LG Kg270, Mg160 Service Manual

Service Manual
Service Manual KG270/MG160
Model : KG270/MG160
Date: April, 2007 / Issue 1.0
Table Of Contents
1. INTRODUCTION ...............................5
1.1 Purpose .................................................. 5 1.2 Regulatory Information............................ 5 4.13 Headphone Trouble .............................75 4.14 Charging Trouble .................................77 4.15 FM Radio Trouble ................................79
2. PERFORMANCE...............................7
2.1 H/W Features...........................................7 2.2 S/W Features ...........................................8
5. DOWNLOAD.......................................82
5.1 Download Setup.....................................82 5.2 Download Process .................................83
3. TECHNICAL BRIEF ........................14

3.1 Digital Main Processor(PMB7880).........14 3.2 Power Amplifier Module (SKY77318) ....22 3.3 26 MHz Clock (DCXO)...........................24 3.4 RTC(32.768KHz Crystal) .......................25 3.5 LCD Interface(3-wire SPI interface) .......26 3.6 SIM Card Interface.................................28 3.7 KEYPAD Interface .................................29 3.8 Battery Charging Block Interface ...........30 3.9 RF Interface ...........................................31 3.10 Audio Interface.....................................33 3.11 Key LED Interface................................37 3.12 Vibrator Interface .................................38 3.13 Memory Interface .................................39 3.14 Power Block Interface ..........................40 3.15 FM Radio Interface ..............................42
6. BLOCK DIAGRAM ..........................88 7. Circuit Diagram ..............................89 8. PCB LAYOUT ..................................93 9. ENGINEERING MODE ....................95
9.1 About Engineering Mode .......................95 9.2 Access Codes ........................................95 9.3 Key Operation ........................................95 9.4 Engineering Mode Menu Tree ...............95
10. CALIBRATION ..............................92

10.1 Test Equipment Setup .........................92 10.2 Calibration Steps..................................92
11. STAND ALONE TEST .................109

11.1 Test Program Setting .........................109 11.2 Tx Test ...............................................111 11.3 RX Test ..............................................112
4. TROUBLE SHOOTING ...................44

4.1 RF Trouble .............................................44 4.2 TX Trouble .............................................50 4.3 Power On Trouble..................................54 4.4 SIM Card Trouble...................................56 4.5 Vibrator Trouble .....................................58 4.6 Keypad Trouble......................................60 4.7 RTC Trouble ..........................................62 4.8. Key backlight Trouble ...........................64 4.9. LCD Trouble..........................................66 4.10. Microphone Trouble ............................69 4.11. Receiver Trouble.................................71 4.12 Speaker Trouble ..................................73 -3-
12. EXPLODED VIEW & REPLACEMENT PART LIST ..... 113

12.1 Exploded View .................................. 113 12.2 Replacement Parts ............................115 12.3 Accessory ......................................... 124
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, description and download the features of this model.
1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Item Band Type Dimension Weight Battery Talk Time Stand-by Time RTC Antenna LCD(Main) Back Light Back Light color Vibrator Speaker&Receiver C-MIC Earphone Jack SIM MIDI I/O Connect Specifications GSM DUAL Band(900/1800) Bar type 98 * 45 * 12.9mm 60g 750mAh Li-ion Over 2hours @EGSM,TX Level : 5 Over 200 hours @Paging period : 5 Under 4 hours when removed battery. Internal Type(Dual-band) 1.52"(128x128 pixels), 65K Color STN LCD Yes Blue Yes Yes(11x07 Receiver, 16 Speaker) Yes Mono or Stereo(Optional) Yes(Plug in Type) : 3.0V 16 poly 18 Pins (included Earphone Jack)
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2. PERFORMANCE
2.2 S/W Features

Function Operating System OS Data Circuit Packet Connectivity Infrared (IrDA) Bluetooth USB USB Mass storage RS232 Voice Function Voice Recording Voice Command Answering machine Memory User Memory Detail Item O O X X X X X O X X X O X X Moving Image) X X O O X Camera Audio Camera Module Voice Codec AMR FM Radio Integrated handsfree speaker X O O O O Speaker phone mode FR, HR, EFR, AMR-NB MP3 (Music Contents) Java Contents Wallpaper Ringtone external memory (microSD) 3 bitmap images 10 MIDI Ringtones TBD MMS Pictures (Still Image & Under 300KB OSE Specification Etc.
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2. PERFORMANCE
Function Display RSSI
Detail Item O O O O 6 level 5 level
Specification
Etc.
Battery Level RTC Multi?Language
Basic:English Max. 4 language of Latin 2 or 3 language of etc.
Quick Access Mode PLMN/Service Indicator Dimming Clock Dual Clock Normal Features Last Dialed Number Last Received Number Last Missed Number Scratch Pad Memory Call Manage-ment Call Waiting Call Swap Call Retrieve Auto Answer Automatic Redial Calling Line dentification Full Call divert Speed Dialing Last Number Redial Multi-party Call (Conference Call) Explicit Call Transfer
X O X X O O O X O O O X O O O O O O X Local Time / Selected Area Time 10 10 10
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2. PERFORMANCE
Function Network
Detail Item Automatic Network Selection Manual Network Selection Network Service Status O O O O O O O O O O O O O O
Specification
Etc.
DTMF
DTMF Signaling DTMF Enable & Disable
Audio
Key Tone Volume Ring Tone Volume Ring Tone Pattern Ring Type Silent Earpiece Volume Mute
6 Level (Include Mute) 6 Level (Include Mute) 10Type(fixed) Vibrator & Ring (Indicator) 6 Level (Include Mute)
Cell Broadcast
Read Cell Broadcast Cell Broadcast Categories Cell Broadcast Message Language
Phone Book
Entry Field Numeric Store and Recall Alphabetic Store Alphabetic Recall Scroll by alphabetic or numeric order Last Number Dialed Last Number Missed Last Number Received Copy & Move Fixed Dial Number Barred Dial Number Service Dial Number Email Entry Picture ID Video Caller ID My Name card
O O O O O O
300 Office,Mobile
O O O O O X O X X X X
10 10 10
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2. PERFORMANCE
Function Supp. Services
Detail Item Call Forwarding O O O O Call Barring O O O O Conference Call O O O O O X O O O O
Specification All Incoming Calls, No Reply On Busy, Not reachable All Outgoing Calls, International Calls, Calls except to Home Country incoming Calls, All incoming Calls when roaming up to 3 calls 3 V only Service Provider / Network Lock Class 1, 2, 3
Etc.
SIM
Plug?In Type SIM Lock SIM Toolkit Prepaid SIM Operation Mega SIM
Short Messaging Manage-ment
Read Message Write and Edit Message Send and Receive Message Reply to Message Forward Message Extract Number from Message Message Status Message Unread Indicator
Not Support EMS
O O O
Settable Message Center Number, O Reply Path and Validity Visible and Audible Message Receive Alerting Voice Mail Settable Voice Mail Center Number Message Protocol O O O O O X Normal, Fax, National Paging, Email, X400, ERMES, Voice Message Overflow Indicator Message Center Number Help Menu O O
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2. PERFORMANCE
Function Sound contents Ringtones Karaoke
Detail Item O X X X O X O O O O O O O X O X X O X X X O O Calculation Phone Book Sync Message Sync Multimedia Contents Sync Scheduler Sync O X X X X X X X Quick Access Mode (Profile) Development and Test Facility X O +-*/
Specification
Etc.
Stutter Sound Flip tone Button tone Others Miscellaneous Function Development & Test Facility Field Test Facility Display Software Version IMEI Text Input Scheduler Language Predictive word input Schedule To Do List Memo D-day counter Send via Bluetooth World Time Setting Local Time Display Two Number of Cities Time Daylight saving NITS Unit converter Stop watch Calculator PC Sync
Selectable Auto Language T9 20 input (20 character) 50 input 20 input (40 character) Schedule, Memo, To Do list, Messaging Dual clock Summer time calibration function Automatic setting as country code in SIM Currency, Surface, Length, Weight, Temperature, Volume, Velocity
E-MAIL, EMS, Schedule, Phonebook, Name card etc.
Sync ML Game Menu
DS DM
External Interface Electrical Man Machine Interface O
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2. PERFORMANCE
Function Handset
Detail Item Restore Factory Setting Read Software Version Battery Charging Mode Emergency Call Handset Lock Security Code SIM Lock Key guard 12/24 hour Calendar Time Zone Daylight saving Alarm Manager Dimming Clock Power-off Alarm On Alarm Event Hand strap Embedded microSD Card microSD Adapter Stereo earmic O O O O O O O O O O O X O X O O X X X O
Specification
Etc.
Security
Delete all
Real Time Clock
Automatic Leap Year Adjustment
Once, Daily, Mon~Fri, Mon~Sat
Display
Accessory
EarMic Type
Provides optionally only for supporting FM radio function.
earmic w/music remote controller Neck strap LCD Cleaner Holster Data cable CD Holster charger additional standard battery Extended Battery Desktop Charger Cigar Lighter Adapter Portable Handsfree Bluetooth headset Bluetooth stereo earset controller Car kit Leather Pouch Stylus Pen Compass
X X X X O X X X X X X X X X X X X X X
RS232 cable Standard battery Back-up and Holster function
Option
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Digital Main Processor(PMB7880)
Figure. 3-1 PMB7880 FUNCTIONAL BLOCK DIAGRAM
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3. TECHNICAL BRIEF
3.1.1 Overview of E-GOLDvoice

The E-GOLDvoice is a GSM baseband modem including RF transceiver covering the low bands GSM850 /GSM900 and high bands GSM1800 / GSM1900 bands. E-GOLDvoice is Dual Band, therefore, it supports by default a low / high pair of bands at the same time: 1. GSM850 / GSM1800 2. GSM850 / GSM1900 3. GSM900 / GSM1800 4. GSM900 / GSM1900 The E-GOLDvoice is optimized for voice-centric Mobile Phone applications. The E-GOLDvoice is designed as a single chip solution that integrates the digital, mixed-signal, RF functionality and a direct-to-battery Power Management Unit. The transceiver consists of: Constant gain direct conversion receiver with an analog I/Q baseband interface Fully integrated Sigma/Delta-synthesizer capability Fully integrated two-band RF oscillator Two-band digital GMSK modulator with digital TX interface Digitally controlled crystal oscillator generating system clocks. The E-GOLDvoice supports a direct battery connection, hence eliminating the need for an external Power Management Unit. The E-GOLDvoice has different power down modes and an integrated power up sequencer. The E-GOLDvoice is powered by the C166S MCU and TEAKLite DSP cores. The operating temperature range from -40C to 85C. It is manufactured using the 0.13 m CMOS process.
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3. TECHNICAL BRIEF
3.1.2 Features
] Baseband High performance fixed-point TEAKlite DSP C166S high performance microcontroller There are several Interfaces: - I2S interface for DAI connections (for Tape Approval) - High Speed SSC Interface for connection of external peripherals - SIM Interface - Keypad Interface (6x4 or 5x5 keys) - EBU for external RAM/FLASH connection - Asynchronous serial interface - JTAG Interface - Black & white and color displays are supported - PWM source to drive vibrator - Keypad and display backlight supported. ] Receiver Constant gain, direct conversion receiver with fully integrated blocking filter Two integrated LNAs No need of interstage and IF filter Highly linear RF quadrature demodulator Programmable DC output level Very low power budget. ] Transmitter Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz@20 MHz Single ended outputs to PA, Pout = +3.5 dBm Very low power budget. ] RF-Synthesizer Synthesizer for multi-slot operation Fast lock-in times (< 150 s) Integrated loop filter RF Oscillator Fully integrated RF VCO. ] Crystal Oscillator Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.
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3. TECHNICAL BRIEF
] Mixed Signal and Power Management Unit DC/DC boost for voltages up to 15V for driving White or Blue LEDs 8-Ohm loud speaker driver (250/350mW) 16-Ohm earpiece driver 32-Ohm headset driver 4 measurement interfaces (PA temperature, battery voltage, battery temperature,and ambient temperature) Differential microphone input System start up circuitry Charger circuitry for NiCd, NiMh and LiIon cells Integrated regulators for direct connection to battery.
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3. TECHNICAL BRIEF
3.1.3 GSM System Description

The E-GOLDvoice is suited for mobile stations operating in the GSM850/900/1800/1900 bands. In the receiver path the antenna input signal is converted to the baseband, filtered, and then amplified to target level by the RF transceiver chipset. Two A-to-D converters generate two 6.5 Mbit/s data streams. The decimation and narrowband channel filtering is done by a digital baseband filter in each path. The DSP performs: 1. The GMSK equalization of the received baseband signal (SAIC support available) 2. Viterbi channel decoding supported by an hardware accelerator. The recovered digital speech data is fed into the speech decoder. The E-GOLDvoice supports fullrate, halfrate, enhanced fullrate and adaptive multirate speech CODEC algorithms. The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data stream is D-to-A converted by a multi-bit-oversampling converter, postfiltered, and then amplified by a programmable gain stage. The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output driver for external loud speaker is implemented. In the transmit direction the differential microphone signal is fed into a programmable gain amplifier. The prefiltered and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled voice signal passes a digital decimation filter. The E-GOLDvoice performs speech and channel encoding (including voice activity detection (VAD) and discontinuous transmission (DTX)) and digital GMSK modulation. In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency in the 850 MHz, 900 MHz, 1.8 GHz, and 1.9 GHz bands using an I/Q modulator. The E-GOLDvoice supports dual band applications. Finally, an RF power module amplifies the RF transmit signal at the required power level. Using software, the E-GOLDvoice controls the gain of the power amplifier by predefined ramping curves (16 words, 11 bits). For baseband operation, the E-GOLDvoice supports: Making or receiving a voice call Sending or receiving an SMS.
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3. TECHNICAL BRIEF
3.1.4 PMU Details

The E-GOLDvoice includes battery charger support (various sensor connections for temperature, battery technology, voltage, etc.) and a ringer buffer. E-GOLDvoice avoids the need for an external power management component because its internal power management unit contains: Voltage regulators for the On-chip and Off-chip functional blocks Charger circuitry for NiCd, NiMh and LiIon cells.
3.1.5 Bus Concept

The E-GOLDvoice has two cores (a microcontroller and a DSP), each with its own bus. There is an interconnection between the TEAKlite bus and the C166S X-Bus.
3.1.6 C166S Buses

The C166S is connected to three buses: 1. Local Memory (LM) bus 2. X-Bus 3. PD-Bus.
3.1.7 TEAKLite Bus

The TEAKlite is connected to the TEAKlite bus.
3.1.8 Bus Interconnections

The interconnection between the X-Bus and the TEAKlite Bus uses: Multicore Synchronization Shared Memory.
3.1.9 Clock Concept

The E-GOLDvoice has a flexible clock control.
3.1.10 Interrupt Concept

The C166 MCU carries out the E-GOLDvoice interrupt system.
3.1.11 Debug Concept

The E-GOLDvoice includes a multi-core debug. The C166 and TEAKlite cores can be debugged in parallel with: A single JTAG port (that is, on a single host) Mutual breakpoint control.
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3. TECHNICAL BRIEF
3.1.12 C166 Debug Concept

The debugging of the C166 uses the OCDS and the Cerberus.
3.1.13 TEAKLite Debug Concept

TEAKlite debugging uses the OCEM and the SEIB.
3.1.14 Power Management

The E-GOLDvoice provides the power management unit (PMU) for the complete mobile phone application. The integrated PMU is directly connected to the battery and provides a set of linear voltage regulators (LDOs). These LDOs generate all required supply voltages and currents needed in a low feature mobile phone. A charger control circuit charges NiCd, NiMH and LiIon batteries. The charger control supports hardware controlled pre-charging and software controlled charging. It offers a wide charger voltage range, making halfwave/full-wave charging with cheap transformers possible. White/blue backlight generation is supported with a special driver for very a low external parts count. Power consumption during operation phases is minimized due to flexible clock switching In the Standby Mode most parts of the device are switched off, only a small part is running at 32kHz and the controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off during Standby via SW.
3.1.15 On-Chip Security Concept

Secure boot is based on a public/private key approach. Flash images that are not signed with the private key during phone manufacture cannot be loaded. Verification of the Flash code is done with the public key. The public key as well as hash and verify algorithms are stored in the ROM, which ensures a hardware secured boot procedure. The following security features are supported: Prevention of illegal Flash programming Flash programming makes use of the E-GOLDvoice ID for personalization checks with IMEI and SIM-lock protection
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3. TECHNICAL BRIEF
The security features use the following mechanism: Boot ROM flow: - Controls the boot transition to external flash - Controls the flash update Flash tied to the individual chip via an ID using e-fuses, that is, each E-GOLDvoice chip has its own fused ID. Further details on the E-GOLDvoice security concept are not publicly documented.
3.1.16 Asynchronous Operation Mode Concept

The E-GOLDvoice can operate in either: The traditional synchronous mode with the 26MHz system clock synchronized on the base station A special asynchronous mode (XO concept). In the asynchronous mode the 26MHz clock input is not synchronized with the base station; the residual frequency offset is compensated in the digital signal processing domain. This processing includes frequency and timing compensation of the baseband and voiceband signals.
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3. TECHNICAL BRIEF
3.2 Power Amplifier Module (SKY77318)
Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM
The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching circuitry for 50 input and output impedances and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.
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3. TECHNICAL BRIEF
RF input and output ports of the SKY77318 are internally matched to a 50 load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5 A, typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains bandselect switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In Figure 1 below, the BS pin selects the PA output (DCS/PCS_OUT orGSM_OUT) and the Analog Power Control (VAPC) controls the level of output power. The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC) function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.
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3. TECHNICAL BRIEF
3.3 26 MHz Clock (DCXO)
Figure. 3-3 E-GoldVoice DCXO Overview
DCXO (Digitally Controlled Crystal Oscillator) and VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator) are two different techniques used To maintain the mobiles reference oscillators accuracy over time. The reference oscillators accuracy over time will vary due to initial crystal frequency offset, temperature drift and aging. These static and dynamic frequency variations have to be compensated, otherwise the mobile would be in danger of losing connection to the network. The technique used to perform the frequency compensation is generally termed Automatic Frequency Control (AFC). To summarize the operation of DCXO, GSM Baseband processor will calculate the AFC compensation (which is continuously updated) required based on the measured frequency error. Then the required AFC compensation is sent to the LUXO (Lineari-Zation Unit of Crystal Oscillator), which in turns control the DCXO core and generates The 26MHz system clock.
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3. TECHNICAL BRIEF
3.4 RTC(32.768KHz Crystal)
32.768KHZ CRYSTAL
X100
32KIN 32KOUT 4 1 MC-146_12_5PF 3 2
32.768KHz
18p C104 C105 18p
Figure. 3-4 E-Gold Voice RTC Interface
The integrated Real Time Clock (RTC) is able to provide programmable alarm functions and external interrupts. Due to its extreme low power consumption the RTC can be supplied from a small backup battery. This allows the generation of external interrupts, even when the main PMB7880 supply voltage is switched off. For this purpose the RTC is powered by own voltage supply pins VDD_RTC and VSS_RTC. The RTC shall be driven by a 32.768 kHz (32k) clock which needs to be applied via the PMB7880 F32K and OSC32K pins. The clock can be fed from either an external clock source or use the on chip 32 KHz oscillator module. The low clock frequency and the optimized low power design give the possibility to run the chip with a minimum of power dissipation. For example, for this specific application the 26 MHz reference oscillator can be switched off during system standby and a lowpower time reference can be kept when the 32k clock is provided to the RTC. The RTC consists of an PMB7880 specific RTC shell, containing the RTC macro, as well as the 32 kHz oscillator, as described in the following sections. The module RTC Shell solely performs level translation of the 32KHz clock to the VDD_LD1 power supply domain, and is not functionally associated with the RTC.
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3. TECHNICAL BRIEF
3.5 LCD Interface(3-wire SPI interface)

2V8_VIO CN200 1 2
MTPG MTPD
3 4 5 6
LCD_RESET SSC0_CLK
R205 R207
47 47 MLED MLED2
R206 R208
47 CS3 47 SSC0_MTSR
7 8 9 10 11 13 R210 100K 12 14 15 MLED1 LCD_ID C221 1u C211 27p C212 27p C213 NA C214 NA
C208 NA
C209 27p
C210 27p
IMSA-9671S-13Y902 (ENQY0013801)
Figure 3-5-1. LCD Interface
VBAT
CHARGE PUMP
U200 5 IN AAT3157ITP-T1 10 C1+ 9 7 C201 1u C2EN_SET D1 D2 D3 NC 6 1 2 3 12 C203 27p C204 27p MLED1 MLED2 C200 1u
MLED
C1C2+ CP
W_LED_DRV
11
R202 100K
C202 27p
GND
Figure 3-5-2. Charge pump interface
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3. TECHNICAL BRIEF
Signals CS3 SSC0_MTSR SSC0_CLK LCD_RESET MLED MLED1/2 2V8_VIO
Description This signal enable to access to the driver IC of LCD. This signal transfer serial data to driver IC. This signal transfer serial clock to driver IC. This signal makes driver IC to HW default status. This signal provide power to white LEDs. This signal be feed back from white LEDs. This signal provides power to LCD modules.(2.8V)
The AAT3157 is a low noise, constant frequency charge pump DC/DC converter that uses a trimode load switch (1X), fractional (1.5X), and doubling (2X) conversion to maximize efficiency for white LED applications. The AAT3157 is capable of driving up to three channels of LEDs at 20mA per channel from a 2.7V to 5.5V input. The current sinks may be operated individually or in parallel for driving higher current LEDs. A low external parts count (two 1F flying capacitors and two small 1F capacitors at VIN and VOUT) make this part ideally suited for small, battery-powered applications. AnalogicTech's S2Cwire (Simple Serial Control) serial digital input is used to enable, disable, and set current for each LED with 16 settings down to 50A. The low-current mode supply current can be as low as 50A to save power.
Data 1 2 3 4 5 6 7 8
Output (mA/Ch) 20.0 17.0 14.0 12.0 10.0 8.6 7.0 6.0
Data 9 10 11 12 13 14 15 16
Output (mA/Ch) 5.0 4.2 3.4 2.8 1.0 0.5 0.1 0.05
Figure 3-5-3. Charge pump Output Current
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3. TECHNICAL BRIEF
3.6 SIM Card Interface

2V85_VSIM
2V85_VSIM 4.7K
2V85_VSIM R303 0
R302
SIM_DATA C310 22p
J300 4 GND VCC 5 VPP RST 6 CLK I_O 8 GND2 GND1
1 2 3 7 C311 0.1u C312 22p
SIM_RST SIM_CLK
Figure 3-6. SIM CARD Interface
The EGoldVoice provides SIM Interface Module. The AD6527 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.
Signals SIM_RST SIM_CLK SIM_DATA
Description This signal makes SIM card to HW default status. This signal is transferred to SIM card. This signal is interface datum.
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3. TECHNICAL BRIEF
3.7 KEYPAD Interface

2V0_VRTC
KEY MATRIX
END
SW200 END_KEY
SW201
SW202
SW203
SW204
LEFT
SW205
MENU
R201 KEY_OUT1 680 C205 NA SW206
SW207
SW208
SW209
UP
SW210
SEL
R203 KEY_OUT2 680 C206 NA SW211
SW212
SW213
SW214
RIGHT
SW215
SEND
R204 KEY_OUT3 680 C207 NA SW216
SW2170
SW218
SW219
DOWN
R209 KEY_OUT4 680 C215 NA R211 680 KEY_IN0 R212 680 KEY_IN1 R213 680 KEY_IN2 R214 680 KEY_IN3 R215 680 KEY_IN4 C216 NA C217 NA C218 NA C219 NA C220 NA
Figure 3-7 KEY MAXTRIX Interface
The keypad interface is connected to the X-Bus, together with the XBIU and the Shared Memory Register, using a single Bus Interface. The keypad supports two scan modes: By default, the keypad is a 4x6 scan matrix (4 input and 6 output pins). To set the keypad to a 5x5 scan matrix (5 input and 5 output pins) The scan mode should be determined at the very beginning of the system start because changes are not allowed later.
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3. TECHNICAL BRIEF
3.8 Battery Charging Block Interface

CHARGING IC
2V8_VIO
VCHARGE R118 NA R119 CHARGE_DETECT 1.8K 1 2 R121 CHG_STATUS NA C126 (10V,K,X5R) 1u C127 0.015u 3 4 VIN _FAULT _STATUS TIME
VBAT VCHARGE
U101 VBAT VSEN_TEMP IREF V2P8 EN 10 9 (10V,K,X5R) 8 R122 7 6 C128 ISL9201IRZ-T 1u 160K (1%) 100K R124 R123 R125 NA CHG_EN 0 CHG_EN_TEST C125 1u R120 NA
5 GND 11 PGND
Figure 3-8. Charging IC Interface
The AAT3681A is a high performance battery charger designed to charge single Cell lithiumion/polymer batteries with up to 500mA of current from an external power source. It is a stand-alone charging solution, with just one external component required For complete functionality. The AAT3681A precisely regulates battery charge voltage and current for 4.2V lithiumion/polymer battery cells. The adapter/USB charge input constant current level can be programmed up to 500mA for rapid charging applications. The AAT3681A has four basic modes for the battery charge cycle: pre-conditioning/trickle charge; constant current/fast charge; constant voltage; and end of charge.
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3. TECHNICAL BRIEF
3.9 RF Interface
FL400 9 IN LMSP2PAA-575TEMP 1 6
VC1 VC2
C417 27p C418 27p
3 7 5 8 10
GSM1800_1900TX GSM1800_1900RX VC_GSM850_900TX VC_GSM1800_1900TX GND1 GND2 GND3 GSM850_900TX GSM850_900RX
2 4
Figure 3-9-1. ASM interface

C419 3p GSM_RXN
2
G1
3
G2
5 10
G3 O2_2 G4
L403 18nH
6
4 I2
C420
O2_1 O1_2
3p 3p
7 8 9
GSM_RXP DCS_RXN
C421
1 I1
O1_1
FL401
B9308 L404 5.1nH
PART_NO SFSB0001401
IN CASE OF GSM850/PCS1900 CHANGE THIS DUAL SAW FILTER TO PART_NO SFSB0001301
C422
3p
DCS_RXP
Figure 3-9-2. SAW Filter interface
E-GOLDvoice features a fully integrated constant-gain direct conversion receiver, i.e. there is no interstage filter needed and the baseband level at the analogue IQinterface follows directly the RF input level. Depending on the baseband ADC dynamic range, single- or multiple-step gain switching schemes are possible. An integrated, selfaligning, low-pass filter ensures the receivers to function under blocking and reference interference conditions and avoids aliasing by baseband sampling. An automatic DC-offset compensation is implemented and can be switched depending on the gain setting.
- 31 -
3. TECHNICAL BRIEF
R402
1K
TX_RAMP
(16V,K,X7R)
VBAT (10V,Z,Y5V) (50V,J,NP0) (50V,J,NP0) VBAT R404 0 R405 DCS_PCS_OUT 0 L402 NA
(50V,J,NP0)
20
17
C403 12p
C404 0.01u
C402 10u (2012)
C401 39p
C405 33p
C406 18p
C407 27p 6 2 VCC1B VCC1A
C408 0.01u C409 NA
VBATT
VAPC
15 R406 0 C411 NA C412 NA 11 19 21
DCS_PCS_OUT EGSM_OUT RSVD_GND P_GND U400 SKY77318
DCS_PCS_IN EGSM_IN ENABLE BS
3 4 18 1
(50V,J,NP0) (16V,K,X7R) R407 GSM_OUT 0 TXON_PA BS C413 27p C414 27p R408 NA R409 NA
R410 0 C415 NA C416 NA
Figure 3-9-3. PAM(Power Amplifier Module) interface The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant envelope GMSK modulation. This configuration allows a very low power design with a reduced external component count. The modulation is transferred between baseband- and RF-part of the PMB7880 via a digital interface signal into the digital modulator. The following Gaussian filter shapes the digital data stream for the GMSK modulation. Additionally a pre-distortion filter compensates the attenuation of the PLL transfer function resulting in a very low distortion at the transmit output. The filtered digital data stream is scaled appropriately and added to the channel word. This sum is fed into the MASH modulator. The output of the MASH modulator is a sequence of integer divider values representing the high resolution fractional input signal. This sequence controls the MMD (multi modulus divider) at a sample rate of 26MHz. Thus a tightly controlled frequency modulation of the VCO is achieved.
16 14 13 12 10 9 8 7 5
GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1
- 32 -
3. TECHNICAL BRIEF
3.10 Audio Interface
K14 LOUD2 L15 LOUD1 VMIC MICP2 MICN2 MICP1 MICN1 EPPA1 EPP1 EPN1 P12 P11 R12 P15 R13 M14 M12 N15
SPK_N SPK_P
VMIC
AUXIP AUXIN VINNORP VINNORN EPPA1 REC_P REC_N
C124 1000p
Figure 3-10-1 Audio interface
The audio front-end of E-GOLDvoice offers the digital and analog circuit blocks for both receive and transmit audio operation and ringing. It features a high-quality, digital-to-analog path with amplifying stages for connecting acoustic transducers to the E-GOLDvoice. In the transmit direction the supply voltage generation for microphones, low-noise amplifier and analog to digital conversion are integrated on the E-GOLDvoice. For E-GOLDvoice the EPp1/EPn1 driver are used as differntial Earpiece-Driver, EPPa1 is used as single-ended Headset-Driver. The audio front-end itself can be considered to be organized in three sub-blocks: Interface to processor cores (TEAKlite and - indirectly - C166S) Digital filters Analog part.
- 33 -
3. TECHNICAL BRIEF
The interface to the processor cores consists of a direct physical connection to the TEAKlite DSP bus and a set of firmware commands to handle communication between the C166S and the audio frontend which serves as the interface peripheral for audio algorithms running on the DSP or the controller. The audio front-end Generates interrupts on certain occasions, for example, when exchange of data is requested. The core interface part of the audio front-end also contains the control and status registers which are used to set up certain operation modes of the peripheral. The section next to the core interface contains the digital filters for interpolation and decimation of the audio signals being received and transmitted. The data path for the receive direction can be set up to process sampling rates between 8kHz and 48kHz. The interpolation filters for the respective sampling rates are implemented in a dedi-cated hardware block and are automatically selected to suite the chosen sampling rate. Low-pass interpolation filtering, which produces an unsigned 16-bit data stream with a sampling rate of 4 MHz, is performed digitally. D-to-A conversion, postfiltering, and final amplification are performed on the analog part. The amplifier buffer for voiceband receive does also support ringer functionality. The ringer functionality is activated by Setting bits RINGSELPN or RINGSELPA in the voiceband part of the analog control register. In transmit direction, amplification, prefiltering and A-to-D conversion (analog modulation) are performed on the analog part. The resulting 2-Mbit/s data stream is filtered by a digital low-pass decimation filter for further processing by DSP firmware. Two sampling rates, 8kHz and 16kHz, are supported. The analog section contains all the necessary analog functional blocks including microphone supply generation, output and input amplifiers and analog filtering. Signals EPp1 EPn1 EPpa1 Loud1 Loud2 MICP1 MICN1 MICP2 MICN2 VMIC Description Main Receiver Positive signal(Differential signal) Main Receiver Negative signal(Differential signal) Headset signal(Single Ended signal) Speaker Output Positive signal(Differential signal) Speaker Output Negative signal(Differential signal) Main Microphone Positive signal(Differential signal) Main Microphone Negative signal(Differential signal) Headset Microphone Positive signal(Differential signal) Headset Microphone Negative signal(Differential signal) Main/Headset Microphone supply power
- 34 -
3. TECHNICAL BRIEF
RECEIVER
L100 REC_P L101 C100 39p REC_N C102 39p C103 39p 22nH 22nH CN100 1 2
11*07*3T receiver
(SURY0013001)
Figure 3-10-2 Main Receiver interface
SPEAKER AMPLIFIER
R102 C116 NA R103 NA SPK_N C117 0.1u R104 20K SPK_P C118 0.1u R105 20K 82K RADIO_SPK_L R108 C119 0.1u R106 20K LOUD_SPK_EN C3 C1 U100 A3 A1 INP INM _SD VM_P BYPASS NCP2890AFCT2G C2 OUTB OUTA VM VP A2 B2 B3 82K VBAT
SPEAKER
L103 L104 27nH CN101 1 27nH 2 16pi 3.4T speaker
(SUSY0025801)
diode diode
B1
0.22u
C120 1 uF (2012)
D100
C122 C123 0.1u 0.1u
D101
R110
100K
C121
(10V,K)
Gain : Rf/Rin
Figure 3-10-3 Main Speaker interface
- 35 -
3. TECHNICAL BRIEF
VMIC
MAIN_MIC
R300 1K
R301 2.2K
C303 39p
C304 10u
R304 VINNORP 100ohm C307 0.1u R307 VINNORN 100ohm
C306
0.1u OB4-15L42-C33L C308 39p 2 1 MIC300
C309
0.1u
R309
Figure 3-10-4 Main Microphone interface
VMIC
R316
C317 AUXIN 0.1u C318 NA
1.5K
R318 2.2K C319 10u
C313
EAR_MIC I/O CONNECTOR

39p 2V8_VIO FM_ANT VBAT L300 270nH 1608 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 22
AUXIP
C320
0.1u
C321
C314
CN301
VCHARGE
2.2K
39p
39p
2V8_VIO
2V8_VIO
C322 10p
R323 100K
NA
R321
100K
FOR RADIO FB300 1800 1800 1800
FOR RADIO
R322
2 : AUDIO 4 : EAR_L 5 : EAR_R 6 : TXD 7 : RXD 8 : JACK_D 9,10 : BATT 11 : R/ON 12,13 : CHG
AUXOP_FML AUXOP_FMR TXD RXD
C323 C324
10u 10u
FB301 FB302
HS_DET 39p 39p 2V8_VIO RPWRON C325 C326 R324 100K DSR C327 10u (2012) (10V,Z,Y5V) C328 56p (50V,J,NP0)
HSEJ-18S04-25R
VBAT
BATT_TEMP
R332
3 2 1 CN302
C336 3p
C337 18p (50V,J,NP0)
(50V,C,NP0) (TOL:0.25P)
Figure 3-10-5 Headset interface
- 36 -
3. TECHNICAL BRIEF
3.11 Key LED Interface
KEY BACKLIGHT
1u
VBAT
R220 100ohm
C222
R219 100ohm
R221 100ohm
R216 100ohm
R217 100ohm
R218 100ohm
LD200 LEBB-S14H
LD201 LEBB-S14H
LD202 LEBB-S14H
LD203 LEBB-S14H
LD204 LEBB-S14H
LD205 LEBB-S14H
C223
1u (10V,K,X5R)
(10V,K,X5R)
KEY_BACKLIGHT
R222
1K R223 10K
2SC5585 Q200
Figure 3-11 Key LED interface This handset has 6 LEDs that illuminates blue color. Control signal is controlled by EGold-voice with PWM and handset has 3 methods, ON, OFF and Dimming.
- 37 -
3. TECHNICAL BRIEF
3.12 Vibrator Interface
VIBRATOR
VBAT VBAT 1SS302-T5L_F_H
(50V,J,NP0)
CN300 1 2
C305 R305 27p 10
(1608)
R306 VIBRATOR 1K R308 100K
Q300 2SC5585
Figure 3-12 Vibrator interface This handset has vibrator operation. Control signal is controlled by EGold-voice with PWM.
- 38 -
D300
C302 27p
3. TECHNICAL BRIEF
3.13 Memory Interface

VBAT
(NOT MOUNTED)
U300 1 2 3
2V8_VMEM_S
BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT C301 NA U301 DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 G2 E3 H3 F4 F5 H6 E6 G7 H2 F3 G3 H4 G6 F6 H7 F7 G4
C300 NA
MEMORY
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 VCCF VCCS S71GL032A40BAW0F E1 A0 D1 A1 C1 A2 B1 A3 D2 A4 C2 A5 B2 A6 A2 A7 A6 A8 C6 A9 D6 A10 A7 A11 B7 A12 C7 A13 D7 A14 B8 A15 E8 A16 D3 A17 C3 A18 B6 A19 C5 A20 TP300 G8 VSS1 E2 VSS2 C8 D8 E7 F8 H5 RFU0 RFU1 RFU2 RFU3 RFU4 R312 100K R313 100K _OE _WE _LB _UB _CE1F _CE1S CE2S RY__BY WP_ACC _RSTF F2 A5 A3 B3 F1 G1 B5 C4 A4 B4 ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21 _OE _WR ADD00 BHE_N CS0n CS1n _RY_BY
2V8_VMEM
C315 0.1u 2V8_VMEM_S
2V8_VMEM 2V8_VMEM
R310
G5
R311 2V8_VIO R315
NA
NA
C316 0.1u
Figure 3-13 Memory interface
In E-GOLDvoice, the 16bits demultiplex X-bus interface is used for memory device support. NOR Flash memory is supported. (The NAND Flash memory is not supported). The page mode can be supported for flash memories. Up to 8MBytes of external RAM and/or ROM can be connected to the MCU via its external bus interface. Up to 3 external CS signals can be generated to save external glue logic. Access to very slow memories is supported via a special Ready function. The system MCU clock is set to run with 26Mhz.
- 39 -
R314
3. TECHNICAL BRIEF
3.14 Power Block Interface
2V85_VSIM
2V8_VMEM
3V2_VBUF VD1
2V8_VIO
1V5_VRF0 1u
VRF1
C101
(1608)
2.2u
2V5_VANA
VD1
2V0_VRTC 1u 1u 1u 1u C111 1u
C108
C107
C109
R100 6.8K BAT100 C112 C106
2V85_VSIM
2V0_VRTC 2V8_VIO 2V8_VMEM
L102 18nH
C113 1u 22K 220n
1u
VBAT
R101
M8 F10 K7 K8 J8 B9 B8 R7 R6 F6 L4 G10 J7 G9
J13 K15 F15 B11 K10 M11 J10 G12 K12
G13 G15 G14 J12 J14
C114
VBAT_4 H14 VBAT_3 H15 VBAT_2 F12 VBAT_1 H13
C110
VDD_LBUF VDD_LANA VDD_LRF2V5 VDD_LRF1V5 VDD_LMEM VDD_LSIM VDD_LIO VDD_LD1 VDD_LRTC
VSS9 VSS8 VSS6 VSS5 VSS4 VSS2 VSS1 VDD_SIM VDD_RTC VDDP_IO VDDP_MEM VDD_PLL VDD_MAIN2 VDD_MAIN1
IREF VREFP AGND W_LED_FBN W_LED_FBP
C115 (1608) 2.2u REXT D12 (16V,K,X5R)
A9 XOX A8 XO
Figure 3-14-1 Power Block interface
The E-GOLDvoice integrated power management unit (PMU) supports direct connection to battery (DCB). That means all supply voltages needed are generated on-chip with integrated linear voltage regulators. The input of these linear voltage regulators is the battery voltage. The external memory and SIM card supply is provided by the on-chip voltage regulators. Table 144 is an overview of the internal generated supply voltages. The integrated power management also provides the control state machine for system start up, including start up with discharged batteries, trickle charging and system reset control. After system start up several methods are implemented for active and idle power saving.
- 40 -
3. TECHNICAL BRIEF
Name LRTC LD1 LIO LRFXO LMEM
Output Voltage(V) Output Current (mA) 2.0 1.2/1.5 1.8/2.85 2.5 2.5 4 150 30 10 100
Comment Used for the real time and digital PMU supply Used for the core supplies (MCU and DSP via switch) Used for the I/O pad supply and, for example, the display Used for the crystal oscillator supply Used for the external memory supply, voltage can be configured during startup
LANA
2.5
100
Used for analog (audio and baseband processing) and headset driver
LSIM LBUF LRFRX LRFTRX
1.8/2.85 2.6/2.8/3.0/3.2 2.5 1.5
30 300 100 120
Used of the SIM card supply Used for the loudspeaker and earpiece driver Used for the RF RX part Used for the RF TX/TX part
Figure 3-14-2 EGold Voice PMU LDO output voltage selection LD1, LIO, LSIM, LBUF output voltage programmable by software. LMEM output voltage is selectable by pin configuration upon startup. Active and idle power saving options: The flexible clock switching options allow minimizing the power consumption during the operation phases of the E-GOLDvoice. Current consumption during the standby mode is minimized by reducing the clock to 32 kHz and switching it off for most of the device. In addition, the power supply for the TEAKLite ROM is switched off and the controller RAM is switched to a power saving mode. Start-up and Reset Control State Machine Features Power up upon battery insertion, push button, alarm, charger connection. Detection of battery exchange or re-insertion. Complete start-up sequence management. System turn-on, system turn-off operation management including emergency (under-voltage) and programmed shutdown functions. Internal reset of the baseband, including silent reset. Tri-state function of the baseband module. Standby mode controlled by VCXO_EN provided by SCCU module.
- 41 -
RADIO
FM_INT RADIO_AMP_SHDN
2V8_VIO
R325
TP301 FM_INT
NA 2V8_RADIO
RADIO_AMP_SHDN (FOR FM RADIO)
3. TECHNICAL BRIEF
2V8_RADIO
R326 21 20 19 18 17 16 C329 1u 2V8_RADIO U303 LM4809LD 7 VDD VIN1 VOUT2 VIN2 3 9 6 R331 0 RADIO_SPK_R VOUT1 C332 C333 R329 R330 1 5 2 BYPASS GND 4 _SHDN BGND 20K 20K 0.1u 0.1u 8 R327 0 RADIO_SPK_L C330 1u
39K
R328
3.15 FM Radio Interface
FM_ANT SI4702-B16
C331 100p
NA
FM_RST
FM_RST
1 2 3 4 5 NC1 FMIP RFGND GND1 _RST
PGND NC2 GPIO1 GPIO2 GPIO3 VA
U302
GND3 LOUT ROUT GND2 VD C335 22n RADIO_AMP_SHDN 2V8_RADIO R333 39K R335 100K
15 14 13 12 11
C334
4.7K
4.7K
0.1u
R336
R337
FM_SCL FM_SDA
R338 47 C340 0.1u
1
C339
- 42 2V8_RADIO R334 10K 2V8_VIO
6 7 8 9 10
_SEN SCLK SDIO RCLK VIO
C338 0.1u
FM_32K
U305 NLAS5223BMNR2G
10 VCC 2 NO1 3 COM1 4 IN1 5 NC1 GND NC2 6 IN2 7 COM2 8 NO2 9
RADIO_DETECT VBAT 2V8_RADIO RADIO_SPK_R U304 AUXOP_FMR FOR RADIO EPPA1 R342 NA 1 2 3
2V8_VIO RADIO_SPK_L AUXOP_FML R340 NA FOR RADIO R341 330K EPPA1 R344 240K
R339 27K
RADIO_EN
BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT
R343 100K C341 1u (10V,K,X5R) C342 1u
HEADSET_RADIO_SEL R345 100K
RADIO_DETECT
RADIO
27K
NO RADIO
2.7K
3. TECHNICAL BRIEF
3.15.1 FM Tunner
The Si4702 patented digital low-IF architecture reduces external components and eliminates the need for factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the worldwide FM broadcast band (76 to 108 MHz). An automatic gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of strong interferers. For two-wire operation, a transfer begins with the START condition. The control word is latched internally on rising SCLK edges and is eight bits in length, comprised of a seven bit device address equal to 0010000b and a read/write bit (write = 0 and read = 1). The device acknowledges the address by setting SDIO low on the next falling SCLK edge. For write operations, the device acknowledge Is followed by an eight bit data word latched internally on rising edges of SCLK. The device always acknowledges the data by setting SDIO low on the next falling SCLK edge. An internal address counter automatically increments to allow continuous data byte writes, starting with the upper byte of register 02h, followed by the lower byte of register 02h, and onward until the lower byte of the last register is reached. The internal address counter then automatically wraps around to the upper byte of register 00h and proceeds from there until continuous writes cease. Data transfer ceases with the STOP command. After every STOP Command, The internal address counter is reset. For read operations, the device acknowledge is followed by an eight bit data word shifted out on falling SCLK edges. An internal address counter automatically increments to allow continuous data byte reads, starting with the upper byte of register 0Ah, followed by the lower byte of register 0Ah, and onward until the lower byte of the last register is reached. The internal address counter then automatically wraps around to the upper byte of register 00h and proceeds from there until continuous reads cease. After each byte of data is read, the controller IC should return an acknowledge if an additional byte of data will be requested. Data transfer ceases with the STOP command. After every STOP command, the internal address counter is reset.
3.15.2 Headphone Amplifier

The MAX4411 fixed-gain, stereo headphone driver features Maxims patented DirectDrive architecture, eliminating the large output-coupling capacitors required By conventional single-supply headphone drivers. The device consists of two 80mW Class AB headphone drivers, internal feedback network (fixed -1.5V/V gain), undervoltage lockout (UVLO)/shutdown control, charge pump, and comprehensive click-and-pop suppression circuitry.
- 43 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Trouble
SW400
FL400
U400
FL401
U102 X101
REFERENCE U400 X101 FL400 SW400 FL401 PAM (Power Amp. Module) DCXO (26MHz)
PART Description
ASM (Antenna Switch Module) Mobile Switch RX SAW Filter
- 44 -
4. TROUBLE SHOOTING
RF Trouble
TEST POINT
Antenna Matching component
Antenna.Contact Point
SW400
TP400
TP401
TP402
TP403
TP404
TP405
CIRCUIT DIAGRAM
R400 NA R401 0
C400
1p
Antenna Matching component
2.2nH L401
L400
22nH
R403 SW400 RF500

G1
Coupling Capacitor
RF
Mobile SW
G2
ANT
- 45 -
0 C410 22p
4. TROUBLE SHOOTING
CHECKING FLOW
START
Check Antenna PAD& Intenna Contact
NG
Change Antenna
Check Matching component
NG
Resolder component
OK NG
Check Mobile SW Change SW400
OK
Download And Calibration
NG
Change PCB
- 46 -
4. TROUBLE SHOOTING
RX Trouble
TEST POINT CHECKING FLOW
START
SW400
Setup Test Equipment Cell Power :-74d Bm GSM850 CH190 PCS CH660
FL400
Check point. DCXO(X101)
U400
FL401
Check point mobile SW & ASM & SAW Filter(SW400,F L400,FL401)

U102 X101
Re-Download S/W & CAL
- 47 -
4. TROUBLE SHOOTING
RX Trouble
(1) Checking VCTCXO Circuit
Is the waveform of Pin3 similar to DCXO(X101) Waveform?

SW400
No
Replace X101
Yes
FL400
DCXO Circuit is OK. See next page to check PLL Circuit.
U400
FL401
U102 X101
CIRCUIT
Waveform
Waveform
HOT1 1 4 GND2
26MHz
Pin 2
2 GND1
X101 NX3225SA
3 HOT2
2V8_VIO
Pin 1
( NX3225SA(W-188-34-7)
R107 NA
- 48 -
4. TROUBLE SHOOTING
RX Trouble
TEST POINT
CHECKING FLOW
Check Pin 1, 2 of SW400 with RF Cable
SW400
Signal is OK ? Yes
N o
Replace Mobile SW (SW400)
FL400
Pin 4
U400
Pin 6
FL401
Check Pin 4,6 of FL400 ? Yes
N o
Replace ASM (FL400)
Check Pin 6,7 and 8,9 of FL401 ?

U102
N o
Replace SAW Filter (FL401)
Yes
Mobile SW & ASM is OK. See next page
* FL401 6,7 and 8,9 output are balanced
- 49 -
4. TROUBLE SHOOTING
4.2 TX Trouble
Setup Test Equipment Cell Power : - 74dBm GSM850 CH190 PCS CH661
SW400
Check point DCXO(X101)
FL400
Check point ULC2(U102)Outp ut Signal
U400
FL401
Check point PAM(U400) Control Signal
U102 X101
Check ASM & Mobile S/W & SAW (FL400,SW400 ,FL401)
Re-Download S/W & RF CAL
- 50 -
4. TROUBLE SHOOTING
TX Trouble
TEST POINT CIRCUIT
TX_RAMP R402 1K
(16V,K,X7R)
VBAT
(10V,Z,Y5V) (50V,J,NP0) (50V,J,NP0)
(50V,J,NP0)
C401 39p
VBAT R404 0 R405 DCS_PCS_OUT 0 L402 NA
U400
20
17
C403 12p
C404 0.01u
C402 10u (2012)
C405 33p
C406 18p
C407 27p
6 2 VCC1B VCC1A
C408 0.01u C409 NA
VAPC
LB RF Input
R406 0 C411 NA C412 NA
VBATT
15 11 19 21
3 4 18 1
R410 0
HB RF Input
U102
C415 NA
C416 NA
Waveform
CHECKING FLOW
Check Control Signals
16 14 13 12 10 9 8 7 5
Signals are Normal ?
N o
Check ULC2(U102)
Yes
Paon & BS
ASM
Vapc
PAM Control Signal is OK. See next page to check ASM & Mobile SW Circuit.
- 51 -
4. TROUBLE SHOOTING
TX Trouble
TEST POINT CIRCUIT
TP400 TP401 TP402 TP403 TP404 TP405
R400 NA R401 0
C400
1p
SW400
2.2nH L401 L400
22nH
R403 SW400 RF500

G1 RF ANT
FL400
U400
FL401
G2
U102 X101
FL400 9 IN LMSP2PAA-575TEMP
0 C410 22p
VC1 VC2
C417 27p C418 27p
3 7
1 GSM1800_1900TX 6 GSM1800_1900RX VC_GSM850_900TX VC_GSM1800_1900TX
5 2 GND1 GSM850_900TX 8 4 GND2 GSM850_900RX 10 GND3
Mode VC1 VC2
GSM900 TX H(2.7V) L
DCS1800 TX L H(2.7V)
GSM800 RX L L
DCS1800 RX L L
- 52 -
4. TROUBLE SHOOTING
RX Trouble
Check Pin 1, 2 of SW400 with RF Cable
SW400
Signal is OK ?
No
Replace Mobile SW (SW400)
Yes
FL400
Pin 1 Pin 2
U400
Pin 7
FL401
Check Pin 1,2
Yes
Pin 3
Control Signal is OK ? Yes
No
Check ULC2 (U102)
U102
Pin 3,7 Signal is normal ? Yes No Replace ASM (FL400)
Mobile SW & ASM is OK. Check Antenna.
- 53 -
4. TROUBLE SHOOTING
4.3 Power On Trouble

TEST POINT Check Points
-Battery Voltage( Need to over 3.35V) -Power-On Key detection (PWRON signal) -Outputs of LDOs from EGV
LDO V_BUF V_MEM V_IO V_SIM VRF0 V_ANA VOLTAGE 3.2V 2.8V 2.8V 2.85V 1.5V 2.5V PART C101 C109 C107 C108 C110 C113
C107 C111 C101
C109 C110
C106
EGV IC
26Mhz
CIRCUIT
2V85_VSIM 2V8_VMEM 1V5_VRF0 1u
3V2_VBUF VD1
2V8_VIO
VRF1
C101
(1608)
2.2u
2V5_VANA
VD1
2V0_VRTC 1u 1u 1u 1u C111 1u
C107
C108
C109
R100 6.8K BAT100 C112 C106
2V85_VSIM
L102 18nH
C113 1u 22K 220n
1u
VBAT
R101
B9 B8 R7 R6 F6 L4 G10 J7 G9
J13 K15 F15 B11 K10 M11 J10 G12 K12
G13 G15 G14 J12 J14
C114
C110
VSS2 VSS1 VDD_SIM VDD_RTC VDDP_IO VDDP_MEM VDD_PLL VDD_MAIN2 VDD_MAIN1
C115 (1608) 2.2u REXT D12 (16V,K,X5R)
A9 XOX A8 XO
- 54 -
4. TROUBLE SHOOTING
Power On Trouble
CHECKING FLOW
START
Check Battery Voltage > 3.35V YES
NO Charge or Change Battery
Push power-on key And check the level change of PWRKEY
NO
Check the contact of power key Or dome-switch
YES
Check the voltage of The LDO outputs at U102
NO Replace U102
YES
LDO
THE PHONE WILL POWER ON.
VOLTAGE 3.2V 2.8V 2.8V 2.85V 1.5V 2.5V
PART C101 C109 C107 C108 C110 C113
V_BUF V_MEM V_IO V_SIM VRF0 V_ANA
- 55 -
4. TROUBLE SHOOTING
4.4. SIM Card Trouble

TEST POINT
R302/C310
J300.PIN1 C331/C332
CIRCUIT DIAGRAM
2V85_VSIM
2V85_VSIM 4.7K
2V85_VSIM R303 0
R302
SIM_DATA C310 22p
J300 4 GND VCC 5 VPP RST 6 CLK I_O 8 GND2 GND1
1 2 3 7 C311 0.1u C312 22p
SIM_RST SIM_CLK
- 56 -
4. TROUBLE SHOOTING
Checking Flow
START
NO Does the SIM cards supports 3V ? Change the SIM Card. Our phone supports only 3V SIM card.
YES NG Resolder J300 or other component
R302/C310/ C311/C312
Check soldering status of J300 and Other component
OK
J300.PIN1 = 2.85V
NG Check J300.PIN1 Change board
OK
Re-download SW
Check Operation
OK
Change board
- 57 -
4. TROUBLE SHOOTING
4.5. Vibrator Trouble

TEST POINT
Q300.PIN3 R306
R308 R305
CIRCUIT DIAGRAM
VBAT VBAT
(50V,J,NP0)
CN300 1 2
C305 R305 27p 10
(1608)
R306 VIBRATOR 1K R308 100K
Q300 2SC5585
- 58 -
D300
C302 27p
1SS302-T5L_F_H
4. TROUBLE SHOOTING
Checking Flow
START
Enter the engineering mode, and set vibrator on.
R306=2.8V R308=0.7V
Check Voltage Level of R306/R308
NG Change PCB
OK
Q300.PIN3=0V R305=0V
Check Voltage Level of Q300.PIN3 and R305
NG Change Q300
OK
Replace Vibrator
- 59 -
4. TROUBLE SHOOTING
4.6. Keypad Trouble

TEST POINT
R215 R201 R211 R203
R214 R212
R209 R204
R213
CIRCUIT DIAGRAM
2V0_VRTC
KEY MATRIX
END
SW200 END_KEY
SW201
SW202
SW203
SW204
LEFT
SW205
MENU
R201 KEY_OUT1 680 C205 NA SW206
SW207
SW208
SW209
UP
SW210
SEL
R203 KEY_OUT2 680 C206 NA SW211
SW212
SW213
SW214
RIGHT
SW215
SEND
R204 KEY_OUT3 680 C207 NA SW216
SW2170
SW218
SW219
DOWN
- 60 -
4. TROUBLE SHOOTING
Checking Flow
START
NG Check Metal Doom Change Metal Doom
OK
R201/R203/R204 R209/R211/R212 R213/R214/R215
Check soldering status Of component
NG Resolder component
OK Change PCB
- 61 -
4. TROUBLE SHOOTING
4.7 RTC Trouble

CIRCUIT Check Points
- 32.768KHz is right clock - The power of RTC is right.
N7 SWITCH_ON P6 OSC32K R5 F32K B4 CLKOUT
PWRON 32KOUT 32KIN CHG_STATUS
X100
32KIN 32KOUT 4 1 MC-146_12_5PF
22K
R100
3 2
1u 6.8K BAT100 C112 R101 VDD_LD1 G12 VDD_LRTC K12 G13 G15 G14 J12 J14 IREF VREFP AGND W_LED_FBN W_LED_FBP C114 220n
32.768KHz
18p C104 C105 18p
- 62 -
4. TROUBLE SHOOTING
CHECKING FLOW
START
Is the frequency about 32Khz?
Replace X100 and try again.
YES
Is VRTC about 2.0V?
Replace BAT100
YES
RTC will work properly
- 63 -
4. TROUBLE SHOOTING
4.8. Key backlight Trouble

TEST POINT
D203 Q200.PIN3 R204 D20 4 R203
D200
D201
Q200.PIN2 D205 D202
CIRCUIT DIAGRAM
KEY BACKLIGHT
1u
VBAT
R220 100ohm
C222
R219 100ohm
R221 100ohm
R216 100ohm
R217 100ohm
R218 100ohm
LD200 LEBB-S14H
LD201 LEBB-S14H
LD202 LEBB-S14H
LD203 LEBB-S14H
LD204 LEBB-S14H
LD205 LEBB-S14H
C223
1u (10V,K,X5R)
(10V,K,X5R)
KEY_BACKLIGHT
R222
1K R223 10K
2SC5585 Q200
- 64 -
4. TROUBLE SHOOTING
Checking Flow
START
R222=2.8V
Check Voltage Level Of R222
NO
Change PCB
Replace component YES NG

Check Voltage Level Of R222 and Q200.PIN2
NO Check component R222 and Q200
R222=0.7V
YES NO
LD200~LD205 R216~R221
Check LED component
Replace component
YES
Change PCB
- 65 -
4. TROUBLE SHOOTING
4.9. LCD Trouble

TEST POINT
CN200
R207 R205
R206 R208
C221
CIRCUIT DIAGRAM
2V8_VIO CN200 1 2
MTPG MTPD
3 4 5 6
LCD_RESET SSC0_CLK
R205 R207
47 47 MLED MLED2
R206 R208
47 CS3 47 SSC0_MTSR
7 8 9 10 11 13 R210 100K 12 14 15 MLED1 LCD_ID C221 1u C211 27p C212 27p C213 NA C214 NA
C208 NA
C209 27p
C210 27p
IMSA-9671S-13Y902 (ENQY0013801)
- 66 -
4. TROUBLE SHOOTING
Checking Flow
START
NO Backlight is OK? YES OK
Change PCB
Check Operation After LCD changes
Change LCD
NG C221=2.8V Control Signal= Refer to next page

Check Control Signal and Power Including soldering status
NG
Replace component Or change PCB
OK NG
Check soldering status of CN200
Replace CN200
OK
Change PCB
- 67 -
4. TROUBLE SHOOTING
WAVEFORM
SS0_SCK
LCD_CS
]SS0_MTSR pattern is out randomly when clock is fluctiatied. , clock frequency is 13MHz and LCD_RESET is High(2.8V).
- 68 -
4. TROUBLE SHOOTING
4.10. Microphone Trouble

TEST POINT
Microphone component
R300
MIC.P
CIRCUIT DIAGRAM
VMIC
MAIN_MIC
R300 1K
R301 2.2K
C303 39p
C304 10u
R304 VINNORP 100ohm C307 0.1u R307 VINNORN 100ohm
C306
0.1u OB4-15L42-C33L C308 39p 2 1 MIC300
C309
0.1u
39p
R309
- 69 -
C313
C314
2.2K
39p
4. TROUBLE SHOOTING
Checking Flow
Make a call
R300.VMIC=2.5V
Check voltage level of R300 YES
NO
Replace PCB
Check component status around MIC
NG
Re-solder or replace the Component
OK
Check status of MIC
NG
Re-solder or replace Microphone
OK
Check the voltage Level of MIC_P MIC_P= about 1.2~1.5V DC with a few tens mV OK
NG Change Microphone
Replace PCB
- 70 -
4. TROUBLE SHOOTING
4.11. Receiver Trouble

TEST POINT
L101 C103
L100 C102
REC.N
REC.P
CIRCUIT DIAGRAM
RECEIVER
L100 REC_P L101 C100 39p REC_N C102 39p C103 39p 22nH 22nH CN100 1 2
11*07*3T receiver
(SURY0013001)
- 71 -
4. TROUBLE SHOOTING
Checking Flow
Press any Key
Check L100/L101 C102/103
Check component status YES
NG
L100&L101 bias will Fluctiate signal above 1.2V
Check L100 & L101
NG
OK
Check Receiver
NG
replace Receiver
OK
Replace PCB
- 72 -
4. TROUBLE SHOOTING
4.12 Speaker Trouble

TEST POINT Check Points - Speaker spring contact - Audio amp soldering
L104 L103
CN101S 1PIN
CN101S 2PIN
C120
CN200
AMP IC
C117 C118
R111
CIRCUIT
SPEAKER AMPLIFIER
R102 C116 NA R103 NA SPK_N C117 0.1u R104 20K SPK_P C118 0.1u R105 20K 82K RADIO_SPK_L R108 C119 0.1u R106 20K LOUD_SPK_EN C3 C1 U100 A3 A1 INP INM _SD VM_P BYPASS NCP2890AFCT2G C2 OUTB OUTA VM VP A2 B2 B3 82K VBAT
SPEAKER
L103 L104 27nH CN101 1 27nH 2 16pi 3.4T speaker
(SUSY0025801)
diode diode
B1
0.22u
C120 1 uF (2012)
D100
C122 C123 0.1u 0.1u
D101
R110
100K
C121
(10V,K)
Gain : Rf/Rin
- 73 -
4. TROUBLE SHOOTING
Checking Flow
Start
Check the voltage level of U100 = Vbat?
No
Check The battery
Yes
Check the Signal, C117,C118
No
Check U102
Yes
Check the Level of U100.C3 = Low ?
No
Check U102
Yes
Check the Signal, L102,L103
No
Re-solder L102,L103
Yes Re-Assemble or Re-place Speaker
Check the Contact Of CN101
No
Yes Try again or Change the Board
- 74 -
4. TROUBLE SHOOTING
4.13 Headphone Trouble

TEST POINT Check Points -18pin IO connector -Passive Parts slodering Status
FB300 FB302 FB301 C321 C322
CN301
CIRCUIT DIAGRAM
VMIC
R316 C317 AUXIN 0.1u C318 NA
1.5K R318 2.2K C319 10u

39p 2V8_VIO FM_ANT VBAT L300 270nH 1608 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 22
AUXIP
C320
0.1u
C321
2V8_VIO
2V8_VIO
CN301
VCHARGE 100K R321
C322 10p
R323 100K
NA
FOR RADIO FB300 1800 1800 1800
FOR RADIO
R322
C323 C324
10u 10u
FB301 FB302
HS_DET 39p 39p 2V8_VIO RPWRON C325 C326 R324 100K DSR C327 10u (2012) (10V,Z,Y5V) C328 56p (50V,J,NP0)
HSEJ-18S04-25R
VBAT
BATT_TEMP
R332
3 2 1 CN302
C336 3p
C337 18p (50V,J,NP0)
(50V,C,NP0) (TOL:0.25P)
- 75 -
4. TROUBLE SHOOTING
CHECKING FLOW
START
Does the audio profile of the phone change to the earphone mode?
No Check the voltage Level CN301.8 = Low?
No Re-solder CN301 or Change another Ear- Mic set and Try again
Yes Yes
Replace U100 or Change Board
Mic
Earphone
Go to MIC Trouble section Acoustic
Check the signal Level at AUX_MIC. Is it about 1.2~1.5V DC with a few tens mV AC?
No
Re-solder causal component (CN301)
Yes
Does waveform at U102.EPPA1 fluctuate? Yes
No
Replace U100 or Change the board
Change another Ear-Mic set and Try again
Does waveform at CN301.4 and CN301.5 fluctuate?
No
Re-solder causal component (CN302,C322 etc.)
Change another Ear-Mic set and Try again
- 76 -
4. TROUBLE SHOOTING
4.14 Charging Trouble

TEST POINT Check Points -Connection of TA (check TA voltage 5.2V) -Charging Current Path component voltage drop -Battery voltage -Charging IC
R124
Charger IC U101
VBAT C125
VCHARGE =5.2V
C126
CN301
CIRCUIT
CHARGING IC
2V8_VIO
VCHARGE R118 NA R119 CHARGE_DETECT 1.8K 1 2 R121 CHG_STATUS NA C126 (10V,K,X5R) 1u C127 0.015u 3 4 VIN _FAULT _STATUS TIME
VBAT VCHARGE
5 GND 11 PGND
- 77 -
4. TROUBLE SHOOTING
Checking Flow
START
I/O Connector(CN301) Is well-soldered ? YES
NO
Resolder the CN300 Pin 12,13 : VCHARGE
Is The Voltage of C126 5.2V ? YES
NO
The TA is out of order Change the TA
LOW
The Voltage of C128 Is 2.8V

YES NO
Replace the U101
Check the voltage of R124 High or Low?

YES
Check the U102
Battery is charged?
NO
The battery may have problems. Change the battery.
YES
Charging is properly operating
- 78 -
4. TROUBLE SHOOTING
4.15. FM Radio Trouble

TEST POINT
R332 R338/R337/R336 U304.P 1 U304.P4 R327 R331
U302 U303 R329/R330 C332/C333
- 79 -
RADIO
CIRCUIT DIAGRAM
2V8_VIO
R325
TP301 FM_INT
NA 2V8_RADIO
2V8_RADIO
R326 21 20 19 18 17 16 C329 1u 2V8_RADIO U303 LM4809LD 7 VDD VIN1 VOUT2 VIN2 3 9 6 R331 0 RADIO_SPK_R VOUT1 C332 C333 R329 R330 1 5 2 BYPASS GND 4 _SHDN BGND 20K 20K 0.1u 0.1u 8 R327 0 RADIO_SPK_L C330 1u
4. TROUBLE SHOOTING
39K
R328 C331 100p
FM_ANT SI4702-B16
NA
FM_RST
FM_RST
1 2 3 4 5 NC1 FMIP RFGND GND1 _RST
U302
GND3 LOUT ROUT GND2 VD C335 22n RADIO_AMP_SHDN 2V8_RADIO R333 39K R335 100K
15 14 13 12 11
C334
4.7K
4.7K
0.1u
R336
R337
FM_SCL FM_SDA
R338 47 C340 0.1u
1
C339
- 80 2V8_RADIO R334 10K C338 0.1u 2V8_VIO
6 7 8 9 10
FM_32K
U305 NLAS5223BMNR2G
10 VCC 2 NO1 3 COM1 4 IN1 5 NC1 GND NC2 6 IN2 7 COM2 8 NO2 9
RADIO_DETECT VBAT 2V8_RADIO RADIO_SPK_R U304 AUXOP_FMR FOR RADIO EPPA1 R342 NA 1 2 3
R339 27K
RADIO_EN
R343 100K C341 1u (10V,K,X5R) C342 1u
HEADSET_RADIO_SEL R345 100K
RADIO_DETECT
RADIO
27K
NO RADIO
2.7K
4. TROUBLE SHOOTING
Checking Flow
Connector Headset and Turn on Radio and tuned channel
U304.PIN1 = High U304.PIN4=2.8V
Check LDO Power
NO Change U304
YES
R336/R337/338 Check I2C signal and 32K clock
Check Control Signal
NG Change PCB
OK
R329/R330 C332/C333
Check Audio Output Of Transceiver
NG
Change U302
OK
R327/R331
Check Audio Output Of Amplifier
NG Change U303
OK
Change PCB
- 81 -
5. DOWNLOAD
5. DOWNLOAD
5.1 Download Setup
Configure system like figure 5-1.
Figure 9-1. Download Setup
- 82 -
5. DOWNLOAD
5.2 Download Process

5.2.1. Download step[1]
: Start or Stop download : Selected configuration DLL file : File name donwloading File(F) Exit(X) : End program Setting(S) Configuration : configuration download condition DLL, SW files and etc. About(H) MultiGSM : Provide version information First, select Setting Menu.
- 83 -
5. DOWNLOAD
: Select a appropriated DLL file - You must select KG270_xxxxxx.DLL file. : Select configuration file You must select cmd.m0 file : Select download speed You must 460800. System supports maximum 460800bps. : Select port select start and end port be operated
- 84 -
5. DOWNLOAD
: Select files downloaded KG270 have 4 files, *.eep, *.fls, *.dffs and *.cust. But You must not select *.eep file.
- 85 -
5. DOWNLOAD
: Start download and stop download next step. If configuration is finished, then push start button and then button is changed to STOP. Turn on power of multi download and connector phones. If download is started, then push start button else program will download repeatedly.
- 86 -
5. DOWNLOAD
: This region appears donwload status. If download is finished, PASS or FAIL.message is showed.
- 87 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
- 88 -
7. CIRCUIT DIAGRAM
10
11
12
13
14
15
16
3
2V85_VSIM 2V8_VMEM 1V5_VRF0 2V8_VIO 3V2_VBUF VD1 REC_P
RECEIVER
L100 L101 VRF1 C100 39p REC_N 2.2u C102 39p 2V5_VANA C103 39p 22nH 22nH CN100 1 2
32.768KHZ CRYSTAL
B
4 1 MC-146_12_5PF
X100
3 2 32KIN 32KOUT
MODEL R196 R197 KG278, MG160b, KG275 KG270 MG160a

(1608)
B
11*07*3T receiver
(SURY0013001)
32.768KHz
18p 18p VD1
R198 R199
C101
2V0_VRTC 1u 1u 1u 1u 1u C111 1u
C104
C105
C107
C108
C109
R100 6.8K BAT100 C112 C106
2V85_VSIM
R196 0
R197 NA
R198 NA
R199 NA
L102 18nH
C113 1u 22K 220n
1u
C110
C
VBAT
R101 M8 F10 K7 K8 J8 B9 B8 R7 R6 F6 L4 G10 J7 G9 J13 K15 F15 B11 K10 M11 J10 G12 K12
G13 G15 G14 J12 J14
C114
VSS9 VSS8 VSS6 VSS5 VSS4 VSS2 VSS1 VDD_SIM VDD_RTC VDDP_IO VDDP_MEM VDD_PLL VDD_MAIN2 VDD_MAIN1
C115 (1608) 2.2u REXT D12 (16V,K,X5R)
SPEAKER AMPLIFIER
R102
HOT1 1
SPEAKER
VBAT L103 L104 27nH CN101 1 27nH 2 16pi 3.4T speaker
diode
DSR
DEFAULT_BANDSEL
68K BATT_TEMP R110 100K
0.22u
LCD_ID
LOUD_SPK_EN
C120 1 uF (2012)
D100
diode
B1
ON BOARD ARM9 JTAG & ETM INTERFACE

2V8_VMEM 2V8_VIO
RXD TXD HS_DET DSR SSC0_CLK CHG_EN_TEST SSC0_MTSR LCD_RESET (FOR FM RADIO) (FOR FM RADIO) FM_SCL FM_SDA
RXD TXD
G7 RXD H7 TXD H8 RTS_N G8 CTS_N J6 SSC0_CLK K6 SSC0_MRST G6 SSC0_MTSR (FOR LCD SPI INTERFACE) H6 DISP_REST H9 SCL H10 SDA R8 CCIO M9 CCVZ_N P7 CCLK R10 CCRST N8 CCIN P8 M10 P9 R9 K9 B5 C5 F7 N6 N9 R4 P1 P2 N2 L1 M2 K1 J2 P3 R2 M1 N1 L2 K2 J1 M4 C2 D5 F4 E4 D4 G4 D2 H4 C1 F1 F2 TDO TDI TMS TCK TRST_N TRIG_OUT TRIG_IN NMI_N (FOR CHARGING IC) MON1 MON2 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10
M7,9 : ~0.96V (30uA) (VOLTAGE SENSING) (30uA) (90uA)
N10 M9 R14 M0 R11 M7 P10 M2 P13
20K
RADIO_DETECT
(FOR FM RADIO)
R109
82K
M0,2 : ~1.92V
( NX3225SA(W-188-34-7)
R107 NA
RADIO_SPK_L
BYPASS
VM_P
R108
KEY_OUT1 KEY_OUT2 KEY_OUT3 KEY_OUT4 KEY_IN0 KEY_IN1 KEY_IN2 KEY_IN3 KEY_IN4
C8 D6 D7 C7 D9 C6 C9 D8 F9 F8
KP0 KP1 KP2 KP3 KP4 KP5 KP6 KP7 KP8 KP9
26MHz
A9 XOX A8 XO A13 TX2 A14 TX1 E15 RX34 D15 RX34X C15 RX12 B15 RX12X DCS_PCS_OUT GSM_OUT DCS_RXP DCS_RXN GSM_RXP GSM_RXN
GND2
C116 X101 NX3225SA
NA
R103 NA
82K U100 A3 A1 C3 C1 INP INM _SD NCP2890AFCT2G C2 OUTB OUTA VM VP A2 B2 B3
2 GND1
3 HOT2
SPK_N
C117
0.1u
R104 20K
2V8_VIO SPK_P C118 0.1u
R105 20K
C119
0.1u
R106
(SUSY0025801)
C122 C123 0.1u 0.1u
D101
PAOUT1
TX_RAMP SPK_N SPK_P VMIC
R111 100K
R112 47K
C121
(NOT MOUNTED)
(FOR SW DEBUGGING / NOT MOUNTED) CN102 G1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 G3 G2 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 G4
K14 LOUD2 L15 LOUD1 VMIC MICP2 MICN2 MICP1 MICN1 EPPA1 EPP1 EPN1 T2IN VIB_CONTROL BACK_LIGHT W_LED_DRV CC00IO RSTOUT_N RESET_N SAFE_RES SWITCH_ON OSC32K F32K CLKOUT T_OUT8 T_OUT4 T_OUT3 T_OUT2 T_OUT0 OE_N ADV_N BHE_N WR_N RD_N CS3_N CS1_N CS0_N A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 P12 P11 R12 P15 R13 M14 M12 N15 B2 B1 B3 A2 A4 A3 P5 M7 N7 P6 R5 B4 B7 A5 A6 B6 A7 N5 M6 E3 E2 R3 M5 K3 P4 G1 E1 H1 D1 F3 L3 K4 J4 H3 J3 H2 G2
(10V,K)
Gain : Rf/Rin
R113 NA (R110 will be changed to NA for mass production)
R114 NA
(FOR FM RADIO)
TRSTn TDI TMS TCK TDO

EXTRSTn
SIM_DATA FM_INT SIM_CLK SIM_RST LOUD_SPK_EN TDO TDI TMS TCK TRSTn TRIG_OUT TRIG_IN CHG_EN MON100
AUXIP AUXIN VINNORP VINNORN EPPA1 REC_P REC_N
C124 1000p
2V0_VRTC
TRIG_IN TRIG_OUT
R115 100K
PMB7880 U102
HEADSET_RADIO_SEL (FOR FM RADIO) VIBRATOR KEY_BACKLIGHT W_LED_DRV RADIO_EN (FOR FM RADIO) FM_RST (FOR FM RADIO)
_RESET
CHARGING IC
2V8_VIO
R116
0 VCHARGE R118 NA R119 CHARGE_DETECT 1.8K 1 2 R121 CHG_STATUS NA C126 (10V,K,X5R) 1u C127 0.015u 3 4 VIN _FAULT _STATUS TIME VBAT VCHARGE
R117 NA
(FOR 2.8V VMEM SELECTION) DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 ADD00 ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10
PWRON 32KOUT 32KIN CHG_STATUS BS FM_32K (FOR FM RADIO) VC2 VC1 TXON_PA _OE BHE_N _WR BHE_N _WR CS3 CS1n CS0n ADD21 ADD20 ADD19 ADD18 ADD17 ADD16 ADD15 ADD14 ADD13 ADD12 ADD11
5 GND 11 PGND
CS100
VBAT UA100 3G 2.5G GND RX TX UFLS

GND RX TX NC1
UART PORT
1 2 3 4 5 6 7 8 9 10 11 12 RXD TXD RPWRON
ON_SW ON_SW
(FOR CHARGING IC)
DSR RTS CTS
H12 CDT J9 CS
L12 K13 M15 L13 L14 N14 P14 N11
VSS_EPLS VSS_MS1 VSS_MS2 VSS_MS3 VSS_MS4 VSS_MS5 VSS_MS6 VSS_MS7
VDD_TRX VDD_LO VDD_DIG VDD_RX VDD_VCO VDD_LRF_XO VSS_RF1 VSS_RF2 VSS_RF3 VSS_RF4 VSS_RF5 VSS_RF6 VSS_RF7 VSS_RF8 VSS_RF9 VSS_RF10 VSS_RF11 VSS_RF12 VSS_RF13 E_FUSE NC1 NC2 NC3 NC4
VBAT VBAT NC2 PWR URXD NC3 NC4 UTXD
1V5_VRF0 CHARGE_DETECT
0.1u
47n
SC100
4700p
35 34 33 32 31 30 29 28
1u
C11 A11 D10 F13 F14 A10 A15 A12 B14 B13 B12 B10 C14 C10 D11 D14 E12 E13 E14 G3 R15 J15 A1 R1 VD1 VRF2 E_FUSE VRF1
C129
C130
E
1 2 3 4 5 6 7 8 9 27 26 25 24 23 22 21 20 19
4700p
C131
C132
Section
C133 VBAT VBAT
Date 11/16
Sign & Name
Sheet/ MODEL
Designer
VBAT1 VBAT2 GND1 GND2
2006
SANG-YOEN.LEE
GB3_RADIO SPFY0144601
Sheets
1/4
Checked
10 11 12 13 14 15 16 17 18
DRAWING
F
Approved
NAME
BB
Iss.
1 2 3 4 5 6 7 8 9
Notice No.
Date
Name
LG Electronics Inc.
DRAWING NO.
VER-1.1
LG Electronics Inc.
LG(42)-A-5505-10:01
- 89 -
7. CIRCUIT DIAGRAM
10
A A
2V0_VRTC
KEY MATRIX
END
SW200 END_KEY
VBAT
CHARGE PUMP
U200 5 IN AAT3157ITP-T1 10 C1+ 9 7 C201 1u C2EN_SET D1 D2 D3 NC 6 1 2 3 12 C203 27p C204 27p MLED1 MLED2 C200 1u
MAKER SII SHARP GP
ID HIGH LOW 150Kohm pull up
Voltage 1.9V 0V 0.9V
MLED
C1C2+ CP
SW201
SW202
SW203
SW204
LEFT
W_LED_DRV SW205
11
MENU
R202 100K C202 27p 4 GND
R201 KEY_OUT1 680 C205 NA SW206
SW207
SW208
SW209
UP
SW210
SEL
2V8_VIO CN200
R203 KEY_OUT2 680 C206 NA SW211 1
SW212
SW213
SW214
RIGHT
SW215
SEND
MTPG
2 3 4 5 6 R207 47 MLED 7 8 9 10 11 13 R210 100K 12 14 15
MTPD
R204 KEY_OUT3 680 C207 NA SSC0_CLK SW216 LCD_RESET
R205
47
R206 R208
47 CS3 47 SSC0_MTSR
SW2170
SW218
SW219
DOWN
MLED2 C208 NA C209 27p C210 27p
MLED1 LCD_ID C221 1u C211 27p C212 27p C213 NA C214 NA
IMSA-9671S-13Y902 (ENQY0013801)
KEY BACKLIGHT
D
1u
VBAT
R219 100ohm
R220 100ohm
C222
R217 100ohm
R221 100ohm
R216 100ohm
R218 100ohm
LD200 LEBB-S14H
LD201 LEBB-S14H
LD204 LEBB-S14H
LD202 LEBB-S14H
LD203 LEBB-S14H
LD205 LEBB-S14H
C223
1u (10V,K,X5R)
(10V,K,X5R)
KEY_BACKLIGHT
R222
1K R223 10K
2SC5585 Q200
Section Designer
Date 11/16 2006
Sign & Name MODEL
GB3_RADIO
Sheet/ Sheets
HYUN-OK.LEE
DRAWING NAME
2/4
Checked
AUDIO,LCD,KEY
Approved
Iss.
1 2 3 4 5
Notice No.
Date
Name
DRAWING
LG Electronics Inc.
NO.
REV-1.1
LG Electronics Inc.
LGIC(42)-A-5505-10:01
- 90 -
7. CIRCUIT DIAGRAM
10
11
12
13
14
15
16
VBAT
(NOT MOUNTED)
U300 1 2 3
2V8_VMEM_S
VIBRATOR SIM_CONNECTOR
VBAT VBAT
VMIC
BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT C301 NA U301
MAIN_MIC
R300 1K D300
C300 NA
2V85_VSIM (50V,J,NP0)
C302 27p CN300 1 2
2V8_VMEM
DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15
G2 E3 H3 F4 F5 H6 E6 G7 H2 F3 G3 H4 G6 F6 H7 F7 G4
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 VCCF VCCS
C315 0.1u 2V8_VMEM_S
2V8_VMEM 2V8_VMEM
R310
G5
TP300 G8 VSS1 E2 VSS2 C8 D8 E7 F8 H5 RFU0 RFU1 RFU2 RFU3 RFU4 R312 100K R313 100K R311 NA _OE _WE _LB _UB _CE1F _CE1S CE2S RY__BY WP_ACC _RSTF F2 A5 A3 B3 F1 G1 B5 C4 A4 B4 _OE _WR ADD00 BHE_N CS0n CS1n _RY_BY VMIC
R315
NA
C316 0.1u
R314
2V8_VIO
REMOTE POWER ON
R316 C317 RPWRON END_KEY
RPWRON
C313
S71GL032A40BAW0F E1 A0 D1 A1 C1 A2 B1 A3 D2 A4 C2 A5 B2 A6 A2 A7 A6 A8 C6 A9 D6 A10 A7 A11 B7 A12 C7 A13 D7 A14 B8 A15 E8 A16 D3 A17 C3 A18 B6 A19 C5 A20
2V85_VSIM ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21 4.7K
1SS302-T5L_F_H
MEMORY
R301 2.2K
2V85_VSIM R303 0
C303 39p
C304 10u
R302
J300 1 4 VCC GND 5 2 VPP RST 6 3 I_O CLK 8 7 GND2 GND1 SIM_RST SIM_CLK R306 C311 0.1u C312 22p VIBRATOR 1K
C305 R305 27p 10
(1608) VINNORP
R304 100ohm C307 0.1u R307 VINNORN 100ohm
C306
0.1u OB4-15L42-C33L C308 39p 2 1 MIC300
SIM_DATA C310 22p
Q300 2SC5585 R308 100K
C309
0.1u
39p
R309
C314
2.2K
39p
1.5K R318 2.2K C319 10u
R317 R319
47 0 R320 100K
PWRON
AUXIN 0.1u C318 NA

39p 2V8_VIO FM_ANT VBAT
AUXIP
C320
0.1u
C321
2V8_VIO
2V8_VIO
CN301
VCHARGE 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 22 100K R321
L300 270nH 1608
C322 10p
R323 100K
NA
FOR RADIO FB300 1800 1800 1800
FOR RADIO
R322
RADIO
C323 C324
10u 10u
FB301 FB302
HS_DET 39p 39p 2V8_VIO RPWRON C325 C326 R324 100K DSR 2V8_RADIO C327 10u (2012) R326 39K (10V,Z,Y5V) C328 56p (50V,J,NP0)
F
2V8_VIO
R325
NA
TP301 FM_INT
2V8_RADIO
21 20 19 18 17 16
C329 1u 2V8_RADIO 15 14 13 12 11
C330 1u U303 LM4809LD 7 VDD VIN1 VOUT2 VIN2 3 9 BATT_TEMP R332 0 3 2 1 CN302 VOUT1 8 R327 0 RADIO_SPK_L VBAT 6 R331 0 RADIO_SPK_R
HSEJ-18S04-25R
C
R328
FM_ANT
NA
C331 100p
FM_RST
C334
FM_RST
1 2 3 4 5
NC1 FMIP RFGND GND1 _RST
U302 SI4702-B16
GND3 LOUT ROUT GND2 VD
C332 C333
0.1u 0.1u
R329 R330
20K 20K
1 5
C335 22n 2V8_RADIO
RADIO_AMP_SHDN
2 BYPASS GND 4 _SHDN BGND
C336 3p R333 39K R335 100K C338 0.1u
C337 18p (50V,J,NP0)
2V8_RADIO
R334 10K 0.1u
6 7 8 9 10
(50V,C,NP0) (TOL:0.25P)
D
R336 R337 4.7K 4.7K
D
2V8_VIO
FM_SCL FM_SDA
R338 47 RADIO_DETECT R339 27K VBAT 2V8_RADIO RADIO_SPK_R
2 NO1 3 COM1 IN2 7 IN1 5 NC1 GND NC2 6 COM2 8
C339
FM_32K
C340 0.1u
1 VCC NO2 9
U305 NLAS5223BMNR2G
10
U304
RADIO_EN
R343 100K C341 1u
1 2 3
AUXOP_FMR FOR RADIO EPPA1 R342 NA
Section
Date
Sign & Name
Sheet/ MODEL
C342 1u R345 100K
HEADSET_RADIO_SEL
Designer
11/16 2006
SANG-YEON.LEE
GB3_RADIO SPFY0144601
Sheets
RADIO_DETECT RADIO NO RADIO

F
(10V,K,X5R)
3/4
27K 2.7K
Checked
2006
DRAWING Approved
2006
NAME
RADIO,MEMORY,AUDIO,I/O
Iss.
1 2 3 4 5 6 7 8 9
Notice No.
Date
Name
LG Electronics Inc.
DRAWING NO.
VER-1.1
LG Electronics Inc.
LG(42)-A-5505-10:01
- 91 -
7. CIRCUIT DIAGRAM
10
TP400
TP401
TP402
TP403
TP404
TP405
R400 NA R401 0 TX_RAMP
A
C400 1p
AA
2.2nH
L400
L401
22nH
R402
1K
R403
(16V,K,X7R)
VBAT (50V,J,NP0) (10V,Z,Y5V) (50V,J,NP0) VBAT R404 0 R405 DCS_PCS_OUT 0 L402 NA
SW400 RF500
G1 G2 ANT
RF
(50V,J,NP0)
20
17
C403 12p
C404 0.01u
C402 10u (2012)
C401 39p
C405 33p
C406 18p
C407 27p 6 2 VCC1B VCC1A
C408 0.01u C409 NA
VBATT
VAPC
15 C410 22p R406 0 C411 NA C412 NA 11 19 21
3 4 18 1
R410 FL400 9 IN LMSP2PAA-575TEMP C415 NA 0 C416 NA
VC1 VC2
C417 27p C418 27p
3 7 5 8 10
1 GSM1800_1900TX 6 GSM1800_1900RX VC_GSM850_900TX VC_GSM1800_1900TX 2 GND1 GSM850_900TX 4 GND2 GSM850_900RX GND3
16 14 13 12 10 9 8 7 5
C419
3p
GSM_RXN
TP406
DEFAULT_BANDSEL
2
G1
3
G2
5 10
G3 O2_2 G4
L403 18nH
6
4 I2
C420
O2_1 O1_2
3p 3p
7 8 9
GSM_RXP DCS_RXN
C421
1 I1
O1_1
FL401
B9308 L404 5.1nH
PART_NO SFSB0001401
D
IN CASE OF GSM850/PCS1900 CHANGE THIS DUAL SAW FILTER TO PART_NO SFSB0001301
C422
3p
DCS_RXP
Section Designer
E
Date
11/16 2006
Sign & Name

KEE-OUN.PARK
MODEL
GB3_RADIO
Sheet/Sheets 4/4
Checked Approved
2006
DRAWING NAME
RF
2006
LG Electronics Inc.
1 2 3 4 5 6 7
DRAWING NO.
VER-1.1
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 92 -
8. PCB LAYOUT
- 93 -
8. PCB LAYOUT
- 94 -
9. ENGINEERING MODE
9. ENGINEERING MODE
9.1 About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset.
9.2 Access Codes

The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
9.3 Key Operation

Use Up and Down key to select a menu and press select key to progress the test. Pressing back key will switch back to the original test menu.
9.4 Engineering Mode Menu Tree
ENGINEERING MODE
1. BB TEST
2. Model Version
3. Eng Mode
4. Call Timer
5. Factory Reset
6. MF Test
- 95 -
9. ENGINEERING MODE
BB TEST
1. Backlight
1. Backlight On 2. Backlight Off 3. Backlight Value
2. LCD 1. LCD Color 1. Red 2. Green 2. Contrast 3. Blue 4. Black 5. White 6. Auto LCD 3. Battery Info
4. Vibrator
1. Vibrator On 2. Vibrator Off
5. Audio
1. Audio Test 2. Close
6. FM Radio
* FM Radio function is not supported
- 96 -
9. ENGINEERING MODE
9.4.1 BB Test
9.4.1.1 Backlight
backlight on : LCD backlight is off. backlight off : LCD backlight is on. backlight value : LCD backlight brightness is controlled by 20% from 100 to 0.
9.4.1.2 LCD
LCD color : This menu includes 5 color menu and automatic color change. 5 color menu is Red, Green, Blue, Black and White. LCD contrast : This menu displays a contrast value and LCD maker.
9.4.1.3 Battery Info

This menu displays the information of battery, as example battery voltage level and temperature. In line 2, battery voltage level is displayed with average and instant value. In line 3. battery temperature value is displayed, but this value is ADC value. In line 4. Icon number of battery voltage is displayed.
9.4.1.4 Vibrator
This menu can control vibrator on and off operation.
9.4.1.5 Audio
This menu can control MIDI operation
- 97 -
9. ENGINEERING MODE
Model Version
9.4.2 Model Version

This menu displays the Model software version.
Eng Mode
1. Serving Cell
2. Neighbour Cells
3. Reset Information
- 98 -
9. ENGINEERING MODE
9.4.3 Eng Mode

9.4.3.1 Serving Cell
This Menu dispays the the informations of Serving Cell environment. For example, ARFCN, RF Level etc. ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while Idle mode RxLev : RX level of Serving Cell while Idle mode C1 : C1 Value of Serving Cell, This value will be used to decide cell reselection. C2 : C2 Value of Serving Cell, This value will be used to decide cell reselection. BPM : Paging period of Serving Cell ARFCND : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while Dedicated mode RxLf : Full RX level of Serving Cell RxLs : Sub RX level of Serving Cell RxQf : Full RX qual of Serving Cell RxQs : Sub RX qual of Serving Cell DSC : Downlink Signal Counter RLL : Radio Link Loss Counter Chtyp : Channel type of Serving Cell Chmod : Channel Mode of Serving Cell DTX : Discontinuous Transmission mode of Serving Cell MCC : Mobile Country Code of Serving Cell MNC : Mobile Country Code of Serving Cell LAC : Location Area Code of Serving Cell CID : Cell ID of Serving Cell BSIC : Base Tranceiver Station Identity Code of Serving Cell TxPwrMax : MS_TXPWR_MAX_CCH value of Serving Cell RxMin : RXLEV_ACCESS_MIN value of Serving Cell C2vld : C2_VALID value of Serving Cell CRoff : CELL_RESELECT_OFFSET value of Serving Cell TMPoff : TEMPORARY_OFFSET value of Serving Cell PTime : PENALTY_TIME value of Serving Cell RF# : Number of frequencies in MA(Mobile Allocation) T3212 : Periodic Location Update Timer TxPwrLev : Current Tx power of MS ACC : Access Control Class Band : Current Band Information TA : Current Timing Advance Cipher : Cipher mode of Serving Cell CBQ : Cell Bar Quality flag of Serving Cell CBA : Cell Bar Access flag of Serving Cell
- 99 -
9. ENGINEERING MODE
9.4.3.2 Neighbour Cells

This menu displays the informations of Neighbour Cells. ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Neighbour Cell RxLev : Rx Level of Neighbour Cell C1 : C1 Value of Neighbour Cell, This value will be used to decide cell reselection. C2 : C2 Value of Neighbour Cell, This value will be used to decide cell reselection. MCC : Mobile Country Code of Neighbour Cell MNC : Mobile Network Code of Neighbour Cell LAC : Location Area Code of Neighbour Cell CID : Cell ID of Neighbour Cell BSIC : Base Tranceiver Station Identity Code of Neighbour Cell
9.4.3.3 Reset Information

This menu displays the information of reset point in source code, call stack.
- 100 -
9. ENGINEERING MODE
Call Timer
9.4.4 Call Timer

This menu displays the time of all calls, including the received calls.
Factory Reset
9.4.5 Factory Reset

This menu is to format data block in the flash memory and this procedure set up the default value in data block.
- 101 -
9. ENGINEERING MODE
MF TEST
1. All auto Test
2. Backlight
3. Audio
4. Vibrator
5. LCD
6. Key Pad
* *
7. Mic Speaker
8. FM radio
* function is not supported
- 102 -
9. ENGINEERING MODE
9.4.6 MF TEST
This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test.
9.4.6.1 All auto Test

LCD, Backlight, Vibrator, Buzzer, Key Pad
9.4.6.2 Backlight
LCD Backlight is on for about 1.5 seconds at the same time, then off.
9.4.6.3 Audio
This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.
9.4.6.4 Vibrator
Vibrator is on for about 1.5 seconds.
9.4.6.5 LCD
Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.
9.4.6.6 Key Pad

When a pop-up message shows Press Any Key, you may press any keys. If the key is working properly, name of the key is displayed on the screen.
- 103 -
10. CALIBRATION
10. CALIBRATION
10.1 Test Equipment Setup
4.000V 0.0000A
10.2 Calibration Steps

10.2.1 Tune on the phone 10.2.2 Execute HK_28.exe
- 104 -
10. CALIBRATION
10.2.3 Click SETTING Memu
KG278
10.2.4 Setup Ezlooks menu such as the following fugure
- 105 -
10. CALIBRATION
10.2.5 Setup Line System menu such as the following fugure
KG278
Adjust the number of times.
10.2.6 Setup Logic operation such as the following figure
KG278
Operation Mode 1. By-Pass: not control by GPIB 2. Normal : control by GPIB
Setup UART Port PWR : Power Supply CELL :Call-Test Equipment
- 106 -
10. CALIBRATION
10.2.7 Select MODEL 10.2.8 Click START for RF calibration
KG278
10.2.9 RF Calibration finish
- 107 -
10. CALIBRATION
10.2.10 Calibration data will be saved to the following folder
- 108 -
11. STAND ALONE TEST

11.1 Test Program Setting
11.1.1 Set COM Port 11.1.2 Check PC Baud rate(115200) 11.1.3 Confirm EEPROM & Delta file prefix name
11.1.4 Click V24AT#ON and then Update Info for communicating Phone and Test Program
Not Connected
- 109 -
Connected
11.1.5 For the purpose of the Standalone Test, Change the Phone to ptest mode and then Click the Reset bar. 11.1.6 Select Non signaling in the Quick Bar menu. Then Standalone Test setup is finished.
Change "ptest mode"
- 110 -
11.2 Tx Test
11.2.1 Click Non signaling mode bar and then confirm OK test in the command line
11.2.2 Put the number of TX Channel in the ARFCN 11.2.3 Select TX in the RF mode menu and PCL in the PA Level menu 11.2.4 Finally, Click Write All bar and try the efficiency test of Phone
- 111 -
11.3 RX Test
11.3.1 Put the number of RX Channel in the ARFCN 11.3.2 Select RX in the RF mode menu 11.3.3 Finally, Click Write All bar and try the efficiency test of Phone
- 112 -
12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW
22
20
21 15 7 18 14
12
13 10 17 19 11
1 9 4 2
16 3 8
23
- 113 -
- 114 -
12.2 Replacement Parts <Mechanic component>

Level 1 2 2 3 4 AAAY00 APEY00 ACGK00 MCJK00 Location No. Description GSM,BAR/FILP ADDITION PHONE COVER ASSY,FRONT COVER,FRONT Part Number TGSM0050103 AAAY0203337 APEY0429703 ACGK0085205 MCJK0069001
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Specification
Color Black Black Black Black
Remark
MOLD, PC LUPOY SC-1004A, , , , ,
Black Without Color Without Color Without Color Without Color Black
MPBG00
PAD,LCD
MPBG0058101
COMPLEX, (empty), , , , ,
14
MPBM00
PAD,RECEIVER
MPBM0016401
15
MTAB00
TAPE,PROTECTION
MTAB0168901
20
MTAD00
TAPE,WINDOW
MTAD0065701
21
4 4 3 4 4 4
MWAC00 SURY00 ACGM00 ENZY00 MCCZ00 MCJN00
WINDOW,LCD RECEIVER COVER ASSY,REAR CONNECTOR,ETC CAP COVER,REAR
MWAC0077002 SURY0013001 ACGM0086801 ENZY0019901 MCCZ0024001 MCJN0065001
CUTTING, PMMA MR 200, , , , , PIN ,109 dB,32 ohm,11*7 ,3T ,; , , , , , ,CONTACT ,
22 18
Black 3 PIN,3 mm,STRAIGHT , , MOLD, Urethane Rubber S185A, , , , , MOLD, PC LUPOY SC-1004A, , , , , Black Black Without Color Without Color 3 4 8
MLAB00
LABEL,A/S
MLAB0000601
HUMIDITY STICKER
MPBN00
PAD,SPEAKER
MPBN0039901
16
GMEY00
SCREW MACHINE,BIND
GMEY0002001
1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD d2.7
23
3 3 3
MBJA00 MCCF00 MLAK00
BUTTON,DIAL CAP,MOBILE SWITCH LABEL,MODEL
MBJA0023209 MCCF0042301 MLAK0006901
COMPLEX, (empty), , , , , MOLD, Urethane Rubber S185A, , , , ,
Black Black
12 5
ADCA00
DOME ASSY,METAL
ADCA0063901
Without Color PID Label 4 Array Without Color Without Color
10
MLAZ00
LABEL
MLAZ0038301
SC100
CAN,SHIELD
MCBA0016401
PRESS, NS, 0.2, , , ,
19
- 115 -
<Main component>
Level 4
Location No. SJMY00
Description VIBRATOR,MOTOR
Part Number SJMY0007903
Specification 3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , ,
Color
Remark 9
VIBRATOR,MOTOR
SJMY0007904
3 V,.1 A,4*8 ,height 5.8mm ,; ,3V , , ,11000 , , , , 3.0 ,-2.0 dBd,, ,internal, GSM900/1800 ,; ,DUAL ,-2.0 ,50 ,3.0 PIN ,8 ohm,89 dB,16 mm, ,; , , , , , , ,CONTACT
SNGF00
ANTENNA,GSM,FIXED
SNGF0022402
11
4 3 4 5
SUSY00 SAFY00 SAFB00 SUMY00
SPEAKER PCB ASSY,MAIN PCB ASSY,MAIN,INSERT MICROPHONE
SUSY0025801 SAFY0193036 SAFB0061605 SUMY0003802
1 17
FPCB ,-42 dB,4*1.5 , MAIN ,128*128 ,35.78*39.7*2.7 ,65k ,CSTN ,TM ,S6B33BG ,1.52" Serial IF Only for CI
SVLM00
LCD MODULE
SVLM0024402
13
SAFF00
PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM BATTERY,CELL,LITHIUM
SAFF0114336
SAFC
SAFC0086602 3.3 V,0.025 mAh,COIN ,Capacitor type Backup Batt. Pb-Free ,; ,3.3 ,0.025mAh ,COIN 39 pF,50V,J,NP0,TC,1005,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 18 pF,50V,J,NP0,TC,1005,R/TP 18 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,10V ,K ,B ,TC ,2012 ,R/TP
BAT100
SBCL0001901
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
C100 C101 C104 C105 C106 C107 C108 C109 C110 C111 C112 C113 C114 C115 C117 C118 C119 C120
CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
ECCH0000120 ECCH0005602 ECCH0000113 ECCH0000113 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECZH0001216 ECCH0005602 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0002101
- 116 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C121 C122 C123 C124 C125 C126 C127 C128 C129 C130 C131 C132 C133 C200 C201 C202 C203 C204 C209 C210 C211 C212 C221 C222 C223 C302 C303 C304 C305 C306 C307 C308 C309 C310
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0002004 ECCH0000182 ECCH0000182 ECCH0000143 ECZH0001215 ECZH0001215 ECCH0000157 ECCH0004904 ECCH0000182 ECCH0002002 ECCH0004904 ECZH0001106 ECZH0001106 ECCH0004904 ECCH0004904 ECZH0000826 ECZH0000826 ECZH0000826 ECZH0000826 ECZH0000826 ECZH0000826 ECZH0000826 ECCH0004904 ECZH0001215 ECZH0001215 ECZH0000826 ECCH0000120 ECCH0006501 ECZH0000826 ECCH0000161 ECCH0000182 ECCH0000120 ECCH0000161 ECCH0000115
Specification 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 15 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP
Color
Remark
- 117 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C311 C312 C313 C314 C315 C316 C317 C319 C320 C321 C322 C323 C324 C325 C326 C327 C328 C329 C330 C331 C332 C333 C335 C336 C337 C338 C339 C340 C341 C342 C400 C401 C402 C403
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER
Part Number ECCH0000182 ECCH0000115 ECCH0000120 ECCH0000120 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0006501 ECCH0000182 ECCH0000120 ECCH0000110 ECCH0006501 ECCH0006501 ECCH0000120 ECCH0000120 ECCH0003002 ECZH0000841 ECCH0004904 ECCH0004904 ECZH0000813 ECCH0000182 ECCH0000182 ECCH0000179 ECCH0000104 ECCH0000113 ECCH0000182 ECCH0000182 ECCH0000182 ECZH0001215 ECCH0004904 ECZH0000802 ECCH0000120 ECCH0003002 ECZH0000816
Specification 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 18 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
Color
Remark
- 118 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C404 C405 C406 C407 C408 C410 C413 C414 C417 C418 C419 C420 C421 C422
Description CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0000155 ECZH0000830 ECCH0000113 ECZH0000826 ECCH0000155 ECCH0009505 ECZH0000826 ECZH0000826 ECZH0000826 ECZH0000826 ECCH0000104 ECCH0000104 ECCH0000104 ECCH0000104
Specification 10 nF,16V,K,X7R,HD,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 18 pF,50V,J,NP0,TC,1005,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 22 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 13 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FPC ,STRAIGHT ,TOP ,SMD ,R/TP ,[empty] , 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type SC-70 ,80 V,0.1 A,R/TP , 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP 850.1900 ,900.1800 ,2.0 dB,2.0 dB,2.0 dB,2.0 dB,ETC ,Dual Band ASM, 2.5x2.5x1.2 942.5 MHz,35 MHz,2.1 dB,20 dB,1842.5 MHz,75 MHz,2.3 dB,12 dB,2.0*1.6*0.68 ,SMD ,925M~960M,1805M~1880M,10p,B,150_82,150_15,EGSM +DCS Rx ,; ,942.5, 1842.5 ,2.0*1.6*0.68 ,SMD ,R/TP 6 PIN,ETC , ,2.54 mm,H=1.5 18 nH,J ,1005 ,R/TP ,PBFREE 27 nH,J ,1005 ,R/TP , 27 nH,J ,1005 ,R/TP , 270 nH,J ,1608 ,R/TP , 2.2 nH,S ,1005 ,R/TP , 22 nH,J ,1005 ,R/TP ,PBFREE 18 nH,J ,1005 ,R/TP ,PBFREE 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
Color
Remark
CN200
CONNECTOR,FFC/FPC
ENQY0013801
6 6 6 6 6
CN301 D300 FB300 FB301 FB302
CONNECTOR,I/O DIODE,SWITCHING FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP
ENRY0006401 EDSY0005301 SFBH0008105 SFBH0008105 SFBH0008105
FL400
FILTER,SEPERATOR
SFAY0010101
FL401
FILTER,SAW,DUAL
SFSB0001401
6 6 6 6 6 6 6 6 6 6
J300 L102 L103 L104 L300 L400 L401 L403 L404 Q200
CONN,SOCKET INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP TR,BJT,NPN
ENSY0018101 ELCH0001032 ELCH0004715 ELCH0004715 ELCH0001556 ELCH0004721 ELCH0001413 ELCH0001032 ELCH0003814 EQBN0007101
- 119 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. Q300 R100 R101 R102 R104 R105 R106 R108 R109 R110 R111 R112 R115 R116 R119 R122 R124 R125 R197 R202 R205 R206 R207 R208 R210 R222 R223 R300 R301 R302 R303 R304 R305 R306
Description TR,BJT,NPN RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER
Part Number EQBN0007101 ERHZ0000506 ERHZ0000244 ERHY0000278 ERHZ0000438 ERHZ0000438 ERHZ0000438 ERHY0000278 ERHZ0000507 ERHZ0000406 ERHZ0000406 ERHZ0000287 ERHZ0000406 ERHZ0000401 ERHY0003401 ERHZ0000401 ERHY0008402 ERHZ0000406 ERHZ0000401 ERHZ0000406 ERHZ0000483 ERHZ0000483 ERHZ0000483 ERHZ0000483 ERHZ0000406 ERHZ0000404 ERHZ0000405 ERHZ0000404 ERHZ0000443 ERHZ0000485 ERHZ0000401 ERHY0003301 ERHZ0000702 ERHZ0000404
Specification EMT3 ,0.15 W,R/TP ,LOW FREQUENCY 6800 ohm,1/16W ,J ,1005 ,R/TP 22 Kohm,1/16W ,F ,1005 ,R/TP 82K ohm,1/16W,J,1005,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 82K ohm,1/16W,J,1005,R/TP 68 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 47 Kohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 1800 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 160 Kohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 4700 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/10W ,J ,1608 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP
Color
Remark
- 120 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. R307 R308 R309 R310 R312 R313 R314 R316 R317 R318 R319 R320 R321 R323 R324 R326 R327 R328 R329 R330 R331 R332 R333 R334 R335 R336 R337 R338 R339 R341 R343 R344 R345 R401
Description RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER
Part Number ERHY0003301 ERHZ0000406 ERHZ0000443 ERHZ0000401 ERHZ0000406 ERHZ0000406 ERHZ0000401 ERHZ0000529 ERHZ0000405 ERHZ0000443 ERHZ0000401 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000476 ERHZ0000401 ERHZ0000401 ERHZ0000438 ERHZ0000438 ERHZ0000401 ERHZ0000401 ERHZ0000476 ERHZ0000405 ERHZ0000406 ERHZ0000485 ERHZ0000485 ERHZ0000483 ERHZ0000454 ERHZ0000467 ERHZ0000406 ERHZ0000450 ERHZ0000406 ERHZ0000401
Specification 100 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 1.5 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 39 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 39 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 4700 ohm,1/16W ,J ,1005 ,R/TP 4700 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 27 Kohm,1/16W ,J ,1005 ,R/TP 330 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 240 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP
Color
Remark
- 121 -
Level 6 6 6 6 6 6 6 6 6
Location No. R402 R403 R404 R405 R406 R407 R410 SW400 U100
Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER CONN,RF SWITCH IC
Part Number ERHZ0000404 ERHZ0000401 ERHZ0000401 ERHZ0000401 ERHZ0000401 ERHZ0000401 ERHZ0000401 ENWY0004501 EUSY0176402
Specification 1 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP ,SMD , dB,H=3.6, Straight type Flip-Chip CSP ,9 PIN,R/TP ,Audio Power Amplifier
Color
Remark
U101
IC
EUSY0328601
DFN ,10 PIN,R/TP ,Li-ion charger IC, 1A, 10Pin, 3x3, DFN
U102
IC
EUSY0317401
BGA ,189 PIN,R/TP ,E-Gold voice TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge Pump(AAT2154 Low cost version) BGA ,56 PIN,R/TP ,32Mb/4Mb , 200 nm, MirroBit QFN ,20 PIN,R/TP ,FM Tuner Chip, 3*3*0.57, Pb Free LLP ,8 PIN,R/TP ,Dual 105mW Headphone Amplifier HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT CONTROL / 2.8V WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog Switch, PB-Free 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band .032768 MHz,20 PPM,12.5 pF,65000 ohm,SMD ,6.9*1.4*1.3 , 26 MHz,10 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.6 ,12ppm at 30'C ~ +85'C, C0 1.0pF, C1 3.6fF ,; ,26 ,10PPM ,8 , , ,SMD ,R/TP
U200
IC
EUSY0238702
6 6 6
U301 U302 U303
IC IC IC
EUSY0328001 EUSY0320801 EUSY0142501
U304
IC
EUSY0223002
U305
IC
EUSY0300101
U400
PAM
SMPY0014001
X100
X-TAL
EXXY0004602
X101
X-TAL
EXXY0018404
5 6 6 6 6 6 6 6 6 6 6 6
SAFD C102 C103 L100 L101 LD200 LD201 LD202 LD203 LD204 LD205 R201
PCB ASSY,MAIN,SMT TOP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP INDUCTOR,CHIP INDUCTOR,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP RES,CHIP,MAKER
SAFD0085602 ECCH0000120 ECCH0000120 ELCH0004711 ELCH0004711 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 ERHZ0000505 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 22 nH,J ,1005 ,R/TP , 22 nH,J ,1005 ,R/TP , Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED 680 ohm,1/16W ,J ,1005 ,R/TP
- 122 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. R203 R204 R209 R211 R212 R213 R214 R215 R216 R217 R218 R219 R220 R221 SPFY00
Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP PCB,MAIN
Part Number ERHZ0000505 ERHZ0000505 ERHZ0000505 ERHZ0000505 ERHZ0000505 ERHZ0000505 ERHZ0000505 ERHZ0000505 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 SPFY0144601
Specification 680 ohm,1/16W ,J ,1005 ,R/TP 680 ohm,1/16W ,J ,1005 ,R/TP 680 ohm,1/16W ,J ,1005 ,R/TP 680 ohm,1/16W ,J ,1005 ,R/TP 680 ohm,1/16W ,J ,1005 ,R/TP 680 ohm,1/16W ,J ,1005 ,R/TP 680 ohm,1/16W ,J ,1005 ,R/TP 680 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP FR-4 ,.0.8mm,BUILD-UP 4 ,KG270/KG278 Main PCB
Color
Remark
- 123 -
12.3 Accessory
Level 3
Location No. MCJA00
Description COVER,BATTERY
Part Number MCJA0040301
Specification MOLD, PC LUPOY SC-1004A, , , , , 3.7 V,750 mAh,1 CELL,PRISMATIC ,WLT, BATT, Europe Label, Pb-Free ,; ,3.7 ,750 ,0.2C ,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack ,Europe Label 3.7 V,750 mAh,1 CELL,PRISMATIC ,GB3 BATT(CMW standard batt), Europe, Pb-Free ,; ,3.7 ,750 ,0.2C ,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack ,Europe Label ; ,10mW ,16 OHM ,105dB ,10KHZ ,450HZ ,[empty] ,BLACK,EARPHONE HOUSING:SILVER ,18P MMI CONNECTOR ,MONO18P(5P)LOW COST 100-240V ,5060 Hz,5.1 V,.7 A,CB/GOST ,AC-DC ADAPTOR ,; ,100Vac~350Vac ,5.1V (+0.15, -0.2) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.2 V,0.7 A,CB/GOST ,AC-DC ADAPTOR ,; ,100Vac~350Vac ,5.20.3V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR ,
Color Black
Remark 6
SBPL00
BATTERY PACK,LI-ION
SBPL0089503
BATTERY PACK,LI-ION
SBPL0088203
SGEY00
EAR PHONE/EAR MIKE SET
SGEY0003209
SSAD00
ADAPTOR,AC-DC
SSAD0024901
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LG Kg270, Mg160 Service Manual

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LG Kg270, Mg160 Service Manual

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Service Manual

Service Manual KG270/MG160

Date: April, 2007 / Issue 1.0

3. TECHNICAL BRIEF ........................14

10. CALIBRATION ..............................92

11. STAND ALONE TEST .................109

4. TROUBLE SHOOTING ...................44

12. EXPLODED VIEW & REPLACEMENT PART LIST ..... 113

1.2 Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices ATTENTION

2.2 S/W Features

Function Display RSSI

Detail Item O O O O 6 level 5 level

Battery Level RTC Multi?Language

Basic:English Max. 4 language of Latin 2 or 3 language of etc.

X O X X O O O X O O O X O O O O O O X Local Time / Selected Area Time 10 10 10

DTMF Signaling DTMF Enable & Disable

Function Supp. Services

Detail Item Call Forwarding O O O O Call Barring O O O O Conference Call O O O O O X O O O O

Short Messaging Manage-ment

Not Support EMS

Function Sound contents Ringtones Karaoke

E-MAIL, EMS, Schedule, Phonebook, Name card etc.

Sync ML Game Menu

External Interface Electrical Man Machine Interface O

Real Time Clock

Automatic Leap Year Adjustment

Once, Daily, Mon~Fri, Mon~Sat

Provides optionally only for supporting FM radio function.

RS232 cable Standard battery Back-up and Holster function

Figure. 3-1 PMB7880 FUNCTIONAL BLOCK DIAGRAM

3.1.1 Overview of E-GOLDvoice

3.1.3 GSM System Description

3.1.4 PMU Details

3.1.5 Bus Concept

3.1.6 C166S Buses

3.1.7 TEAKLite Bus

3.1.8 Bus Interconnections

3.1.9 Clock Concept

3.1.10 Interrupt Concept

3.1.11 Debug Concept

3.1.12 C166 Debug Concept

3.1.13 TEAKLite Debug Concept

3.1.14 Power Management

3.1.15 On-Chip Security Concept

3.1.16 Asynchronous Operation Mode Concept

3.2 Power Amplifier Module (SKY77318)

Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM

3.3 26 MHz Clock (DCXO)

Figure. 3-3 E-GoldVoice DCXO Overview

3.4 RTC(32.768KHz Crystal)

Figure. 3-4 E-Gold Voice RTC Interface

3.5 LCD Interface(3-wire SPI interface)

Figure 3-5-1. LCD Interface

Figure 3-5-2. Charge pump interface

Signals CS3 SSC0_MTSR SSC0_CLK LCD_RESET MLED MLED1/2 2V8_VIO

Figure 3-5-3. Charge pump Output Current

3.6 SIM Card Interface

SIM_DATA C310 22p

J300 4 GND VCC 5 VPP RST 6 CLK I_O 8 GND2 GND1

1 2 3 7 C311 0.1u C312 22p