257F (-50C to 125C) Rugged construction Available in other material systems Intended for temperature measurement, control and compensation Suitable for standard soldering techniques Excellent solderability without tombstoning Ceramic between electrodes glass coated for improved stability Supplied in tape-and-reel packaging

Type NHQ Specification

Surface mount chip 1206 size

0.0197 in (0.5 mm) 0.012 in (0.3 mm) 0.0630 in (1.6 mm) 0.008 in (0.2 mm)

Description
A range of 1206 size surface mount NTC chip thermistors.The terminations are nickel barrier with solder plating.

0.0472 in (1.2 mm) maximum 0.126 in (3.2 mm) 0.008 in (0.2 mm) NTC Type NHQ Outline Drawing Code NHQ101B280T5 NHQ501B325T5 NHQ801B325T5 NHQ102B325T5 NHQ152B345T5 NHQ202B410T5 NHQ222B410T5 NHQ252B410T5 NHQ272B410T5 NHQ302B410T5 NHQ472B355T5 NHQ502B355T5 NHQ103B375T5 NHQ153B400T5 NHQ203B400T5 NHQ223B400T5 NHQ303B400T5 NHQ333B400T5 NHQ473B400T5 NHQ503B400T5 NHQ104B425T5 NHQ154B425T5 NHQ304B435T5 NHQ474B435T5 NHQ504B435T5 R25 W 100 500 800 1000 1500 2000 2200 2500 2700 3000 4700 5000 10000 15000 20000 22000 30000 33000 47000 50000 100000 150000 300000 470000 500000 B (25/85) 2800 3250 3250 3250 3450 4100 4100 4100 4100 4100 3550 3550 3750 4000 4000 4000 4000 4000 4000 4000 4250 4250 4350 4350 4350

General
Soldering Recommendations
Maximum storage time in closed package: One year Maximum storage time exposed to ambient conditions of 59F to 86F (15C to 30C), 15% to 70% RH: 30 days Drying prior to soldering: Not to exceed 48h at 176F (80C) or 16h at 212F (100C) or 8h at 257F (125C) Flux type: R or RMA

Flow Soldering Conditions

Preheat temperature: 176F to 302F (80C to 150C) Maximum rate of temperature change: 4.5F/s or 2.5C/s Maximum solder temperature: 509F (265C) Maximum dwell time: 10 seconds Cooling in ambient or air flow of 5m/s

Reflow Soldering Conditions

Method infrared, hot gas, vapor Maximum rate of preheat temperature change: 4.5F/s or 2.5C/s Maximum temperature: 437F (225C) Maximum time above: 392F (200C) 30 seconds Maximum radiant flux: (0.1 to 100 W ) 5 W/ cm2 Maximum hot air temperature: 527F (275C) at 4 m/s Maximum vapor temperature: 419F (215C) Maximum rate of cooling: 4.5F/s or 2.5C/s

Data
Resistance tolerance at 77F (25C) 5%; for 10% replace T5 by T10 in code. Tolerance on B value 200 K Minimum temperature: -40F (-40C) Maximum temperature: 257F (125C) Dissipation factor: 3 mW/K Time constant: 8 seconds maximum

Cleaning

Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158F (70C) for 7 minutes (recommended).

Type NHQM Specification

Surface mount chip 0805 size

0.0157 in (0.4 mm) 0.008 in (0.2 mm) 0.0492 in (1.25 mm) 0.008 in (0.2 mm)

Description
A range of 0805 size surface mount NTC chip thermistors. The terminations are nickel barrier with solder plating.

0.0472 in (1.2 mm) maximum 0.0787 in (2.0 mm) 0.008 in (0.2 mm) NTC Type NHQM Outline Drawing Code NHQM400B280T5 NHQM800B280T5 NHQM101B280T5 NHQM221B310T5 NHQM471B325T5 NHQM501B325T5 NHQM801B325T5 NHQM102B325T5 NHQM152B345T5 NHQM202B410T5 NHQM252B410T5 NHQM272B410T5 NHQM302B410T5 R25 W 40 80 100 220 470 500 800 1000 1500 2000 2500 2700 3000 4700 5000 6800 10000 15000 20000 22000 27000 30000 33000 47000 50000 100000 150000 300000 470000 500000 B (25/85) 2800 2800 2800 3100 3250 3250 3250 3250 3450 4100 4100 4100 4100 3550 3550 3750 3750 4000 4000 4000 4000 4000 4000 4150 4150 4250 4250 4250 4350 4350

General
Soldering Recommendations
Maximum storage time in closed package: One year Maximum storage time exposed to ambient conditions of 59F to 86F (15C to 30C), 15% to 70% RH: 30 days Drying prior to soldering: Not to exceed 48h at 176F (80C) or 16h at 212F (100C) or 8h at 257F (125C) Flux type: R or RMA

Flow Soldering Conditions

Preheat temperature: 176F to 302F (80C to 150C) Maximum rate of temperature change: 4.5F/s or 2.5C/s Maximum solder temperature: 509F (265C) Maximum dwell time: 10 seconds Cooling in ambient or air flow of 5m/s

Reflow Soldering Conditions

NHQM472B355T5 NHQM502B355T5 NHQM682B375T5 NHQM103B375T5 NHQM153B400T5 NHQM203B400T5 NHQM223B400T5 NHQM273B400T5 NHQM303B400T5 NHQM333B400T5 NHQM473B415T5 NHQM503B415T5 NHQM104B425T5 NHQM154B425T5 NHQM304B425T5 NHQM474B435T5 NHQM504B435T5

Method infrared, hot gas, vapor Maximum rate of preheat temperature change: 4.5F/s or 2.5C/s Maximum temperature: 437F (225C) Maximum time above: 392F (200C) 30 seconds Maximum radiant flux: (0.1 to 100 W) 5 W /cm2 Maximum hot air temperature: 527F (275C) at 4 m/s Maximum vapor temperature: 419F (215C) Maximum rate of cooling: 4.5F/s or 2.5Cs

Cleaning

Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158F (70C) for 7 minutes (recommended).

Data
Resistance tolerance at 77F (25C) 5%; for 10% replace T5 by T10 in code. Tolerance on B value 200 K Minimum temperature: -40F (-40C) Maximum temperature: 257F (125C) Dissipation factor: 1.5 mW/K Time constant: 5 seconds maximum

Type NHQMM Specification

Surface mount chip 0603 size

0.0157 in (0.4 mm) 0.008 in (0.2 mm) 0.0492 in (1.25 mm) 0.008 in (0.2 mm)

Description
A range of 0603 size surface mount NTC chip thermistors.The terminations are nickel barrier with solder plating.

0.0472 in (1.2 mm) maximum 0.0787 in (2.0 mm) 0.008 in (0.2 mm) NTC Type NHQMM Outline Drawing Code NTC Type NHQMM Outline R25 W Drawing 30 40 68 80 100 470 500 1000 1500 2000 2200 2500 3000 3300 4700 5000 6800 10000 15000 20000 22000 30000 33000 47000 50000 68000 100000 150000 200000 B (25/85) 2750 2800 2800 2800 2800 3200 3200 3250 3450 4100 4100 4100 4100 4100 3550 3550 3550 3750 3800 3800 3800 4000 4000 4000 4000 4000 4150 4250 4250

General
Soldering Recommendations
Maximum storage time in closed package: One year Maximum storage time exposed to ambient conditions of 59F to 86F (15C to 30C), 15% to 70% RH: 30 days Drying prior to soldering: Not to exceed 48h at 176F (80C) or 16h at 212F (100C) or 8h at 257F (125C) Flux type: R or RMA

NHQMM300B275T5 NHQMM400B280T5 NHQMM680B280T5 NHQMM800B280T5 NHQMM101B280T5 NHQMM471B320T5 NHQMM501B320T5 NHQMM102B325T5 NHQMM152B345T5 NHQMM202B410T5

Flow Soldering Conditions

NHQMM222B410T5 NHQMM252B410T5 NHQMM302B410T5 NHQMM332B410T5 NHQMM472B355T5 NHQMM502B355T5 NHQMM682B355T5 NHQMM103B375T5 NHQMM153B380T5 NHQMM203B380T5 NHQMM223B380T5 NHQMM303B400T5 NHQMM333B400T5 NHQMM473B400T5 NHQMM503B400T5 NHQMM683B400T5 NHQMM104B415T5 NHQMM154B425T5 NHQMM204B425T5

Preheat temperature: 176F to 302F (80C to 150C) Maximum rate of temperature change: 4.5F/s or 2.5C/s Maximum solder temperature: 509F (265C) Maximum dwell time: 10 seconds Cooling in ambient or air flow of 5m/s

Reflow Soldering Conditions

Method infrared, hot gas, vapor Maximum rate of preheat temperature change: 4.5F/s or 2.5C/s Maximum temperature: 437F (225C) Maximum time above: 392F (200C) 30 seconds Maximum radiant flux: (0.1 to 100 W) 5 W/ cm2 Maximum hot air temperature: 527F (275C) at 4 m/s Maximum vapor temperature: 419F (215C) Maximum rate of cooling: 4.5F/s or 2.5C/s

Data
Resistance tolerance at 77F (25C) 5%; for 10% replace T5 by T10 in code. Tolerance on B value 200 K Minimum temperature: -40F (-40C) Maximum temperature: 257F (125C) Dissipation factor: 1.2 mW/K Time constant: 4 seconds maximum

Cleaning
Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158F (70C) for 7 minutes (recommended).

Type NHQT Specification

Surface mount chip 0402 size

0.0078 in (0.2 mm) 0.004 in (0.1 mm) 0.0196 in (0.5 mm) 0.006 in (0.15 mm)

Description
A range of 0402 size surface mount NTC chip thermistors.The terminations are nickel barrier with solder plating.

0.0177 in (0.45 mm) 0.006 in (0.15 mm)

General
Soldering Recommendations
Maximum storage time in closed package: One year Maximum storage time exposed to ambient conditions of 59F to 86F (15C to 30C), 15% to 70% RH: 30 days Drying prior to soldering: Not to exceed 48h at 176F (80C) or 16h at 212F (100C) or 8h at 257F (125C) Flux type: R or RMA

0.0394 in (1 mm) 0.006 in (0.15 mm) NTC Type NHQT Outline Drawing

Code NHQT400B285T5 NHQT500B285T5 NHQT600B285T5 NHQT101B285T5 NHQT151B285T5 NHQT102B330T5 NHQT202B410T5 NHQT252B410T5 NHQT302B410T5 NHQT332B410T5 NHQT352B410T5 NHQT402B410T5 NHQT652B410T5 NHQT153B380T5 NHQT203B380T5 NHQT223B380T5

R25 W 40 50 60 100 150 1000 2000 2500 3000 3300 3500 4000 6500 15000 20000 22000 30000 47000 68000 100000 150000 200000

B (25/85) 2850 2850 2850 2850 2850 3300 4100 4100 4100 4100 4100 4100 4100 3800 3800 3800 4000 4000 4000 4250 4250 4250

Flow Soldering Conditions

Preheat temperature: 176F to 302F (80C to 150C) Maximum rate of temperature change: 4.5F/s or 2.5C/s Maximum solder temperature: 509F (265C) Maximum dwell time: 10 seconds Cooling in ambient or air flow of 5m/s

Reflow Soldering Conditions

NHQT303B400T5 NHQT473B400T5 NHQT683B400T5 NHQT104B425T5 NHQT154B425T5 NHQT204B425T5

Method infrared, hot gas, vapor Maximum rate of preheat temperature change: 4.5F/s or 2.5C/s Maximum temperature: 437F (225C) Maximum time above: 392F (200C) 30 seconds Maximum radiant flux: (0.1 to 100 W) 5 W/cm2 Maximum hot air temperature: 527F (275C) at 4 m/s Maximum vapor temperature: 419F (215C) Maximum rate of cooling: 4.5F/s or 2.5C/s

Data
Resistance tolerance at 77F (25C) 5%; for 10% replace T5 by T10 in code. Tolerance on B value 200 K Minimum temperature: -40F (-40C) Maximum temperature: 257F (125C) Dissipation factor: 1.5 mW/K Time constant: 4 seconds maximum

Cleaning
Ultrasonic cleaning in methanol or isopropanol notexceeding 40 kHz for 5 minutes, or aqueous cleaning notexceeding 158F (70C) for 7 minutes (recommended).

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