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SEMICON Taiwan 2013 MEMS

Thursday, September 5th, 2013 2013 9 5 08:30 - 16:40 Room 401, 4F, TWTC Nangang Exhibition Hall, Taipei 4F 401

: MEMS
: Dr. Min-Shyong Lin, Chairman, SEMI Taiwan MEMS Committee / Honorary Chairman & Founder, Asia Pacific Microsystems, Inc. SEMI MEMS / & : Dr. Chih-Kung Lee, Chairman, SEMI Taiwan MEMS Committee / Distinguished Professor / National Taiwan University SEMI MEMS / : Dr. Chih-Kung Lee, Distinguished Professor, National Taiwan University : Dr.Weileun Fang, Distinguished Professor, National Tsing Hua University MEMS

MEMS MEMS Home gateways HA HMI MEMS IoT MEMS MEMS

MEMS
Time / Topic & Speaker

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08:3009:00 Registration 09:0009:10 Welcome Remarks Dr. Min-Shyong Lin, Chairman, SEMI Taiwan MEMS Committee / Honorary Chairman & Founder, Asia Pacific Microsystems, Inc. 09:1009:40 Smart Systems for Internet of Things Mr. Benedetto Vigna, Executive Vice President / General Manager, Analog, MEMS & Sensors Group, STMicroelectronics 09:4010:10 MEMS Market Outlook:Steady Growth for MEMS in 2013 and Beyond Mr. Pascal Viaud, Chief Strategy Officer, Yole Developpement Taiwan 10:1010:30 Break Time 10:3011:00 Application to RF MEMS / NEMS and 3D RFICs for Wireless Communication Dr. Wen Lai, Director of Sys BG-Mobile Communication Product BU. / BD5-Systems R&D Director, ASUSTek Computer Inc. 11:0011:30 MEMS Innovation in Automotive Mr. Marc OSAJDA, Director Pressure Sensor Business Unit, Freescale Semiconductor 11:3012:00 Path to MEMS Sensing System Integrations Dr. Yang Zhao, President & CEO, MEMSIC, Inc. 12:0013:20 Lunch Break 13:2013:30 Welcome Remarks 13:3014:00 BioMEMS:Enabling Technology for Killer Apps in Healthcare and Lifestyle Dr. Chris Van Hoof, Director Wearable Healthcare, IMEC 14:0014:30 Integrated Packaging Solution in MEMS Mr. Scott Chen, VP,Technical Support, ASE 14:3015:00 Minimizing Cost of Calibration and Test(COCT)to Drive Cost Reduction of MEMS Dr. Reinhart Richter, CEO, Multitest Electronic Systems 15:0015:10 Break Time This Presentation is not allowed to release

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15:1015:40 Trends in Wafer Bonding for High Volume Consumer MEMS Applications Mr. Markus Wimplinger, Corporate Technology Development & IP Director, EV Group *Lucky Draw for On-site Attendees 15:4016:10 MEMS Device Release With In-Situ Wafer Level Encapsulation SPTS Multi-Technology Approach Mr. Ian Wright, Regional Marketing Director for Asia, SPTS 16:1016:40 An Emerging Dimension of Internet - of - Things System - Chemical MEMS Sensors Dr. Chih Ting Lin , Assistant Professor, Intel-NTU Connected Context Computing Center Adjourment 16:40 Programs are subject to change without prior notice. All presentations will be conducted in English. No recording/ photography during seminar.

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