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RDS(on) 10 m (*)
Ilim
Vclamp
10
30 A
40 V
1
D2PAK
PowerSO-10
n LINEAR CURRENT LIMITATION n THERMAL SHUT DOWN n SHORT CIRCUIT PROTECTION n INTEGRATED CLAMP n LOW CURRENT DRAWN FROM INPUT PIN n DIAGNOSTIC FEEDBACK THROUGH INPUT
3 1 2
1
3 2
TO-220
PIN
MOSFET
DESCRIPTION The VNB35NV04, VNP35NV04, VNV35NV04, VNW35NV04 are monolithic devices designed in STMicroelectronics VIPower M0-3 Technology, BLOCK DIAGRAM
intended for replacement of standard Power MOSFETS from DC up to 25KHz applications. Built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. Fault feedback can be detected by monitoring the voltage at the input pin.
DRAIN
2 Overvoltage Clamp
INPUT
Gate Control
Over Temperature
3
SOURCE
FC01000
March 2004
1/19
6 7 8 9 10 11 DRAIN
5 4 3 2 1
(*) For the pins configuration related to TO-220, TO-247, D2PAK, see outlines at page 1.
ID VDS
VIN
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PowerSO-10 Thermal Resistance Junction-case}}} MAX 1 Thermal Resistance Junction-ambient MAX 50(*)
Parameter
TO-220 1 50
TO-247 0.6 30
mounted on a standard single-sided FR4 board with 50mm2 of Cu (at least 35 m thick) connected to all DRAIN pins.
ELECTRICAL CHARACTERISTICS (-40C < Tj < 150C, unless otherwise specified) OFF
Symbol VCLAMP VCLTH VINTH IISS VINCL IDSS Parameter Drain-source Clamp Voltage Drain-source Clamp Threshold Voltage Input Threshold Voltage Supply Current from Input Pin Input-Source Clamp Voltage Zero Input Voltage Drain Current (VIN=0V) Test Conditions VIN=0V; ID=15A VIN=0V; ID=2mA VDS=VIN; ID=1mA VDS=0V; VIN=5V IIN=1mA IIN=-1mA VDS=13V; VIN=0V; Tj=25C VDS=25V; VIN=0V 6 -1.0 Min 40 36 0.5 100 6.8 2.5 150 8 -0.3 30 75 Typ 45 Max 55 Unit V V V A V A
ON
Max Symbol Parameter Static Drain-source On Resistance Test Conditions VIN=5V; ID=15A; Tj=25C VIN=5V; ID=15A; Tj=150C PowerSO-10 10 20 D2PAK TO-220 / TO-247 13 24 Unit m
RDS(on)
3/19
SWITCHING
Symbol td(on) tr td(off) tf td(on) tr td(off) tf (di/dt)on Qi Parameter Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Current Slope Total Input Charge Test Conditions VDD=15V; ID=15A Vgen=5V; Rgen=RIN MIN=4.7 (see figure 1) VDD=15V; ID=15A Vgen=5V; Rgen=2.2K (see figure 1) VDD=15V; ID=15A Vgen=5V; Rgen=RIN MIN=4.7 VDD=12V; ID=15A; VIN=5V Igen =2.13mA (see figure 5) Min Typ 150 840 980 600 4 27 34 31 18 118 Max 500 2500 3000 1500 12 100 120 110 Unit ns ns ns ns s s s s A/s nC
VIN=5V; VDS=13V; Tj=Tjsh starting Tj=25C; VDD=24V VIN=5V; Rgen=RIN MIN=4.7; L=24mH (see figures 3 & 4)
15
20
4/19
5/19
VD Rgen Vgen
ID 90%
tr td(on)
10% td(off)
tf t
Vgen
A D I
A
FAST DIODE
OMNIFET
S 25 B
L=100uH B
Rgen
VDD
I
OMNIFET
S
Vgen
8.5
6/19
RGEN VIN PW
VIN
GEN
ND8003
7/19
900
Vin=2.5V
Tj=-40C
Vin=0V
850
40
Tj=25C
800
30
Tj=150C
750 20 700
650 0 5 10 15 20 25 30 35
10 0 1 2 3 4 5 6
Id (A)
Id (A)
D2PAK, TO-220 & TO-247 Static Drain-Source On resistance Vs. Input Voltage
Rds(on) (mOhm)
30
Id=15A Id=7.5A
25
Tj=150C
20
Tj=150C
Id=15A Id=7.5A
15
Id=15A Id=7.5A
Tj=25C
10
10 5 7.5
Tj=-40C
Tj=-40C
Vin (V)
Vin (V)
25
Vin=5V
20
Tj=150C
18 15 12
Tj=150C
15
Tj=25C
9 10
Tj=25C Tj=-40C
Tj=-40C
6
Vin=5V
3 0 0 5 10 15 20 25 30 35 0 4 8 12 16 20 24 28 32
Id (A)
Id (A)
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Transfer Characteristics
Idon (A)
Tj=-40C
48
50 45
Vds=13V
42 36 30
Tj=25C Tj=150C
Vds=13.5V
40 35 30
Tj=-40C
Tj=150C
25 20
24 18 15 12 6 0 0 4 8 12 16 20 24 28 32
Tj=25C
10 5 0 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5
Id (A)
Vin (V)
Output Characteristics
Id (A)
55 50 45
Vin=5V Id=15A
40 35 30 25 20 15
Vin=2.5V
10
0.5
Vds (V)
Tc (C)
8 7 6 5 4 3 2
Rg (Ohm)
Rg (Ohm)
9/19
Vds=12V Id=15A
300
450
600
750
900
1050
Qg (nC)
Rg (Ohm)
30 25 20 15 10 5 0 0
td(on)
300
600
900
1200
1500
1800
2100
2400
Rg (Ohm)
Rg (Ohm)
1500
tr
Vds=Vin Id=1mA
1250
1000 1 750
tf
500
250
td(on)
0 3 3.5 4 4.5 5 5.5 6 6.5 7
-50
-25
25
50
75
100
125
150
175
Vin (V)
Tc (C)
10/19
Vin=6V Vds=13V
160
Vin=6V
140
120
80
Tc (C)
Vdd (V)
Derating Curve
11/19
P
Q Package Weight
12/19
13/19
mm. MIN. 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0 2 1.80 1.10 8 8 0.047 0.031 0 2 1.35 1.40 14.40 14.35 0.049 0.047 0.543 0.545 TYP MAX. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 MIN. 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.370 0.291 0.366 0.283 0.287 0.232 0.232
inch TYP. MAX. 0.144 0.142 0.004 0.024 0.021 0.022 0.0126 0.378 0.300 0.374 300 0.295 0.240 0.248 0.050 0.053 0.055 0.567 0.565 0.002 0.070 0.043 8 8
0.10 A B
10
E2
E4
SEATING PLANE e
0.25
DETAIL "A"
C D = D1 = = = SEATING PLANE
A F A1
A1
L DETAIL "A"
P095A
14/19
P011P6
15/19
16/19
10.8- 11 6.30
A A
9.5
All dimensions are in mm. Base Q.ty Bulk Q.ty Tube length ( 0.5) Casablanca Muar 50 50 1000 1000 532 532 A B C ( 0.1) 0.8 0.8
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2
End
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
17/19
16.90
12.20
1.60 3.50 9.75
5.08
B
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) All dimensions are in mm.
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 60 30.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 16 1.5 1.5 11.5 6.5 2
End
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
18/19
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19/19