You are on page 1of 13

TN805, TN815 TS820, TYN608

Sensitive and standard 8 A SCRs


Features

On-state rms current, IT(RMS) 8 A Repetitive peak off-state voltage, VDRM/VRRM 600 and 800 V Triggering gate current, IGT 0.2 to 15 mA
A

Description
Available either in sensitive (TS8) or standard (TN8 / TYN) gate triggering levels, the 8 A SCR series is suitable to fit all modes of control found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits. Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space.

IPAK TS820-600H
A

K A G

DPAK TN805-600B TN815-x00B TS820-600B


A

A G

TO-220AB TYN608RG

K A G K A G

TO-220AB TS820-600T

TO-220FPAB TS820-600FP

Table 1.

Device summary
Voltage (x00) VDRM/VRRM Sensitivity IGT 0.2 mA 0.2 mA 0.2 mA 0.2 mA 5 mA X 15 mA 15 mA Package DPAK IPAK TO-220AB TO-220FPAB DPAK DPAK TO-220AB

Order code 600 V TS820-600B TS820-600H TS820-600T TS820-600FP TN805-600B TN815-x00B TYN608RG X X X X X X X 800 V

October 2011

Doc ID 7476 Rev 7

1/13
www.st.com 13

Characteristics

TN805, TN815, TS820, TYN608

1
Table 2.

Characteristics
Absolute ratings (limiting values)
Value

Symbol

Parameter

TN805 TN815 TYN608 TS820

Unit

IT(RMS)

On-state rms current (180 conduction angle)

Tc = 110 C T0-220FPAB, Tc = 91 C

IT(AV)

Average on-state current (180 conduction angle) Non repetitive surge peak on-state current I2t value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range tp = 8.3 ms tp = 10 ms tp = 10 ms F = 60 Hz tp = 20 s

Tc = 110 C T0-220FPAB, Tc = 91 C 73 Tj = 25 C Tj = 25 C Tj = 125 C Tj = 125 C Tj = 125 C 70 24.5

5 100

ITSM I2t dI/dt IGM PG(AV) Tstg Tj VRGM

A 95 45 50 4 1 - 40 to + 150 - 40 to + 125 5 A2S A/s A W C V

Maximum peak reverse gate voltage (for TN8x5 and TYN608 only)

Table 3.
Symbol IGT VGT VGD VRG IH IL dV/dt VTM Vt0 Rd IDRM IRRM

Sensitive electrical characteristics (Tj = 25 C, unless otherwise specified)


Test conditions VD = 12 V, RL = 140 VD = VDRM, RL = 3.3 k, RGK = 220 IRG = 10 A IT = 50 mA, RGK = 1 k IG = 1 mA ,, RGK = 1 k VD = 65% VDRM, RGK = 220 ITM = 16 A, tp = 380 s Threshold voltage Dynamic resistance VDRM = VRRM, RGK = 220 Tj = 125 C Tj = 25 C Tj = 125 C Tj = 125 C Tj = 25 C Tj = 125 C Tj = 125 C MAX. MAX. MIN. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 1 mA TS820 200 0.8 0.1 8 5 6 5 1.6 0.85 46 5 Unit A V V V mA mA V/s V V m A

2/13

Doc ID 7476 Rev 7

TN805, TN815, TS820, TYN608 Table 4.


Symbol IGT VGT VGD IH IL dV/dt VTM Vt0 Rd IDRM IRRM VD = VDRM, RL = 3.3 k IT = 100 mA , gate open IG = 1.2 IGT VD = 67% VDRM, gate open ITM = 16 A tp = 380 s Tj =125 C Tj = 25 C Tj = 125 C Tj = 125 C Tj = 25 C Tj = 125 C Tj = 125 C

Characteristics

Standard electrical characteristics (Tj = 25 C, unless otherwise specified)


Test conditions MIN. VD = 12 V, RL = 33 MAX. MAX. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 2 mA 25 30 50 TN805 0.5 5 TN815 2 15 1.3 0.2 40 50 150 1.6 0.85 46 5 30 70 150 TYN608 2 mA 15 V V mA mA V/s V V m A Unit

Threshold voltage Dynamic resistance VDRM = VRRM

Table 5.
Symbol Rth(j-c)

Thermal resistance
Parameter DPAK, IPAK, TO-220AB Junction to case (DC) TO-220FPAB S(1) = 0.5 cm2 DPAK IPAK TO-220AB, TO-220FPAB 4.6 70 100 60 C/W Value 1.3 C/W Unit

Rth(j-a)

Junction to ambient (DC)

1. S = Copper surface under tab

Figure 1.

Maximum average power Figure 2. dissipation versus average on-state current


IT(AV)(A)
10

Average and DC on-state current versus case temperature

P(W)
8 7 6
7
= 180

DPAK IPAK

9 8
D.C.

TO-220AB

5 4 3
360

6 5 4 3 2

= 180

TO-220FPAB

2 1 0 0 1 2 3 4 5 6

IT(AV)(A)

1 0 0 25

Tcase(C)
50 75 100 125

Doc ID 7476 Rev 7

3/13

Characteristics

TN805, TN815, TS820, TYN608

Figure 3.

Average and DC on-state current versus ambient temperature

Figure 4.

Relative variation of thermal impedance junction to case versus pulse duration

IT(AV)(A)
2,5
D.C. = 180

K=[Zth(j-c)/Rth(j-c)]
Recommended pad layout, FR4 printed circuit board
1.0

2,0
TO-220AB TO-220FPAB

0.5

1,5

1,0
DPAK IPAK

0.2

0,5

Tamb(C)
0,0 0 25 50 75 100 125

tp(s)
0.1 1E-3 1E-2 1E-1 1E+0

Figure 5.

Relative variation of thermal impedance junction to ambient versus pulse duration

Figure 6.

Relative variation of gate trigger current and holding current versus junction temperature for TS820

K=[Zth(j-a)/Rth(j-a)]
1.00
2.0

IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C]
1.8
IGT

Recommended pad layout, FR4 printed circuit board

1.6
DPAK

1.4 1.2
IH & IL RGK = 1k

0.10
TO-220AB / IPAK TO-220FPAB

1.0 0.8 0.6 0.4

tp(s)
0.01 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

0.2 0.0 -40 -20 0 20

Tj(C)
40 60 80 100 120 140

Figure 7.

Relative variation of gate trigger Figure 8. and holding current versus junction temperature
6.0 5.5
IGT

Relative variation of holding current versus gate-cathode resistance (typical values)


Tj = 25C

IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C]
2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 100 120 140
IH & IL

IH[RGK] / IH[RGK=1k]
TN8 and TYNx8
TS8

5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5

Tj(C)

1.0 0.5 0.0 1E-2 1E-1

RGK(k)
1E+0 1E+1

4/13

Doc ID 7476 Rev 7

TN805, TN815, TS820, TYN608

Characteristics

Figure 9.

Relative variation of dV/dt immunity Figure 10. Relative variation of dV/dt immunity versus gate-cathode resistance versus gate-cathode capacitance (typical values) for TS820 (typical values) for TS820
dV/dt[CGK] / dV/dt[RGK=220]
15.0
Tj = 125C VD = 0.67 x VDRM VD = 0.67 x VDRM Tj = 125C RGK = 220

dV/dt[RGK] / dV/dt[RGK=220]
10.00

12.5

1.00

10.0

7.5

0.10

5.0

2.5

RGK(k)
0.01 0 200 400 600 800 1000 1200 1400 1600 1800 2000

CGK(nF)
0.0 0 20 40 60 80 100 120 140 160 180 200 220

Figure 11. Surge peak on-state current versus Figure 12. Non-repetitive surge peak on-state number of cycles current and corresponding values of I2t
ITSM(A)
100 90 80 70 60 50 40 30 20 10 0 1 10
Repetitive TC=110C TN8 / TS8 Non repetitive Tj initial=25C TYN08 tp=10ms One cycle

ITSM(A), I t (A s)
1000
Tj initial = 25C

ITSM TYN08 dI/dt limitation

100

Sinusoidal pulse width tp < 10 ms

TN8 / TS8

TYN08 It
2

TN8 / TS8

Number of cycles
10
100 1000

tp(ms)
0.01 0.10 1.00 10.00

Figure 13. On-state characteristics (maximum Figure 14. Thermal resistance junction to values) ambient versus copper surface under tab (DPAK)
ITM(A)
50.0
Tj max.: Vt0=0.85V Rd=46m

Rth(j-a)(C/W)
100

80

Epoxy printed circuit board FR4 copper thickness = 35 m

10.0
Tj=max

60

1.0
Tj=25C

40

20

VTM(V)
0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

S(cm)
0 0 2 4 6 8 10 12 14 16 18 20

Doc ID 7476 Rev 7

5/13

Ordering information scheme

TN805, TN815, TS820, TYN608

Ordering information scheme


Figure 15. TN8 series
TN 8 05 - 600 B -TR
Standard SCR series Current 8=8A Sensitivity 05 = 5 mA 15 = 15 mA Voltage 600 = 600 V 800 = 800 V Package B = DPAK Packing mode -TR = Tape and reel

Figure 16. TS8 series


TS 8 20 - 600 B (-TR)
Sensitive SCR series Current 8=8A Sensitivity 20 = 200 A Voltage 600 = 600 V Package B = DPAK H = IPAK T = TO-220AB FP = TO220FPAB Packing mode Blank = Tube -TR = Tape and reel

Figure 17. TYNx08 series


TYN
Standard SCR series Voltage 6 = 600 V Current 8=8A Packing mode RG = Tube

08

RG

6/13

Doc ID 7476 Rev 7

TN805, TN815, TS820, TYN608

Package information

Package information

Epoxy meets UL94, V0 Lead-free packages Recommended torque: 0.4 to 0.6 Nm

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 6. DPAK dimensions
Dimensions Ref. Millimeters Min. A
E B2 C2 L2 A

Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397

Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10

2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35

A1 A2 B B2
D

H L4 B G A1

C C2
R C

D E

A2 0.60 MIN.

G H
V2

L2 L4 V2

0.80 typ. 0.60 0 1.00 8

0.031 typ. 0.023 0 0.039 8

Figure 18. Footprint (dimensions in mm)


6.7 3 3 1.6

2.3 6.7 2.3

1.6

Doc ID 7476 Rev 7

7/13

Package information Table 7. IPAK dimensions

TN805, TN815, TS820, TYN608

Dimensions Ref. Millimeters Min. A A1 A3


A E B2 L2 C2

Inches Min. 0.086 0.035 0.027 0.025 0.204 Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.035

Typ.

Max. 2.40 1.10 1.30 0.90 5.40 0.95

2.20 0.90 0.70 0.64 5.20

B B2 B3 B5
D

0.30 0.45 0.48 6 6.40 2.28 4.40 16.10 9 0.8 0.80 10 9.40 1.20 1 0.354 0.031 4.60 0.173 0.60 0.60 6.20 6.60 0.017 0.019 0.236 0.252

C C2

0.023 0.023 0.244 0.260 0.090 0.181 0.634 0.370 0.047 0.031 0.039 10

H L

L1

B3 B V1 A1

D E e
C A3

e G

B5

G H L L1 L2 V1

8/13

Doc ID 7476 Rev 7

TN805, TN815, TS820, TYN608 Table 8. TO-220AB dimensions (for TS820-xxxT)

Package information

Dimensions Ref. Millimeters Min. A C


H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A

Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409

Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40

4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10

D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam.

16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93

0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154

2.6 typ. 3.75 3.85

0.102 typ. 0.147 0.151

Doc ID 7476 Rev 7

9/13

Package information Table 9. TO-220AB dimensions (for TYNx8 series)

TN805, TN815, TS820, TYN608

Dimensions Ref. Millimeters Min. A a1


B I L F A I4 l3 a1 l2 c2 b2 C

Inches Min. Typ. Max. 0.625 0.147

Typ.

Max.

15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75

15.90 0.598

a2 B b1 b2 C c1 c2

14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.094 0.244 0.147

0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151

a2

e
M

F
c1

b1 e

I I4 L l2 l3 M

15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 1.70 1.70 0.104 0.044 0.044 0.102 0.116 0.066 0.066

10/13

Doc ID 7476 Rev 7

TN805, TN815, TS820, TYN608 Table 10. TO-220FPAB dimensions

Package information

Dimensions Ref. Millimeters Min. A B


A H B

Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409

Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4

4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10

D E

Dia L6 L2 L3 L5 F1 L4 F2 D L7

F F1 F2 G G1 H L2
E

16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20

0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126

F G1 G

L3 L4 L5 L6 L7 Dia.

Doc ID 7476 Rev 7

11/13

Ordering information

TN805, TN815, TS820, TYN608

Ordering information
Table 11. Ordering information
Marking TN805600 TN815600 TN815800 TS820600 TS820600 TS820600 TS820600T TS820600 TYN608 Package DPAK DPAK DPAK DPAK DPAK IPAK TO-220AB TO-220FPAB TO-220AB Weight 0.3 g 0.3 g 0.3 g 0.3 g 0.3 g 0.4 g 2.3 g 2.0 g 2.3 g Base qty Delivery mode 2500 2500 2500 75 2500 75 50 50 50 Tape and reel Tape and reel Tape and reel Tube Tape and reel Tube Tube Tube Tube

Order code TN805-600B-TR TN815-600B-TR TN815-800B-TR TS820-600B TS820-600B-TR TS820-600H TS820-600T TS820-600FP TYN608RG

Revision history
Table 12.
Date Apr-2002 13-Feb-2006 22-Jan-2010 10-Oct-2011

Document revision history


Revision 4A 5 6 7 Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Alpha definition updated in Figure 1. Thermal resistance, junction to case, updated in Table 5. Added TO-220FPAB package. Removed 700 V and 1000 V products. Changes

12/13

Doc ID 7476 Rev 7

TN805, TN815, TS820, TYN608

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (ST) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to STs terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN STS TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USERS OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com

Doc ID 7476 Rev 7

13/13

You might also like