Computer Aided Design for Microwave Circuits

University of Perugia

Background Experience

The research group at the University of Perugia has been involved since 15 years in the analysis
and design of microwave and millimeter-wave circuits in various technologies, from conventional
(waveguide) to integrated (both hybrid and monolithic) circuits.
The activity has been focused on both theoretical and experimental aspects. From the theoretical
point of view an electromagnetic simulator, based on the Finite Difference Time Domain (FDTD)
method, has been developed. This simulator is suitable for the analysis of structures with arbitrary
geometry and has been extended in such a way as to rigorously model the interaction between
electromagnetic fields and electronic devices (diodes, BJT, etc.). From the experimental point of
view a great effort has been devoted to the set-up of a Microwave Electronic Laboratory (MEL)
including a clean room and a test and measurement setup. At present, such laboratory is used for
manufacturing hybrid integrated circuits up to 20 GHz, and for the testing of waveguide circuits up
to 60 GHz.
The following presentation begins with an outline of the main features and capabilities of the FDTD
simulator developed at the University of Perugia. Then, for each research topic a brief abstract of
the work is given.

1 FDTD simulator
The FDTD method is based on the direct solution of Maxwell's time-dependent curl equations. To
this purpose, time and space are discretized according to the Yee's algorithm: in particular, the
space is divided in a finite number of elementary cells used for the mapping of electric and
magnetic fields. The time solution is obtained by an iterative scheme which evaluates the electric
and magnetic field components at alternate half-time steps. The following features have been
implemented in the code developed at the University of Perugia.

1.1 Variable mesh

In order to improve the efficiency of the method, a Variable Mesh is applied so that resolution of
the grid can be improved according to the variation of the electromagnetic field in the proximity of
singularities. However, if a variable mesh is adopted, slight local numerical anisotropies are
introduced in the grid. This is due to the variation of the numerical propagation constant along the
mesh.

1.2 Boundary conditions

From the theoretical point of view, the electromagnetic problem is completed once boundary
conditions for Maxwell's equations are defined. In terms of numerical implementation it leads to the
definition of some local constraints among the field components, according to the geometry of the
original structure. In practice, it is done by defining some kinds of walls: the electric wall, the
magnetic wall, the absorbing wall and the source wall. The first one is used to model perfect
conductors, the second one to model symmetry planes, and the last one to avoid reflection from
termination either in a waveguide problem and in an open-space one.
In the FDTD simulator developed at the University of Perugia several Absorbing Boundary
Condition (ABC) algorithms have been implemented. Among them it is worth mentioning: Mur's
first and second order, which have the advantage of being computationally fast and easy but suffer
fairly low accuracy; Perfectly Matched Layer (PML), which is general purpose and very accurate
but quite demanding in terms of computing resources; Modal Absorbing Boundary Conditions
(MABC) that allow a very efficient simulation of waveguide and coaxial circuits.
Source type boundary conditions are used to provide the proper field excitation of the structure.
Actually sources can be seen as time-varying boundary conditions. Interfaces between materials
with different dielectric permittivities and conductivities are other kind of boundary conditions that
are required expecially for the analysis of planar circuits.

1.3 Antenna and scattering problems

In order to study antenna and scattering problems two additional features are required, namely the
near-to-far field transform and the plane wave excitation. The former is based on the time-domain
equivalence theorem applied to a parallelepipedal surface enclosing the radiating structure. This
method is particularly suited for the analysis of planar antennas with finite ground plane. The latter
is based on the separation between incident and scattered field.

1.4 Lumped elements

Combining Lumped Element (LE) models of electronic devices and FDTD electromagnetic
simulation the so called LE-FDTD method is obtained. The accuracy of this method, however,
relies on the careful tuning of LE model parameters against the actual fabrication technology. This
is usually obtained by extracting parameters values from experimental procedures.

1.5 Global modeling

Within the framework of a full-custom IC design, an “a-priori” characterization of active devices
cannot be easily pursued. In these cases a more “technology-oriented” modelling technique can
be adopted. In this technique, no equivalent circuit should be defined, and thus no device-
parameter extraction procedure is needed. Semiconductor transport equations are instead directly
solved in a distributed fashion over an arbitrary domain.
This modellization strategy, conventionally referred to as “Global Modeling”, is based on the self-
consistent solution of Maxwell's equations and charge transport equations. In principle, the
derivation of the combined field and device simulation scheme is straightforward. It consist of
solving the curl Maxwell's equation in conjunction with the Boltzmann transport equations that, in
the simplest case, lead to the “drift-diffusion” approximation.

1.6 Modal Analysis

The Compact-2D-FDTD method is a specialized version of the 3D-FDTD simulator suited to
perform the modal analysis of planar guiding structures, operating in the ranges of microwave,
millimeter-wave and optical frequencies. Well known examples of such structures are microstrips,
coplanar waveguides and rib-waveguides. Since all of them are typically uniform along the
propagation direction, their modal character is influenced by the transverse geometry and physical
parameters only. This feature is exploited to obtain an accurate and computationally efficient
mode-solver known as Compact-2D-FDTD method.
2 Packaged microwave integrated circuits

Because of the increasing operating frequency and complexity of the circuits, the prediction of the
package behavior and of the interaction between the package and the enclosed circuit itself is
becoming more and more significant.
In most of the commercial microwave simulators, the presence of the package is taken into
account by simply considering the reactance introduced by the electric walls close to the circuit;
unfortunately, when the package supports resonant modes and when electromagnetic couplings
between different parts of the circuit are present, this approach is not valid anymore. To overcome
this limitation the full-wave FDTD simulator has successfully been used to investigate packaged
MMIC circuits. In particular, the behaviour of packaged single and coupled MMIC via-hole grounds
have been investigated; the theoretical analysis has been compared with experimental results
showing excellent agreement. Moreover, since the package introduces resonances, we have
investigated several different possibilities to choke off these resonances. It is shown that the
common practice of inserting a damping layer just below the lid is often not effective. In particular,
the importance of placing damping layers also on the side walls is demonstrated.

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Figure 1: Single packaged microstrip via-hole ground.

3 MMIC commercial package

The behaviour of a commercial MMIC package operating in the range 0-40 GHz has been
investigated. It consists of a mechanical support of kovar with a fused quartz substrate above it.
The area where the MMIC must be placed is enclosed between glass side walls and a top metallic
lid. The latter is connected to a ground plane by via-holes through the glass walls. Bias lines and
metal backed CPW terminations are also present. It is interesting to note that this package is
substantially an open structure. Within the operating frequency range, the electromagnetic
shielding is realized by metallic via-holes connecting the lid with the ground plane. In order to
compare theoretical and experimental results, a simple microstrip transmission line, inserted
between the input and output ports has been simulated.

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(a) MMIC package geometry (b) FDTD vs experiment

Figure 2: Comparison between theoretical and experimental results

4 Coplanar waveguide to slotline transitions

The uniplanar configuration has having a growing popularity in the area of microwave integrated
circuits. Fundamentals uniplanar configurations are the coplanar waveguide (CPW) and the
slotline(SL). Well known advantages with respect to the microstrip line configuration are: easy
shunt and series mounting, elimination of via holes, reduced radiation loss (for CPW), use of
thicker substrates overcompensate the necessity for air bridges to suppress the spurious slotline
mode in the CPW. The lack of accurate design tools however has prevented an extensive
application of uniplanar technology, of which the transition between CPW and SL is a key element.
The FDTD method has been employed to analyze several types of CPW-SL transitions including
the effects of the coaxial connectors, air bridges, shielding effects as well as interactions between
discontinuities. Theoretical simulations show excellent agreement with experimental data
appeared in the literature.

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Figure 3: Broad-band CPW-SL transition.

5 Hybrid integrated circuit bonding

The bonding wire interconnection is a key element for the fabrication of hybrid integrated circuits. It
is employed to connect solid state devices to passive circuit elements as well as multichip
modules. In spite of its small physical length, when millimeter-wave operations are required, the
discontinuity introduced by the bonding wire can significantly affect the performance of the whole
circuit.
At the University of Perugia, the bonding wire interconnection has been studied from the point of
view of its modeling and electrical characterization. In particular, two electrical models of the
bonding wire have been developed. First, the Finite Difference Time Domain (FDTD) method has
been adopted to rigorously analyze several bonding wire configurations (including multi-chip,
single- and double-wire structures) and to produce reference results. Then, a quasi-static model of
the bonding wire has been derived. This model is based on the representation of the structure with
four uniform transmission line sections. Such an approach is suitable for commercial microwave
CAD tools since the model parameters can be evaluated analytically from the dimensions of the
structure.

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Figure 4: Realized bonding wire interconnection and comparison of the developed models with the
measured data.
6 SPDT switch

A millimeter-wave “Single Pole, Double Throw” (SPDT) switch, realized with a Si-MMIC microstrip
technology has been studied. The analysis has been performed with both commercial, equivalent
circuit based simulator and mixed electromagnetic-device simulator. The sinusoidal RF signal
(ampl. 0.2 V, freq. 76 GHz) is injected at one end of the structure, and then forwarded along either
output branches, depending on the bias supplied by the square-wave generator (ampl. 2.5 V, freq.
214 MHz). Microstrip stubs and matched loads complete the structure. To isolate the inactive
branch, {p-i-n} diodes have been used, due to their high impedance in the off-state, and to the
compatibility with the high-resistivity silicon, planar process. Feasibility of such Si-MMICs, suitable
for operating frequencies up to 100 GHz, has been demonstrated.
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Figure 5: SPDT switch structure and performances: comparison between FDTD and hp-MDS
simulations.
7 Quasi-optical frequency multipliers

The basic quasi-optical frequency doubler is shown in Fig.6a. In this device the frequency
multiplication is achieved by a diode bridge connected to the center of two /2-dipoles. These
dipoles are placed in a cross configuration (referred to as crossed dipole): the longest one
receives the incoming power at the fundamental frequency (3.5 GHz in our prototype), while the
shortest one transmits the generated power at the doubled frequency (7.0 GHz in our prototype).
The advantages of such structure are the following. First, a good isolation between input and
output signals is achieved since incoming and outgoing waves are orthogonally polarized. Second,
the symmetry of the structure has been exploited to obtain a balanced topology which is
characterized by a good conversion efficiency (only even harmonics are generated within the
multiplier). However, the conversion efficiency of the above structure is intrinsically limited by the
omnidirectional nature of both receiving and transmitting antennas. To overcome the above
mentioned problem, the front-to-back ratio (and thus the directivity) of both receiving and
transmitting dipoles has been increased by additional layers with parasitic elements. The resulting
structure is essentially constituted by two Yagi-Uda antennas working at orthogonal polarizations.
The new, multi-layer structure can be better understood with the example of Fig. 6b. In this case
only two parasitic elements are adopted, one for each antenna of the frequency doubler. The
longest element (left of the photograph) is used as a reflector for the fundamental frequency
dipole; the shortest element (right of the photograph) is used as reflector for the doubled frequency
dipole.

(a) basic crossed-dipole multiplier structure (b) improved Yagi-Uda multiplier structure

(c) conversion gain: experiments (d) radiation patterns at f1=2f0: experiments

Figure 6: Crossed-dipole quasi-optical frequency doubler.

8 GaAs MMIC prototypes

Simple GaAs MMIC prototypes have been designed and experimented with the purpose to set-up
and refine both the design tools and the test and measurement facilities. The chips have been
manufactured by the Gec-Marconi foundry using the F20 process.

(a) low-pass filter with bonding pads (b) MeSFET with coplanar test ports

(c) low-pass filter measurement (d) MeSFET measurement

Figure 7: Manufactured GaAs MMICs and measured performances.

9 Radio-over-Fibre modulating devices

Radio-over-Fibre (RoF) networks integrate optical fibre backbones and wireless cellular networks
to provide broadband services to mobile, nomadic and fixed users. To generate and distribute RF-
modulated optical signals, two schemes are used: direct modulation schemes, where a
semiconductor laser is directly intensity-modulated by the RF-signal, and external modulation
schemes, where the optical carrier generated by the laser is subsequently modulated by the RF-
information through an electro-optical modulator.
The main modulating devices of such schemes have been analysed and modelled:
• the optical behaviour of an electro-absorption modulator has been analysed by using the
Compact-2D-FDTD method;
• a circuit model has been developed and used to study the non-linear behaviour of directly
modulated lasers.

(b) 1st optical mode: dispersion curve and

(a) structure.
spatial distribution.

Figure 8: Electro-absorption modulator analysis for external modulation schemes: structure (a) and results (b).

(b) non-linear behaviour: comparison between

(a) equivalent circuit model. measurements (solid) and predictions (dashed) in two
different bias conditions (38 mA circles; 50 mA triangles).

Figure 9: Semiconductor laser model for direct modulation schemes: schematic (a) and performance (b).
10 RoF-Predistortion circuit

Radio-over-Fibre (RoF) networks performances are typically influenced by the non-linearities due
to the modulating devices: lasers in direct modulation schemes, electro-optical modulators in
external modulation schemes.
A completely analog predistortion circuit has been developed to compensate the non-linearities
generated by directly modulated semiconductor lasers. This low-cost circuit, of industrial interest,
has a multi-decade correction capability, from 300 MHz up to 2 GHz; thus, it can be used
effectively to reduce second and third order harmonic (HD2 and HD3) and intermodulation (IM2
and IM3) distortions generated inside the CATV, GSM/DCS, GPRS and UMTS bands.
An average broadband compensation of at least 10 dB has been recorded during measurements;
the compensation magnitude can be further enhanced by specifically tuning the circuit for CATV or
cellular bands, alternatively.

(a) predistorter prototype. (b) predistorter schematic.

-80

-90
intensity (dB)

-100

-110 laser
laser+pred

-120
5 6 7 8 9 10
Pin (dBm)

(c) HD2 compensation: uncompensated (d) IM3 compensation: uncompensated laser (blue),
laser (red), compensated laser (green). compensated laser (red).

Figure 10: Predistortion circuit: structure (a)-(b) and performance (c)-(d).

11 Analyis of the EM fields interaction with biological tissues

The Em field inside a tissue, rapresented with spherical cells has been computed. The Hodgkin-
Huxley model has been implemented on the cell’s membrane by using the LE-FDTD method. Long
simulation time has been avoided using a quasistatic FDTD technique and reducing the
computational domain with the Periodic Boundary Conditions (PBC) based on the Floquet
theorem. The computation has been carried out at mobile communication frequencies (GSM900,
GSM1800). The basic structure is shown in Fig. 11. In Fig. 12 the electric field is showed on a
plane parallel to the direction of propagation. . The modulus of the electric field along the centre of
the structure is showed in Fig. 13.
X
Floquet Floquet
Floquet
Floquet

Floquet Y Floquet Z
Figure 11: Simulated structure

Figure 12: modulus of electric field in the zx plane of the structure at 900 MHz.

70

60
Electric field [V/m]

50

40

30

20

10

0
0 200 400 600 800 1000 1200 1400 1600 1800 2000
µm]
Distance from the surface of the tissue [µ

Figure 13: Electric Field along z axis at 900 MHz.

References

[1] P. Mezzanotte, M. Mongiardo, L. Roselli, R. Sorrentino, and W. Heinrich,”Analysis of

Packaged Microwave Integrated Circuits by FDTD,” IEEE Trans. Microwave Theory Tech., vol.
MTT-42, Sept. 1994, pp.1796-1801.

[2] P. Mezzanotte, M. Mongiardo, L. Roselli, R. Sorrentino, “FDTD Analysis of High

Performance MMIC Package,” 1994 IEEE MTT-S International Symposium Digest, San Diego,
May 1994, pp. 337-340.

[3] P. Ciampolini, P. Mezzanotte, L. Roselli and R. Sorrentino, “Accurate and efficient circuit
simulation with lumped-element FDTD technique,” IEEE Trans. Microwave Theory Tech., vol.MTT-
44, no. 12, 1996.

[4] P. Ciampolini, L. Roselli, G. Stopponi, “Integrated FDTD and Solid-State Device

Simulation,”IEEE Microwave and Guided Wave Letters, Vol. 6, n. 11, Nov. 1996, pp. 419-421.

[5] F. Alessandri, M.Dionigi, R. Sorrentino, and L.Tarricone, “Rigorous and Efficient

Fabrication-Oriented CAD and Optimization of Complex Waveguide Networks,” IEEE Trans.
Microwave Theory and Tech., vol. MTT-45, No. 12 , Dec.1997, pp. 2366-2374.

[6] F. Alessandri,M. Dionigi, M. Mongiardo, and R. Sorrentino, “Efficient Full-wave Automated

Design and Yield Analysis of Waveguide Components,” Int J. of RF and Microwave Computer –
Aided Engineering, Vol.8 no 3, May 1998, pp. 200-207.

[7] P. Ciampolini, L. Roselli, G. Stopponi, R. Sorrentino, “Global Modeling Strategies for the
Analysis of High Frequency Integrated Circuits,” IEEE Trans. Microwave Theory Tech., vol. 47,
n.6, June 1999.

[8] S. Helbing, M. Cryan, F. Alimenti, P. Mezzanotte, L. Roselli and R. Sorrentino, “A Novel

Crossed Dipole Structure for Quasi-Optical Frequency Doubler Applications,” in Proc. 29th Eu.
Microw. Conf., München, Oct. 1999, pp. 193-196.

[9] M. Cryan, S. Helbing, F. Alimenti, P. Mezzanotte , L. Roselli and R. Sorrentino, “Simulation,

Measurements and Structure Improvement of Quasi-Optical Multipliers,” in Proc. 29th Eu. Microw.
Conf., München, Oct.. 1999, pp. 37-40.

[10] F. Alimenti, P. Mezzanotte, L. Roselli, R. Sorrentino, “Modeling and Characterization of the

Bonding Wire Interconnection,” IEEE Trans. Microwave Theory Tech., vol. 49, n.1, Jan 2001, pp.
142-150.

[11] F. Zepparelli, F. Alimenti, P. Bassi, P. Mezzanotte, L. Roselli, G. Tartarini and R.

Sorrentino, “Rigorous Analysis of 3D Optical and Optoelectronic Devices by the Compact-2D-
FDTD Method”, Optical and Quantum Electronics, vol.31, n.9/10, pp. 827-841, Oct. 1999

[12] A. Schiavoni, G. Emili, M. Francavilla, P. Bertotto, L. Roselli, R. Sorrentino

“Electromagnetic field in a cluster of cells” BEMS, St. Paul, Minnesota, Giugno 2001
Structure of Organization

Organization of the Perugia research group

Prof. R. Sorrentino
Microwave Electronic Laboratory Head

Ing. R. Russo Dr. M. Stovali

Technician Technician
Responsable for the Clean room Public relations
Software communications

Ing. L. Roselli
Assistant Professor
Research Manager

Dr. M. Dionigi Dr. P. Mezzanotte Dr. F. Alimenti Ing. F. Zepparelli Ing. G. Emili
Assistant Researcher Assistant Researcher Contract Researcher PhD. Student PhD. Student
Frequency-Domain Modelling Responsable Time-Domain Modelling Responsable Microwave Circuits Responsable Microwave photonics Global Modelling strategies
Facilities

CAD tools for MMICs Design

1. 3D-LE-FDTD + Compact-2D-FDTD elecromagnetic simulator developed at the University
of Perugia.
2. Agilent-EEsof ADS 1.5
3. hp-MDS
4. hp-Momentum
5. hp-EEsof Series IV
6. Microwave Office (AWR)
7. CST Microwave Studio 3.0
8. Eagleware
9. Cadence 2001

Test and measurement equipment

1. Clean room (30 square meters; class 10000, 1000 and 100 under laminar air flow)
equipped with photo-etching process for the manufacturing of microwave hybrid planar
circuits.
2. Vector network analyzed Hewlett/Packard model hp-8720C; 45 MHz – 20 GHz.
3. Scalar network analyzer Hewlett/Packard model hp-8757A; up to 60 GHz.
4. Spectrum Analyzer Tektronik model 492P; up to 20 GHz.
5. Equipment for the manufacturing of bonding wire interconnections model West Bond
7400C (wedge-wedge wire bonder).
6. Power meter up to 20 GHz
7. Optical microscope
8. Probing station (Alessi) for on-wafer microwave measurements up to 40 GHz .

Figure 8: Clean room.

Key Personnel

Roberto Sorrentino
Roberto Sorrentino received the Doctor degree in Electronic Engineering from the University of
Rome "La Sapienza", Rome, Italy, in 1971, where he became an Assistant Professor of
Microwaves in 1974. He was adjunct professor at the University of Catania, at the University of
Ancona and at the University of Rome "La Sapienza" (1977-1982), where he then was an
Associate Professor from 1982 to 1986. In 1983 and 1986 he was appointed as a Research Fellow
at the University of Texas at Austin, Austin, USA. From 1986 to 1990 he was a Professor at the
University of Rome "Tor Vergata". Since November 1990 he has been a Professor at University of
Perugia, Perugia, Italy, where he was the Chairman of the Electronic Department and Director of
the Computer Center (1990-1995). He is presently the Dean of the Faculty of Engineering.
His research activities have been concerned with various technical subjects, such as the
electromagnetic wave propagation in anisotropic media, the interaction of electromagnetic fields
with biological tissues, but mainly with numerical methods for passive microwave structures and
the analysis and design of microwave and millimeter-wave circuits. He is the author or co-author of
about 70 technical papers in international journals and 100 refereed conference papers. He has
edited a book for IEEE Press, and has recently co-authored a book on Advanced Modal Analysis.
In 1990 he became a Fellow of the IEEE "for contribution to the modeling of planar and quasi-
planar microwave and millimeter-wave circuits". From 1984 through 1987 he was the Chairman of
the IEEE Section of Central and South Italy and was the founder of the local MTT/AP Chapter, that
he chaired from 1984 to 1987. In 1993 he was the recipient of the MTT-S Meritorious Service
Award. From Jan. 1995 through April 1998 he was the Editor-in-Chief of the IEEE Microwave and
Guided Wave Letters. He presently serves on the Administrative Committee of the IEEE
Microwave Theory and Techniques Society.
He served the International Union of Radio Science as Vice Chair (1993-1996) then Chair (1996-
1999) of the Commission D (Electronics and Photonics). Since 1996 he has been the Chairman of
the Management Committee of the European Microwave Conference. He has been the Chairman
of the European Microwave Association since its constitution in 1998. He is a member of the High
Technical Council of the Italian Ministery of Communications.

Luca Roselli

Luca Roselli was born in Florence, Italy, in 1962. He received the Laurea degree in electronic
engineering from the University of Florence, Florence, Italy, in 1988. From 1988 to 1991 he
worked at the University of Florence on SAW devices. In November 1991, he joined the
Department of Electronic and Information Engineering at the University of Perugia, Perugia, Italy,
as a Research Assistant. Since 1992 he has been an IEEE member. Since 1994 he has tought the
``Electronic Devices'' course at the same University. Since 1996 he has been in the reviewer list of
Microwave and Guided Wave Letters (MGWL). Since 1998 he has been in the reviewer list of the
transactions on Microwave Theory and Techniques (MTT). In the same year he has been included
in the technical committee of the Electrosoft conference, of the European Microwave Conference
and of the Microwave Theory and Techniques Symposium. His research interests include the
design and development of microwave and millimeter-wave active and passive circuits by
numerical techniques.

Paolo Mezzanotte

Paolo Mezzanotte was born in Perugia in 1965. He received the Laurea degree in Electronic
Engineering from the University of Ancona, Italy in 1991 with a thesis on FDTD analysis of the
GTEM cell and the Ph.D. degree from the University of Perugia, Italy in 1997. Since 1992 he has
been working on FDTD analysis of microwave structures in co-operation with the Department of
Electronic and Information Engineering of the University of Perugia, Italy. In November 1999, he
joined the same Department as a Research Assistant. Paolo Mezzanotte is member of IEEE and
reviewer for Microwave and Guided Wave Letters (MGWL) and Microwave Theory and techniques
(MTT) transactions. His main field of interest is the application of numerical methods to the study
of components and structures for microwave and millimetre-wave circuits.

Marco Dionigi

He received the Laurea degree (cum laude) in 1992 and Ph.D. degree in Electronic Engineering in
1996 from the University of Perugia, Italy. In 1995 he was visiting scholar at the McMaster
University (Hamilton, Ontario, Canada) working on fullwave optimization of waveguide structures.
In 1997 he became researcher in electromagnetic fields at University of Perugia. His current
research interests are in the field of microwave and millimeter-wave waveguide components
modeling and optimization, antenna modeling, nondestructive testing and characterization of
materials.

Federico Alimenti

Federico Alimenti was born in Foligno, Italy, in 1968. He received the Laurea degree (cum laude)
and the Ph.D. degree from the University of Perugia, Perugia, Italy, in 1993 and 1997 respectively,
both in Electronic Engineering. In 1993 he held a scholarship from Daimler Benz Aerospace, Ulm,
Germany, where he worked at the microwave and millimeter-wave department. In 1996 he was
awarded as young scientist from URSI and he was guest scientist at the “Lehrstuhl fur
Hochfrequenztechnik” of the Technical University of Munchen, Germany. In 1997 he visited the
Technical University of Munchen, Germany in the frame of the Vigoni programme. Since 1993
Federico Alimenti has been with the Department of Electronic and Information Engineering of the
University of Perugia. His research interests concern the FDTD simulation of microwave and
millimeter-wave devices, the study of MMIC interconnection and packaging technologies and the
design, realization and measurement of high frequency circuits. Since 1997 he has been in the
reviewer list of Microwave and Guided Wave Letters (MGWL).

Fabio Zepparelli

Fabio Zepparelli received the electronic engineering diploma degree from the University of
Perugia, Italy, in 1998. Since the same year he has been at the Department of Electronic and
Information Engineering (DIEI) of the University of Perugia, working towards the Ph.D. degree.
Since 2000 he has been a tutor at the course of Microwaves for the telecommunication
engineering diploma, held at the same University.
His research interests are connected with the modelling of optical waveguides, lasers and
microwave/photonic devices, mainly oriented to the development of Radio-over-Fibre systems.
Recent publications cover the development of RF predistortion techniques for laser transmitters.