Applied Materials Science

Applications of Engineering Materials in Structural, Electronics, Thermal, and Other Industries

Deborah D.L. Chung

CRC Press Boca Raton London New York Washington, D.C.

Library of Congress Cataloging-in-Publication Data

McLachlan, Alan Molecular biology of the hepatitis B virus / Alan McLachlan p. cm. Includes bibliographical references and index. ISBN 0-8493-1073-3 1. Hepatitis B virus. 2. Biologymolecular. I. McLachlan, Alan. II. Title. [DNLM: 1. Hepatitis B virus. QW 710 G289h] QR749.H64G78 2000 616.0149dc20 Catalog record is available from the Library of Congress

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2001 by Chapman & Hall/CRC CRC Press LLC St. Lucie Press Lewis Publishers Auerbach is an imprint of CRC Press LLC No claim to original U.S. Government works International Standard Book Number 0-8493-1073-3 Library of Congress Card Number ??-????? Printed in the United States of America 1 2 3 4 5 6 7 8 9 0 Printed on acid-free paper

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Dedication

To the memory of my nanny, Ms. Kwai-Sheung Ng (18931986)

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The Author
Deborah D. L. Chung is Niagara Mohawk Power Corporation Endowed Chair Professor, Director of the Composite Materials Research Laboratory, and Professor of Mechanical and Aerospace Engineering at the State University of New York (SUNY) in Buffalo. She holds a Ph.D. in materials science and an S.M. degree from the Massachusetts Institute of Technology (M.I.T.), as well as an M.S. in engineering science and a B.S. in engineering and applied science from the California Institute of Technology. Dr. Chung is a Fellow of ASM International and of the American Carbon Society, and is past recipient of the Teacher of the Year Award from Tau Beta Pi; the Teetor Educational Award from the Society of Automotive Engineers; the Hardy Gold Medal from the American Institute of Mining, Metallurgical, and Petroleum Engineers; and the Ladd Award from Carnegie Mellon University. Dr. Chung has written or cowritten 322 articles published in journals (88 on carbon, 107 on cement-matrix composites, 31 on metal-matrix composites, 62 on polymer-matrix composites, 12 on metal-semiconductor interfaces, 5 on silicon, and 17 on other topics). She is the author of three books, including Carbon Fiber Composites (Butterworth, 1994) and Composite Materials for Electronic Functions (Trans Tech, 2000), and has edited two books including Materials for Electronic Packaging (Butterworth, 1995). Dr. Chung is the holder of 16 patents and has given 125 invited lectures. Her research has covered many materials, including lightweight structural, construction, smart, adsorption, battery electrode, solar cell, and electronic packaging materials.

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Preface
Materials constitute the foundation of technology. They include metals, polymers, ceramics, semiconductors, and composite materials. The fundamental concepts of materials science are crystal structures, imperfections, phase diagrams, materials processing, and materials properties. They are taught in most universities to materials, mechanical, aerospace, electrical, chemical, and civil engineering undergraduate students. However, students need to know not only the fundamental concepts, but also how materials are applied in the real world. Since a large proportion of undergraduate students in engineering go on to become engineers in various industries, it is important for them to learn about applied materials science. Due to the multifunctionality of many materials and the breadth of industrial needs, this book covers structural, electronic, thermal, electrochemical, and other applications of materials in a cross-disciplinary fashion. The materials include metals, ceramics, polymers, cement, carbon, and composites. The topics are scientically rich and technologically relevant. Each is covered in a tutorial and up-to-date manner with numerous references cited. The book is suitable for use as a textbook for undergraduate and graduate courses, or as a reference book. The reader should have background in fundamental materials science (at least one course), although some fundamental concepts pertinent to the topics in the chapters are covered in the appendices.

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Contents
Chapter 1 Introduction to Materials Applications 1.1 Classes of Materials 1.2 Structural Applications 1.3 Electronic Applications 1.4 Thermal Applications 1.5 Electrochemical Applications 1.6 Environmental Applications 1.7 Biomedical Applications Bibliography Chapter 2 2.1 2.2 Materials for Thermal Conduction

Introduction Materials of High Thermal Conductivity 2.2.1 Metals, Diamond, and Ceramics 2.2.2 Metal-Matrix Composites 2.2.2.1 Aluminum-Matrix Composites 2.2.2.2 Copper-Matrix Composites 2.2.2.3 Beryllium-Matrix Composites 2.2.3 Carbon-Matrix Composites 2.2.4 Carbon and Graphite 2.2.5 Ceramic-Matrix Composites 2.3 Thermal Interface Materials 2.4 Conclusion References Chapter 3 Polymer-Matrix Composites for Microelectronics

3.1 3.2 3.3

Introduction Applications in Microelectronics Polymer-Matrix Composites 3.3.1 Polymer-Matrix Composites with Continuous Fillers. 3.3.2 Polymer-Matrix Composites with Discontinuous Fillers 3.4 Summary References

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Chapter 4

Materials for Electromagnetic Interference Shielding

4.1 Introduction 4.2 Mechanisms of Shielding 4.3 Composite Materials for Shielding 4.4 Emerging Materials for Shielding 4.5 Conclusion References Chapter 5 5.1 5.2 5.3 Cement-Based Electronics

Introduction Background on Cement-Matrix Composites Cement-Based Electrical Circuit Elements 5.3.1 Conductor 5.3.2 Diode 5.4 Cement-Based Sensors 5.4.1 Strain Sensor 5.4.2 Damage Sensor 5.4.3 Thermistor 5.5 Cement-Based Thermoelectric Device 5.6 Conclusion References Chapter 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 Self-Sensing of Carbon Fiber Polymer-Matrix Structural Composites

Introduction Background Sensing Strain Sensing Damage Sensing Temperature Sensing Bond Degradation Sensing Structural Transitions 6.7.1 DSC Analysis 6.7.2 DC Electrical Resistance Analysis 6.8 Sensing Composite Fabrication Process 6.9 Conclusion References Chapter 7 7.1 7.2 7.3 7.4 Structural Health Monitoring by Electrical Resistance Measurement

Introduction Carbon Fiber Polymer-Matrix Structural Composites Cement-Matrix Composites Joints 7.4.1 Joints Involving Composite and Concrete by Adhesion

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7.4.2 Joints 7.4.3 Joints 7.4.4 Joints 7.4.5 Joints 7.5 Conclusion References Chapter 8 8.1 8.2 8.3

Involving Involving Involving Involving

Composites by Adhesion Steels by Fastening Concrete by Pressure Application Composites by Fastening

Modication of the Surface of Carbon Fibers for Use as a Reinforcement in Composite Materials

Introduction to Surface Modication Introduction to Carbon Fiber Composites Surface Modication of Carbon Fibers for Polymer-Matrix Composites 8.4 Surface Modication of Carbon Fibers for Metal-Matrix Composites References Chapter 9 Corrosion Control of Steel-Reinforced Concrete

9.1 Introduction 9.2 Steel Surface Treatment 9.3 Admixtures In Concrete 9.4 Surface Coating on Concrete 9.5 Cathodic Protection 9.6 Steel Replacement 9.7 Conclusion Acknowledgment References Chapter 10 Applications of Submicron-Diameter Carbon Filaments 10.1 10.2 10.3 Introduction Structural Applications Electromagnetic Interference Shielding, Electromagnetic Reection, and Surface Electrical Conduction 10.4 DC Electrical Conduction 10.5 Field Emission 10.6 Electrochemical Application 10.7 Thermal Conduction 10.8 Strain Sensors 10.9 Porous Carbons 10.10 Catalyst Support 10.11 Conclusion Acknowledgment References
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Chapter 11 Improving Cement-Based Materials by Using Silica Fume 11.1 Introduction 11.2 Workability 11.3 Mechanical Properties 11.4 Vibration Damping Capacity 11.5 Sound Absorption 11.6 Freeze-Thaw Durability 11.7 Abrasion Resistance 11.8 Shrinkage 11.9 Air Void Content and Density 11.10 Permeability 11.11 Steel Rebar Corrosion Resistance 11.12 Alkali-Silica Reactivity Reduction 11.13 Chemical Attack Resistance 11.14 Bond Strength to Steel Rebar 11.15 Creep Rate 11.16 Coefcient of Thermal Expansion 11.17 Specic Heat 11.18 Thermal Conductivity 11.19 Fiber Dispersion 11.20 Conclusion References Appendix A Electrical Behavior of Various Types of Materials Appendix B Temperature Dependence of Electrical Resistivity Appendix C Electrical Measurement Appendix D Dielectric Behavior Appendix E Electromagnetic Measurement Appendix F Thermoelectric Behavior Appendix G Nondestructive Evaluation Appendix H Electrochemical Behavior Appendix I Appendix J The pn Junction Carbon Fibers

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