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USOO5446581A
[11] [45]
5,446,581
Aug. 29, 1995
[75] Inventor:
[56]
[73] Assignee:
4,623,224 11/1986
4,738,496 4,989,928 4/1988 2/1991
Clarke .... ..
359/784 X
359/784 X
[57]
ABSTRACT
GOZB 13/18
US. Cl. .................................. .. 359/357; 359/356;
Design forms are disclosed for wide-?eld infrared imag ing systems characterized by a large ratio of entrance aperture to focal length, where the limiting aperture stop is located in the converging image space.
359/716; 359/784
US. Patent
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5,446,581
substantially proportional to the ?eld angle--i.e., for which the f-0 condition substantially obtains.
It is a more particular object of the present invention
This is a continuation of application Ser. No. 5 08/031,445, ?led Mar. 15, 1993 now abandoned. greater than one steradian and at relative apertures greater than f/2, and for which the f-0 condition sub TECHNICAL FIELD
to provide design forms for infrared imaging systems capable of operation simultaneously at ?elds of view
It is a further object of the present invention to pro vide design forms for infrared lens systems capable of operation simultaneously at wide ?eld of view and at wide relative aperture, which substantially meet the f-6 ture stop located in converging image space. condition and which have a limiting aperture stop lo cated in the converging image space. BACKGROUND ART 15 It is also an object of the present invention to provide Lens systems of wide relative aperture are generally design forms for infrared lens systems capable of opera capable of forming bright images at low light levels. tion simultaneously at wide ?eld of view and at wide This capability is especially advantageous in infrared relative aperture, where each design form is character imaging applications in which the image-forming radia ized by: tion consists of thermal emissions from the objects that a) a diverging front lens group, which functions to are being imaged. However, lens systems of wide rela form a virtual image of a distant scene; tive aperture have hitherto been capable of forming b) a converging rear lens group disposed coaxially high-resolution images only over small ?elds of view with respect to the diverging front lens group to (i.e., less than about 30). relay the virtual image to a focal surface; and In a distortion-free imaging system, the image size is 25 c) an intermediate lens group located coaxially be proportional to the tangent of the ?eld angle. Conse tween the diverging front lens group and the con quently, if an imaging lens system having an extremely
systems, and more particularly to infrared lens systems capable of operation simultaneously at a wide ?eld of view and a wide relative aperture with a limiting aper
stantially obtains.
size of the image plane is correspondingly extremely large. However, in many applications requiring a wide
?eld lens system, it is bene?cial to permit a certain amount of image distortion in order to accommodate an
verging rear lens group, which coacts with the front lens group and the rear lens group to provide
30
substantial correction for geometrical aberrations. In accordance with the present invention, design
forms are disclosed for infrared lens systems of wide
relative aperture (i.e., greater than f/2) that provide image plane of reasonable size. In practice, for many high-resolution imagery for ?elds of view that approach wide-?eld imaging applications, a condition in which image size is substantially proportional to the ?eld angle 35 180 (i.e., almost a complete hemisphere). Infrared lens systems according to the present invention can be de itself (rather than to the tangent of the ?eld angle) is signed to such a scale as to be usable with small ?at deemed to provide acceptably small image distortion. semiconductor array detectors having an area on the The condition in which image size is substantially pro
portional to the ?eld angle for a lens system having a wide ?eld of view is called the f-B condition.
order of 1 square cm.
Until the present invention, design forms had not been developed for infrared imaging systems that sub stantially meet the f-6 condition simultaneously for
A semiconductor array detector manufactured for use in association with an infrared imaging system fre
wide ?elds of view and for wide relative apertures. A need has been experienced in the prior art for infra 45 part of the design form of the associated infrared imag red lens systems having wide ?elds of view as well as ing system-but can signi?cantly affect the aberrational wide relative apertures, which substantially meet the f-0 balance of the overall system. Accordingly, it is appro condition and have a limiting aperture stop in converg priate in certain applications for the sealing window to ing image space. For a lens system used in an infrared function as a lens element in order to minimize aberra tions in the system. detection device, location of the limiting aperture stop in converging image space would allow the entire re DESCRIPTION OF THE DRAWING gion of the lens system from the physical aperture stop to the image plane to be shielded and cooled (e.g., to FIG. 1 is a pro?le drawing of a ?rst embodiment of cryogenic temperatures) so as to limit the amount of an infrared lens system according to the present inven
quently includes a ?at sealing window made of infrared transmissive material. The sealing window of such a semiconductor array detector does not, per se, form
55 tion.
invention, design forms had not been developed for infrared lens systems having wide ?elds of view (e.g.,
greater than one steradian) and wide relative apertures
FIG. 2 is a plot of root-mean-square (RMS) spot diameter versus semi-?eld angle for the infrared lens system of FIG. 1. FIG. 3 is a pro?le drawing of a second embodiment of an infrared lens system according to the present in vention. FIG. 4 is a plot of RMS spot diameter versus semi ?eld angle for the infrared lens system of FIG. 3. FIG. 5 is a pro?le drawing of a third embodiment of 65 an infrared lens system according to the present inven
tion.
5,446,581
FIG. 7 is a pro?le drawing of a fourth embodiment of an infrared lens system according to the present inven tion. FIG. 8 is a plot of RMS spot diameter versus semi ?eld angle for the infrared lens system of FIG. 7. FIG. 9 is a pro?le drawing of a ?fth embodiment of an infrared lens system according to the present inven tion. FIG. 10 is a plot of RMS spot diameter versus semi ?eld angle for the infrared lens system of FIG. 9. FIG. 11 is a graphical illustration in which the plots of RMS spot diameter versus semi-?eld angle as shown
in FIGS. 2, 4, 6, 8 and 10 are superimposed on a com
mon set of axes.
diameter of 6 mm, and provides substantially diffrac tion-limited performance over the wavelength range
from 3.5 to 5.0 microns. The variation of the index of refraction with wavelength for silicon in that wave length range is indicated as follows:
TABLE II Wavelength (microns) 3.5p. 4.0;4.
3.428117 3.425406
Material
Silicon
5.0;].
3.422272
BEST MODE OF CARRYING OUT THE It is apparent from TABLE II that the index of refrac INVENTION tion for silicon varies only in the third decimal place In FIG. 1, a lens system according to a ?rst embodi over the wavelength range from 3.5 to 5.0 microns. ment of the present invention is illustrated, which has a In FIG. 2, the root-mean-square (RMS) spot diameter ?eld of view of 120 and a relative aperture of f/l, and 20 is plotted as a function of semi-?eld angle for the lens which provides substantially diffraction-limited perfor system of FIG. 1 to provide a graphical indication of mance over an infrared wavelength range from 3.5 to performance. The curve in FIG. 2 shows that the RMS 5.0 microns. The lens system of FIG. 1 comprises four spot diameter varies over a ?eld of view of 120 (i.e., a lens elements 11, 12, 13 and 14, all of which are made of semi-?eld angle of 60) from 22 microns at 0 (i.e., at the silicon. The lens elements 11, 12, 13 and 14 are con?g 25 center of the ?eld) to 26 microns at 120 (i.e., at the edge ured and coaxially positioned with respect to each other
15
of the ?eld).
TABLE I
Surface Radius Thickness
No.
1 2
(mm)
65.99509 34.37579
(mm)
2.5 60.0
3
4
59.88651
58.88825
3.0
30.0
Silicon
Silicon Silicon
5
6
76.93851
- 52.16937
3.5
7.0
elements 21 and 22 are made of germanium, and the lens elements 23, 24 and 25 are made of silicon. The lens
25.90995 37.17134 co so
elements 21, 22, 23, 24 and 25 are con?gured and coaxi ally positioned with respect to each other according to an optical prescription speci?ed in tabular format as follows: TABLE III
Surface Radius Thickness
consecutively from left to right along an optic axis in accordance with optical design convention. Thus, sur
faces No. l and No. 2 are the left and right surfaces,
45
No.
1 2 3 4 5
6 7
8
(mm)
5l3.3l095 107.11530 49.13908 36.94364 252.05 523
141 .87030 - 117.37876
- 68.33107
(mm)
2.5 45.0 2.5 5.0 4.5
50.0 3.5
1.0
Material
Germanium
Germanium
Silicon
Silicon
9 10
Aperture stop
19.50573 24.59003
m
co
3.5 5.0
10.699595
Silicon
Image plane
according to the convention described above in connec spherical aberration. In accordance with optical design convention, the radius of curvature of a speci?ed lens 60 tion with TABLE I. The use of germanium in combina tion with silicon for the lens elements of the lens system surface is positive if the center of curvature of the sur shown in FIG. 3 allows correction for chromatic aber face lies to the right of the surface, and negative if the ration to be achieved. In developing the optical pre center of curvature of the surface lies to the left of the scription for the lens system of FIG. 3, the lens element surface. The thickness listed in the third column for each of the lens surfaces in Table I is the axial thickness 65 12 of the lens system of FIG. 2 (with the conic surface N0. 3) is replaced by the two lens elements 22 and 23 (expressed in millimeters) of the lens element bounded with spherical surfaces, which provide a comparable on the left by the speci?ed surface, or the axial separa
tion (i.e., air gap) between the speci?ed surface and the
5,446,581
length in the wavelength range from 3.5 to 5.0 microns for germanium and silicon (i.e., the materials from
which the lens elements of the lens system of FIG. 3 are
The particular application for which the lens system of FIG. 5 was designed requires diffraction-limited performance in the relatively narrow wavelength range
from 4.3 to 4.9 microns. The variation of the index of
5 refraction with wavelength for germanium and silicon (i.e., the materials from which the lens elements of the
5.011
4.015388 3.422272 10
3.5g
4.032548 3.428117
_ Wavelength (microns)
4.01.1
lens system of FIG. 5 are made) in the wavelength range from 4.3 to 4.9 microns is indicated as follows:
TABLE VI Wavelength (microns)
4.024610 3.425406
Material
4.311.
4.611.
4.911.
It is apparent from TABLE IV that the index of refracGermanium 44321147 491E551 4016060 tion for germanium varies only in the second decimal 5mm 3424224 3423273 3422498 place, and the index of refraction for silicon varies only 15 in the third decimal place, over the wavelength range It is apparent from TABLE VI that the index of refrac from 3.5 to 5.0 microns. tion for germanium varies only in the second decimal In FIG. 4, RMS spot diameter is plotted as a function place, and the index of refraction for silicon varies only of semi-?eld angle for the lens system of FIG. 3 to in the third decimal place, over the wavelength range provide a graphical indication of performance. The 20 from 4.3 to 4.9 microns. curve in FIG. 4 shows that the RMS spot diameter The lens element (i.e., sealing window) 34 in the varies over a ?eld of view of 120 (i.e., a semi-?eld angle embodiment of FIG. 5 signi?cantly contributes to of 60) from 12.6 microns at 0 to 27 microns at 120. monochromatic and chromatic aberrations of the over Thus, it is apparent that the correction of chromatic all system. However, the design form achieved utilizing aberration achieved by the design form illustrated in 25 the sealing window 34 allows the aperture stop to be FIG. 3 is especially good at the center of the ?eld of located to the rear of the sealing window 34, so that the view, although it degrades somewhat at the edge of the entire region between the aperture stop and the semi
?eld. conductor array detector can be cooled to cryogenic
In FIG. 5, a lens system according to a third emboditemperatures by an appropriate cooling apparatus in ment of the present invention is illustrated, which also 30 order to optimize the sensitivity of the detector. In
has a ?eld of view of 120 and a relative aperture of f/l. The lens system of FIG. 5 was designed for a particular application requiring a focal length of 6 mm and an order to compensate for the aberrations attributable to the lens element 34, surface No. 2 of the lens element 31 is conic, and surface No. 3 of the lens element 32 has a
window near the aperture stop. Accordingly, the lens 35 In FIG. 6, RMS spot diameter is plotted as a function system illustrated in FIG. 5 comprises four lens eleof semi-?eld angle for the lens system of FIG. 5 to ments 31, 32, 33 and 34 of which the lens element 34 provide a graphical indication of performance. The
functions as a sealing window for a semiconductor curve in FIG. 6 shows that over a ?eld of view of 120
sign form of the lens system of FIG. 5 could be used 40 varies from 9.6 microns at the center of the ?eld to 16.6 without the lens element 34. microns at the edge of the ?eld. As illustrated in FIG. 5, the lens elements 31 and 32 In FIG. 7, a lens system according to a fourth em are made of germanium, and the lens elements 33 and 34 bodiment of the present invention is illustrated, which are made of silicon. The lens elements 31, 32, 33 and 34 has an exceptionally wide ?eld of view of 170' as well are con?gured and coaxially positioned with respect to 45 as a relative aperture of f/l. The lens system of FIG. 7
TABLE V
Surface Radius Thickness
No.
1 2 3
(mm)
(mm)
Material
Germanium
Germanium
M
A = .347012 X 10-5 B = .101446 X 10-7 c = .268179 >< 10-11 D = .158740 X 10-12 .
4 5 6
7 8
Silicon
Silicon
so 00
15.162707
where the surfaces of the lens elements are numbered 65 crons. The particular lens system illustrated in FIG. 7
5,446,581
stop. Accordingly, the lens system illustrated in FIG. 7 comprises four lens element 41, 42, 43, 44 and 45 of
which the lens element 45 functions as a sealing window for a semiconductor array detector. The lens element 41, 42, 43 and 44 are made of silicon, and the lens ele
ment 45 is made of sapphire. The lens element 41, 42, 43 and 44 are con?gured and coaxially positioned with respect to each other according to an optical prescrip
tion speci?ed in tabular format as follows: TABLE VII
Surface Radius Thickness
nium. The lens system of FIG. 9 comprises four lens elements 31, 32, 33 and 34, which are con?gured and coaxially positioned with respect to each other accord ing to an optical prescription speci?ed in tabular format
as follows:
TABLE IX
Surface Radius Thickness
1O
Material
Silicon
No.
1 2
3
4
(mm)
62.41336 32.07998
- 82.42941
- 74.76767
(mm)
2.5 60.0
3.0
34.0
Material
Germanium
Germanium
No.
1 2 3
(mm)
(mm)
4 5 6 7 8
9 Aperture stop
12224468 2.5 36.29113 56.0 76.15656 3.0 Conic constant: 7.924001 65.17392 33.0 71.96637 3.5 -53.16908 9.0 33.25649 3.5 51.89328 5.0 w 2.0 so 17.109679
Silicon
Silicon Silicon
Sapphire
64.26079
53.56433
5.0
1.0
Germanium
7 8 Aperture stop
38.22219 53.00037 on
Germanium
Image plane
so
Image plane
on
Material
Germanium
35
3.5p.
3.428117
4.0;;
3.425406
5.0;].
3.422272
Sapphire
1.695326
1.675244
1.623989
fraction for silicon varies only in the third decimal place, and the index of refraction for sapphire varies only in the second decimal place, over the wavelength
range from 3.5 to 5.0 microns.
In FIG. 10, RMS spot diameter is plotted as a func tion of semi-?eld angle for the lens system of FIG. 9 to
microns at the edge of the ?eld. In FIG. 11, the plots of RMS spot diameter versus semi-?eld angle for the various embodiments of the present invention as illustrated in FIGS. 1, 3, 5, 7 and 9
are superimposed on a single set of axes for purposes of
easy comparison. It is readily apparent from FIG. 11 that every illustrated embodiment of the invention has
an RMS spot diameter of less than 25 microns for a ?eld
angle up to 90 (i.e., a semi-?eld angle of 45). The present invention has been described above in terms of design forms developed for use in particular applications. However, variations on the above-dis closed design forms (as optimized for use in different applications) would be within the scope of the inven tion, and would become apparent to practitioners skilled in the art of optical design upon perusal of the
Accordingly, the invention is de?ned more generally by tion-limited performance over a longer infrared wave 65 the following claims and their equivalents.
length range from 8.0 to 12.0 microns, and was designed for an application requiring a focal length of 6 mm and
an entrance pupil diameter of 8.6 mm. All the lens ele~
9
comprising:
5,446,581
10
_Continued
_
sg?ce
Image plane
12:35
T222555
Material
along an optic axis, said rear lens group functioning consecutively from left to right along the optic axis. to relay said virtual image to said focal surface; and 4. The optical system of claim 2 comprising lens ele c) an intermediate lens group located coaxially be- 10 ments con?gured and positioned with respect to each
tween said front lens group and said rear lens group, said intermediate lens group coacting with said diverging front lens group and said converg
ing rear lens group to provide substantial correc
tion for geometrical aberrations. 15
. . . .
other along said optic axis substantially according to a design form speci?ed as follows:
Surface
No.
Rad'us
Thckness
(mm)
513 3
(mm)
25
Material
;
3 4
5
107$
4914 36.94
252.06
-141.8'/
45'()
2:5 5.0
4.5
50.0
emamum
Germanium
Silicon
_m 38
35
Silicon
functioning to form a virtual image of said scene: b) a converging rear lens group disposed coaxially
with respect to said diverging front lens group
8 9
10
_6833 19.51
24-59
1:0 3.5
50
Silicon
?geargtgrglzip
1O'7
group, said intermediate lens group coacting with Consecutlvely from left to gilt along 31991906 @415 said diverging front lens group and said converg- 3O 5- The Optlcal System Of_ flalm 2 CPmPnsmg lens 616' ing rear lens group to provide substantial correcments con?gul'ed an_d pqsltloned flth respect 30 each
tion for geometrical aberrations; and d) means forming an aperture stop in a converging
Surface
other along said optic axis substantially according to a deslgn form Specl?ed as follows:
Radius Thickness
No.
1
(mm)
(mm)
Material
Germanium
Germanium
Asphseric coefficients:
A = .247012 x 10-5
4
B = .101446 X 10-7
89.53
D = .1587402 X 10-12
5
6
238.76
62.61
4.0
2.0
Silicon
Silicon
7 8
co 00
2.5 1.0
Aperture stop
as
15.2
Image plane
as
and said focal surface. consecutively from left to right along the optic axis. 3. The optical system of claim 2 comprising lens ele6. The optical system of claim 2 comprising lens ele ments con?gured and positioned with respect to each ments con?gured and positioned with respect to each other along said optic axis substantially according to a 55 other along said optic axis substantially according to a design form speci?ed as follows: design form specified as follows:
Surface Radius Thickness Surface Radius Thickness
No.
1 2 3
4 5 6 7 8 Aperture stop
(mm)
(mm)
Material
Silicon
60
No.
1 2 3
4 5 6 7 8 9
(mm)
(mm)
Material
Silicon
66.0 2.5 34.38 60.0 59.89 3.0 Conic constant: 6.313089 58.89 30.0 76.94 3.5 -52.17 7.0 25.91 3.5 37.17 5.0 m 14.5
Silicon
Silicon
Silicon
65
122.24 2.5 36.29 56.0 ~76.l6 3.0 Conic constant: 7.924001 65.l7 33.0 -71.97 3.5 53.17 9.0 33.26 3.5 51.89 5.0 a0 2.0
Silicon
Silicon
Silicon
Sapphire
11
continued
Surface Radius Thickness
5,446,581
Surface Radius
12
Thickness
No.
(mm)
62.41 32.08
82.43
(mm)
2.5 60.0
3.0
Material
Germanium
Germanium
No.
Aperture stop
(mm)
co
(mm)
17.1
Material
1 2
3
Image plane
o0
4 5 6 7 8 Aperture stop
consecutively from left to right along the optic axis. 7. The optical system of claim 2 comprising lens ele
ments con?gured and positioned with respect to each other along said optic axis substantially according to a design form specified as follows:
Image plane
Germanium
Germanium
25
30
35
45
55
60
65