THE VEECO DC SPUTTERING SYSTEM

OPERATION MANUAL

(Reference Person: Randy Hoffman )

Department of Electrical and Computer Engineering

Oregon State University

1 HISTORY
Date Name Changes
1989 John Ebner, Hyungmo Yoo,
Tagore Kollipara, Leon Ungier Original document
July 4, 2001 Jeff Bender Document revised.
July 25, 2001 Randy Hoffman Revisions.

2 INTRODUCTION
The function of the Veeco Sputtering system is based on the principle of surface abrasions by ion
bombardment. The plasma of a stable DC gas (Ar, Ar/O2 ) discharge provides positive ions that
are extracted and accelerated by the application of a large DC potential (∼800 V) between the ion
source assembly and the target chamber (target chamber is at ground potential). The resulting
homogeneous ion beam, collimated (by a grid system) and monoenergetic, bombards the surface of
the target, removing atoms which are then deposited onto the substrate.
The principal components of the Veeco sputtering system are the ion source, target and substrate
fixture assemblies, and vacuum system.

2.1 Ion source

The function of the ion source is to continuously supply an adequate number of positive ions for
the ion beam. It is a low pressure gas discharge contained in a vertical cylindrical chamber on top
of the system. It incorporates the following features:

1. A hot filament electron emitter (the cathode), which is centrally located within the discharge.

2. A molybdenum cylinder (the anode), surrounding the cathode, which provides a radial electric
field for the gas discharge (ARC).
 3. A solenoidal electromagnet mounted on the outside of the ion source chamber which produces
an axial magnetic field, perpendicular to the electric field, thus deflecting the electrons into
cycloidal trajectories and maximizing the number of collisions per electron emitted by the
cathode.

4. An automatically controlled gas leak valve that regulates the gas flow for the discharge.

5. A protective, grounded metal shroud that also serves as a guide for the cooling air flow
produced by a centrifugal blower.

Ion extraction and acceleration is accomplished by the application of a large DC potential

between the ion source assembly and the target chamber. A set of three parallel grids between the
ion source and the target chamber facilitates collimation of the ion beam. The grid assembly also
serves to restrict gas flow through the system, thus maintaining a pressure differential between the
ion source chamber and the target chamber. This allows the coexistence of a high enough pressure
in the ion source chamber to maintain a stable discharge, and a low enough pressure in the target
chamber to keep the mean free path for the ion beam and sputtered particles sufficiently large.

2.2 Target chamber

The target chamber, in which the sputter deposition takes place, contains the following elements:

1. The neutralizing filament, positioned so that almost its entire length is immersed in the ion
beam. The filament emits electrons in order to neutralize the positive space charge of the
ion beam, thus eliminating spatial divergence due to electrostatic forces. Another purpose is
to eliminate any buildup of surface charge on the target, which, in theory, allows insulating
materials to be etched with the same uniformity as conductive materials (although, practically,
this is probably not be the best system for use in the deposition of insulators).

2. The target holder, a water cooled copper plate, which is insulated from ground and electrically
connected to the control panel (target current). The target holder can accommodate up to
three targets simultaneously; the appropriate target is rotated into place, at a 45o angle to
the incident ion beam. The target can be selected externally (i.e. while under vacuum).

3. Substrate holder, with rotational capability to enhance film uniformity.

4. Shutter, to cover substrate before and after deposition.

2.3 Vacuum system

The vacuum system consists of a diffusion pump backed by a mechanical pump, and a liquid
nitrogen cold trap; the mechanical pump is also used to rough the chamber. The vacuum system
is equipped with an automatic controller (AVC1000) that raises and lowers the hoist and controls
all valves, based on user-defined pressure and timing setpoints. The vacuum system should always
be run in automatic mode, since this enables pressure and timing setpoints and prevents damage
to the system. Manual mode should only be used by a person familiar with the operation of the
vacuum system and only under special circumstances.
Pneumatic valves are currently supplied with high-pressure (80 psi) nitrogen, rather than com-
pressed air. Thus the nitrogen gas supply should be verified prior to operating this system. The
cooling water valves should always be left open when the diff pump is running, and should not be
turned off until the diff pump has had sufficient time to cool after being shut down.
3 OPERATION PROCEDURE
3.1 Vacuum system startup and sample loading
1. The vacuum system may be run in automatic or manual mode. Automatic mode should
be used under normal circumstances, as this enables safety interlocks for time delays and
pressure. Manual mode should be used only if absolutely necessary, and only by a person
familiar with the operation of the vacuum system. Instructions here are given for automatic
mode operation only.

2. If the vacuum system is shut down (i.e. diffusion pump and mechanical pump indicator lights
are off), it must be powered up.

(a) Make sure the vacuum system is in AUTO (AUTO/MAN selector switched to AUTO).
(b) Open cooling water valves.
(c) Make sure nitrogen pressure is high enough to operate the pneumatic valves (i.e. ∼
80 psi). The system currently runs on nitrogen rather than compressed air, so be sure
the nitrogen pressure will remain high enough for operation (i.e. the tank is not nearly
empty). The system may be switched over to compressed air at some point in the future,
so disregard the above if this is the case.
(d) Open nitrogen (or compressed air) valve.
(e) Press the PWR UP switch. The mechanical pump will start, followed by the diffusion
pump after short delay. The diffusion pump must now be allowed to warm up before
going to high vac. A time delay setpoint (currently set to 30 minutes) prevents further
activity in automatic mode until the diffusion pump is functioning. Normally, the diff
pump should be given a minimum of 1 hour to warm up before placing the system in
high vac.

3. Check the foreline pressure; it should always less than ∼100 mTorr (typically ∼50 mTorr).
Re-check the foreline pressure periodically during operation of the system.

4. Put liquid nitrogen into the cold trap through the funnel at the back until nitrogen comes
out liquid.

5. Press STDBY/VENT key, and hold for several seconds (if the key is momentarily depressed,
the system will go into STANDBY, i.e. high vac valve closed, but will not vent). After the
system is at atmospheric pressure, the hoist will go up.

6. Load the sample (always wearing gloves) and move the desired target into position.

7. Press the START key. The hoist will go down; the vacuum system controller will rough the
chamber, then switch to high vac.

8. DO NOT use the RG1000 ionization gauge (IG1). It may be connected to pressure instabilities
when the automatic leak valve controller (APC2000) is enabled. IG1 is not necessary for
system operation.

9. Turn on the APC2000 by pressing POWER. Wait a few seconds, then turn on the ionization
gauge by pressing the FILAMENT button.

10. Pump the chamber to < 5 E-6 Torr.

3.2 Igniting the discharge and extracting the ion beam
1. Open the Ar (Ar/O2 ) tank valve. Make sure the regulator is set to ∼8 psi (< 10 psi).

2. Start Ar (Ar/O2 ) flow by pressing CONTROL on the APC2000. Wait until the pressure
stabilizes at 1 E-4.

3. Let the gas flow for ∼ 5-10 minutes (or more) to flush out unwanted components that may
have leaked into the gas line.

4. Make sure that all power supplies are OFF and voltages turned down, then turn on the
ISOLATION TRANSFORMER breaker. This supplies power to the entire rack (excluding
the APC2000).

5. SLOWLY turn up the CATHODE current to ∼ 15 A (20 A max). As the cathode is a

hot filament, it should always be turned on and off gradually (i.e. ∼ 2-3 A per minute) to
maximize its lifetime.

6. Slowly turn up the ARC (anode) voltage to ∼ 40 V (30-60 V). The discharge should ignite as
the ARC power is increased, usually between 20 and 30 V. Discharge ignition is indicated by
a non-zero ARC current. The ARC current then increases as the ARC voltage is increased.
The ARC current is typically ∼ 0.6-1.0 A.

7. Turn on the MAGNET power supply, and slowly increase the current to ∼ 0.6-0.8 A.

8. The discharge (ARC) current can now be varied by increasing or decreasing the CATHODE
current (increases or decreases the number of electrons emitted by the cathode filament)
and by increasing or decreasing the magnet current (increases or decreases the number of
collisions per electron emitted by the cathode). If the discharge goes out during operation
(ARC current reads zero), it should re-ignite if the magnet current is decreased momentarily.

9. Turn on Suppressor Power Supply and slowly increase to 250 V. To minimize current on
middle and bottom grids during ion beam extraction process, turn acceleration voltage (see
next step) up to ∼ 400 V before turning suppressor to full power. The current on the middle
and bottom grids should not exceed ∼ 15 mA while extracting the ion beam, and should be
less than ∼ 1-3 mA during normal operation.

10. Turn on ACCELERATION power supply switch, then depress the HV (high voltage) button.
Slowly increase voltage to ∼ 750 V (600-1000 V). The ACCELERATION power supply current
is typically ∼ 40-50 mA.

11. Turn on NEUTRALIZER power supply and SLOWLY increase current until TARGET CUR-
RENT reads ∼ 0 mA or is slightly positive. As the neutralizer is a hot filament, it should
be turned on and off slowly to increase lifetime (similar to cathode filament). The necessary
neutralizer current is typically ∼ 2-3 A.

12. The target is now being sputtered. Allow the target to sputter for ∼ 5-10 minutes (or more)
to remove surface contamination. This time should be increased if the chamber has been
open for an extended period of time, if the target has just been installed, or when changing
from one target to another.
3.3 Sputter deposition
1. Open the shutter. Move the substrate holder into position (at a 90o angle to the ion beam,
45o angle to the target). Turn on substrate rotation.

2. Allow sputter deposition to continue for the desired time.

3. When done, stop substrate rotation, move substrate back to original location, and cover with
shutter.

3.4 Extinguishing the discharge

1. Slowly decrease the ACCELERATION voltage to zero. Simultaneously decrease the neutral-
izer and suppressor as necessary to minimize current on the grids (again, grid currents should
be less than ∼ 15 mA). Be sure to SLOWLY decrease current to the neutralizer filament.
When the ACCELERATION voltage has been decreased to zero, press the HV OFF button
and switch off the ACCELERATION power supply.

2. Slowly decrease the ARC voltage to zero. The ARC current will drop to zero suddenly as the
discharge is extinguished.

3. Turn off gas flow (once discharge has been extinguished) by pressing the CONTROL button
on the APC2000.

4. Slowly decrease the remaining powered components. Be sure to decrease cathode filament
current SLOWLY.

5. Leave the ISOLATION TRANSFORMER breaker on and allow the system to cool down for
∼ 10 minutes.

6. Make sure all power supplies are OFF, the turn off the ISOLATION TRANSFORMER
breaker. Vent the system as explained earlier and remove sample. Be sure to turn off the ion
gauge before venting (or going to standby).

3.5 System shutdown

1. If not sputtering another sample, lower the hoist and let the system pump to high vac as
explained earlier.

2. If the system will not be used further for the day, press the STDBY/VENT key momentarily
to close the high vac valve and place the system in standby. Leave cooling water running and
nitrogen valve open.

3. If the system will not be used for several days, place the system in standby, then press the
PWR DN key. The diff pump will be turned off, and allowed to cool down for approximately
30 minutes while the mechanical pump continues pumping the foreline. When the mechanical
pump is turned off (and diff pump is sufficiently cool), the cooling water and nitrogen valves
may be closed.

NOTE: If an error occurs, press the CLEAR button to clear the error. If the error does not
clear, the situation that caused the error has not been corrected. Look in the manual to determine
the cause of the error, take care of the situation, then again press CLEAR to go back to normal
operation. Refer to the manual for instructions on modifying setpoints, interpretation of error
codes, and further details of system operation.
NOTE: To prevent damage to the middle and bottom grids, the ARC current should be 0.75 A
or less for ACCELERATION voltages smaller than 800 V, and 0.5 A or less for ACCELERATION
voltages smaller than 600 V.