Ultralow-Noise, High PSRR, Fast RF 200ma Low-Dropout Linear Regulators in Nanostar™ Wafer Chip Scale and Sot23

DBV 5 DBV 6 YEQ, YZQ
3
2
4
5
DBV PACKAGE
(TOP VIEW)
1 IN
GND
EN
OUT
NR
Fixed Option
3
2
4
6
DBV PACKAGE
(TOP VIEW)
1 IN
GND
EN
OUT
NR
5 FB
Adjustable Option
TPS79328
RIPPLE REJECTION
vs
FREQUENCY
IN
EN
OUT
NR
GND
YEQ, YZQ
PACKAGE
(TOP VIEW)
10 100 1 k 10 k
10
40
80
100 k 1 M 10 M
R
i
p
p
l
e

R
e
j
e
c
t
i
o
n

(
d
B
)
Frequency (Hz)
I
OUT
= 10 mA
50
0
V
IN
= 3.8 V
C
OUT
= 10 F
C
NR
= 0.01 F
I
OUT
= 200 mA
20
30
60
70
90
100
A3 A1
C3 C1
B2
0
0.05
0.10
0.15
0.20
0.25
0.30
100 1 k 10 k 100 k
Frequency (Hz)
I
OUT
= 1 mA
V
IN
= 3.8 V
C
OUT
= 2.2 F
C
NR
= 0.1 F
I
OUT
= 200 mA
TPS79328
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
O
u
t
p
u
t

S
p
e
c
t
r
a
l

N
o
i
s
e

D
e
n
s
i
t
y

(
V
/
H
z
)
www.ti.com
www.ti.com
yyy
www.ti.com
www.ti.com
_
+
Thermal
Shutdown
Bandgap
Reference
1.22V
Current
Sense
R2
GND
EN
SHUTDOWN
V
ref
UVLO
ILIM
External to
the Device
R1
UVLO
2.45V
250 k
NR
FB
59 k
QuickStart
OUT IN
IN
_
+
Thermal
Shutdown
Current
Sense
R1
R2
GND
EN
SHUTDOWN
V
ref
UVLO
ILIM
250 k
NR
QuickStart
Bandgap
Reference
1.22V
UVLO
2.45V
R2 = 40 k
IN
IN OUT
www.ti.com
2.795
2.796
2.797
2.798
2.799
2.800
2.801
2.802
2.803
2.804
2.805
0 50 100 150 200
I
OUT
(mA)
V
IN
= 3.8 V
C
OUT
= 10 F
T
J
= 25C
V
O
U
T

(
V
)
0
50
100
150
200
250
40 2510 5 20 35 50 65 80 95 110 125
T
J
(C)
I
OUT
= 1 mA
V
IN
= 3.8 V
C
OUT
= 10 F
I
OUT
= 200 mA
I
G
N
D

(
A
)
2.775
2.780
2.785
2.790
2.795
2.800
2.805
40 25 10 5 20 35 50 65 80 95 110 125
T
J
(C)
I
OUT
= 200 mA
I
OUT
= 1 mA
V
IN
= 3.8 V
C
OUT
= 10 F
V
O
U
T

(
V
)
0
0.05
0.10
0.15
0.20
0.25
0.30
100 1 k 10 k 100 k
Frequency (Hz)
I
OUT
= 1 mA
V
IN
= 3.8 V
C
OUT
= 2.2 F
C
NR
= 0.1 F
I
OUT
= 200 mA
O
u
t
p
u
t

S
p
e
c
t
r
a
l

N
o
i
s
e

D
e
n
s
i
t
y

(
V
/
H
z
)
0
0.05
0.10
0.15
0.20
0.25
0.30
100 1 k 10 k 100 k
Frequency (Hz)
I
OUT
= 1 mA
I
OUT
= 200 mA
V
IN
= 3.8 V
C
OUT
= 10 F
C
NR
= 0.1 F
O
u
t
p
u
t

S
p
e
c
t
r
a
l

N
o
i
s
e

D
e
n
s
i
t
y

(
V
/
H
z
)
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
100 1 k 10 k 100 k
Frequency (Hz)
V
IN
= 3.8 V
I
OUT
= 200 mA
C
OUT
= 10 F
C
NR
= 0.1 F
C
NR
= 0.001 F
C
NR
= 0.0047 F
C
NR
= 0.01 F
O
u
t
p
u
t

S
p
e
c
t
r
a
l

N
o
i
s
e

D
e
n
s
i
t
y

(
V
/
H
z
)
100 1 M 10 1 k
Frequency (Hz)
10 k 100 k
I
OUT
= 1 mA
0
0.5
1.0
1.5
2.0
2.5
0
I
OUT
= 100 mA
10 M
V
IN
= 3.8 V
C
OUT
= 10 F
T
J
= 25 C
Z
O

(
)
0
20
40
60
80
100
120
140
160
180
40 2510 5 20 35 50 65 80 95 110 125
I
OUT
= 200 mA
I
OUT
= 10 mA
V
IN
= 2.7 V
C
OUT
= 10 F
T
J
(C)
V
D
O

(
m
V
)
0.001 0.01 0.1
C
NR
(F)
0
10
20
30
40
50
60
V
OUT
= 2.8 V
I
OUT
= 200 mA
C
OUT
= 10 F
BW = 100 Hz to 100 kHz
R
M
S
,

O
u
t
p
u
t

N
o
i
s
e

(
V
R
M
S
)
www.ti.com
10 100 1 k 10 k
10
40
80
100 k 1 M 10 M
R
i
p
p
l
e

R
e
j
e
c
t
i
o
n

(
d
B
)
Frequency (Hz)
I
OUT
= 10 mA
50
0
V
IN
= 3.8 V
C
OUT
= 10 F
C
NR
= 0.01 F
I
OUT
= 200 mA
20
30
60
70
90
100
10 100 1 k 10 k
20
60
100
100 k 1 M 10 M
R
i
p
p
l
e

R
e
j
e
c
t
i
o
n

(
d
B
)
Frequency (Hz)
V
IN
= 3.8 V
C
OUT
= 2.2 F
C
NR
= 0.01 F
I
OUT
= 10 mA
I
OUT
= 200 mA
40
70
90
30
50
80
10
0
10 100 1 k 10 k
20
60
100
100 k 1 M 10 M
R
i
p
p
l
e

R
e
j
e
c
t
i
o
n

(
d
B
)
Frequency (Hz)
V
IN
= 3.8 V
C
OUT
= 2.2 F
C
NR
= 0.1 F
I
OUT
= 10 mA
I
OUT
= 200 mA
40
70
90
30
50
80
10
0
3
Time (s)
0 60 40 20 80 100 140 120 160 180 200
V
IN
= 3.8 V
V
OUT
= 2.8 V
I
OUT
= 200 mA
C
OUT
= 2.2 F
T
J
= 25C
1
2
0
0
2
C
NR
= 0.0047 F
C
NR
= 0.01 F
4
C
NR
= 0.001 F
V
E
N

(
V
)
V
O
U
T

(
V
)
Time (s)
0 30 20 10 40 50 70 60 80 90 100
I
OUT
= 200 mA
C
OUT
= 2.2 F
C
NR
= 0.01 F
0
-20
3.8
dv
dt
+
0.4 V
s
20
4.8
V
I
N

(
m
V
)
V
O
U
T

(
m
V
)
Time (s)
0
0 150 100 50 200 250 350 300 400 450
20
0
20
100
500
V
IN
= 3.8 V
C
OUT
= 10 F
40
200
300
di
dt
+
0.02A
s
1mA
I
O
U
T

(
m
A
)
V
O
U
T

(
m
V
)
5
0
0

m
V
/
d
i
v
1s/div
V
IN
V
OUT
V
OUT
= 3 V
R
L
= 15
100
50
0 20 40 60 80 100 120
150
200
250
140 160 180 200
0
I
OUT
(mA)
T
J
= 125C
T
J
= 25C
T
J
= 55C
V
D
O

(
m
V
)
0
50
100
150
200
2.5 3.0 3.5 4.0 4.5 5.0
V
IN
(V)
I
OUT
= 200 mA
T
J
= 25C
T
J
= 40C
T
J
= 125C
V
D
O

(
m
V
)
www.ti.com
0.01
0.1
10
100
0 0.02 0.04 0.06 0.08 0.20
I
OUT
(A)
1
Region of Instability
Region of Stability
C
OUT
= 2.2 F
V
IN
= 5.5 V, V
OUT
1.5 V
T
J
= 40C to 125C
E
S
R
,

E
q
u
i
v
a
l
e
n
t

S
e
r
i
e
s

R
e
s
i
s
t
a
n
c
e

(
)
0.01
0.1
10
100
0 0.02 0.04 0.06 0.08 0.20
I
OUT
(A)
1
Region of Instability
Region of Stability
C
OUT
= 10 F
V
IN
= 5.5 V
T
J
= 40C to 125C
E
S
R
,

E
q
u
i
v
a
l
e
n
t

S
e
r
i
e
s

R
e
s
i
s
t
a
n
c
e

(
www.ti.com
TPS793xx
GND EN NR
IN OUT
V
IN
V
OUT
0.1F
0.01F
2.2F
V
IN
V
OUT
www.ti.com
P
D(max)
+
T
J
max *T
A
R
QJA

P
D
+
V
IN
*V
OUT
I
OUT

V
OUT
+V
REF
1 )
R
1
R
2
R
1
+
V
OUT
V
REF
*1 R
2
C
1
+
(3 x 10
*7
) x (R
1
) R
2
)
(R
1
x R
2
)
www.ti.com
GND NR FB
IN OUT
EN
V
IN
V
OUT
R
1
C
1
R
2
1 F m
2.2 F m
0.01 F m
TPS79301
OUTPUT VOLTAGE
PROGRAMMING GUIDE
R
1
R
2
C
1
2.5V
3.3V
3.6V
1.22V
OUTPUT
VOLTAGE
31.6kW
short
51kW
59kW
open
30.1kW
30.1kW
30.1kW
0pF
22pF
15pF
15pF
www.ti.com
0.625 Max
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStar package configuration.
NanoStar is a trademark of Texas Instruments.
1,30
1,34
0,79
0,84
PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
TPS79301DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PGVI
TPS79301DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PGVI
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHHI
& no Sb/Br)
TPS79318DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br)
TPS79318DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br)
TPS79318YEQR OBSOLETE DSBGA YEQ 5 TBD Call TI Call TI -40 to 85
TPS79318YEQT OBSOLETE DSBGA YEQ 5 TBD Call TI Call TI -40 to 85
TPS79318YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM -40 to 85 E3
TPS79318YZQT ACTIVE DSBGA YZQ 5 250 Green (RoHS
& no Sb/Br)
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PGWI
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PGWI
& no Sb/Br)
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHII
& no Sb/Br)
TPS793285DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br)
TPS793285DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br)
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Top-Side Markings
(4)
Samples
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PGXI
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PGXI
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PGYI
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PGYI
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHUI
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHUI
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHJI
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHJI

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 3
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS79301, TPS79318, TPS79325, TPS79328, TPS793285, TPS79330, TPS79333, TPS793475 :
Automotive: TPS79301-Q1, TPS79318-Q1, TPS79325-Q1, TPS79328-Q1, TPS793285-Q1, TPS79330-Q1, TPS79333-Q1, TPS793475-Q1
Enhanced Product: TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79333-EP, TPS793475-EP

NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPS79301DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS79301DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79318DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS79318DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS79318YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1
TPS79318YZQT DSBGA YZQ 5 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1
TPS79325DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS793285DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS793285DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS79328DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS79330DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
Pack Materials-Page 1
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPS79333DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS79333DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS793475DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS793475DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79301DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
TPS79301DBVR SOT-23 DBV 6 3000 203.0 203.0 35.0
TPS79318DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS79318DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS79318YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0
TPS79318YZQT DSBGA YZQ 5 250 217.0 193.0 35.0
TPS79325DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS793285DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS793285DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS79328DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79330DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS79333DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS79333DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
TPS793475DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS793475DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
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PACKAGE OPTION ADDENDUM

Automotive: TPS79301-Q1, TPS79318-Q1, TPS79325-Q1, TPS79328-Q1, TPS793285-Q1, TPS79330-Q1, TPS79333-Q1, TPS793475-Q1

Enhanced Product: TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79333-EP, TPS793475-EP

Enhanced Product - Supports Defense, Aerospace and Medical Applications

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