Electromagnetic Interference (EMI) in Power Supplies

EMI in power supplies
Alfred Hesener Fairchild Semiconductor Europe
www.fairchildsemi.com
Agenda Introduction Different types of EMI and their characteristics Regulations and standards for EMI Measurement and sources of EMI Conducted EMI Radiated EMI EMI as integral part of the design flow Conclusion
Company Confidential
Page 2
Introduction EMI more and more complex Increasing power density, faster switching, higher currents are causing g more EMI-related issues Conducted / radiated EMI Further changes complicating things New semiconductor switches are faster New topologies (e.g. Quasi-resonant) How to achieve hi a robust b design? d i ? Embed EMI into the design flow from the beginning What is the goal? Emit low EMI levels to meet regulations (dont disturb other applications nearby) EMI compliance Work properly (be self-compliant) Robustness
Company Confidential Page 3 www.fairchildsemi.com
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Different types of EMI and their characteristics

Emitter Reduce emission of source
Galvanic Coupling
Capacitive Coupling Receiver
Inductive Coupling
Wave Coupling
Reduce transmission in the system
Reduce sensitivity of receiver

Magnetic field Typically > 30MHz Large dI/dt Magnetic shield
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Galvanic coupling of signals in the circuit Typically <30MHz Any noisy An nois signal in the system (RC) filtering
Electric field Medium-high frequencies Large dV/dt Metal shield
Radiated wave traveling in the system High frequencies Fast switching s itching Electromagnetic shield
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Regulations and standard for EMI EN550xx and EN61000 most important
Two main considerations: Limit the amount of emission which a given application generates Define minimum immunity levels a given application must tolerate EN550xx the EMI norm (class A = consumer, class B = industrial)
CISPR11, EN55011 for industrial, medical, scientific applications CISPR13, EN55013 for consumer applications CISPR14 EN55014 for CISPR14, f home h appliances, li power tools, t l involving i l i motion ti control t l CISPR15, EN55015 for lighting equipment CISPR22, EN55022 for computing applications CISPR16, EN55016 defines the measurement method
Many applications being tested against a mix of different norms (e.g. EN55022 for frequencies >150kHz, EN55015 for frequencies <150kHz) EN61000 the PFC norm (equipment classes see next page)
Noise current up to the 40th harmonic of the line frequency ( <= 2.0kHz 2 0kHz (e (e.g. g EU) / 2.4kHz 2 4kHz (e.g. (e g US)) EN61000-3-2 for applications < 16A EN61000-3-12 for applications with 16A75A EN61000-4-7 defines the measurement and evaluation method EN61000 4 16 for common EN61000-4-16 common-mode mode disturbances up to 150kHz Many further standards exist, dealing with more specialized applications EN61000 specifies maximum harmonic currents, not a power factor
Page 7 www.fairchildsemi.com
Regulations and standard for EMI Equipment classes for EN61000

Class A Equipment 3phase equipment, household appliances, tools dimmers for incandescent lamps, tools, lamps audio equipment, everything not B, C or D Portable tools, tools Arc welding equipment Power > 75W Comment Limit values are defined as absolute values Limit values are defined as absolute values Limit values defined as relative values to first harmonic Limit values defined only for 3rd and 5th harmonic, relative to first harmonic Limit values relative per input power
> 75W
Lighting
> 25W
Lighting
< 25W 75W 600W
Personal Computer, Monitor, Television

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The power factor Simulation results

Simulation shows input and bus cap voltage, and current spikes in the input High dI/dt illustrates significant harmonic content Simulation below is 100W class A SMPS, SMPS would require a (active) PFC EN61000 considers harmonics to 2kHz/2.4kHz this would be a pretty large filter if realized with passive components Attenuation of this filters components p for higher g frequencies q (conducted ( EMI) ) would be low, due to potentially high parasitic capacitance, and it may not help with CM noise at all
Limit values for EN61000 class D
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Measurement and sources of EMI Conducted EMI test setup
Line Impedance Stabilizer Network (LISN): - Defined impedance for noise voltage measurement - Blocking the noise coming from the grid
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Measurement and sources of EMI Conducted EMI limits

Vertical: Amplitude in dbuV Horizontal: Frequency in MHz Solid blue line: EN55011/22 limits for average Solid red line: EN55022 limits for quasipeak Red spectrum line: quasipeak measurement values Black spectrum line: average measurement values
Frequency Limit (dbuV) Limit (V) Comment 9kHz ... 50kHz 110 316mV EN55011 Quasipeak 50kHz ... 150kHz 90 ... 80 32mV ... 10mV EN55011 Quasipeak EN55022 B, B Quasi-peak; Quasi peak; linearly falling 66 ... 56 2mV ... 0.63mV with log (frequency) 150kHz ... 500kHz EN55022 B, Average; linearly falling with 56 ... 46 0.63mV ... 0.2mV log (frequency) 56 630uV EN55022 B, Quasi-peak 0.5MHz ... 5MHz 46 200uV EN55022 B, Average 60 1mV EN55022 B, Quasi-peak 5MHz ... 30MHz 50 316uV EN55022 B, Average
Frequency range 9kHz ... 150kHz 150kHz ... 30MHz 30MHz ... 1GHz
Bandwidth (-6dB) 200 Hz 9 kHz 120kHz
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Conducted EMI Differential and common mode noise

In most cases, two different noise voltages will appear at nodes L and N Separate into differential (DM) and common mode (CM) noise Different filtering required for both noise types! Differential mode noise appears out of phase at the nodes Noise current flows in a loop between L and N ( (1) 1 ) Common mode noise appears in phase at both nodes Noise current flows via ground and back through the lines (2)
L DM noise current 1 N
2 CM noise current
Ground
Parasitic Coupling
Page 13
Measurement and sources of EMI Conducted EMI as result of switching

The main switching action will cause a current flow into / out of the bulk cap, at the main switching frequency This current flow causes a noise voltage to appear at the input Typical values are ESRmax = 1.9, ESLtyp = 20nH Impedance p minimum is ESR, , will increase at high g frequencies q EMI is primarily a result from parasitic elements in the circuit
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Conducted EMI Different filter types

Filter type Balanced Unbalanced
Pi filter 18 db / oct 60 db / dec T filter 18 db / oct 60 db / dec L filter filt 12 db / oct 40 db / dec
(Calculation of component values is explained later)
Conducted EMI Common mode vs differential mode For common mode noise, the line to line capacitors do not help
Only y the inductors contribute (but ( typically yp y they y are too small) )
Introduce a common mode choke

Designed for (large) leakage inductance to provide DM filter function
Choke (with leakage inductance)
Line to line cap
Example of a 200W power supply input stage with a two-stage CM choke

Conducted EMI Calculation of the filter components

Design impedance
Input data
Line frequency Minimal RMS voltage Maximum RMS load current Lowest switching frequency
fLine Vmin Imax fswmin
Attenuation
Calculate the component values Filter topology
Determine required attenuation level p per frequency q y from simulation or measurement
Determine suitable filter topology and cutoff frequency so attenuation goals are met with a margin g g of 6...10dB (but fcut > 10* fLine)
Conducted EMI Simulation and results Simulation for compliance: Noise generation and filter attenuation are mostly y determined by yp parasitic elements in the circuit Noise generation: Leakage inductance, ESR, ESL, capacitive coupling (to ground) Attenuation: Core frequency response, capacitive coupling Most simulators allow to set parasitics for all passive components Using a behavioural model for the noise (current) source is a good approximation Simulation for function and robustness: Very complex better to design accordingly, test a prototype, implement fixes in final circuit
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Conducted EMI Example values for parasitics Inductor

Parallel capacitance e.g. g 50pF p for 1mH Series resistance e.g. g 1.9 Ohm for 100uF Series inductance e.g. 20nH for 100uF Leakage inductance e.g. 10uH for 200uH (prim) Parasitic capacitance e g 50pF for EF25 e.g. Leakage inductance e.g. 300uH for 10mH P Parasitic i i capacitance i e.g. 100pF for 10mH
Capacitor
Transformer
CM choke
Conducted EMI Simulation circuit example

Bus cap Load
0.05A 100kHz
LISN Input voltage 230V / 50Hz CM filter Parasitic coupling
DM filter (T type)
Page 20
Conducted EMI Simulation results

without filter
EN55022 limits (quasi-peak)
with filter
EN55022 limits (quasi-peak)
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Radiated EMI What generates it?

Magnetic EMI is caused by changing currents:
Current (di/dt)
Vnoise =
RM RS + RM
*M*
dI dt
RS
Vnoise + Vmeas RM
Coupling factor M depends on: Distance, Di t area and d orientation i t ti of f the th disturbing magnetic loops Magnetic absorption between the loops Current risetime Impedance of the receiver
Radiated EMI Main contributions to radiated EMI

Avoid high dI/dt move to softer (slower switching) or zero-current switching Analyze the current flows at normal behavior of the circuit, circuit and check which elements will only see current flow in one part of the cycle these elements are very likely to be in a current loop with high dI/dt Reduce the coupling factor M between the magnetic loops Orientation Oi i of f the h current loops l should h ld be b orthogonal, h l not parallel. ll l The current loop areas should be made as small as possible Increase the distance between the emitting current loop and the loop picking p g up p the noise (energy ( gy transfer proportional p p to power p of 3) ) Magnetic shielding Make the signal processing nodes in the system as low-impedance as possible Current-based C b d signal i l transfer f Add additional resistors to Ground at sensitive Differential signaling
Reduce emission of source
Reduce transmission in the system system
Reduce sensitivity of receiver
Page 24
Radiated EMI How to measure radiated EMI
Page 25
Radiated EMI How to identify hot spots Use a two-channel scope Connect a (HV) probe to the main switching signal Connect the H-field probe to a probe amplifier (if necessary) and to the second channel (proper termination required) Use the main switching signal as a trigger signal Wander around the PCB to identify areas of large emission, then zoom in Take (static) pictures of the critical field signals to determine q y and quality q y factor ( (this can be used to identify y the frequency elements of the resonant tanks)
Page 26
Transformers radiating magnetic fields High leakage inductance == leakage field
P core h Pot has the h smallest ll field fi ld (not ( surprising) ii )
ER core better b than h E core (tighter ( i h winding) i di )
Toroid T id with ith exposed d core emits more than it should

Better B tt to t move air i gap to t center leg (may increase AC losses)

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E core stronger field due to leakage inductance
Radiated EMI - various issues (incomplete list..)

Leakage inductance fields External field of air gaps Diode reverse recovery M i l losing Materials l i their h i damping d i Caps becoming inductive Inductors becoming capacitive (secondary ( y side) ) chokes picking p g up p magnetic noise Ringing between parallel caps Ringing between parallel rectifiers Transformer shield ringing
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Example 1: 70W QR flyback supply 18MHz peak from transformer
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Example 1: 70W QR flyback supply Two different diodes in the snubber
Yellow: Drain voltage of main MOSFET Blue: Magnetic field at snubber
Fast snubber diode gives faster rise / fall times and lower losses Slow diode with much larger Qrr shows significant magnetic EMI Impact can not be seen in the node voltage need to investigate magnetic field to find out
Example 2: 300W CCM PFC board Strong EMI event at turn-off

Yellow: Drain voltage of MOSFET Blue: Magnetic field
At MOSFET
At Diode
Inside inductor
Medium EMI spike at the MOSFET, MOSFET high frequency ( (~40MHz) 40MHz) indicates ringing between Coss (780pF) and the parasitic inductance of the PCB and package (20nH), well damped, after which the inductor ringing takes over Smaller EMI spike at the (SiC) diode shows ringing at similar frequency, indicating that this is imposed p by y the power p MOSFET ( (in this case, , the equivalent q charge g of the diode is 100x smaller so the contribution is too) Long ringing tail of the inductor shows the energy flowing between the inductor and its parasitic capacitance g( (distributed air gap) g p) and the tail lasts for 800ns ( (high g Q) Field is strong Ringing frequency is ~9MHz, parasitic cap ~20pF (estimated) effective inductance is reduced by 40x at this frequency! (core material)
Example 3: 400W interleaved PFC PCB layout
Page 32
Example 3: 400W interleaved PFC Main difference between two boards
Prototype Prototype
Company Confidential Page 33
Production Production
10dB difference in magnetic field peak intensity
Example 4: 200W LLC power supply Turn-off of main LLC stage
Small EMI fields around the converter, most at leakage inductor (gapped core) which itself has small leakage Well-damped Well damped transformer resonance at 22.7MHz 70pF and 0.7uH leakage Not visible in the node voltage
100 /di 100ns/div
Red: Magnetic field at leakage ind. Pink: Phase node voltage g
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EMI as part of the design flow Design steps

Write the specification Select the topology Calculate the components Consider impedance of EMI filter Make circuit nodes low impedance (esp. control loop) Avoid high di/dt and dv/dt
EN550xx EN61000 Time for EMI testing Space for EMI filter
Topologies with low EMI
PFC
Page 36

Simulate the design g Simulate with a LISN model (but without filter) to predict noise Use behavioural model for the load to save simulation time Chose filter topology for needed attenuation levels, simulate again Put realistic values for parasitic elements Use an impedance analyzer t measure typical to t i l components and put these in
Build a prototype p yp Try to be close to final arrangement of compo components, so the coupling and radiated EMI can be tested Minimize high-current loop area Minimize node area with high dv/dt Leave some space at the input to put a EMI filter
Test the prototype p yp After checking the function, perform pre pre-compliance compliance EMI testing to see the real conducted noise Check CM noise on a grounded metal plate (worst case) Perform first radiated EMI tests to identify critical spots in the circuit Compare with simulation results and calibrate the models d l
Page 37

Add the EMI filter Build the EMI filter into the p prototype yp and perform p full functional test again Check if EMI filter impedance and possible resonances create any issues Perform pre-compliance testing again to see if the measured attenuation matches calculation Design the final version Test the final version
Final implementation will After full functional testing, g the noise signature g change p perform p pre-compliance p of conducted DM and CM testing especially and high as well as radiated EMI and low line conditions (Alternate source) compoover full load range nents used in production Try out different passive may have different paracomponents (including sitics, so the EMI behaviour different vendors) may change need to add Build several prototypes appropriate margins and check if the noise results are repeatable
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Conclusion There is no silver bullet! Switching currents and voltages will generate EMI Assess implications early in the design cycle, and prepare g cycle y the p problem is detected, the more The later in the design expensive it is to fix Use topologies and control ICs that create less noise to begin with LLC, C QR Q fl flyback, b k PSR S References:
[1] [2] [3] [4] [5] Didier Bozec, David Cullen, Les McCormack, John Dawson, Bryan Flynn: An investigation into the EMC emissions from switched mode power supplies and similar switched electronic load controllers operating at various loading conditions (IEEE Symposium on Electromagnetic Compatibility, Santa Clara CA, August 2004) Bruce Carsten: Application note for H-field probe (http://bcarsten.com) Jonathan Harper: Electromagnetic compatibility design for power supplies (Fairchild Semiconductor power seminar series 2004/2005) Richard Lee Ozenbaugh: EMI filter design (CRC, Nov 2000) Christophe Basso: Switch-Mode Power Supplies SPICE Simulations and Practical Designs, McGraw-Hill, 2008 Page 40 www.fairchildsemi.com
Follo us Follow s on Twitter T itter @ http://twitter.com/fairchildSemi http://t itter com/fairchildSemi View product and company videos @ http://www.fairchildsemi.com/video/index.html Listen to our podcasts @ http://www.fairchildsemi.com/company/media_center/index.html Comment on our blog @ http://engineeringconnections.com/blog/
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Electromagnetic Interference (EMI) in Power Supplies

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EMI in power supplies

Alfred Hesener Fairchild Semiconductor Europe

Different types of EMI and their characteristics

Capacitive Coupling Receiver

Reduce transmission in the system

Reduce sensitivity of receiver

Electric field Medium-high frequencies Large dV/dt Metal shield

Regulations and standard for EMI Equipment classes for EN61000

< 25W 75W 600W

Personal Computer, Monitor, Television

The power factor Simulation results

Limit values for EN61000 class D

Measurement and sources of EMI Conducted EMI test setup

Measurement and sources of EMI Conducted EMI limits

Bandwidth (-6dB) 200 Hz 9 kHz 120kHz

Conducted EMI Differential and common mode noise

Measurement and sources of EMI Conducted EMI as result of switching

Conducted EMI Different filter types

Introduce a common mode choke

Choke (with leakage inductance)

Line to line cap

Example of a 200W power supply input stage with a two-stage CM choke

Conducted EMI Calculation of the filter components

fLine Vmin Imax fswmin

Calculate the component values Filter topology

Determine required attenuation level p per frequency q y from simulation or measurement

Conducted EMI Example values for parasitics Inductor

Conducted EMI Simulation circuit example

LISN Input voltage 230V / 50Hz CM filter Parasitic coupling

Conducted EMI Simulation results

Radiated EMI What generates it?

Radiated EMI Main contributions to radiated EMI

Reduce emission of source

Reduce transmission in the system system

Reduce sensitivity of receiver

Radiated EMI How to measure radiated EMI

Transformers radiating magnetic fields High leakage inductance == leakage field

P core h Pot has the h smallest ll field fi ld (not ( surprising) ii )

ER core better b than h E core (tighter ( i h winding) i di )

Toroid T id with ith exposed d core emits more than it should

Better B tt to t move air i gap to t center leg (may increase AC losses)

E core stronger field due to leakage inductance

Radiated EMI - various issues (incomplete list..)

Example 1: 70W QR flyback supply 18MHz peak from transformer

Example 1: 70W QR flyback supply Two different diodes in the snubber

Yellow: Drain voltage of main MOSFET Blue: Magnetic field at snubber

Example 2: 300W CCM PFC board Strong EMI event at turn-off

Example 3: 400W interleaved PFC PCB layout

Example 3: 400W interleaved PFC Main difference between two boards

10dB difference in magnetic field peak intensity

Example 4: 200W LLC power supply Turn-off of main LLC stage

100 /di 100ns/div

Red: Magnetic field at leakage ind. Pink: Phase node voltage g

EMI as part of the design flow Design steps

Topologies with low EMI

EMI as part of the design flow Design steps

EMI as part of the design flow Design steps

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